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AD9238BSTZ-20

hot AD9238BSTZ-20

AD9238BSTZ-20

For Reference Only

Part Number AD9238BSTZ-20
Manufacturer Analog Devices Inc.
Description IC ADC 12BIT DUAL 20MSPS 64-LQFP
Datasheet AD9238BSTZ-20 Datasheet
Package 64-LQFP
In Stock 1580 piece(s)
Unit Price $ 22.68 *
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AD9238BSTZ-20 Specifications

ManufacturerAnalog Devices Inc.
CategoryIntegrated Circuits (ICs) - Data Acquisition - Analog to Digital Converters (ADC)
Datasheet AD9238BSTZ-20 Datasheet
Package64-LQFP
Series-
Number of Bits12
Sampling Rate (Per Second)20M
Number of Inputs2
Input TypeDifferential, Single Ended
Data InterfaceParallel
ConfigurationS/H-ADC
Ratio - S/H:ADC1:1
Number of A/D Converters2
ArchitecturePipelined
Reference TypeExternal, Internal
Voltage - Supply, Analog2.7 V ~ 3.6 V
Voltage - Supply, Digital2.25 V ~ 3.6 V
FeaturesSimultaneous Sampling
Operating Temperature-40°C ~ 85°C
Package / Case64-LQFP
Supplier Device Package64-LQFP (7x7)

AD9238BSTZ-20 Datasheet

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12-Bit, 20 MSPS/40 MSPS/65 MSPS Dual A/D Converter AD9238 Rev. C Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 ©2003–2010 Analog Devices, Inc. All rights reserved. FEATURES Integrated dual 12-bit ADC Single 3 V supply operation (2.7 V to 3.6 V) SNR = 70 dB (to Nyquist, AD9238-65) SFDR = 80.5 dBc (to Nyquist, AD9238-65) Low power: 300 mW/channel at 65 MSPS Differential input with 500 MHz, 3 dB bandwidth Exceptional crosstalk immunity > 85 dB Flexible analog input: 1 V p-p to 2 V p-p range Offset binary or twos complement data format Clock duty cycle stabilizer Output datamux option APPLICATIONS Ultrasound equipment Direct conversion or IF sampling receivers WB-CDMA, CDMA2000, WiMAX Battery-powered instruments Hand-held scopemeters Low cost, digital oscilloscopes GENERAL DESCRIPTION The AD9238 is a dual, 3 V, 12-bit, 20 MSPS/40 MSPS/65 MSPS analog-to-digital converter (ADC). It features dual high performance sample-and-hold amplifiers (SHAs) and an integrated voltage reference. The AD9238 uses a multistage differential pipelined architecture with output error correction logic to provide 12-bit accuracy and to guarantee no missing codes over the full operating temperature range at up to 65 MSPS data rates. The wide bandwidth, differential SHA allows for a variety of user-selectable input ranges and offsets, including single-ended applications. It is suitable for various applications, including multiplexed systems that switch full- scale voltage levels in successive channels and for sampling inputs at frequencies well beyond the Nyquist rate. Dual single-ended clock inputs are used to control all internal conversion cycles. A duty cycle stabilizer is available and can compensate for wide variations in the clock duty cycle, allowing the converter to maintain excellent performance. The digital output data is presented in either straight binary or twos complement format. Out-of-range signals indicate an overflow condition, which can be used with the most significant bit to determine low or high overflow. FUNCTIONAL BLOCK DIAGRAM VIN+_A VIN–_A REFT_A REFB_A VREF SENSE AGND REFT_B REFB_B VIN+_B VIN–_B OTR_A D11_A TO D0_A OEB_A MUX_SELECT CLK_A CLK_B DCS SHARED_REF PWDN_A PWDN_B DFS OTR_B D11_B TO D0_B OEB_B AVDD AGND DRVDD DRGND 12 AD9238 12 0.5V OUTPUT MUX/ BUFFERS 1212 OUTPUT MUX/ BUFFERS CLOCK DUTY CYCLE STABILIZER MODE CONTROL ADC SHA SHA 02 64 0- 00 1 ADC Figure 1. Fabricated on an advanced CMOS process, the AD9238 is available in a Pb-free, space saving, 64-lead LQFP or LFCSP and is specified over the industrial temperature range (−40°C to +85°C). PRODUCT HIGHLIGHTS 1. Pin-compatible with the AD9248, 14-bit 20MSPS/ 40 MSPS/65 MSPS ADC. 2. Speed grade options of 20 MSPS, 40 MSPS, and 65 MSPS allow flexibility between power, cost, and performance to suit an application. 3. Low power consumption: AD9238-65: 65 MSPS = 600 mW, AD9238-40: 40 MSPS = 330 mW, and AD9238-20: 20 MSPS = 180 mW. 4. Typical channel isolation of 85 dB @ fIN = 10 MHz. 5. The clock duty cycle stabilizer (AD9238-20/AD9238-40/ AD9238-65) maintains performance over a wide range of clock duty cycles. 6. Multiplexed data output option enables single-port operation from either Data Port A or Data Port B.

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AD9238 Rev. C | Page 2 of 48 TABLE OF CONTENTS Specifications ..................................................................................... 4  DC Specifications ......................................................................... 4  AC Specifications .......................................................................... 5  Digital Specifications ................................................................... 6  Switching Specifications .............................................................. 6  Absolute Maximum Ratings ............................................................ 7  Explanation of Test Levels ........................................................... 7  ESD Caution .................................................................................. 7  Pin Configurations and Function Descriptions............................ 8  Terminology .................................................................................... 10  Typical Performance Characteristics ........................................... 11  Equivalent Circuits ......................................................................... 15  Theory of Operation ...................................................................... 16  Analog Input ............................................................................... 16  Clock Input and Considerations .............................................. 17  Power Dissipation and Standby Mode ..................................... 18  Digital Outputs ........................................................................... 18  Timing .......................................................................................... 18  Data Format ................................................................................ 19  Voltage Reference ....................................................................... 19  AD9238 LQFP Evaluation Board ................................................. 21  Clock Circuitry ........................................................................... 21  Analog Inputs ............................................................................. 21  Reference Circuitry .................................................................... 21  Digital Control logic .................................................................. 21  Outputs ........................................................................................ 21  LQFP Evaluation Board Bill of Materials (BOM) .................. 23  LQFP Evaluation Board Schematics ........................................ 24  LQFP PCB Layers ....................................................................... 28  Dual ADC LFCSP PCB .................................................................. 34  Power Connector ........................................................................ 34  Analog Inputs ............................................................................. 34  Optional Operational Amplifier .............................................. 34  Clock ............................................................................................ 34  Voltage Reference ....................................................................... 34  Data Outputs ............................................................................... 34  LFCSP Evaluation Board Bill of Materials (BOM) ................ 35  LFCSP PCB Schematics ............................................................. 36  LFCSP PCB Layers ..................................................................... 39  Thermal Considerations ............................................................ 44  Outline Dimensions ....................................................................... 45  Ordering Guide .......................................................................... 46  REVISION HISTORY 11/10—Rev. B to Rev. C Changes to Absolute Maximum Ratings Section ......................... 7 Added Figure 4; Renumbered Sequentially .................................. 8 Changes to Analog Input Section ................................................. 16 Deleted Note 1 from Dual ADC LFCSP PCB Section ............... 34 Changes to Outline Dimensions ................................................... 45 4/05—Rev. A to Rev. B Changes to Format and Layout ........................................ Universal Added LFCSP ..................................................................... Universal Changes to Features and Applications ........................................... 1 Changes to General Description and Product Highlights .......... 1 Changes to Figure 1 .......................................................................... 1 Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 5 Added Digital Specifications ........................................................... 6 Moved Switching Specifications to ................................................ 6 Changes to Pin Function Descriptions .......................................... 8 Changes to Terminology Section ................................................. 10 Changes to Figure 29 ...................................................................... 15 Changes to Clock Input and Considerations Section ................ 17 Changes to Figure 33 ...................................................................... 18 Changes to Data Format Section .................................................. 19 Added AD9238 LQFP Evaluation Board Section ...................... 21 Added Dual ADC LFCSP PCB Section ....................................... 34 Added Thermal Considerations Section ..................................... 44 Updated Outline Dimensions ....................................................... 45 Changes to Ordering Guide .......................................................... 46

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AD9238 Rev. C | Page 3 of 48 9/03—Rev. 0 to Rev. A Changes to DC Specifications ........................................................ 2 Changes to Switching Specifications ............................................. 3 Changes to AC Specifications ......................................................... 4 Changes to Figure 1 .......................................................................... 4 Changes to Ordering Guide ............................................................ 5 Changes to TPCs 2, 3, and 6 ........................................................... 8 Changes to Clock Input and Considerations Section ................ 13 Added Text to Data Format Section ............................................ 15 Changes to Figure 9 ........................................................................ 16 Added Evaluation Board Diagrams Section ............................... 17 Update Outline Dimensions ......................................................... 24 2/03—Revision 0: Initial Version

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AD9238 Rev. C | Page 4 of 48 SPECIFICATIONS DC SPECIFICATIONS AVDD = 3 V, DRVDD = 2.5 V, maximum sample rate, CLK_A = CLK_B; AIN = −0.5 dBFS differential input, 1.0 V internal reference, TMIN to TMAX, DCS enabled, unless otherwise noted. Table 1. Test AD9238BST/BCP-20 AD9238BST/BCP-40 AD9238BST/BCP-65 Parameter Temp Level Min Typ Max Min Typ Max Min Typ Max Unit RESOLUTION Full VI 12 12 12 Bits ACCURACY No Missing Codes Guaranteed Full VI 12 12 12 Bits Offset Error Full VI ±0.30 ±1.2 ±0.50 ±1.1 ±0.50 ±1.1 % FSR Gain Error1 Full IV ±0.30 ±2.2 ±0.50 ±2.4 ±0.50 ±2.5 % FSR Differential Nonlinearity (DNL)2 Full V ±0.35 ±0.35 ±0.35 LSB 25°C I ±0.35 ±0.9 ±0.35 ±0.8 ±0.35 ±1.0 LSB Integral Nonlinearity (INL)2 Full V ±0.45 ±0.60 ±0.70 LSB 25°C I ±0.40 ±1.4 ±0.50 ±1.4 ±0.55 ±1.75 LSB TEMPERATURE DRIFT Offset Error Full V ±4 ±4 ±6 μV/°C Gain Error Full V ±12 ±12 ±12 ppm/°C INTERNAL VOLTAGE REFERENCE Output Voltage Error (1 V Mode) Full VI ±5 ±35 ±5 ±35 ±5 ±35 mV Load Regulation @ 1.0 mA Full V 0.8 0.8 0.8 mV Output Voltage Error (0.5 V Mode) Full V ±2.5 ±2.5 ±2.5 mV Load Regulation @ 0.5 mA Full V 0.1 0.1 0.1 mV INPUT REFERRED NOISE Input Span = 1 V 25°C V 0.54 0.54 0.54 LSB rms Input Span = 2.0 V 25°C V 0.27 0.27 0.27 LSB rms ANALOG INPUT Input Span = 1.0 V Full IV 1 1 1 V p-p Input Span = 2.0 V Full IV 2 2 2 V p-p Input Capacitance3 Full V 7 7 7 pF REFERENCE INPUT RESISTANCE Full V 7 7 7 kΩ POWER SUPPLIES Supply Voltages AVDD Full IV 2.7 3.0 3.6 2.7 3.0 3.6 2.7 3.0 3.6 V DRVDD Full IV 2.25 3.0 3.6 2.25 3.0 3.6 2.25 3.0 3.6 V Supply Current IAVDD2 Full V 60 110 200 mA IDRVDD2 Full V 4 10 14 mA PSRR Full V ±0.01 ±0.01 ±0.01 % FSR POWER CONSUMPTION DC Input4 Full V 180 330 600 mW Sine Wave Input2 Full VI 190 212 360 397 640 698 mW Standby Power5 Full V 2.0 2.0 2.0 mW MATCHING CHARACTERISTICS Offset Error 25°C V ±0.1 ±0.1 ±0.1 % FSR Gain Error 25°C V ±0.05 ±0.05 ±0.05 % FSR 1 Gain error and gain temperature coefficient are based on the ADC only (with a fixed 1.0 V external reference). 2 Measured at maximum clock rate with a low frequency sine wave input and approximately 5 pF loading on each output bit. 3 Input capacitance refers to the effective capacitance between one differential input pin and AVSS. Refer to Figure for the equivalent analog input structure. 29 4 Measured with dc input at maximum clock rate. 5 Standby power is measured with the CLK_A and CLK_B pins inactive (that is, set to AVDD or AGND).

