Page 6 - Embedded - Microcontroller, Microprocessor, FPGA Modules | Integrated Circuits (ICs)

Part Number	Manufacturer	Description	Package	Stock	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
CC-WMX-LB69-CV-1	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock2,112	-	-	-	-	-	-	-	-
CC-MX-LC47-ZM-B	Digi International	CONNECTCORE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock2,448	-	-	-	-	-	-	-	-
DC-ME-01T-NC	Digi International	MOD ME 8MB SDRAM 2MB FLASH 50PAK Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 2MB RAM Size: 8MB Connector Type: RJ45 Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock2,784	ARM7TDMI, NS7520	-	55MHz	2MB	8MB	RJ45	1.45" x 0.75" (36.7mm x 19.1mm)	-40°C ~ 85°C
CENGPXA270-312-10-440ECR	Logic	CARD ENGING 32MB SDRAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 312MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock3,664	PXA270	-	312MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
20-101-1055	Digi International	MODULE RABBITCORE RCM3375 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 44.2MHz Flash Size: 512KB (Internal), 32MB (External) RAM Size: 1MB Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card Size / Dimension: 1.85" x 2.73" (47mm x 69mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock2,896	Rabbit 3000	-	44.2MHz	512KB (Internal), 32MB (External)	1MB	2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card	1.85" x 2.73" (47mm x 69mm)	0°C ~ 70°C
CENGPXA270-312-10-550EC	Logic	CARD ENGINE 64MB FLASH 64MB RAM Module/Board Type: MCU Core Core Processor: PXA270 Co-Processor: - Speed: 312MHz Flash Size: 64MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,464	PXA270	-	312MHz	64MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGSH7727-20-403HC	Logic	CARD ENGINE 16MB FLASH 32MB RAM Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock5,536	-	-	-	-	-	-	-	-
CENGSH7760-10-503HC	Logic	CARD ENGINE 16MB FLASH 64MB RAM Module/Board Type: MPU Core Core Processor: SH7760 Co-Processor: - Speed: 198MHz Flash Size: 32MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock5,328	SH7760	-	198MHz	32MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
101-0488	Digi International	MODULE RABBITCORE RCM2210 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x13 Size / Dimension: 1.6" x 2.3" (41mm x 58mm) Operating Temperature: -40°C ~ 70°C	Package: -	Stock7,152	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x13	1.6" x 2.3" (41mm x 58mm)	-40°C ~ 70°C
CC-MX-MB47-ZM-B	Digi International	MODULE I.MX51 128MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock6,800	-	-	-	-	-	-	-	-
TE0841-01-040-1I	Trenz Electronic GmbH	SOM USCALE XCKU040-1I 1GB DDR4 Module/Board Type: FPGA Core Processor: Kintex UltraScale KU40 Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 4GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock6,896	Kintex UltraScale KU40	-	-	32MB	4GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DLP-245PL-G	DLP Design Inc.	MOD USB-MCU FT245RL W/18LF8722 Module/Board Type: MCU, USB Core Core Processor: PIC16F8722 Co-Processor: FT245RL Speed: 24MHz Flash Size: 128KB RAM Size: 3.75KB Connector Type: USB - B, Pin Header Size / Dimension: 2.8" x 2" (71.1mm x 50.8mm) Operating Temperature: -	Package: -	Stock6,128	PIC16F8722	FT245RL	24MHz	128KB	3.75KB	USB - B, Pin Header	2.8" x 2" (71.1mm x 50.8mm)	-
100-1221-3	Bluetechnix GmbH	CORE MOD CM-BF537E 600MHZ CONN Module/Board Type: MPU Core Core Processor: CM-BF537 Co-Processor: - Speed: 600MHz Flash Size: 4MB RAM Size: 32MB Connector Type: Expansion 2 x 60 Size / Dimension: 1.44" x 1.24" (36.5mm x 31.5mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock6,880	CM-BF537	-	600MHz	4MB	32MB	Expansion 2 x 60	1.44" x 1.24" (36.5mm x 31.5mm)	0°C ~ 70°C
EZ80F920120MOD	Zilog	MODULE EZ80F92 512K 20MHZ Module/Board Type: MCU Core Core Processor: eZ80F92 Co-Processor: - Speed: 20MHz Flash Size: 128KB (Internal), 1MB (External) RAM Size: 8KB (Internal), 512KB (External) Connector Type: Header 2x25 Size / Dimension: 2.5" x 2.5" (64mm x 64mm) Operating Temperature: 0°C ~ 70°C	Package: -	Stock7,824	eZ80F92	-	20MHz	128KB (Internal), 1MB (External)	8KB (Internal), 512KB (External)	Header 2x25	2.5" x 2.5" (64mm x 64mm)	0°C ~ 70°C
