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For Reference Only

Part Number 74LCXH16245MTDX
Manufacturer ON Semiconductor
Datasheet 74LCXH16245MTDX Datasheet
Package 48-TFSOP (0.240", 6.10mm Width)
In Stock 258 piece(s)
Unit Price $ 0.603 *
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74LCXH16245MTDX Specifications

ManufacturerON Semiconductor
CategoryIntegrated Circuits (ICs) - Logic - Buffers, Drivers, Receivers, Transceivers
Datasheet 74LCXH16245MTDX Datasheet
Package48-TFSOP (0.240", 6.10mm Width)
Logic TypeTransceiver, Non-Inverting
Number of Elements2
Number of Bits per Element8
Output Type3-State
Current - Output High, Low24mA, 24mA
Voltage - Supply2 V ~ 3.6 V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package48-TSSOP

74LCXH16245MTDX Datasheet

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To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. Is Now Part of ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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© 2005 Fairchild Semiconductor Corporation DS500581 www.fairchildsemi.com May 2002 Revised June 2005 7 4 L C X H 1 6 2 4 5 L o w V o lta g e 1 6 -B it B id ire c tio n a l T ra n s c e iv e r w ith B u s h o ld 74LCXH16245 Low Voltage 16-Bit Bidirectional Transceiver with Bushold General Description The LCXH16245 contains sixteen non-inverting bidirec- tional buffers with 3-STATE outputs and is intended for bus oriented applications. The device is designed for low volt- age (2.5V or 3.3V) VCC applications with capability of inter- facing to a 5V signal environment. The device is byte controlled. Each byte has separate control inputs which could be shorted together for full 16-bit operation. The T/R inputs determine the direction of data flow through the device. The OE inputs disable both the A and B Ports by placing them in a high impedance state. The LCXH16245 data inputs include active bushold cir- cuitry, eliminating the need for external pull-up resistors to hold unused or floating data inputs at a valid logic level. The LCXH16245 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain- ing CMOS low power dissipation. Features ■2.3V–3.6V VCC specifications provided ■4.5 ns tPD max (VCC 3.3V), 20 PA ICC max ■Power-down high impedance outputs ■Bushold on inputs eliminates the need for external pull-up/pull-down resistors ■r24 mA output drive (VCC 3.0V) ■ Implements patented noise/EMI reduction circuitry ■Latch-up performance conforms to the requirements of JESD78 ■ESD performance: Human body model ! 2000V Machine model ! 200V ■Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA) Ordering Code: Note 1: Ordering Code “G” indicates Trays. Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Logic Symbol Order Number Package Number Package Description 74LCXH16245G (Note 1) (Note 2) BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide 74LCXH16245MTD (Note 2) MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

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www.fairchildsemi.com 2 7 4 L C X H 1 6 2 4 5 Connection Diagrams Pin Assignment for SSOP and TSSOP Pin Assignment for FBGA (Top Thru View) Pin Descriptions FBGA Pin Assignments Truth Tables H HIGH Voltage Level L LOW Voltage Level X Immaterial Z High Impedance Logic Diagram Pin Names Description OEn Output Enable Input T/Rn Transmit/Receive Input A0–A15 Side A Inputs or 3-STATE Outputs (Bushold) B0–B15 Side B Inputs or 3-STATE Outputs (Bushold) 1 2 3 4 5 6 A B0 NC T/R1 OE1 NC A0 B B2 B1 NC NC A1 A2 C B4 B3 VCC VCC A3 A4 D B6 B5 GND GND A5 A6 E B8 B7 GND GND A7 A8 F B10 B9 GND GND A9 A10 G B12 B11 VCC VCC A11 A12 H B14 B13 NC NC A13 A14 J B15 NC T/R2 OE2 NC A15 Inputs Outputs OE1 T/R1 L L Bus B0–B7 Data to Bus A0–A7 L H Bus A0–A7 Data to Bus B0–B7 H X HIGH Z State on A0–A7, B0–B7 Inputs Outputs OE2 T/R2 L L Bus B8–B15 Data to Bus A8–A15 L H Bus A8–A15 Data to Bus B8–B15 H X HIGH Z State on A8–A15, B8–B15

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3 www.fairchildsemi.com 7 4 L C X H 1 6 2 4 5 Absolute Maximum Ratings(Note 3) Recommended Operating Conditions (Note 5) Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The “Recom- mended Operating Conditions” table will define the conditions for actual device operation. Note 4: IO Absolute Maximum Rating must be observed. Note 5: Floating or unused control inputs must be HIGH or LOW. DC Electrical Characteristics Symbol Parameter Value Conditions Units VCC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to VCC  0.5 V VO DC Output Voltage 0.5 to 7.0 Output in 3-STATE V 0.5 to VCC  0.5 Output in HIGH or LOW State (Note 4) IIK DC Input Diode Current 50 VI  GND mA IOK DC Output Diode Current 50 VO  GND mA 50 VO ! VCC IO DC Output Source/Sink Current r50 mA ICC DC Supply Current per Supply Pin r100 mA IGND DC Ground Current per Ground Pin r100 mA TSTG Storage Temperature 65 to 150 qC Symbol Parameter Min Max Units VCC Supply Voltage Operating 2.0 3.6 V Data Retention 1.5 3.6 VI Input Voltage 0 VCC V VO Output Voltage HIGH or LOW State 0 VCC V 3-STATE 0 VCC IOH/IOL Output Current VCC 3.0V  3.6V r24 mAVCC 2.7V  3.0V r12 VCC 2.3V  2.7V r8 TA Free-Air Operating Temperature 40 85 qC 't/'V Input Edge Rate, VIN 0.8V–2.0V, VCC 3.0V 0 10 ns/V Symbol Parameter Conditions VCC TA 40qC to 85qC Units (V) Min Max VIH HIGH Level Input Voltage 2.3  2.7 1.7 V 2.7  3.6 2.0 VIL LOW Level Input Voltage 2.3  2.7 0.7 V 2.7  3.6 0.8 VOH HIGH Level Output Voltage IOH 100 PA 2.3  3.6 VCC  0.2 V IOH 8 mA 2.3 1.8 IOH 12 mA 2.7 2.2 IOH 18 mA 3.0 2.4 IOH 24 mA 3.0 2.2 VOL LOW Level Output Voltage IOL 100 PA 2.3  3.6 0.2 V IOL 8mA 2.3 0.6 IOL 12 mA 2.7 0.4 IOL 16 mA 3.0 0.4 IOL 24 mA 3.0 0.55 II Input Leakage Current Data VI VCC or GND 2.3  3.6 r5.0 PA Control O d VI d 5.5 2.3  3.6 r5.0

