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74LCX543MTCX

hot 74LCX543MTCX

74LCX543MTCX

For Reference Only

Part Number 74LCX543MTCX
Manufacturer ON Semiconductor
Description IC TXRX NON-INVERT 3.6V 24TSSOP
Datasheet 74LCX543MTCX Datasheet
Package 24-TSSOP (0.173", 4.40mm Width)
In Stock 40000 piece(s)
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74LCX543MTCX

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74LCX543MTCX Specifications

ManufacturerON Semiconductor
CategoryIntegrated Circuits (ICs) - Logic - Buffers, Drivers, Receivers, Transceivers
Datasheet 74LCX543MTCX Datasheet
Package24-TSSOP (0.173", 4.40mm Width)
Series74LCX
Logic TypeTransceiver, Non-Inverting
Number of Elements1
Number of Bits per Element8
Output Type3-State
Current - Output High, Low24mA, 24mA
Voltage - Supply2 V ~ 3.6 V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package24-TSSOP

74LCX543MTCX Datasheet

Page 1

Page 2

To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. Is Now Part of ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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© 2001 Fairchild Semiconductor Corporation DS012463 www.fairchildsemi.com May 1995 Revised March 2001 7 4 L C X 5 4 3 L o w V o lta g e O c ta l R e g is te re d T ra n s c e iv e r w ith 5 V T o le ra n t In p u ts a n d O u tp u ts 74LCX543 Low Voltage Octal Registered Transceiver with 5V Tolerant Inputs and Outputs General Description The LCX543 is a non-inverting octal transceiver containing two sets of D-type registers for temporary storage of data flowing in either direction. Separate Latch Enable and Out- put Enable inputs are provided for each register to permit independent input and output control in either direction of data flow. The LCX543 is designed for low voltage (2.5V or 3.3V) VCC applications with capability of interfacing to a 5V signal environment. The LCX543 is fabricated with an advanced CMOS tech- nology to achieve high speed operation while maintaining CMOS low power dissipation. Features ■5V tolerant inputs and outputs ■2.3V − 3.6V VCC specifications provided ■7.0 ns tPD max (VCC = 3.3V), 10 µ A ICC max ■Power down high impedance inputs and outputs ■Supports live insertion/withdrawal (Note 1) ■ ± 24 mA Output Drive (VCC = 3.0V) ■ Implements patented noise/EMI reduction circuitry ■Latch-up performance exceeds 500 mA ■ESD performance: Human body model > 2000V Machine model > 200V Note 1: To ensure the high-impedance state during power up or down, OE should be tied to VCC through a pull-up resistor: the minimum value or the resistor is determined by the current-sourcing capability of the driver. Ordering Code: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagram Pin Descriptions Order Number Package Number Package Description 74LCX543WM M24B 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LCX543MSA MSA24 24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LCX543MTC MTC24 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Pin Names Description OEAB A-to-B Output Enable Input (Active LOW) OEBA B-to-A Output Enable Input (Active LOW) CEAB A-to-B Enable Input (Active LOW) CEBA B-to-A Enable Input (Active LOW) LEAB A-to-B Latch Enable Input (Active LOW) LEBA B-to-A Latch Enable Input (Active LOW) A0–A7 A-to-B Data Inputs or B-to-A 3-STATE Outputs B0–B7 B-to-A Data Inputs or A-to-B 3-STATE Outputs

Page 4

www.fairchildsemi.com 2 7 4 L C X 5 4 3 Logic Symbols IEEE/IEC Data I/O Control Table H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial A-to-B data flow shown; B-to-A flow control is the same, except using CEBA, LEBA and OEBA Functional Description The LCX543 contains two sets of eight D-type latches, with separate input and output controls for each set. For data flow from A to B, for example, the A-to-B Enable (CEAB) input must be LOW in order to enter data from A0–A7 or take data from B0–B7, as indicated in the Data I/O Control Table. With CEAB LOW, a LOW signal on the A-to-B Latch Enable (LEAB) input makes the A-to-B latches transparent; a subsequent LOW-to-HIGH transition of the LEAB signal puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB and OEAB both LOW, the 3-STATE B output buffers are active and reflect the data present at the output of the A latches. Con- trol of data flow from B to A is similar, but using the CEBA, LEBA and OEBA inputs. Logic Diagram Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. Inputs Latch Status Output Buffers CEAB LEAB OEAB H X X Latched High Z X H X Latched — L L X Transparent — X X H — High Z L X L — Driving