SOMAM3517-10-1780FJIR	Logic	SYSTEM ON MODULE AM3517 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3517 Co-Processor: - Speed: 600MHz Flash Size: 512MB RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 300 Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock4,304	ARM? Cortex?-A8, AM3517	-	600MHz	512MB	256MB	Board-to-Board (BTB) Socket - 300	1.61" x 2.02" (40.9mm x 51.2mm)	-40°C ~ 85°C
TE0807-02-04EG-1E	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Stock5,280	-	-	-	-	-	-	-	-
TE0820-03-02EG-1ED	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 1.57" x 1.97" (40mm x 50mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock5,616	Zynq UltraScale+ XCZU2EG-1SFVC784E	-	-	128MB	2GB	B2B	1.57" x 1.97" (40mm x 50mm)	0°C ~ 85°C
IW-G45M-S085-4E008G-E032G-BEA	iWave Systems	Stratix 10 SoC FPGA SOM Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53 Co-Processor: - Speed: 1.5GHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53	-	1.5GHz	-	-	-	4.330" L x 2.950" W (110.00mm x 75.00mm)	-40°C ~ 85°C
OSD32MP157C-512M-BAA	Octavo Systems LLC	SIP ARM CORTEX STM32MP157C Module/Board Type: MPU Core Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4 Co-Processor: NEON™ SIMD Speed: 650MHz, 209MHz Flash Size: - RAM Size: - Connector Type: 302-BGA Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm) Operating Temperature: 0°C ~ 85°C	Package: -	Stock1,662	Arm® Dual Cortex®-A7, Arm® Cortex®-M4	NEON™ SIMD	650MHz, 209MHz	-	-	302-BGA	0.709" L x 0.709" W (18.00mm x 18.00mm)	0°C ~ 85°C
TE0830-01-ABI26FAP	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ ZU11EG-1I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 16GB Connector Type: 2 x 400 Pin Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	Zynq UltraScale+ ZU11EG-1I	-	-	128MB	16GB	2 x 400 Pin	4.724" L x 4.724" W (120.00mm x 120.00mm)	-40°C ~ 85°C
TE0823-01-3PIU1FA	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I	-	128MB	1GB	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
20-101-0072	Digi	DEV VERSION SMARTBLOCK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
ME-AA1-480-2I3-D12E-NFX3-R2	Enclustra FPGA Solutions	SOM ARRIA 10 10AS048 4GB Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
TE0741-05-D2C-1-A	Trenz Electronic GmbH	MODULE FPGA KINTEX Module/Board Type: FPGA Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C Co-Processor: - Speed: - Flash Size: 32MB RAM Size: - Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	Xilinx Kintex-7 FPGA XC7K325T-2FBG676C	-	-	32MB	-	Board-to-Board (BTB) Socket	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
TE0720-03-62I33NA	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 32GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	32GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 70°C
ME-XU9-5EV-1I-D12E-L11-R3-0	Enclustra FPGA Solutions	SOM XU9 ZYNQ 5EV REV2.1 Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I Speed: - Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I	-	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	-40°C ~ 85°C
TE0820-05-3BE81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	Package: -	Request a Quote	-	-	-	-	-	-	-	-
CC-WMX-ZC6D-L1	Digi	CC 93 SOM SINGLE-CORE WIRELESS Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Co-Processor: - Speed: 250MHz, 1.7GHz Flash Size: 8GB RAM Size: 512MB Connector Type: - Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM® Cortex®-A55, ARM® Cortex®-M33	-	250MHz, 1.7GHz	8GB	512MB	-	1.770" L x 1.570" W (45.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-92I31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7045) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7045)	-	64MB	1GB	Board-to-Board (BTB) Socket - 480	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0714-03-50-2I	Trenz Electronic GmbH	IC MODULE Module/Board Type: FPGA Core Core Processor: Artix-7 A50T Co-Processor: - Speed: - Flash Size: 16MB RAM Size: 16MB Connector Type: Samtec LSHM Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	Package: -	Stock105	Artix-7 A50T	-	-	16MB	16MB	Samtec LSHM	1.180" L x 1.570" W (30.00mm x 40.00mm)	-40°C ~ 85°C