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www.fairchildsemi.com 4 7 4 L C X H 1 6 2 4 5 DC Electrical Characteristics (Continued) Note 6: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 7: An external driver must sink at least the specified current to switch from HIGH-to-LOW. AC Electrical Characteristics Note 8: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH). Parameter guaranteed by design. Dynamic Switching Characteristics Capacitance Symbol Parameter Conditions VCC TA 40qC to 85qC Units (V) Min Max II(HOLD) Bushold Input Minimum VIN 0.7V 2.3 45 PA Drive Hold Current VIN 1.7V 45 VIN 0.8V 3.0 75 VIN 2.0V 75 II(OD) Bushold Input Over-Drive (Note 6) 2.7 300 PA Current to Change State (Note 7) 300 (Note 6) 3.6 450 (Note 7) 450 IOZ 3-STATE I/O Leakage VO VCC or GND 2.3  3.6 r5.0 PA IOFF Power-Off Leakage Current VI or VO 5.5V 0 10 PA ICC Quiescent Supply Current VI VCC or GND 2.3–3.6 20 PA 'ICC Increase in ICC per Input VIH VCC 0.6V 2.3–3.6 500 PA Symbol Parameter TA 40qC to 85qC, RL 500: Units VCC 3.3V r 0.3V VCC 2.7V VCC 2.5V r 0.2V CL 50 pF CL 50 pF CL 30 pF Min Max Min Max Min Max tPHL Propagation Delay 1.0 4.5 1.0 5.2 1.0 5.4 ns tPLH An to Bn or Bn to An 1.0 4.5 1.0 5.2 1.0 5.4 tPZL Output Enable Time 1.0 6.5 1.0 7.2 1.0 8.5 ns tPZH 1.0 6.5 1.0 7.2 1.0 8.5 tPLZ Output Disable Time 1.0 6.4 1.0 6.9 1.0 7.7 ns tPHZ 1.0 6.4 1.0 6.9 1.0 7.7 tOSHL Output to Output Skew (Note 8) 1.0 ns tOSLH 1.0 Symbol Parameter Conditions VCC (V) TA 25qC Units Typical VOLP Quiet Output Dynamic Peak VOL CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 V CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 VOLV Quiet Output Dynamic Valley VOL CL 50 pF, VIH 3.3V, VIL 0V 3.3 0.8 V CL 30 pF, VIH 2.5V, VIL 0V 2.5 0.6 Symbol Parameter Conditions Typical Units CIN Input Capacitance VCC Open, VI 0V or VCC 7 pF CI/O Input/Output Capacitance VCC 3.3V, VI 0V or VCC 8 pF CPD Power Dissipation Capacitance VCC 3.3V, VI 0V or VCC, f 10 MHz 20 pF

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5 www.fairchildsemi.com 7 4 L C X H 1 6 2 4 5 AC LOADING and WAVEFORMS Generic for LCX Family FIGURE 1. AC Test Circuit (CL includes probe and jig capacitance) Waveform for Inverting and Non-Inverting Functions Propagation Delay. Pulse Width and trec Waveforms 3-STATE Output Low Enable and Disable Times for Logic 3-STATE Output High Enable and Disable Times for Logic Setup Time, Hold Time and Recovery Time for Logic trise and tfall FIGURE 2. Waveforms (Input Characteristics; f =1MHz, tr = tf = 3ns) Test Switch tPLH, tPHL Open tPZL, tPLZ 6V at VCC 3.3 r 0.3V, 2.7V and VCC x 2 at VCC 2.5 r 0.2V tPZH, tPHZ GND Symbol VCC 3.3V r 0.3V 2.7V 2.5V r 0.2V Vmi 1.5V 1.5V VCC/2 Vmo 1.5V 1.5V VCC/2 Vx VOL  0.3V VOL  0.3V VOL  0.15V Vy VOH  0.3V VOH  0.3V VOH  0.15V

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www.fairchildsemi.com 6 7 4 L C X H 1 6 2 4 5 Schematic Diagram Generic for LCX Family

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7 www.fairchildsemi.com 7 4 L C X H 1 6 2 4 5 Physical Dimensions inches (millimeters) unless otherwise noted 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Package Number BGA54A

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www.fairchildsemi.com 8 7 4 L C X H 1 6 2 4 5 L o w V o lt a g e 1 6 -B it B id ir e c ti o n a l T ra n s c e iv e r w it h B u s h o ld Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48 Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea- sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com

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