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AD9238 Rev. C | Page 5 of 48 AC SPECIFICATIONS AVDD = 3 V, DRVDD = 2.5 V, maximum sample rate, CLK_A = CLK_B; AIN = −0.5 dBFS differential input, 1.0 V internal reference, TMIN to TMAX, DCS enabled, unless otherwise noted. Table 2. Test AD9238BST/BCP-20 AD9238BST/BCP-40 AD9238BST/BCP-65 Parameter Temp Level Min Typ Max Min Typ Max Min Typ Max Unit SIGNAL-TO-NOISE RATIO (SNR) fINPUT = 2.4 MHz 25°C V 70.4 70.4 70.3 dB fINPUT = 9.7 MHz Full V 70.2 dB 25°C IV 69.7 70.4 dB fINPUT = 19.6 MHz Full V 70.1 dB 25°C IV 69.7 70.3 dB fINPUT = 32.5 MHz Full V 69.3 dB 25°C IV 68.7 70.0 dB fINPUT = 100 MHz 25°C V 68.7 68.3 67.6 dB SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD) fINPUT = 2.4 MHz 25°C V 70.2 70.2 70.1 dB fINPUT = 9.7 MHz Full V 70.1 dB 25°C IV 69.3 70.2 dB fINPUT = 19.6 MHz Full V 69.9 dB 25°C IV 69.4 70.1 dB fINPUT = 32.5 MHz Full V 68.9 dB 25°C IV 68.1 69.1 dB fINPUT = 100 MHz 25°C V 67.9 67.9 66.6 dB EFFECTIVE NUMBER OF BITS (ENOB) fINPUT = 2.4 MHz 25°C V 11.5 11.5 11.4 Bits fINPUT = 9.7 MHz Full V 11.4 Bits 25°C IV 11.3 11.5 Bits fINPUT = 19.6 MHz Full V 11.4 Bits 25°C IV 11.3 11.4 Bits fINPUT = 32.5 MHz Full V 11.2 Bits 25°C IV 11.1 11.3 Bits fINPUT = 100 MHz 25°C V 11.1 11.1 10.9 Bits WORST HARMONIC (SECOND or THIRD) fINPUT = 9.7 MHz Full V −84.0 dBc fINPUT = 19.6 MHz Full V −85.0 dBc fINPUT = 35 MHz Full V −80.0 dBc SPURIOUS-FREE DYNAMIC RANGE (SFDR) fINPUT = 2.4 MHz 25°C V 86.0 86.0 86.0 dBc fINPUT = 9.7 MHz Full V 84.0 dBc 25°C I 76.1 86.0 dBc fINPUT = 19.6 MHz Full V 85.0 dBc 25°C I 76.7 86.0 dBc fINPUT = 32.5 MHz Full V 80.0 dBc 25°C I 72.5 80.5 dBc fINPUT = 100 MHz 25°C V 75.0 dBc CROSSTALK Full V −85.0 −85.0 −85.0 dB

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AD9238 Rev. C | Page 6 of 48 DIGITAL SPECIFICATIONS AVDD = 3 V, DRVDD = 2.5 V, maximum sample rate, CLK_A = CLK_B; AIN = −0.5 dBFS differential input, 1.0 V internal reference, TMIN to TMAX, DCS enabled, unless otherwise noted. Table 3. Test AD9238BST/BCP-20 AD9238BST/BCP-40 AD9238BST/BCP-65 Parameter Temp Level Min Typ Max Min Typ Max Min Typ Max Unit LOGIC INPUTS High Level Input Voltage Full IV 2.0 2.0 2.0 V Low Level Input Voltage Full IV 0.8 0.8 0.8 V High Level Input Current Full IV −10 +10 −10 +10 −10 +10 μA Low Level Input Current Full IV −10 +10 −10 +10 −10 +10 μA Input Capacitance Full IV 2 2 2 pF LOGIC OUTPUTS1 High Level Output Voltage Full IV DRVDD − 0.05 DRVDD − 0.05 DRVDD − 0.05 V Low Level Output Voltage Full IV 0.05 0.05 0.05 V 1 Output voltage levels measured with capacitive load only on each output. SWITCHING SPECIFICATIONS AVDD = 3 V, DRVDD = 2.5 V, maximum sample rate, CLK_A = CLK_B; AIN = −0.5 dBFS differential input, 1.0 V internal reference, TMIN to TMAX, DCS enabled, unless otherwise noted. Table 4. Test AD9238BST/BCP-20 AD9238BST/BCP-40 AD9238BST/BCP-65 Parameter Temp Level Min Typ Max Min Typ Max Min Typ Max Unit SWITCHING PERFORMANCE Maximum Conversion Rate Full VI 20 40 65 MSPS Minimum Conversion Rate Full V 1 1 1 MSPS CLK Period Full V 50.0 25.0 15.4 ns CLK Pulse-Width High1 Full V 15.0 8.8 6.2 ns CLK Pulse-Width Low1 Full V 15.0 8.8 6.2 ns DATA OUTPUT PARAMETER Output Delay2 (tPD) Full VI 2 3.5 6 2 3.5 6 2 3.5 6 ns Pipeline Delay (Latency) Full V 7 7 7 Cycles Aperture Delay (tA) Full V 1.0 1.0 1.0 ns Aperture Uncertainty (tJ) Full V 0.5 0.5 0.5 ps rms Wake-Up Time3 Full V 2.5 2.5 2.5 ms OUT-OF-RANGE RECOVERY TIME Full V 2 2 2 Cycles 1 The AD9238-65 model has a duty cycle stabilizer circuit that, when enabled, corrects for a wide range of duty cycles (see Figure 24). 2 Output delay is measured from clock 50% transition to data 50% transition, with a 5 pF load on each output. 3 Wake-up time is dependent on the value of the decoupling capacitors; typical values shown with 0.1 μF and 10 μF capacitors on REFT and REFB. N–1 N N+1 N+2 N+3 N+4 N+5 N+6 N+7 N+8 ANALOG INPUT CLOCK DATA OUT N–9 N–8 N–7 N–6 N–5 N–4 N–3 N–2 N–1 N MIN 2.0ns, MAX 6.0ns tPD = 02 64 0- 00 2 Figure 2. Timing Diagram

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AD9238 Rev. C | Page 7 of 48 ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings are limiting values to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period may affect device reliability. Table 5. Parameter Rating ELECTRICAL AVDD to AGND −0.3 V to +3.9 V DRVDD to DRGND −0.3 V to +3.9 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −3.9 V to +3.9 V Digital Outputs to DRGND −0.3 V to DRVDD + 0.3 V OEB, DFS, CLK, DCS, MUX_SELECT, SHARED_REF to AGND −0.3 V to AVDD + 0.3 V VINA, VINB to AGND −0.3 V to AVDD + 0.3 V VREF to AGND −0.3 V to AVDD + 0.3 V SENSE to AGND −0.3 V to AVDD + 0.3 V REFB, REFT to AGND −0.3 V to AVDD + 0.3 V PDWN to AGND −0.3 V to AVDD + 0.3 V ENVIRONMENTAL1 Operating Temperature −40°C to +85°C Junction Temperature 150°C Lead Temperature (10 sec) 300°C Storage Temperature −65°C to +150°C 1 Typical thermal impedances: 64-lead LQFP, θJA = 54°C/W; 64-lead LFCSP, θJA = 26.4°C/W with heat slug soldered to ground plane. These measurements were taken on a 4-layer board in still air, in accordance with EIA/JESD51-7. EXPLANATION OF TEST LEVELS I 100% production tested. II 100% production tested at 25°C and sample tested at specified temperatures. III Sample tested only. IV Parameter is guaranteed by design and characterization testing. V Parameter is a typical value only. VI 100% production tested at 25°C; guaranteed by design and characterization testing for industrial temperature range; 100% production tested at temperature extremes for military devices. ESD CAUTION

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AD9238 Rev. C | Page 8 of 48 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 9 10 11 13 14 15 16 12 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 64 63 62 61 60 55 54 53 52 51 50 4959 58 57 56 PIN 1 IDENTIFIER 64-LEAD LQFP TOP VIEW (Not to Scale) D4_A D3_A D2_A D1_A D0_A (LSB) DNC DNC DRGND OTR_B D11_B (MSB) D10_B D9_B D8_B D7_B D6_B AD9238 AGND AVDD REFT_A REFB_A VREF SENSE REFB_B AGND VIN–_B VIN+_B VIN+_A VIN–_A AVDD REFT_B C L K _ A S H A R E D _ R E F M U X _S E L E C T O E B _A D 1 1 _ A ( M S B ) D 1 0 _ A D 9 _ A D 8 _ A D R G N D D 7 _ A D 6 _ A D 5 _ A C L K _ B D C S D F S P D W N _B O E B _B D N C D 0 _ B (L S B ) D 1 _ B D 2 _ B D R G N D D 3 _ B D 4 _ B D 5 _ B D N C AGND AGND A V D D D R V D D DRVDD A V D D P D W N _A O T R _A D R V D D DNC = DO NOT CONNECT 02 6 4 0 -0 0 3 Figure 3. 64-Lead LQFP Pin Configuration 64-LEAD LFCSP TOP VIEW (Not to Scale) D4_A D3_A D2_A D1_A D0_A (LSB) DNC DNC DRGND OTR_B D11_B (MSB) D10_B D9_B D8_B D7_B D6_B AD9238 AGND AVDD REFT_A REFB_A VREF SENSE REFB_B AGND VIN–_B VIN+_B VIN+_A VIN–_A AVDD REFT_B C L K _A S H A R E D _R E F M U X _S E L E C T O E B _A D 11 _A ( M S B ) D 10 _A D 9_ A D 8_ A D R G N D D 7_ A D 6_ A D 5_ A C L K _B D C S D F S P D W N _B O E B _B D N C D 0_ B ( L S B ) D 1_ B D 2_ B D R G N D D 3_ B D 4_ B D 5_ B D N C AGND AGND A V D D D R V D D DRVDD A V D D P D W N _A O T R _A D R V D D PIN 1 INDICATOR 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NOTES 1. THERE IS AN EXPOSED PAD THAT MUST CONNECT TO AGND. 2. DNC = DO NOT CONNECT. 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 02 64 0- 1 03 Figure 4. 64-Lead LFCSP Pin Configuration

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AD9238 Rev. C | Page 9 of 48 Table 6. 64-Lead LQFP and 64-Lead LFCSP Pin Function Descriptions Pin No. Mnemonic Description 1, 4, 13, 16 AGND Analog Ground. 2 VIN+_A Analog Input Pin (+) for Channel A. 3 VIN–_A Analog Input Pin (−) for Channel A. 5, 12, 17, 64 AVDD Analog Power Supply. 6 REFT_A Differential Reference (+) for Channel A. 7 REFB_A Differential Reference (−) for Channel A. 8 VREF Voltage Reference Input/Output. 9 SENSE Reference Mode Selection. 10 REFB_B Differential Reference (−) for Channel B. 11 REFT_B Differential Reference (+) for Channel B. 14 VIN−_B Analog Input Pin (−) for Channel B. 15 VIN+_B Analog Input Pin (+) for Channel B. 18 CLK_B Clock Input Pin for Channel B. 19 DCS Enable Duty Cycle Stabilizer (DCS) Mode (Tie High to Enable). 20 DFS Data Output Format Select Bit (Low for Offset Binary, High for Twos Complement). 21 PDWN_B Power-Down Function Selection for Channel B: Logic 0 enables Channel B. Logic 1 powers down Channel B. (Outputs static, not High-Z.) 22 OEB_B Output Enable Bit for Channel B: Logic 0 enables Data Bus B. Logic 1 sets outputs to High-Z. 23, 24, 42, 43 DNC Do Not Connect Pins. Should be left floating. 25 to 27, 30 to 38 D0_B (LSB) to D11_B (MSB) Channel B Data Output Bits. 28, 40, 53 DRGND Digital Output Ground. 29, 41, 52 DRVDD Digital Output Driver Supply. Must be decoupled to DRGND with a minimum 0.1 μF capacitor. Recommended decoupling is 0.1 μF capacitor in parallel with 10 μF. 39 OTR_B Out-of-Range Indicator for Channel B. 44 to 51, 54 to 57 D0_A (LSB) to D11_A (MSB) Channel A Data Output Bits. 58 OTR_A Out-of-Range Indicator for Channel A. 59 OEB_A Output Enable Bit for Channel A: Logic 0 enables Data Bus A. Logic 1 sets outputs to High-Z. 60 PDWN_A Power-Down Function Selection for Channel A: Logic 0 enables Channel A. Logic 1 powers down Channel A. (Outputs static, not High-Z.) 61 MUX_SELECT Data Multiplexed Mode. (See Data Format section for how to enable; high setting disables output data multiplexed mode). 62 SHARED_REF Shared Reference Control Bit (Low for Independent Reference Mode, High for Shared Reference Mode). 63 CLK_A Clock Input Pin for Channel A. EP For the 64-Lead LFCSP only, there is an exposed pad that must connect to AGND.