CC-WMX-LB69-CV-1

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Stock2,112

-

CC-MX-LC47-ZM-B

Digi International

CONNECTCORE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Stock2,448

-

DC-ME-01T-NC

Digi International

MOD ME 8MB SDRAM 2MB FLASH 50PAK

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 2MB
RAM Size: 8MB
Connector Type: RJ45
Size / Dimension: 1.45" x 0.75" (36.7mm x 19.1mm)
Operating Temperature: -40°C ~ 85°C

Package: -

Stock2,784

ARM7TDMI, NS7520

-

55MHz

2MB

8MB

RJ45

1.45" x 0.75" (36.7mm x 19.1mm)

-40°C ~ 85°C

CENGPXA270-312-10-440ECR

Logic

CARD ENGING 32MB SDRAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 312MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Stock3,664

PXA270

-

312MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

20-101-1055

Digi International

MODULE RABBITCORE RCM3375

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 44.2MHz
Flash Size: 512KB (Internal), 32MB (External)
RAM Size: 1MB
Connector Type: 2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card
Size / Dimension: 1.85" x 2.73" (47mm x 69mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Stock2,896

Rabbit 3000

-

44.2MHz

512KB (Internal), 32MB (External)

1MB

2 IDC Headers 2x17, 1 IDC Header 2x5. 1 xD-Picture Card

1.85" x 2.73" (47mm x 69mm)

0°C ~ 70°C

CENGPXA270-312-10-550EC

Logic

CARD ENGINE 64MB FLASH 64MB RAM

Module/Board Type: MCU Core
Core Processor: PXA270
Co-Processor: -
Speed: 312MHz
Flash Size: 64MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Stock6,464

PXA270

-

312MHz

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGSH7727-20-403HC

Logic

CARD ENGINE 16MB FLASH 32MB RAM

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Stock5,536

-

CENGSH7760-10-503HC

Logic

CARD ENGINE 16MB FLASH 64MB RAM

Module/Board Type: MPU Core
Core Processor: SH7760
Co-Processor: -
Speed: 198MHz
Flash Size: 32MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Stock5,328

SH7760

-

198MHz

32MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

101-0488

Digi International

MODULE RABBITCORE RCM2210

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x13
Size / Dimension: 1.6" x 2.3" (41mm x 58mm)
Operating Temperature: -40°C ~ 70°C

Package: -

Stock7,152

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x13

1.6" x 2.3" (41mm x 58mm)

-40°C ~ 70°C

CC-MX-MB47-ZM-B

Digi International

MODULE I.MX51 128MB FLASH 25PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Stock6,800

-

TE0841-01-040-1I

Trenz Electronic GmbH

SOM USCALE XCKU040-1I 1GB DDR4

Module/Board Type: FPGA
Core Processor: Kintex UltraScale KU40
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 4GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

Package: -

Stock6,896

Kintex UltraScale KU40

-

32MB

4GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DLP-245PL-G

DLP Design Inc.

MOD USB-MCU FT245RL W/18LF8722

Module/Board Type: MCU, USB Core
Core Processor: PIC16F8722
Co-Processor: FT245RL
Speed: 24MHz
Flash Size: 128KB
RAM Size: 3.75KB
Connector Type: USB - B, Pin Header
Size / Dimension: 2.8" x 2" (71.1mm x 50.8mm)
Operating Temperature: -

Package: -

Stock6,128

PIC16F8722

FT245RL

24MHz

128KB

3.75KB

USB - B, Pin Header

2.8" x 2" (71.1mm x 50.8mm)

-

100-1221-3

Bluetechnix GmbH

CORE MOD CM-BF537E 600MHZ CONN

Module/Board Type: MPU Core
Core Processor: CM-BF537
Co-Processor: -
Speed: 600MHz
Flash Size: 4MB
RAM Size: 32MB
Connector Type: Expansion 2 x 60
Size / Dimension: 1.44" x 1.24" (36.5mm x 31.5mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Stock6,880

CM-BF537

-

600MHz

4MB

32MB

Expansion 2 x 60

1.44" x 1.24" (36.5mm x 31.5mm)

0°C ~ 70°C

EZ80F920120MOD

Zilog

MODULE EZ80F92 512K 20MHZ

Module/Board Type: MCU Core
Core Processor: eZ80F92
Co-Processor: -
Speed: 20MHz
Flash Size: 128KB (Internal), 1MB (External)
RAM Size: 8KB (Internal), 512KB (External)
Connector Type: Header 2x25
Size / Dimension: 2.5" x 2.5" (64mm x 64mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Stock7,824

eZ80F92

-

20MHz

128KB (Internal), 1MB (External)

8KB (Internal), 512KB (External)

Header 2x25

2.5" x 2.5" (64mm x 64mm)

0°C ~ 70°C

SOMAM3517-10-1780FJIR

Logic

SYSTEM ON MODULE AM3517

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3517
Co-Processor: -
Speed: 600MHz
Flash Size: 512MB
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 300
Size / Dimension: 1.61" x 2.02" (40.9mm x 51.2mm)
Operating Temperature: -40°C ~ 85°C

