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ADM3202ARN

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ADM3202ARN

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Part Number ADM3202ARN
Manufacturer Analog Devices Inc.
Description IC TX/RX DUAL RS-232 3.3V 16SOIC
Datasheet ADM3202ARN Datasheet
Package 16-SOIC (0.154", 3.90mm Width)
In Stock 64,050 piece(s)
Unit Price $ 3.5100 *
Lead Time Can Ship Immediately
Estimated Delivery Time Dec 2 - Dec 7 (Choose Expedited Shipping)
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Part Number # ADM3202ARN (Interface - Drivers, Receivers, Transceivers) is manufactured by Analog Devices Inc. and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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ADM3202ARN Specifications

ManufacturerAnalog Devices Inc.
CategoryIntegrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers
Datasheet ADM3202ARNDatasheet
Package16-SOIC (0.154", 3.90mm Width)
Series-
TypeTransceiver
ProtocolRS232
Number of Drivers/Receivers2/2
DuplexFull
Receiver Hysteresis400mV
Data Rate460Kbps
Voltage - Supply3 V ~ 5.5 V
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case16-SOIC (0.154", 3.90mm Width)
Supplier Device Package16-SOIC

ADM3202ARN Datasheet

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Low Power, 3.3 V, RS-232 Line Drivers/Receivers ADM3202/ADM3222/ADM1385 Rev. E Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©1998–2011 Analog Devices, Inc. All rights reserved. FEATURES 460 kbps data rate Specified at 3.3 V Meets EIA-232E specifications 0.1 μF charge pump capacitors Low power shutdown (ADM3222 and ADM1385) PDIP, SOIC_N, SOIC_W, SSOP, and TSSOP options Upgrade for MAX3222/MAX3232 and LTC1385 ESD protection to IEC 1000-4-2 (801.2) on RS-232 pins (ADM3202 only) ±8 kV: contact discharge ±15 kV: air gap discharge APPLICATIONS General-purpose RS-232 data link Portable instruments Printers, palmtop computers, PDAs GENERAL DESCRIPTION The ADM3202/ADM3222/ADM1385 transceivers are high speed, 2-channel RS-232/V.28 interface devices that operate from a single 3.3 V power supply. Low power consumption and a shutdown facility (ADM3222/ADM1385) make them ideal for battery-powered portable instruments. The ADM3202/ADM3222/ADM1385 parts conform to the EIA-232E and CCITT V.28 specifications and operate at data rates up to 460 kbps. Four external 0.1 μF charge pump capacitors are used for the voltage doubler/inverter, permitting operation from a single 3.3 V supply. The ADM3222 contains additional enable and shutdown circuitry. The EN input can be used to three-state the receiver outputs. The SD input is used to power down the charge pump and transmitter outputs, reducing the quiescent current to less than 0.5 μA. The receivers remain enabled during shutdown unless disabled using EN. The ADM1385 contains a driver disable mode and a complete shutdown mode. The ADM3202 is available in a 16-lead PDIP, SOIC_W, and SOIC_N, as well as a space-saving 16-lead TSSOP. The ADM3222 is available in 18-lead PDIP and SOIC_W and in 20-lead SSOP and TSSOP. The ADM1385 is available in a 20-lead SSOP, which is pin-compatible with the LTC1385 CG. FUNCTIONAL BLOCK DIAGRAMS C1+ C2+ C1– C2– VCC V– V+ T1IN T1OUT T2IN T2OUT R1OUT R1IN R2OUT R2IN CMOS INPUTS EIA/TIA-232 OUTPUTS CMOS OUTPUTS EIA/TIA-232 INPUTS* T1 T2 R1 R2 + + + 0.1µF 10V 0.1µF 10V GND ADM3202 C3 0.1µF 6.3V +3.3V INPUT +3.3V TO +6.6V VOLTAGE DOUBLER +6.6V TO –6.6V VOLTAGE INVERTER C5 0.1µF + C4 0.1µF 10V + *INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT 00 07 1- 00 1 Figure 1. C1+ C2+ C1– C2– VCC V– V+ T1IN T1OUT T2IN T2OUT R1OUT R1IN R2OUT EN R2IN SD CMOS INPUTS EIA/TIA-232 OUTPUTS CMOS OUTPUTS EIA/TIA-232 INPUTS* T1 T2 R1 R2 + + + 0.1µF 10V 0.1µF 10V GND ADM3222 C3 0.1µF 6.3V +3.3V INPUT +3.3V TO +6.6V VOLTAGE DOUBLER +6.6V TO –6.6V VOLTAGE INVERTER C5 0.1µF + C4 0.1µF 10V + *INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT 00 07 1- 00 2 Figure 2. C1+ C2+ C1– C2– VCC V– V+ T1IN T1OUT T2IN T2OUT R1OUT R1IN R2OUT DD R2IN SD CMOS INPUTS EIA/TIA-232 OUTPUTS CMOS OUTPUTS EIA/TIA-232 INPUTS* T1 T2 R1 R2 + + 0.1µF 10V 0.1µF 10V GND ADM1385 +3.3V INPUT +3.3V TO +6.6V VOLTAGE DOUBLER +6.6V TO –6.6V VOLTAGE INVERTER C5 0.1µF + + + *INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT 0 00 7 1 -0 03 C3 0.1µF 10V C4 0.1µF 10V Figure 3.