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AD9238 Rev. C | Page 10 of 48 TERMINOLOGY Aperture Delay SHA performance measured from the rising edge of the clock input to when the input signal is held for conversion. Aperture Jitter The variation in aperture delay for successive samples, which is manifested as noise on the input to the ADC. Integral Nonlinearity (INL) Deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each particular code to the true straight line. Differential Nonlinearity (DNL, No Missing Codes) An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Guaranteed no missing codes to 12-bit resolution indicates that all 4,096 codes must be present over all operating ranges. Offset Error The major carry transition should occur for an analog value ½ LSB below VIN+ = VIN−. Offset error is defined as the deviation of the actual transition from that point. Gain Error The first code transition should occur at an analog value ½ LSB above negative full scale. The last transition should occur at an analog value 1½ LSB below the nominal full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions. Temperature Drift The temperature drift for zero error and gain error specifies the maximum change from the initial (25°C) value to the value at TMIN or TMAX. Power Supply Rejection The specification shows the maximum change in full scale from the value with the supply at the minimum limit to the value with the supply at its maximum limit. Total Harmonic Distortion (THD) The ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal, expressed as a percentage or in decibels relative to the peak carrier signal (dBc). Signal-to-Noise and Distortion (SINAD) Ratio The ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in dB. Effective Number of Bits (ENOB) Using the following formula ENOB = (SINAD − 1.76)/6.02 ENOB for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD. Signal-to-Noise Ratio (SNR) The ratio of the rms value of the measured input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding the first six harmonics and dc. The value for SNR is expressed in dB. Spurious-Free Dynamic Range (SFDR) The difference in dB between the rms amplitude of the input signal and the peak spurious signal, which may or may not be a harmonic. Nyquist Sampling When the frequency components of the analog input are below the Nyquist frequency (fCLOCK/2), this is often referred to as Nyquist sampling. IF Sampling Due to the effects of aliasing, an ADC is not limited to Nyquist sampling. Higher sampled frequencies are aliased down into the first Nyquist zone (DC − fCLOCK/2) on the output of the ADC. The bandwidth of the sampled signal should not overlap Nyquist zones and alias onto itself. Nyquist sampling performance is limited by the bandwidth of the input SHA and clock jitter (jitter adds more noise at higher input frequencies). Two-Tone SFDR The ratio of the rms value of either input tone to the rms value of the peak spurious component. The peak spurious component may or may not be an IMD product. Out-of-Range Recovery Time The time it takes for the ADC to reacquire the analog input after a transient from 10% above positive full scale to 10% above negative full scale, or from 10% below negative full scale to 10% below positive full scale. Crosstalk Coupling onto one channel being driven by a (−0.5 dBFS) signal when the adjacent interfering channel is driven by a full-scale signal. Measurement includes all spurs resulting from both direct coupling and mixing components.

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AD9238 Rev. C | Page 11 of 48 TYPICAL PERFORMANCE CHARACTERISTICS AVDD, DRVDD = 3.0 V, T = 25°C, AIN differential drive, full scale = 2 V, unless otherwise noted. –120 10 15 20 25 3050 –100 –80 –60 –40 –20 0 SECOND HARMONIC FREQUENCY (MHz) CROSSTALK M A G N IT U D E ( d B F S ) THIRD HARMONIC 02 64 0- 00 4 Figure 5. Single-Tone FFT of Channel A Digitizing fIN = 12.5 MHz While Channel B Is Digitizing fIN = 10 MHz –120 10 d B 15 20 25 3050 –100 –80 –60 –40 –20 0 FREQUENCY (MHz) CROSSTALK SECOND HARMONIC 02 64 0- 00 5 Figure 6. Single-Tone FFT of Channel A Digitizing fIN = 70 MHz While Channel B Is Digitizing fIN = 76 MHz –120 10 d B 15 20 25 3050 –100 –80 –60 –40 –20 0 SECOND HARMONIC FREQUENCY (MHz) CROSSTALK 02 64 0- 00 6 Figure 7. Single-Tone FFT of Channel A Digitizing fIN = 120 MHz While Channel B is Digitizing fIN = 126 MHz ADC SAMPLE RATE (MSPS) 90 55 40 S F D R /S N R ( d B c ) 85 80 75 70 65 60 45 50 55 60 65 95 100 SNR SFDR 50 02 64 0- 00 7 Figure 8. AD9238-65 Single-Tone SNR/SFDR vs. FS with fIN = 32.5 MHz ADC SAMPLE RATE (MSPS) 90 55 40 S F D R /S N R ( d B c ) 85 80 75 70 65 60 95 100 SNRFDR 50 35302520 SNRSNR 02 64 0- 00 8 Figure 9. AD9238-40 Single-Tone SNR/SFDR vs. FS with fIN = 20 MHz ADC SAMPLE RATE (MSPS) 90 55 S F D R /S N R ( d B c ) 85 80 75 70 65 60 95 100 50 0 5 10 15 20 SFDR SNR 02 64 0- 00 9 Figure 10. AD9238-20 Single-Tone SNR/SFDR vs. FS with fIN = 10 MHz

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AD9238 Rev. C | Page 12 of 48 INPUT AMPLITUDE (dBFS) 90 S F D R /S N R ( d B c ) 80 70 60 100 SNRFDR 50 –35 SNR 40 –30 –25 –20 –15 –10 –5 0 02 64 0- 01 0 Figure 11. AD9238-65 Single-Tone SNR/SFDR vs. AIN with fIN = 32.5 MHz INPUT AMPLITUDE (dBFS) 90 S F D R /S N R ( d B c ) 80 70 60 100 SNRFDR 50 –35 SNR 40 –30 –25 –20 –15 –10 –5 0 02 64 0- 01 1 Figure 12. AD9238-40 Single-Tone SNR/SFDR vs. AIN with fIN = 20 MHz INPUT AMPLITUDE (dBFS) 90 S F D R /S N R ( d B c ) 80 70 60 100 SNRFDR 50 –35 SNR 40 –30 –25 –20 –15 –10 –5 0 02 64 0- 01 2 Figure 13. AD9238-20 Single-Tone SNR/SFDR vs. AIN with fIN = 10 MHz INPUT FREQUENCY (MHz) 90 S F D R /S N R ( d B c ) 85 80 75 95 SNRFDR 70 0 SNR 65 20 40 60 80 100 120 140 02 64 0- 01 3 Figure 14. AD9238-65 Single-Tone SNR/SFDR vs. fIN 90 85 80 75 95 SNRFDR 70 0 SNR 65 20 40 60 80 100 120 140 INPUT FREQUENCY (MHz) S F D R /S N R ( d B c ) 02 64 0- 01 4 Figure 15. AD9238-40 Single-Tone SNR/SFDR vs. fIN 90 85 80 75 95 SNRFDR 70 0 SNR 65 20 40 60 80 100 120 140 INPUT FREQUENCY (MHz) S F D R /S N R ( d B c ) 02 64 0- 01 5 Figure 16. AD9238-20 Single-Tone SNR/SFDR vs. fIN

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AD9238 Rev. C | Page 13 of 48 –120 10 M A G N IT U D E ( d B F S ) 15 20 25 3050 –100 –80 –60 –40 –20 0 FREQUENCY (MHz) 02 64 0- 01 6 Figure 17. Dual-Tone FFT with fIN1 = 45 MHz and fIN2 = 46 MHz –120 10 15 20 25 3050 –100 –80 –60 –40 –20 0 M A G N IT U D E ( d B F S ) FREQUENCY (MHz) 02 64 0- 01 7 Figure 18. Dual-Tone FFT with fIN1 = 70 MHz and fIN2 = 71 MHz –120 10 15 20 25 3050 –100 –80 –60 –40 –20 0 M A G N IT U D E ( d B F S ) FREQUENCY (MHz) 02 64 0- 01 8 Figure 19. Dual-Tone FFT with fIN1 = 200 MHz and fIN2 = 201 MHz INPUT AMPLITUDE (dBFS) 95 S F D R /S N R ( d B F S ) 90 85 80 100 SNRFDR 75 –24 SNR 70 –21 –18 –15 –12 –9 –6 65 60 02 64 0- 01 9 Figure 20. Dual-Tone SNR/SFDR vs. AIN with fIN1 = 45 MHz and fIN2 = 46 MHz INPUT AMPLITUDE (dBFS) 95 S F D R /S N R ( d B F S ) 90 85 80 100 SNRFDR 75 –24 SNR 70 –21 –18 –15 –12 –9 –6 65 60 02 64 0- 02 0 Figure 21. Dual-Tone SNR/SFDR vs. AIN with fIN1 = 70 MHz and fIN2 = 71 MHz INPUT AMPLITUDE (dBFS) 95 S F D R /S N R ( d B F S ) 90 85 80 100 SNRFDR 75 –24 SNR 70 –21 –18 –15 –12 –9 –6 65 60 02 64 0- 02 1 Figure 22. Dual-Tone SNR/SFDR vs. AIN with fIN1 = 200 MHz and fIN2 = 201 MHz

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AD9238 Rev. C | Page 14 of 48 CLOCK FREQUENCY S IN A D ( d B c ) 72 70 74 0 68 20 40 60 SINAD –65SINAD –40 SINAD –20 12.0 11.5 11.0 0 26 40 -0 22 Figure 23. SINAD vs. FS with Nyquist Input DUTY CYCLE (%) 85 S IN A D /S F D R ( d B c ) 80 75 70 95 65 30 60 40 45 50 55 60 65 55 50 DCS ON (SINAD) DCS ON (SFDR) DCS OFF (SINAD) DCS OFF (SFDR) 90 35 02 64 0- 02 3 Figure 24. SINAD/SFDR vs. Clock Duty Cycle TEMPERATURE (°C) 80 S IN A D /S F D R ( d B ) 78 76 74 84 72 –50 70 0 50 100 68 66 SINAD SFDR 82 02 64 0- 02 4 Figure 25. SINAD/SFDR vs. Temperature with fIN = 32.5 MHz SAMPLE RATE (MSPS) 500 A V D D P O W E R ( m W ) 400 300 200 600 100 0 10 20 30 40 50 60 –65 –40 –20 02 64 0- 02 5 Figure 26. Analog Power Consumption vs. FS CODE 0.6 –0.8 IN L ( L S B ) 0.4 0.2 0 –0.2 –0.4 –0.6 0.8 1.0 –1.0 150010005000 2000 2500 3000 3500 4000 02 64 0- 02 6 Figure 27. AD9238-65 Typical INL CODE 0.6 –0.8 D N L ( L S B ) 0.4 0.2 0 –0.2 –0.4 –0.6 0.8 1.0 –1.0 150010005000 2000 2500 3000 3500 4000 02 64 0- 02 7 Figure 28. AD9238-65 Typical DNL

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AD9238 Rev. C | Page 15 of 48 EQUIVALENT CIRCUITS AVDD VIN+_A, VIN–_A, VIN+_B, VIN–_B 0 2 6 4 0 -0 6 2 Figure 29. Equivalent Analog Input Circuit DRVDD 0 2 6 4 0 -0 6 3 Figure 30. Equivalent Digital Output Circuit AVDD CLK_A, CLK_B DCS, DFS, MUX_SELECT, SHARED_REF 0 2 6 4 0 -0 6 4 Figure 31. Equivalent Digital Input Circuit