Package: -

Stock4,304

ARM? Cortex?-A8, AM3517

-

600MHz

512MB

256MB

Board-to-Board (BTB) Socket - 300

1.61" x 2.02" (40.9mm x 51.2mm)

-40°C ~ 85°C

TE0807-02-04EG-1E

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Stock5,280

-

TE0820-03-02EG-1ED

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 1.57" x 1.97" (40mm x 50mm)
Operating Temperature: 0°C ~ 85°C

Package: -

Stock5,616

Zynq UltraScale+ XCZU2EG-1SFVC784E

-

128MB

2GB

B2B

1.57" x 1.97" (40mm x 50mm)

0°C ~ 85°C

IW-G45M-S085-4E008G-E032G-BEA

iWave Systems

Stratix 10 SoC FPGA SOM

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53
Co-Processor: -
Speed: 1.5GHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 4.330" L x 2.950" W (110.00mm x 75.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

Request a Quote

ARM® Cortex®-A53

-

1.5GHz

-

4.330" L x 2.950" W (110.00mm x 75.00mm)

-40°C ~ 85°C

OSD32MP157C-512M-BAA

Octavo Systems LLC

SIP ARM CORTEX STM32MP157C

Module/Board Type: MPU Core
Core Processor: Arm® Dual Cortex®-A7, Arm® Cortex®-M4
Co-Processor: NEON™ SIMD
Speed: 650MHz, 209MHz
Flash Size: -
RAM Size: -
Connector Type: 302-BGA
Size / Dimension: 0.709" L x 0.709" W (18.00mm x 18.00mm)
Operating Temperature: 0°C ~ 85°C

Package: -

Stock1,662

Arm® Dual Cortex®-A7, Arm® Cortex®-M4

NEON™ SIMD

650MHz, 209MHz

-

302-BGA

0.709" L x 0.709" W (18.00mm x 18.00mm)

0°C ~ 85°C

TE0830-01-ABI26FAP

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ ZU11EG-1I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 16GB
Connector Type: 2 x 400 Pin
Size / Dimension: 4.724" L x 4.724" W (120.00mm x 120.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

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Zynq UltraScale+ ZU11EG-1I

-

128MB

16GB

2 x 400 Pin

4.724" L x 4.724" W (120.00mm x 120.00mm)

-40°C ~ 85°C

TE0823-01-3PIU1FA

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

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ARM Cortex-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

128MB

1GB

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

20-101-0072

Digi

DEV VERSION SMARTBLOCK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Request a Quote

-

ME-AA1-480-2I3-D12E-NFX3-R2

Enclustra FPGA Solutions

SOM ARRIA 10 10AS048 4GB

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Request a Quote

-

TE0741-05-D2C-1-A

Trenz Electronic GmbH

MODULE FPGA KINTEX

Module/Board Type: FPGA
Core Processor: Xilinx Kintex-7 FPGA XC7K325T-2FBG676C
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: -
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

Package: -

Request a Quote

Xilinx Kintex-7 FPGA XC7K325T-2FBG676C

-

32MB

-

Board-to-Board (BTB) Socket

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

TE0720-03-62I33NA

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 32GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

Package: -

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

32GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 70°C

ME-XU9-5EV-1I-D12E-L11-R3-0

Enclustra FPGA Solutions

SOM XU9 ZYNQ 5EV REV2.1

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I
Speed: -
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU5EV-1FBVB900I

-

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

-40°C ~ 85°C

TE0820-05-3BE81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

Package: -

Request a Quote

-

CC-WMX-ZC6D-L1

Digi

CC 93 SOM SINGLE-CORE WIRELESS

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Co-Processor: -
Speed: 250MHz, 1.7GHz
Flash Size: 8GB
RAM Size: 512MB
Connector Type: -
Size / Dimension: 1.770" L x 1.570" W (45.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

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ARM® Cortex®-A55, ARM® Cortex®-M33

-

250MHz, 1.7GHz

8GB

512MB

-

1.770" L x 1.570" W (45.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-92I31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7045)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

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ARM Cortex-A9

Zynq-7000 (Z-7045)

-

64MB

1GB

Board-to-Board (BTB) Socket - 480

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0714-03-50-2I

Trenz Electronic GmbH

IC MODULE

Module/Board Type: FPGA Core
Core Processor: Artix-7 A50T
Co-Processor: -
Speed: -
Flash Size: 16MB
RAM Size: 16MB
Connector Type: Samtec LSHM
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

Package: -

Stock105

Artix-7 A50T

-

16MB

Samtec LSHM

1.180" L x 1.570" W (30.00mm x 40.00mm)

-40°C ~ 85°C