Page 5

3 www.fairchildsemi.com 7 4 L C X 5 4 3 Absolute Maximum Ratings(Note 2) Recommended Operating Conditions (Note 4) Note 2: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom- mended Operating Conditions” table will define the conditions for actual device operation. Note 3: IO Absolute Maximum Rating must be observed. Note 4: Unused inputs or I/O's must be held HIGH or LOW. They may not float. DC Electrical Characteristics Symbol Parameter Value Conditions Units VCC Supply Voltage − 0.5 to + 7.0 V VI DC Input Voltage − 0.5 to + 7.0 V VO DC Output Voltage − 0.5 to + 7.0 Output in 3-STATE V − 0.5 to VCC + 0.5 Output in HIGH or LOW State (Note 3) IIK DC Input Diode Current − 50 VI < GND mA IOK DC Output Diode Current − 50 VO < GND mA + 50 VO > VCC IO DC Output Source/Sink Current ± 50 mA ICC DC Supply Current per Supply Pin ± 100 mA IGND DC Ground Current per Ground Pin ± 100 mA TSTG Storage Temperature − 65 to + 150 ° C Symbol Parameter Min Max Units VCC Supply Voltage Operating 2.0 3.6 V Data Retention 1.5 3.6 VI Input Voltage 0 5.5 V VO Output Voltage HIGH or LOW State 0 VCC V 3-STATE 0 5.5 IOH/IOL Output Current VCC = 3.0V − 3.6V ± 24 mAVCC = 2.7V − 3.0V ± 12 VCC = 2.3V − 2.7V ± 8 TA Free-Air Operating Temperature − 40 85 ° C ∆ t/∆ V Input Edge Rate, VIN = 0.8V − 2.0V, VCC = 3.0V 0 10 ns/V Symbol Parameter Conditions VCC TA = − 40° C to + 85° C Units (V) Min Max VIH HIGH Level Input Voltage 2.3 − 2.7 1.7 V 2.7 − 3.6 2.0 VIL LOW Level Input Voltage 2.3 − 2.7 0.7 V 2.7 − 3.6 0.8 VOH HIGH Level Output Voltage IOH = − 100 µ A 2.3 − 3.6 VCC − 0.2 V IOH = − 8 mA 2.3 1.8 IOH = − 12 mA 2.7 2.2 IOH = − 18 mA 3.0 2.4 IOH = − 24 mA 3.0 2.2 VOL LOW Level Output Voltage IOL = 100 µ A 2.3 − 3.6 0.2 V IOL = 8mA 2.3 0.6 IOL = 12 mA 2.7 0.4 IOL = 16 mA 3.0 0.4 IOL = 24 mA 3.0 0.55 II Input Leakage Current 0 ≤ VI ≤ 5.5V 2.3 − 3.6 ± 5.0 µ A IOZ 3-STATE I/O Leakage 0 ≤ VO ≤ 5.5V 2.3 − 3.6 ± 5.0 µ A VI = VIH or VIL IOFF Power-Off Leakage Current VI or VO = 5.5V 0 10 µ A