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AD9238 Rev. C | Page 16 of 48 THEORY OF OPERATION The AD9238 consists of two high performance ADCs that are based on the AD9235 converter core. The dual ADC paths are independent, except for a shared internal band gap reference source, VREF. Each of the ADC paths consists of a proprietary front end SHA followed by a pipelined switched-capacitor ADC. The pipelined ADC is divided into three sections, consisting of a 4-bit first stage, followed by eight 1.5-bit stages, and a final 3-bit flash. Each stage provides sufficient overlap to correct for flash errors in the preceding stages. The quantized outputs from each stage are combined through the digital correction logic block into a final 12-bit result. The pipelined architecture permits the first stage to operate on a new input sample, while the remaining stages operate on preceding samples. Sampling occurs on the rising edge of the respective clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC and a residual multiplier to drive the next stage of the pipeline. The residual multiplier uses the flash ADC output to control a switched-capacitor digital-to-analog converter (DAC) of the same resolution. The DAC output is subtracted from the stage’s input signal and the residual is amplified (multiplied) to drive the next pipeline stage. The residual multiplier stage is also called a multiplying DAC (MDAC). One bit of redundancy is used in each one of the stages to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The input stage contains a differential SHA that can be configured as ac- or dc-coupled in differential or single-ended modes. The output-staging block aligns the data, carries out the error correction, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. ANALOG INPUT The analog input to the AD9238 is a differential, switched- capacitor, SHA that has been designed for optimum perfor- mance while processing a differential input signal. The SHA input accepts inputs over a wide common-mode range. An input common-mode voltage of midsupply is recommended to maintain optimal performance. The SHA input is a differential, switched-capacitor circuit. In Figure 32, the clock signal alternatively switches the SHA between sample mode and hold mode. When the SHA is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within one-half of a clock cycle. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source. Also, a small shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low-pass filter at the ADC input; therefore, the precise values are dependent on the application. In IF undersampling applications, any shunt capacitors should be removed. In combination with the driving source impedance, they limit the input bandwidth. For best dynamic performance, the source impedances driving VIN+ and VIN− should be matched such that common-mode settling errors are symmetrical. These errors are reduced by the common-mode rejection of the ADC. 5pF 5pF T T VIN+ VIN– CPAR T T H H CPAR 02 64 0- 06 5 Figure 32. Switched-Capacitor Input An internal differential reference buffer creates positive and negative reference voltages, REFT and REFB, respectively, that define the span of the ADC core. The output common mode of the reference buffer is set to midsupply, and the REFT and REFB voltages and span are defined as: REFT = ½(AVDD + VREF) REFB = ½ (AVDD −VREF) Span = 2 × (REFT − REFB) = 2 × VREF The equations above show that the REFT and REFB voltages are symmetrical about the midsupply voltage and, by definition, the input span is twice the value of the VREF voltage. The internal voltage reference can be pin-strapped to fixed values of 0.5 V or 1.0 V or adjusted within the same range as discussed in the Internal Reference Connection section. Maximum SNR performance is achieved with the AD9238 set to the largest input span of 2 V p-p. The relative SNR degradation is 3 dB when changing from 2 V p-p mode to 1 V p-p mode. The SHA may be driven from a source that keeps the signal peaks within the allowable range for the selected reference voltage. The minimum and maximum common-mode input levels are defined as: VCMMIN = VREF/2 VCMMAX = (AVDD + VREF)/2

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AD9238 Rev. C | Page 17 of 48 The minimum common-mode input level allows the AD9238 to accommodate ground-referenced inputs. Although optimum performance is achieved with a differential input, a single- ended source may be driven into VIN+ or VIN−. In this configuration, one input accepts the signal, while the opposite input should be set to midscale by connecting it to an appropriate reference. For example, a 2 V p-p signal may be applied to VIN+, while a 1 V reference is applied to VIN−. The AD9238 then accepts an input signal varying between 2 V and 0 V. In the single-ended configuration, distortion performance may degrade significantly as compared to the differential case. However, the effect is less noticeable at lower input frequencies and in the lower speed grade models (AD9238-40 and AD9238-20). Differential Input Configurations As previously detailed, optimum performance is achieved while driving the AD9238 in a differential input configuration. For baseband applications, the AD8138 differential driver provides excellent performance and a flexible interface to the ADC. The output common-mode voltage of the AD8138 is easily set to AVDD/2, and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal. At input frequencies in the second Nyquist zone and above, the performance of most amplifiers is not adequate to achieve the true performance of the AD9238. This is especially true in IF under-sampling applications where frequencies in the 70 MHz to 200 MHz range are being sampled. For these applications, differential transformer coupling is the recommended input configuration, as shown in Figure 33. AD9238 VINA VINB AVDD AGND 2V p-p 50Ω 50Ω 10pF 10pF 49.9Ω 1kΩ 1kΩ0.1μF 02 64 0- 03 2 Figure 33. Differential Transformer Coupling The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few MHz, and excessive signal power can also cause core saturation, which leads to distortion. Single-Ended Input Configuration A single-ended input may provide adequate performance in cost-sensitive applications. In this configuration, there is a degradation in SFDR and distortion performance due to the large input common-mode swing. However, if the source impedances on each input are matched, there should be little effect on SNR performance. CLOCK INPUT AND CONSIDERATIONS Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, may be sensitive to the clock duty cycle. Commonly, a 5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. The AD9238 provides separate clock inputs for each channel. The optimum performance is achieved with the clocks operated at the same frequency and phase. Clocking the channels asynchronously may degrade performance significantly. In some applications, it is desirable to skew the clock timing of adjacent channels. The AD9238’s separate clock inputs allow for clock timing skew (typically ±1 ns) between the channels without significant performance degradation. The AD9238 contains two clock duty cycle stabilizers, one for each converter, that retime the nonsampling edge, providing an internal clock with a nominal 50% duty cycle. When proper track-and-hold times for the converter are required to maintain high performance, maintaining a 50% duty cycle clock is particularly important in high speed applications. It may be difficult to maintain a tightly controlled duty cycle on the input clock on the PCB (see Figure 24). DCS can be enabled by tying the DCS pin high. The duty cycle stabilizer uses a delay-locked loop to create the nonsampling edge. As a result, any changes to the sampling frequency require approximately 2 μs to 3 μs to allow the DLL to acquire and settle to the new rate. High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given full-scale input frequency (fINPUT) due only to aperture jitter (tJ) can be calculated as ( )⎥⎥⎦ ⎤ ⎢ ⎢ ⎣ ⎡ ××× ×= jINPUT tf SNR π2 1 log20 In the equation, the rms aperture jitter, tJ, represents the root- sum square of all jitter sources, which includes the clock input, analog input signal, and ADC aperture jitter specification. Undersampling applications are particularly sensitive to jitter. For optimal performance, especially in cases where aperture jitter may affect the dynamic range of the AD9238, it is important to minimize input clock jitter. The clock input circuitry should use stable references; for example, use analog power and ground planes to generate the valid high and low digital levels for the AD9238 clock input. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or other methods), it should be retimed by the original clock at the last step.

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AD9238 Rev. C | Page 18 of 48 A single channel can be powered down for moderate power savings. The powered-down channel shuts down internal circuits, but both the reference buffers and shared reference remain powered on. Because the buffer and voltage reference remain powered on, the wake-up time is reduced to several clock cycles. POWER DISSIPATION AND STANDBY MODE The power dissipated by the AD9238 is proportional to its sampling rates. The digital (DRVDD) power dissipation is determined primarily by the strength of the digital drivers and the load on each output bit. The digital drive current can be calculated by DIGITAL OUTPUTS IDRVDD = VDRVDD × CLOAD × fCLOCK × N The AD9238 output drivers can be configured to interface with 2.5 V or 3.3 V logic families by matching DRVDD to the digital supply of the interfaced logic. The output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies that may affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fanouts may require external buffers or latches. where N is the number of bits changing, and CLOAD is the average load on the digital pins that changed. The analog circuitry is optimally biased so that each speed grade provides excellent performance while affording reduced power consumption. Each speed grade dissipates a baseline power at low sample rates that increases with clock frequency. Either channel of the AD9238 can be placed into standby mode independently by asserting the PDWN_A or PDWN_B pins. The data format can be selected for either offset binary or twos complement. See the Data Format section for more information. It is recommended that the input clock(s) and analog input(s) remain static during either independent or total standby, which results in a typical power consumption of 1 mW for the ADC. Note that if DCS is enabled, it is mandatory to disable the clock of an independently powered-down channel. Otherwise, significant distortion results on the active channel. If the clock inputs remain active while in total standby mode, typical power dissipation of 12 mW results. TIMING The AD9238 provides latched data outputs with a pipeline delay of seven clock cycles. Data outputs are available one propa- gation delay (tPD) after the rising edge of the clock signal. Refer to Figure 2 for a detailed timing diagram. The internal duty cycle stabilizer can be enabled on the AD9238 using the DCS pin. This provides a stable 50% duty cycle to internal circuits. The minimum standby power is achieved when both channels are placed into full power-down mode (PDWN_A = PDWN_B = HI). Under this condition, the internal references are powered down. When either or both of the channel paths are enabled after a power-down, the wake-up time is directly related to the recharging of the REFT and REFB decoupling capacitors and to the duration of the power-down. Typically, it takes approximately 5 ms to restore full operation with fully discharged 0.1 μF and 10 μF decoupling capacitors on REFT and REFB. The length of the output data lines and loads placed on them should be minimized to reduce transients within the AD9238. These transients can detract from the converter’s dynamic performance. The lowest typical conversion rate of the AD9238 is 1 MSPS. At clock rates below 1 MSPS, dynamic performance may degrade. B–8 A–7 B–7 A–6 B–6 A–5 B–5 A–4 B–4 A–3 B–3 A–2 B–2 A–1 B–1 A0 B0 A1 A–1 A0 A1 A2 A3 A4 A5 A6 A7 A8 B–1 B0 B1 B2 B3 B4 B5 B6 B7 B8 ANALOG INPUT ADC A ANALOG INPUT ADC B CLK_A = CLK_B = MUX_SELECT D0_A TO D11_A tPD tPD 02 64 0- 06 6 Figure 34. Multiplexed Data Format Using the Channel A Output and the Same Clock Tied to CLK_A, CLK_B, and MUX_SELECT

