The long wave infrared thermal imaging module provides industry-leading sensitivity | Heisener Electronics
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The long wave infrared thermal imaging module provides industry-leading sensitivity

Technology Cover
Post Date: 2022-05-05, Teledyne LeCroy

       AUVSI Xponential, Booth #2107, April 25-28, Orlando, Florida.

     Teledyne FLIR has released Boson+ with a thermal sensitivity of 20mK or less, which shares the industry-leading Boson thermal Imager module SWaP. It has the same mechanical, electrical and optical interfaces and is a direct upgrade that also incorporates updated image processing to provide enhanced clarity and contrast for defense and commercial applications. Making it the most sensitive LWIR camera currently available.

      Dan Walker, VICE President of Core Product Management at Teledyne FLIR OEM said:"Improved thermal sensitivity and automatic gain control (AGC) allow more scene detail in images for better detection, especially in outdoor low-contrast scenes," Improved thermal performance and recognized market-leading reliability make it an ideal uncooled thermal module for integration with unmanned platforms, security applications, handheld devices, wearables and thermal sights."

     While improved video latency, better tracking, seeker performance and decision support. The module also includes a redesigned 640 x 512 resolution, 12 micron pixel spacing detector with NEDT of 20mK or less, significantly improving DRI performance.

     A shared family of interfaces and access to the company's technical services team reduces development risk and reduces time-to-market. Designed for integrators, the device offers a variety of lens options, comprehensive product documentation, an easy-to-use SDK, and a user-friendly GUI. Boson + has dual uses and is classified by the U.S. Department of Commerce as EAR 6A003.b.4.a.

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