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www.fairchildsemi.com 4 7 4 L C X 5 4 3 DC Electrical Characteristics (Continued) Note 5: Outputs disabled or 3-STATE only. AC Electrical Characteristics Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Dynamic Switching Characteristics Capacitance Symbol Parameter Conditions VCC TA = − 40° C to + 85° C Units (V) Min Max ICC Quiescent Supply Current VI = VCC or GND 2.3 − 3.6 10 µ A 3.6V ≤ VI, VO ≤ 5.5V (Note 5) 2.3 − 3.6 ± 10 ∆ ICC Increase in ICC per Input VIH = VCC − 0.6V 2.3 − 3.6 500 µ A Symbol Parameter TA = − 40° C to + 85° C, RL = 500Ω Units VCC = 3.3V ± 0.3V VCC = 2.7V VCC = 2.5V ± 0.2V CL = 50 pF CL = 50 pF CL = 30 pF Min Max Min Max Min Max tPHL Propagation Delay 1.5 7.0 1.5 8.0 1.5 8.4 ns tPLH An to Bn or Bn to An 1.5 7.0 1.5 8.0 1.5 8.4 tPHL Propagation Delay 1.5 8.5 1.5 9.5 1.5 10.5 ns tPLH LEBA to An or LEAB to Bn 1.5 8.5 1.5 9.5 1.5 10.5 tPZL Output Enable Time 1.5 9.0 1.5 10.0 1.5 11.0 nstPZH OEBA or OEAB to An or Bn 1.5 9.0 1.5 10.0 1.5 11.0 CEBA or CEAB to An or Bn tPLZ Output Disable Time 1.5 7.0 1.5 7.5 1.5 8.4 nstPHZ OEBA or OEAB to An or Bn 1.5 7.0 1.5 7.5 1.5 8.4 CEBA or CEAB to An or Bn tS Setup Time, HIGH or LOW Data to LEXX 2.5 2.5 4.0 ns tH Hold Time, HIGH or LOW Data to LEXX 1.5 1.5 2.0 ns tW Pulse Width, Latch Enable, LOW 3.3 3.3 3.3 ns tOSHL Output to Output Skew 1.0 ns tOSLH (Note 6) 1.0 Symbol Parameter Conditions VCC TA = 25° C Units (V) Typical VOLP Quiet Output Dynamic Peak VOL CL = 50 pF, VIH = 3.3V, VIL = 0V 3.3 0.8 V CL = 30 pF, VIH = 2.5V, VIL = 0V 2.5 0.6 VOLV Quiet Output Dynamic Valley VOL CL = 50 pF, VIH = 3.3V, VIL = 0V 3.3 − 0.8 V CL = 30 pF, VIH = 2.5V, VIL = 0V 2.5 − 0.6 Symbol Parameter Conditions Typical Units CIN Input Capacitance VCC = Open, VI = 0V or VCC 7 pF CI/O Input/Output Capacitance VCC = 3.3V, VI = 0V or VCC 8 pF CPD Power Dissipation Capacitance VCC = 3.3V, VI = 0V or VCC, f = 10 MHz 25 pF

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5 www.fairchildsemi.com 7 4 L C X 5 4 3 AC LOADING and WAVEFORMS Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Waveform for Inverting and Non-Inverting Functions Propagation Delay. Pulse Width and trec Waveforms 3-STATE Output Low Enable and Disable Times for Logic 3-STATE Output High Enable and Disable Times for Logic Setup Time, Hold Time and Recovery Time for Logic trise and tfall FIGURE 2. Waveforms (Input Characteristics; f =1MHz, tR = tF = 3ns) Test Switch tPLH, tPHL Open tPZL, tPLZ 6V at VCC = 3.3 ± 0.3V VCC x 2 at VCC = 2.5 ± 0.2V tPZH,tPHZ GND Symbol VCC 3.3V ± 0.3V 2.7V 2.5V ± 0.2V Vmi 1.5V 1.5V VCC/2 Vmo 1.5V 1.5V VCC/2 Vx VOL + 0.3V VOL + 0.3V VOL + 0.15V Vy VOH − 0.3V VOH − 0.3V VOH − 0.15V

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www.fairchildsemi.com 6 7 4 L C X 5 4 3 Schematic Diagram Generic for LCX Family

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7 www.fairchildsemi.com 7 4 L C X 5 4 3 Physical Dimensions inches (millimeters) unless otherwise noted 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide Package Number M24B 24-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA24

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www.fairchildsemi.com 8 7 4 L C X 5 4 3 L o w V o lt a g e O c ta l R e g is te re d T ra n s c e iv e r w it h 5 V T o le ra n t In p u ts a n d O u tp u ts Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC24 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea- sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com

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