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AD9238 Rev. C | Page 19 of 48 DATA FORMAT The AD9238 data output format can be configured for either twos complement or offset binary. This is controlled by the data format select pin (DFS). Connecting DFS to AGND produces offset binary output data. Conversely, connecting DFS to AVDD formats the output data as twos complement. The output data from the dual ADCs can be multiplexed onto a single 12-bit output bus. The multiplexing is accomplished by toggling the MUX_SELECT bit, which directs channel data to the same or opposite channel data port. When MUX_SELECT is logic high, the Channel A data is directed to the Channel A output bus, and the Channel B data is directed to the Channel B output bus. When MUX_SELECT is logic low, the channel data is reversed, that is the Channel A data is directed to the Channel B output bus, and the Channel B data is directed to the Channel A output bus. By toggling the MUX_SELECT bit, multiplexed data is available on either of the output data ports. If the ADCs run with synchronized timing, this same clock can be applied to the MUX_SELECT pin. Any skew between CLK_A, CLK_B, and MUX_SELECT can degrade ac performance. It is recommended to keep the clock skew <100 pS. After the MUX_SELECT rising edge, either data port has the data for its respective channel; after the falling edge, the alternate channel’s data is placed on the bus. Typically, the other unused bus would be disabled by setting the appropriate OEB high to reduce power consumption and noise. Figure 34 shows an example of multiplex mode. When multiplexing data, the data rate is two times the sample rate. Note that both channels must remain active in this mode and that each channel’s power-down pin must remain low. VOLTAGE REFERENCE A stable and accurate 0.5 V voltage reference is built into the AD9238. The input range can be adjusted by varying the reference voltage applied to the AD9238, using either the internal reference with different external resistor configurations or an externally applied reference voltage. The input span of the ADC tracks reference voltage changes linearly. If the ADC is being driven differentially through a transformer, the reference voltage can be used to bias the center tap (common-mode voltage). The shared reference mode allows the user to connect the references from the dual ADCs together externally for superior gain and offset matching performance. If the ADCs are to function independently, the reference decoupling can be treated independently and can provide superior isolation between the dual channels. To enable shared reference mode, the SHARED_REF pin must be tied high and the external differential references must be externally shorted. (REFT_A must be externally shorted to REFT_B, and REFB_A must be shorted to REFB_B.) Internal Reference Connection A comparator within the AD9238 detects the potential at the SENSE pin and configures the reference into four possible states, which are summarized in Table 7. If SENSE is grounded, the reference amplifier switch is connected to the internal resistor divider (see Figure 35), setting VREF to 1 V. Connecting the SENSE pin to VREF switches the reference amplifier output to the SENSE pin, completing the loop and providing a 0.5 V reference output. If a resistor divider is connected, as shown in Figure 36, the switch is again set to the SENSE pin. This puts the reference amplifier in a noninverting mode with the VREF output defined as VREF = 0.5 × (1 + R2/R1) In all reference configurations, REFT and REFB drive the ADC core and establish its input span. The input range of the ADC always equals twice the voltage at the reference pin for either an internal or an external reference. VIN+ VIN– 10μF 10μF 0.1μF 0.1μF REFT ADC CORE SELECT LOGIC SENSE 0.1μF 0.5V AD9238 REFB 0.1μF VREF 0 2 6 4 0 -0 3 4 Figure 35. Internal Reference Configuration Table 7. Reference Configuration Summary Selected Mode SENSE Voltage Resulting VREF (V) Resulting Differential Span (V p-p) External Reference AVDD N/A 2 × External Reference Internal Fixed Reference VREF 0.5 1.0 Programmable Reference 0.2 V to VREF 0.5 × (1 + R2/R1) 2 × VREF (See Figure 36) Internal Fixed Reference AGND to 0.2 V 1.0 2.0

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AD9238 Rev. C | Page 20 of 48 External Reference Operation The use of an external reference may be necessary to enhance the gain accuracy of the ADC or to improve thermal drift characteristics. When multiple ADCs track one another, a single reference (internal or external) may be necessary to reduce gain matching errors to an acceptable level. A high precision external reference may also be selected to provide lower gain and offset temperature drift. Figure 37 shows the typical drift characteristics of the internal reference in both 1 V and 0.5 V modes. When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal reference buffer loads the external reference with an equivalent 7 kΩ load. The internal buffer still generates the positive and negative full-scale references, REFT and REFB, for the ADC core. The input span is always twice the value of the reference voltage; therefore, the external reference must be limited to a maximum of 1 V. If the internal reference of the AD9238 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 38 depicts how the internal reference voltage is affected by loading. VIN+ VIN– VREF 10μF 10μF 10μF 0.1μF 0.1μF REFT ADC CORE SELECT LOGIC SENSE 0.5V AD9238 REFB 0.1μF R1 R2 0 2 6 4 0 -0 3 5 Figure 36. Programmable Reference Configuration TEMPERATURE (°C) 0.2 V R E F E R R O R ( % ) 1.2 1.0 0.8 0.6 0.4 0 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 VREF = 1V VREF = 0.5V 02 64 0- 06 7 Figure 37. Typical VREF Drift LOAD (mA) –0.20 E R R O R ( % ) 0.05 0 –0.05 –0.10 –0.15 –0.25 0 0.5 1.0 1.5 2.0 2.5 3.0 0.5V ERROR 1V ERROR 02 64 0- 06 8 Figure 38. VREF Accuracy vs. Load

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AD9238 Rev. C | Page 21 of 48 AD9238 LQFP EVALUATION BOARD The evaluation board supports both the AD9238 and AD9248 and has five main sections: clock circuitry, inputs, reference circuitry, digital control logic, and outputs. A description of each section follows. Table 8 shows the jumper settings and notes assumptions in the comment column. Four supply connections to TB1 are necessary for the evaluation board: the analog supply of the DUT, the on-board analog circuitry supply, the digital driver DUT supply, and the on- board digital circuitry supply. Separate analog and digital supplies are recommended, and on each supply 3 V is nominal. Each supply is decoupled on-board, and each IC, including the DUT, is decoupled locally. All grounds should be tied together. CLOCK CIRCUITRY The clock circuitry is designed for a low jitter sine wave source to be ac-coupled and level shifted before driving the 74VHC04 hex inverter chips (U8 and U9) whose output provides the clock to the part. The POT (R32 and R31) on the level shifting circuitry allows the user to vary the duty cycle if desired. The amplitude of the sine wave must be large enough for the trip points of the hex inverter and within the supplies to avoid noise from clipping. To ensure a 50% duty cycle internal to the part, the AD9238-65 has an on-chip duty cycle stabilizer circuit that is enabled by putting in Jumper JP11. The duty cycle stabilizer circuitry should only be used at clock rates above 40 MSPS. Each channel has its own clock circuitry, but normally both clock pins are driven by a single 74VHC04, and the solder Jumper JP24 is used to tie the clock pins together. When the clock pins are tied together and only one 74VHC04 is being used, the series termination resistor for the other channel must be removed (either R54 or R55, depending on which inverter is being used). A data capture clock for each channel is created and sent to the output buffers in order to be used in the data capture system if needed. Jumpers JP25 and JP26 are used to invert the data clock if necessary and can be used to debug data capture timing problems. ANALOG INPUTS The AD9238 achieves the best performance with a differential input. The evaluation board has two input options for each channel, a transformer (XFMR) and an AD8138, both of which perform single-ended-to-differential conversions. The XFMR allows for the best high frequency performance, and the AD8138 is ideal for dc evaluation, low frequency inputs, and driving an ADC differentially without loading the single-ended signal. The common-mode level for both input options is set to midsupply by a resistor divider off the AVDD supply but can also be overdriven with an external supply using the (test points) TP12, TP13 for the AD8138s and TP14, TP15 for the XFMRs. For low distortion of full-scale input signals when using an AD8138, put JP17 and JP22 in Position B and put an external negative supply on TP10 and TP11. For best performance, use low jitter input sources and a high performance band-pass filter after the signal source, before the evaluation board (see Figure 39). For XFMR inputs, use solder Jumpers JP13, JP14 for Channel A and JP20, JP21 for Channel B. For AD8138 inputs, use solder Jumpers JP15, JP16 for Channel A and JP18, JP19 for Channel B. Remove all solder from the jumpers not being used. REFERENCE CIRCUITRY The evaluation board circuitry allows the user to select a reference mode through a series of jumpers and provides an external reference if necessary. Refer to Table 9 to find the jumper settings for each reference mode. The external reference on the board is a simple resistor divider/zener diode circuit buffered by an AD822 (U4). The POT (R4) can be used to change the level of the external reference to fine adjust the ADC full scale. DIGITAL CONTROL LOGIC The digital control logic on the evaluation board is a series of jumpers and pull-down resistors used as digital inputs for the following pins on the AD9238: the power-down and output enable bar for each channel, the duty cycle restore circuitry, the twos complement output mode, the shared reference mode, and the MUX_SELECT pin. Refer to Table 8 for normal operating jumper positions. OUTPUTS The outputs of the AD9238 (and the data clock discussed earlier) are buffered by 74VHC541s (U2, U3, U7, U10) to ensure the correct load on the outputs of the DUT, as well as the extra drive capability to the next part of the system. The 74VHC541s are latches, but on this evaluation board, they are wired and function as buffers. JP30 can be used to tie the data clocks together if desired. If the data clocks are tied, R39 or R40 must be removed, depending on which clock circuitry is being used.

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AD9238 Rev. C | Page 22 of 48 Table 8. PCB Jumpers JP Description Normal Setting Comment 1 Reference Out 1 V Reference Mode 2 Reference In 1 V Reference Mode 3 Reference Out 1 V Reference Mode 4 Reference Out 1 V Reference Mode 5 Reference Out 1 V Reference Mode 6 Shared Reference Out 7 Shared Reference Out 8 PDWN B Out 9 PDWN A Out 10 Shared Reference Out 11 Duty Cycle In Duty Cycle Restore On 12 Twos Complement Out 13 Input In Using XFMR Input 14 Input In Using XFMR Input 15 Input Out Using XFMR Input 16 Input Out Using XFMR Input 17 AD8138 Supply A Using XFMR Input 18 Input Out Using XFMR Input 19 Input Out 20 Input In 21 Input In 22 AD8138 Supply A 23 Mux Select Out 24 Tie Clocks In Using One Signal for Clock 25 Data Clock A 26 Data Clock Out Using One Signal for Clock 27 Mux Select In 28 OEB_A Out 29 Mux Select Out 30 Data Clock Out 35 OEB_B Out Table 9. Reference Jumpers Reference Mode JP1 JP2 JP3 JP4 JP5 1 V Internal Out In Out Out Out 0.5 V Internal Out Out In Out Out External In Out Out Out In AD9238 EVALUATION BOARD SINE SOURCES LOW JITTER (HP8644) SINE SOURCE LOW JITTER (HP8644) BAND-PASS FILTERS OUTPUT BUFFERS INPUT CIRCUITRY CLOCK CIRCUITRY AD9238 02 64 0- 06 0 REFERENCE MODE SELECTION/EXTERNAL REFERENCE/CONTROL LOGIC Figure 39. PCB Test Setup

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AD9238 Rev. C | Page 23 of 48 LQFP EVALUATION BOARD BILL OF MATERIALS (BOM) Table 10. No. Quantity Reference Designator Device Package Value 1 18 C1, C2, C11, C12, C27, C28, C33, C34, C50, C51, C73 to C76, C87 to C90 Capacitors ACASE 10 μF 2 23 C3 to C10, C29 to C31, C56, C61 to C65, C77, C79, C80, C84 to C86 Capacitors 0805 0.1 μF 3 7 C13, C15, C18, C19, C21, C23, C25 Capacitors 0603 0.001 μF 4 15 C6, C14, C16, C17, C20, C22, C24, C26, C32, C35 to C40 Capacitors 0603 0.1 μF 5 4 C41 to C44 Capacitors DCASE 22 μF 6 4 C45 to C48 Capacitors 1206 0.1 μF 7 2 C49, C53 Capacitors ACASE 6.3 V 8 2 C52, C57 Capacitors 0201 0.01 μF 9 4 C54, C55, C68, C69 Capacitors 0805 10 4 C58, C59, C70, C71 Capacitors 0603 DNP 11 2 C60, C72 Capacitors 0603 20 pF 12 1 D1 AD1580 SOT-23CAN 1.2 V 13 1 J1 SAM080UPM 14 14 JP1 to JP5, JP8 to JP12, JP23, JP28, JP29, JP35 JPRBLK02 15 13 JP6, JP7, JP13, JP14 to JP16, JP18 to JP21, JP24, JP27, JP30 JPRSLD02 16 4 JP17, JP22, JP25, JP26 JPRBLK03 17 4 L1 to L4 IND1210 LC1210 10 μH 18 6 R1, R2, R13, R14, R23, R27 Resistors 1206 33 Ω 19 1 R3 Resistor 1206 5.49 kΩ 20 1 R4 Resistor RV3299UP 10 kΩ 21 7 R5, R6, R38, R41, R43, R44, R51 Resistors 0805 5 kΩ 22 6 R7, R8, R19, R20, R52, R53 Resistors 1206 49.9 Ω 23 8 R9, R18, R29, R30, R47 to R50 Resistors 0805 1 kΩ 24 6 R10, R12, R15, R24, R25, R28 Resistors 1206 499 Ω 25 2 R11, R26 Resistors 1206 523 Ω 26 4 R16, R17, R21, R22 Resistors 1206 40 Ω 27 2 R31, R32 Resistors RV3299W 10 kΩ 28 4 R33 to R35, R42 Resistors 0805 500 Ω 29 2 R36, R37 Resistors 1206 10 kΩ 30 2 R39, R40 Resistors 0805 22 Ω 31 2 R54, R55 Resistors 1206 0 Ω 32 16 RP1 to RP16 Resistor Pack RCA74204 22 Ω 33 6 S1 to S6 SMA200UP 34 2 T1, T2 DIP06RCUP T1-1T 35 1 TB1 TBLK06REM 36 4 TP1, TP3, TP5, TP7 LOOPTP RED 37 4 TP2, TP4, TP6, TP8 LOOPTP BLK 38 7 TP9, TP12 to TP17 LOOPMINI WHT 39 2 TP10, TP11 LOOPMINI RED 40 1 U1 64LQFP7X7 AD9238 41 4 U2, U3, U7, U10 SOL20 74VHC541 42 1 U4 SOIC-8 AD822 43 2 U5, U6 SO8NC7 AD8138 44 2 U8, U9 TSSOP-14 74VHC04

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AD9238 Rev. C | Page 24 of 48 LQFP EVALUATION BOARD SCHEMATICS B T P 8 B L K T P 2 B L K A V D D IN A V D D R E D T P 1 10 μH L 2 D U T A V D D IN T B 1 D U T A V D D T P 3 R E D 10 μH L 1 B L K T P 4 R E D T P 5 10 μH L 4 D V D D IN A G N D T B 1 A G N D D R V D D IN T B 1 T B 1 T B 1 D V D D D U T D R V D D T P 7 R E DB L K T P 6 10 μH L 3 R 2 33 Ω A G N D ;7 A V D D ;1 4 U 8 12 U 8 A G N D ;7 A V D D ;1 4 10 U 8 8 JP 26 3 2 W H T T P 16 7 4 V H C 0 4 7 4 V H C 0 4 7 4 V H C 0 4 B 1311 9 JP 25 2 1 3 R 1 33 ΩJ P 24 R 5 4 0 Ω T P 17 W H T C L K A O U 9 A G N D ;7 A V D D ;1 4 12 A G N D ;7 A V D D ;1 4 U 9 10 7 4 V H C 0 4 7 4 V H C 0 4 U 9 A G N D ;7 A V D D ;1 4 9 7 4 V H C 0 4 U 9 A G N D ;7 A V D D ;1 4 3 A G N D ;7 A V D D ;1 4 U 9 6 A G N D ;7 A V D D ;1 4 U 9 2 1 7 4 V H C 0 4 7 4 V H C 0 4 7 4 V H C 0 4 R 5 3 49 .9 Ω S 6 R 3 2 10 kΩ R 4 2 50 0Ω C 8 4 0. 1μ F C L K A C W C W R 3 1 10 kΩ A V D D R 3 4 50 0Ω R 3 5 50 0Ω C 7 7 0. 1μ F R 5 2 49 .9 Ω C 7 3 10 μF 6. 3V S 5 C 7 9 0. 1μ F C L K B A V D D C 7 4 10 μF 6. 3V C 8 0 0. 1μ F U 8 A G N D ;7 A V D D ;1 4 5 A G N D ;7 A V D D ;1 4 U 8 4 3 U 8 A G N D ;7 A V D D ;1 4 7 4 V H C 0 4 7 4 V H C 0 4 7 4 V H C 0 4 A G N D ;7 A V D D ;1 4 1 D A T A C L K B 13 11 A V D D R 3 3 50 0Ω D U T C L K A 5 D A T A C L K A D U T C L K B C 4 2 22 μF 25 V C 4 6 0. 1μ F C 4 1 22 μF 25 V C 4 5 0. 1μ F C 4 4 22 μF 25 V C 4 8 0. 1μ F C 4 3 22 μF F 25 V C 4 7 0. 1μ F R 5 5 0 Ω 8 4 A A 1 2 1 2 3 T B 1 5 4 6 6 02 64 0- 03 8 Figure 40. Evaluation Board Schematic

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AD9238 Rev. C | Page 25 of 48 R 2 0 4 9 .9 Ω R 8 4 9 .9 Ω R 1 9 4 9 .9 Ω R 7 4 9 .9 Ω C 5 9 D N P C 5 8 D N P C 7 1 D N P C 7 0 D N P 0 .1 μF C 6 5 C 6 4 0 .1 μF R 1 8 1 kΩ R 5 0 1 kΩ R 2 9 1 kΩ R 9 1 kΩ R 3 0 1 kΩ R 4 7 1 kΩ C 8 5 0 .1 μF C 6 3 0 .1 μF C 6 8 V A L C 6 9 V A L V A L C 5 5 V A L C 5 4 C 5 6 0 .1 μF C 6 2 0 .1 μF C 6 1 0 .1 μF C 5 3 1 0 V 6 . 3 V C 4 9 1 0 V 6 .3 V R 2 1 4 0Ω R 2 2 4 0Ω R 2 3 3 3 Ω J P 1 8 J P 1 9 R 2 4 4 9 9Ω R 2 5 4 9 9Ω J P 2 2 2 S 4 J P 2 0 J P 2 1 T 1 T 1– 1 T 6 4 1 2 3 J P 1 4 J P 1 3 S 2 R 1 4 3 3Ω V IN + _ A V IN –_ A V IN + _ B V IN –_ B J P 1 7 2 3 1 4 9 9Ω R 1 2 J P 1 6 J P 1 5 R 1 3 3 3Ω R 1 7 4 0 Ω R 2 7 3 3Ω T 1 – 1 T T 2 321 46 S 3 T P 1 1 R E D R 1 6 4 0 Ω C 8 7 1 0μ F 6 .3 V T P 1 2 W H T T P 1 3 W H T T P 1 4 W H T T P 1 5 W H T U 6 18 6 3 2 45 U 5 5 4 2 36 8 1 C 8 8 1 0μ F 6 .3 V C 5 0 1 0μ F 6 .3 V C 5 1 1 0 μF 6 .3 V R 4 9 1 k Ω R 4 8 1 kΩ R 1 5 4 9 9Ω C 8 6 0 .1 μF R 1 0 4 9 9Ω S 1 R 1 1 5 2 3Ω R 2 6 5 2 3Ω R 2 8 4 9 9 C 6 0 2 0 p F C 7 2 2 0 P F N C = 5 N C = 5 A D 81 38 A D 81 38 X F M R I N P U T B X F M R I N P U T A S P S P S H E E T 3 S H E E T 3 A – IN + IN V E E V C CV O C V O + V O – A V D D A V D D A V D D A V D D A V D D A M P I N P U T A A M P I N P U T B – IN + IN V E E V C CV O C V O + V O – B B A T P 1 0 R E D C 8 9 1 0 μF 6 .3 V C 9 0 1 0μ F 6 .3 V 1 3 O O O O 02 64 0- B -0 39 A V D D Figure 41. Evaluation Board Schematic (Continued)

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AD9238 Rev. C | Page 26 of 48 D U T A V D D A V D D A V D D R 3 6 1 0 kΩ J P 6 R 4 1 5 kΩ R 5 1 5 kΩ A V D DC 1 1 0μ F 6 .3 V A V D D R 4 4 5 kΩ C 3 4 1 0μ F 6 .3 V V IN + _ B V IN –_ B V IN –_ A O T R A D A 1 3 D A 1 2 D A 1 1 D A 1 0 D A 9 D A 8 D A 7 D A 6 D A 5 D A 4 D A 3 D A 2 D A 1 O T R B D B 1 3 D B 1 2 D B 1 1 D B 1 0 D B 9 D B 7 D B 6 D B 5 D B 4 D B 3 D B 2 D B 1 D 1 21 D U T A V D D D U T D R V D D R 4 1 0 kΩ D B 0 D B 8 D A 0 A G N D ;4 A V D D ;8 U 4 2 1 3 A G N D ;4 A V D D ;8 U 4 O U T 5 7 6 V IN + _ A C 3 5 0 .1 μF C 3 7 0 .1 μF C 3 8 0 .1 μF C 3 6 0 .1 μF R 3 5 .4 9 kΩ R 5 5 kΩ C 3 0 0 .1 μF C 2 9 0 .1 μF 0 .1 μF R 4 3 5 k Ω R 6 5 k Ω R 3 8 5 k Ω U 1 6 4 6 3 6 2 6 1 6 0 5 9 5 8 5 7 5 6 5 5 5 4 5 3 5 2 5 1 5 0 4 9 3 2 3 1 3 0 2 9 2 8 2 7 2 6 2 5 4 8 2 41 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 2 3 2 2 2 1 2 0 1 9 1 8 1 7 1 6 1 5 1 4 1 3 1 2 1 1 1 098765432 C 1 2 1 0μ F 6 .3 V T P 9 W H T J P 7 A V D D C L K A O D U T C L K B D U T C L K A R 3 7 1 0 kΩ C 5 2 0 .0 1μ F 1 .2 V A D 82 2 A D 82 2 A D 92 38 V IN + _ A V IN – _ A A V S S 2 A V D D 2 R E F T _A R E F B _ A V R E F S E N S E R E F B _ B R E F T _B A V D D 3 A V S S 3 V IN – _ B V IN + _ B A V S S 4 A V D D 4 C L K _ B D U T Y E N D F S P D W N _ B D N C D 3 _ A D 2 _ A D 1 _ A D 0 _ A D N C D N C D R V D D 2 D R V S S 2 O T R _B (M S B )D 1 1 _ B D 1 0 _ B D 9 _ B D 8 _ B D 7 _ B D 6 _ B A V S S 1 D N C D 4 _ A D 0 _ B D 1 _ B D 2 _ B D R V S S 1 D R V D D 1 D 3 _ B D 4 _ B D 5 _ B D 5 _ A D 6 _ A D 7 _ A D R V D D 3 D R V S S 3 D 8 _ A D 9 _ A D 1 0 _ A (M S B )D 1 1 _ A O T R _A P D W N _ A M U X S E L E C T S H A R E D R E F C L K _ A A V D D 1 O E B _A O E B _B C 3 1 J P 1 1 J P 1 2J P 2 J P 3 J P 4 J P 1 C 5 7 0 .0 1μ F J P 5 C 3 2 0 .1 μF C 3 9 0 .1 μF C 4 0 0 .1 μF C 3 3 1 0μ F 6 .3 V C W J P 3 5 J P 8 C 2 4 0 .1 μF C 2 5 0 .0 0 1μ F C 2 6 0 .1 μF C 1 3 0 .0 0 1μ F C 1 4 0 .1 μF C 1 1 1 0μ F 6 .3 V C 2 3 0 .0 0 1μ F J P 2 3 J P 2 7 J P 2 9 J P 2 8 J P 1 0 C 2 2 0 .1 μF C 1 5 0 .0 0 1μ F C 1 7 0 .1 μF C 1 8 0 .0 0 1μ F C 1 9 0 .0 0 1μ F C 2 0 0 .1 μF C 2 1 0 .0 0 1μ F C 1 6 0 .1 μF J P 9 C 2 1 0μ F 6 .3 V A V D D + IN – IN O U T + IN – IN 02 64 0- 04 0 Figure 42. Evaluation Board Schematic (Continued)

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AD9238 Rev. C | Page 27 of 48 4 2 2 RP11 DVDD U10 182 11 12 13 14 15 16 17 20 1019 1 9 8 7 6 5 4 3 U7 3 4 5 6 7 8 9 1 19 10 20 17 16 15 14 13 12 11 2 DA13 DA12 DA11 DA10 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 RP104 RP10 63 RP4 63 RP42 RP34 RP3 63 RP32 RP3 81 RP24 RP2 63 RP22 RP2 81 RP14 RP1 63 RP12 C3 0.1μF C10 0.1μF C9 0.1μF C8 0.1μF RP4 81 RP44 OTRA DA0 RP102 RP10 81 RP94 RP9 6 5 7 5 3 RP92 RP9 8 7 5 7 5 7 1 RP124 RP12 63 RP12 RP12 81 RP11 RP11 63 RP11 C28 10μF 6.3V 81 C75 10μF 6.3V JP30 R39 22Ω R40 22ΩDATACLKA DATACLKB RP1 22Ω 81 A2 A3 A4 A5 A6 A7 A8 G1 G2 GND VCC Y2 Y3 Y4 Y5 Y6 Y7 Y8 A1 Y1 74VHC541 A2 A3 A4 A5 A6 A7 A8 G1 G2 GND VCC Y2 Y3 Y4 Y5 Y6 Y7 Y8 A1 Y1 74VHC541 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω SAM080UPM 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω A8 Y8 22Ω SAM080UPM 18 2 2 3 1 4 3 4 4 4 2 2 22Ω 2 4 2 4 2 4 2 1 19 1 9 11 DVDD C7 0.1μF C6 0.1μF C5 0.1μF C4 0.1μF C27 10μF 6.3V C76 10μF 6.3V 182 11 12 13 14 15 16 17 10 20 9 8 7 6 5 4 3 U3 3 4 5 6 7 8 1 19 10 20 17 16 15 14 13 12 2 DA13 DA12 DA11 DA10 DA9 DA8 DA6 DA5 DA4 DA3 DA2 DA1 DA0 RP14 RP14 63 RP8 63 54 RP8 RP7 RP7 63 RP7 RP7 81 RP6 RP6 63 RP6 RP6 81 RP5 RP5 63 RP5 RP8 81 OTRB RP14 RP14 81 RP13 RP13 6 5 7 5 7 3 RP13 RP13 81 RP16 RP16 RP16 7 8 6 5 RP16 RP15 5 6RP15 RP15 7 A2 A3 A4 A5 A6 A7 G1 G2 GND VCC Y2 Y3 Y4 Y5 Y6 Y7 A1 Y1 74VHC541 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω RP5 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 22Ω 18 RP8 22Ω 1 DA7 RP15 822Ω 13 11 9 7 5 3 1 39 37 35 33 31 29 27 25 23 21 19 17 15 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 53 51 49 47 45 43 41 79 77 75 73 71 69 67 65 63 61 59 57 55 80 78 76 74 72 70 68 66 64 62 60 58 56 54 52 50 48 46 44 42 5 7 7 5 7 5 7 5 J1 H E A D E R U P M A L E N O S H R O U D U2 A2 A3 A4 A5 A6 A7 A8 G2 G1 GND VCC Y2 Y3 Y4 Y5 Y6 Y7 Y8 A1 Y1 74VHC541 J1 H E A D E R U P M A L E N O S H R O U D 8 7 5 7 5 7 5 7 02 64 0- 04 1 Figure 43. Evaluation Board Schematic (Continued)

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AD9238 Rev. C | Page 28 of 48 LQFP PCB LAYERS 02 64 0- 04 6 Figure 44. PCB Top Side Silkscreen

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AD9238 Rev. C | Page 29 of 48 02 64 0- 04 2 Figure 45. PCB Top Layer

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AD9238 Rev. C | Page 30 of 48 02 64 0- 04 4 Figure 46. PCB Ground Plane

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AD9238 Rev. C | Page 31 of 48 02 64 0- 04 5 Figure 47. PCB Split Power Plane

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AD9238 Rev. C | Page 32 of 48 02 64 0- 04 3 Figure 48. PCB Bottom Layer

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AD9238 Rev. C | Page 33 of 48 02 64 0- 04 7 Figure 49. PCB Bottom Silkscreen

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AD9238 Rev. C | Page 34 of 48 DUAL ADC LFCSP PCB The LFCSP PCB requires a low jitter clock source, analog sources, and power supplies. The PCB interfaces directly with Analog Devices standard dual-channel data capture board (HSC-ADC- EVAL-DC), which together with ADI’s ADC Analyzer™ software allows for quick ADC evaluation. POWER CONNECTOR Power is supplied to the board via three detachable 4-lead power strips. Table 11. Power Connector Terminal Comments VCC1 3.0 V Analog supply for ADC VDD1 3.0 V Output supply for ADC VDL1 3.0 V Supply circuitry VREF Optional external VREF +5 V Optional op amp supply −5 V Optional op amp supply 1VCC, VDD, and VDL are the minimum required power connections. ANALOG INPUTS The evaluation board accepts a 2 V p-p analog input signal centered at ground at two SMB connectors, Input A and Input B. These signals are terminated at their respective transformer primary side. T1 and T2 are wideband RF transformers that provide the single-ended-to-differential conversion, allowing the ADC to be driven differentially, minimizing even-order harmonics. The analog signals can be low-pass filtered at the transformer secondary to reduce high frequency aliasing. OPTIONAL OPERATIONAL AMPLIFIER The PCB has been designed to accommodate an optional AD8139 op amp that can serve as a convenient solution for dc-coupled applications. To use the AD8139 op amp, remove C14, R4, R5, C13, R37, and R36. Place R22, R23, R30, and R24. CLOCK The clock inputs are buffered on the board at U5 and U6. These gates provide buffered clocks to the on-board latches, U2 and U4, ADC input clocks, and DRA and DRB that are available at the output Connector P3, P8. The clocks can be inverted at the timing jumpers labeled with the respective clocks. The clock paths also provide for various termination options. The ADC input clocks can be set to bypass the buffers at P2 to P9 and P10, P12. An optional clock buffer U3, U7 can also be placed. The clock inputs can be bridged at TIEA, TIEB (R20, R40) to allow one to clock both channels from one clock source; however, optimal performance is obtained by driving J2 and J3. Table 12. Jumpers Terminal Comments OEB A Output Enable for A Side PDWN A Power-Down A MUX Mux Input SHARED REF Shared Reference Input DR A Invert DR A LATA Invert A Latch Clock ENC A Invert Encode A OEB B Output Enable for B Side PDWN B Power-Down B DFS Data Format Select SHARED REF Shared Reference Input DR B Invert DR B LATB Invert B Latch Clock ENC B Invert Encode B VOLTAGE REFERENCE The ADC SENSE pin is brought out to E41, and the internal reference mode is selected by placing a jumper from E41 to ground (E27). External reference mode is selected by placing a jumper from E41 to E25 and E30 to E2. R56 and R45 allow for programmable reference mode selection. DATA OUTPUTS The ADC outputs are latched on the PCB at U2 and U4. The ADC outputs have the recommended series resistors in line to limit switching transient effects on ADC performance.

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AD9238 Rev. C| Page 35 of 48 LFCSP EVALUATION BOARD BILL OF MATERIALS (BOM) Table 13. No. Quantity Reference Designator Device Package Value 1 2 C1, C3 Capacitors 0201 20 pF 2 7 C2, C5, C7, C9, C10, C22, C36 Capacitors 0805 10 μF 3 44 C4, C6, C8, C11 to C15, C20, C21, C24 to C27, C29 to C35, C39 to C61 Capacitors 0402 0.1 μF 4 6 C16 to C19, C37, C38 Capacitors TAJD 10 μF 5 2 C23, C28 Capacitors 0201 0.1 μF 6 6 J1 to J6 SMBs 7 3 P1, P4, P11 Power Connector Posts Z5.531.3425.0 Wieland 8 3 P1, P4, P11 Detachable Connectors 25.602.5453.0 Wieland 9 2 P31, P8 Connectors 10 4 R1, R2, R32, R34 Resistors 0402 36 Ω 11 6 R3, R7, R11, R14, R51, R61 Resistors 0402 50 Ω 12 4 R4, R5, R36, R37 Resistors 0402 33 Ω 13 9 R9, R10, R12, R13, R20, R35, R38, R40, R43 Resistors 0402 0 Ω 14 6 R15, R16, R18, R26, R29, R31 Resistors 0402 499 Ω 15 2 R17, R25 Resistors 0402 525 Ω 16 27 R19, R21, R27, R28, R39, R41, R44, R46 to R49, R52, R54, R55, R57 to R60, R62 to R70 Resistors 0402 1 kΩ 17 4 R22 to R24, R30 Resistors 0402 40 Ω 18 2 R45, R56 Resistors 0402 10 kΩ 19 1 R50 Resistor 0402 22 Ω 20 8 RZ1 to RZ6, RZ9, RZ10 Resistor Pack 220 Ω 21 2 T1, T2 Transformers AWT-1WT Mini-Circuits® 22 1 U1 AD9238 LFCSP-64 23 2 U2, U4 SN74LVCH16373A TSSOP-48 24 2 U32, U7 SN74LVC1G04 SOT-70 25 2 U5, U6 SN74VCX86 SO-14 26 2 U11, U12 AD8139 SO-8/EP 27 4 R6, R8, R33, R42 Resistors 0402 100 Ω 1 P3 and P8 implemented as one 80-pin connector SAMTEC TSW-140-08-L-D-RA. 2 U3 and U7 not placed.

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AD9238 Rev. C | Page 36 of 48 LFCSP PCB SCHEMATICS D7_AD7A 49 D8_AD8A 50 D9_AD9A 51 DRVDD252 DRGND253 D10_AD10A 54 D11_AD11A 55 D12_AD12A 56 D13_AD13A 57 OTR_AOTRA 58 OEB_A59 PDWN_A60 MUX_SEL61 SH_REF62 CLK_A63 AVDD5VD 64 EPAD 65 D7BD7_B 32 D6B31 D5_B 30 DRVDD 29 DRGND 28 D4BD4_B 27 D3BD3_B 26 D2BD2_B 25 D1B24 23 22 21 20 DCS 19 ENCB D6_B D1_B D0_B OEB_B PDWN_B DFS CLK_B D 6 _ A D 6 A 4 8 D 5 _ A D 5 A 4 7 D 4 _ A D 4 A 4 6 D 3 _ A D 3A 4 5 D 2 _ A D 2A 4 4 D 1 _ A D 1 A 4 3 D 0 _ A D 0 A 4 2 D R V D D 1 4 1 D R G N D 1 4 0 O T R _B O T R B 3 9 D 1 3 _ B D 1 3 B 3 8 D 1 2 _ B D 1 2 B 3 7 D 1 1 _ B D 1 1 B 3 6 D 1 0 _ B D 1 0 B 3 5 D 9 _ B D 9B 3 4 D 8 _ B D 8 B 3 3 1 A G N D 2 V IN _A 3 V IN _A B 4 A G N D 1 V D 5 A V D D 1 6 R E F T _A 7 R E F B _A V R E F 8 V R E F S E N S E 9 S E N S E 10 R E F B _B 11 R E F T _B V D 12 A V D D 2 13 A G N D 2 14 V IN _B B 15 V IN _B 16 A G N D 3 V C C 14 4B 13 4A 12 4Y 11 3B 10 3A 9 3Y 8 1A 1B 1Y 2A 2B 2Y G N D 1 2 3 4 5 6 7 G N D 7 2Y 6 2B 5 2A 4 1Y 3 1B 2 1A 1 3Y 3A 3B 4Y 4A 4B V C C 8 9 10 11 12 13 14 18 VDAVDD3 17 D0B D5B + + + + + + ENCA V R E F C 30 0. 1 μ F R 45 10 kΩ R 56 10 kΩ E 2 E 27 E 25 E 30 E 41 V D C 11 0. 1μ F S E N S E E X T _V R E F C 2 10 μF V R E F A N D S E N S E C IR C U IT M U X R 35 0 Ω R 38 0 Ω R 20 0 Ω R 40 0 Ω R 14 50 Ω J5 T IE B T IE A T O T IE C L O C K S T O G E T H E R C 4 0. 1μ F V D D V D D C 60 .1 μF E 22 E 24 V D R 67 1k Ω R 68 1k Ω  R 70 1k Ω R 69 1k Ω E 21 E 40 V D E 26 E 29 V D E 31 E 33 V D P A D S T O S H O R T R E F E R E N C E S T O G E T H E R P 1 5 P 1 6 P 1 8 P 1 7 R E F T A R E F T B R E F B A R E F B B R E F B _ B R E F T _ B A M P O U T B R 36 33 Ω R 37 33 Ω A M P O U T B B C 3 20 p F C 2 8 0 .1 μF C 7 1 0μ F C 5 4 0 .1 μF C 2 3 0 .1 μF C 5 1 0μ F C 5 5 0 .1 μF C 2 4 0 .1 μF C 2 6 0 .1 μF C 2 9 0 .1 μF C 2 7 0 .1 μF H 3 M T H O L E 6 H 1 M T H O L E 6 H 2 M T H O L E 6 H 4 M T H O L E 6 4 1 2 3 4 1 2 3 4 1 2 3 P 5 P 6 P 7 V D V D D V D L C 3 7 1 0μ F C 3 8 1 0μ F C 1 6 1 0μ F C 1 7 1 0μ F C 1 8 1 0μ F C 1 9 1 0μ F C 3 9 0 .1 μF C 43 0. 1μ F C 44 0. 1μ F C 45 0. 1μ F + 5 V –5 V E X T _V R E F V D L V D D V D P 11 P 4 P 1 E 34 E 16 V D V D R 55 1k Ω E 37 E 38 R 48 1k Ω 0Ω R 12 0Ω R 13 E 3 5 E 3 6 V D R 4 9 1 kΩ C 41 0. 1μ F V D V D J 2 E N C O D E B R 5 1 5 0Ω C 4 2 0 .1 μF R 5 4 1 kΩR 5 2 1 kΩ P 2 P 9 U 3 P 13 E N C B V D V D C 2 2 1 0μ F C 5 7 0 .1 μF R 6 10 0Ω R 8 10 0Ω T IE B 1 2 3 5 4 S N 7 4 L V C 1 G 0 4 N C A G N D V C C Y 1 2 3 5 4 S N 7 4 L V C 1 G 0 4 N C A G N D V C C Y P 10 P 12 C 3 6 1 0μ F C 5 8 0 .1 μF E N C A V D V D R 33 10 0Ω R 42 10 0Ω R 50 22 Ω R 430Ω U 1 E 13 E 12 V D V D R 47 1k Ω E 15 E 14 R 46 1k Ω 0Ω R 90 Ω R 10 C L K L A T B D R B D R A C L K L A T A J6 R 61 50 Ω C 56 0. 1μ F V D J 3 E N C O D E A R 1 1 5 0Ω C 4 0 0 .1 μF R 4 1 1 kΩ T IE AR 3 9 1 kΩ V D C 2 5 0 .1 μF E 3 E 4 V D R 4 4 1 kΩ P 1 4 E 6 E 5 V D E 20 E 18 V D E 9 E 7 V D R 66 1k Ω R 6 5 1 kΩ R 64 1k Ω E 10 E 17 R 63 1k Ω R 62 1k Ω V D V D D C 8 0 .1 μF M U X D U T C L O C K S E L E C T A B L E T O B E D IR E C T O R B U F F E R E D 74 L C X 867 4L C X 86 R 4 33 Ω J1A IN B C 13 0. 1μ F R 59 1k Ω R 7 50 Ω A M P IN B C 10 10 μF C 12 0. 1μ F E 43 E 42 C 9 10 μFC 31 0. 1 μ F R 57 1k Ω 1 2 3 6 5 4 C T A P B R 5 33 Ω 1 2 3 6 5 4 C T A P A A M P O U T A B A M P O U T A C 14 0. 1μ F A M P IN A R 3 50 Ω J4 C 1 2 0 p F V D –5 V + 5 V V D V D D V D L E X T _ V R E F C T A P A R 58 1k Ω V D V D R 60 1k Ω C T A P B T 1 T 2 S E E B E L O W D U T C L O C K S E L E C T A B L E T O B E D IR E C T O R B U F F E R E D U 5 U 6 U 7 A IN A 02 64 0- 06 9 Figure 50. PCB Schematic (1 of 3)

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AD9238 Rev. C | Page 37 of 48 R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 8765431 2 16 15 14 13 12 11 10 9 22 0 22 0 22 0 135791113151719212325272931333537 246810121416182022242628303234363840 H E A D E R 40 22 0 S N 74 L V C H 16 37 3A U 2 1D 1 1D 2 1D 3 1D 4 1D 5 1D 6 1D 7 1D 8 1Q 1 1Q 2 1Q 3 1Q 4 1Q 5 1Q 6 1Q 7 1Q 8 2D 1 2D 2 2D 3 2D 4 2D 5 2D 6 2D 7 2D 8 2Q 1 2Q 2 2Q 3 2Q 4 2Q 5 2Q 6 2Q 7 2Q 8 G N D L E 1 L E 2 V C C O E 1 O E 2 V C C V C C V C C G N D G N D G N D G N D G N D G N D G N D 22 0 R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 2 20 22 0 22 0 S N 74 L V C H 16 37 3A U 4 1D 1 1D 2 1D 3 1D 4 1D 5 1D 6 1D 7 1D 8 1Q 1 1Q 2 1Q 3 1Q 4 1Q 5 1Q 6 1Q 7 1Q 8 2D 1 2D 2 2D 3 2D 4 2D 5 2D 6 2D 7 2D 8 2Q 1 2Q 2 2Q 3 2Q 4 2Q 5 2Q 6 2Q 7 2Q 8 G N D L E 1 L E 2 V C C O E 1 O E 2 V C C V C C V C C G N D G N D G N D G N D G N D G N D G N DQ = O U T P U T D = IN P U T 4746444341403837 2356891112 3635333230292726 1314161719202223 4101521 45393428 4825 718 4231 124 C L K L A T B C L K L A T B C L K L A T A V D L V D L V D L R Z 6 R S O 16 IS O R Z 5 R S O 16 IS O 8765431 2 16 15 14 13 12 11 10 9 R Z 4 R S O 16 IS O 8765431 2 16 15 14 13 12 11 10 9 R Z 3 R S O 16 IS O 4746444341403837 2356891112 3635333230292726 1314161719202223 4101521 45393428 4825 718 4231 124 8765431 2 16 15 14 13 12 11 10 9 R Z 1 R S O 16 IS O 135791113151719212325272931333537 246810121416182022242628303234363840 P 3 R Z 9 R S O 16 IS O R Z 10 R S O 16 IS O D 9Q D 8Q D 7Q D 6Q D 5Q D 4Q D 3Q D 2Q D 1Q D 9P D 8P D 7P D 6P D 5P D 4P D 3P D 2P D 1P D 8A D 9A D 2A D 3A D 4A D 5A D 6A D 7A D 0A D 1A G N D D 9P D 8P D 7P D 6P D 5P D 4P D 3P D 2P D 1P D 0P G N D D R A D R B O T R A D 13 A D 12 A D 11 A D 10 A D 7B D 9B D 8B O T R B D 13 B D 12 B D 11 B D 10 B D O R P D 13 P D 12 P D 11 P D 10 P D O R Q D 13 Q D 12 Q D 11 Q D 10 Q D 9Q D 0Q D 8Q D 1Q D 2Q D 6Q D 7Q D 3Q D 4Q D 5Q D 13 P D 12 P D 11 P D 10 P D 0P D O R P D 13 Q D 12 Q D 11 Q D 10 Q D 0Q D O R Q V D L V D L V D L V D L C L K L A T A 8765431 2 16 15 14 13 12 11 10 9 R Z 2 R S O 16 IS O D 5B D 6B D 4B D 3B D 2B D 1B D 0B R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 Q = O U T P U T D = IN P U T R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 8765431 2 16 15 14 13 12 11 10 9 R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 8765431 2 16 15 14 13 12 11 10 9 R 8 R 7 R 6 R 5 R 4 R 3 R 1 R 2 8765431 2 16 15 14 13 12 11 10 9 13579111315171921232527293133353739 246810121416182022242628303234363840 H E A D E R 40 13579111315171921232527293133353739 246810121416182022242628303234363840 P 8 V D L C 49 0. 1μ F C 48 0. 1μ F C 47 0. 1μ F C 46 0. 1μ F C 53 0. 1μ F C 52 0. 1μ F C 51 0. 1μ F  C 50 0. 1μ F 39 39 V D L 02 64 0- 07 0 Figure 51. PCB Schematic (2 of 3)

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AD9238 Rev. C | Page 38 of 48 + IN + O U T –I N –O U T E P A D N C V + V – V O C M A D 81 39 C 2 0 0. 1μ F 8 41 5 9 7 3 6 2 U 1 2 C 3 5 0. 1μ F R 2 9 49 9Ω R 3 0 40 ΩR 2 5 52 5Ω A M P O U T B A M P O U T B B + 5 V –5 V A M P IN B C 3 4 0. 1μ F R 2 8 1k Ω R 2 7 1k Ω V D R 2 4 40 Ω + IN + O U T –I N – O U T E P A D N C V + V – V O C M A D 81 39 C 2 1 0. 1μ F 8 41 5 9 7 3 6 2 U 1 1 C 3 2 0. 1μ F R 1 7 52 5Ω R 2 2 40 ΩR 1 6 49 9Ω A M P O U T A B A M P O U T A + 5 V –5 V A M P IN A C 3 3 0. 1μ F R 1 9 1k Ω R 2 1 1k Ω V D R 2 3 40 Ω O P A M P I N P U T O F F P IN 1 O F T R A N S F O R M E R 02 64 0- 07 1 R 3 1 49 9Ω C 6 1 R 2 6 49 9Ω C 1 5 R 1 5 49 9Ω C 6 0 R 1 8 49 9Ω C 5 9 Figure 52. PCB Schematic (3 of 3)

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AD9238 Rev. C | Page 39 of 48 LFCSP PCB LAYERS 0 2 6 4 0 -0 7 2 Figure 53. PCB Top-Side Silkscreen

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AD9238 Rev. C | Page 40 of 48 0 2 6 4 0 -0 7 3 Figure 54. PCB Top-Side Copper Routing

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AD9238 Rev. C | Page 41 of 48 0 2 6 4 0 -0 7 4 Figure 55. PCB Ground Layer

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AD9238 Rev. C | Page 42 of 48 0 2 6 4 0 -0 7 5 Figure 56. PCB Split Power Plane

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AD9238 Rev. C | Page 43 of 48 0 2 6 4 0 -0 7 6 Figure 57. PCB Bottom-Side Copper Routing

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AD9238 Rev. C | Page 44 of 48 0 2 6 4 0 -0 7 7 Figure 58. PCB Bottom-Side Silkscreen 0 2 6 4 0 -0 7 8 THERMAL CONSIDERATIONS The AD9238 LFCSP has an integrated heat slug that improves the thermal and electrical properties of the package when locally attached to a ground plane at the PCB. A thermal (filled) via array to a ground plane beneath the part provides a path for heat to escape the package, lowering junction temperature. Improved electrical performance also results from the reduction in package parasitics due to proximity of the ground plane. Recommended array is 0.3 mm vias on 1.2 mm pitch. θJA = 26.4°C/W with this recommended configuration. Soldering the slug to the PCB is a requirement for this package. Figure 59. Thermal Via Array

Page 46

AD9238 Rev. C | Page 45 of 48 OUTLINE DIMENSIONS COMPLIANT TO JEDEC STANDARDS MS-026-BBD 05 1 70 6- A TOP VIEW (PINS DOWN) 1 16 17 33 32 48 4964 0.23 0.18 0.13 0.40 BSC LEAD PITCH 1.60 MAX 0.75 0.60 0.45 VIEW A PIN 1 0.20 0.09 1.45 1.40 1.35 0.08 COPLANARITY VIEW A ROTATED 90° CCW SEATING PLANE 7° 3.5° 0°0.15 0.05 9.20 9.00 SQ 8.80 7.20 7.00 SQ 6.80 Figure 60. 64-Lead Low Profile Quad Flat Package [LQFP] (ST-64-1) Dimensions shown in millimeters PIN 1 INDICATOR TOP VIEW 8.75 BSC SQ 9.00 BSC SQ 1 64 16 17 49 48 32 33 0.50 0.40 0.30 0.50 BSC 0.20 REF 12° MAX 0.80 MAX 0.65 TYP 1.00 0.85 0.80 7.50 REF 0.05 MAX 0.02 NOM 0.60 MAX 0.60 MAX *4.85 4.70 SQ 4.55 EXPOSED PAD (BOTTOM VIEW) *COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4 EXCEPT FOR EXPOSED PAD DIMENSION 08 2 90 8- B SEATING PLANE PIN 1 INDICATOR 0.30 0.25 0.18 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 61. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 9 mm × 9 mm Body, Very Thin Quad (CP-64-1) Dimensions shown in millimeters

Page 47

AD9238 Rev. C | Page 46 of 48 ORDERING GUIDE Model1 Temperature Range Package Description Package Option AD9238BST-20 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTZ-20 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTZRL-20 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BST-40 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTRL-40 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTZ-40 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTZRL-40 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BST-65 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTRL-65 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTZ-65 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BSTZRL-65 –40°C to +85°C 64-Lead Low Profile Quad Flat Package (LQFP) ST-64-1 AD9238BCPZ-20 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD9238BCPZRL-20 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD9238BCPZ-40 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD9238BCPZRL-40 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD9238BCPZ-65 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD9238BCPZRL-65 –40°C to +85°C 64-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-64-1 AD9238BCP-65EBZ Evaluation Board 1 Z = RoHS Compliant Part.

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AD9238 Rev. C | Page 47 of 48 NOTES

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