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ADM3202/ADM3222/ADM1385 Rev. E | Page 2 of 16 TABLE OF CONTENTS Features .............................................................................................. 1  Applications....................................................................................... 1  General Description ......................................................................... 1  Functional Block Diagrams............................................................. 1  Revision History ............................................................................... 2  Specifications..................................................................................... 3  Absolute Maximum Ratings............................................................ 4  ESD Caution.................................................................................. 4  Pin Configurations and Function Descriptions ........................... 5  Pin Configurations (N, RN, RU, and RW Packages)................5  Pin Configurations (RS and RU Packages)................................5  Typical Performance Characteristics ..............................................6  General Description..........................................................................8  Circuit Description .......................................................................8  High Baud Rate..............................................................................9  Outline Dimensions ....................................................................... 10  Ordering Guide .......................................................................... 14  REVISION HISTORY 7/11—Rev. D to Rev. E Changes to Figure 3.......................................................................... 1 Changes to Table 2............................................................................ 4 Changes to Figure 17........................................................................ 8 Updated Outline Dimensions ....................................................... 10 Changes to Ordering Guide .......................................................... 14 8/06—Rev. C to Rev. D Changes to Table 1............................................................................ 3 Updated Outline Dimensions ....................................................... 10 Changes to Ordering Guide .......................................................... 12 9/05—Rev. B to Rev. C Updated Outline Dimensions ....................................................... 10 Changes to Ordering Guide .......................................................... 12 12/01—Rev. A to Rev. B Changes to Specifications Page....................................................... 2

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ADM3202/ADM3222/ADM1385 Rev. E | Page 3 of 16 SPECIFICATIONS VCC = 3.3 V ± 0.3 V, C1 to C4 = 0.1 μF. All specifications TMIN to TMAX, unless otherwise noted. Table 1. Parameter Min Typ Max Unit Test Conditions/Comments DC CHARACTERISTICS Operating Voltage Range 3.0 3.3 5.5 V VCC Power Supply Current 1.3 3 mA No load 8 12 mA RL = 3 kΩ to GND Shutdown Supply Current 0.01 0.5 μA LOGIC Input Logic Threshold Low, VINL 0.8 V TIN Input Logic Threshold High, VINH 2.0 V TIN CMOS Output Voltage Low, VOL 0.4 V IOUT = 1.6 mA CMOS Output Voltage High, VOH VCC − 0.6 V IOUT = −1 mA Logic Pull-Up Current 5 10 μA TIN = GND to VCC1 Output Leakage Current ±10 μA Receivers disabled RS-232 RECEIVER EIA-232 Input Voltage Range −30 +30 V EIA-232 Input Threshold Low 0.6 1.2 V EIA-232 Input Threshold High 1.6 2.4 V EIA-232 Input Hysteresis 0.4 V EIA-232 Input Resistance 3 5 7 kΩ RS-232 TRANSMITTER Output Voltage Swing (RS-232) ±5.0 ±5.2 V VCC = 3.3 V, all transmitter outputs loaded with 3 kΩ to ground Output Voltage Swing (RS-562) ±3.7 V VCC = 3.0 V Transmitter Output Resistance 300 Ω VCC = 0 V, VOUT = ±2 V RS-232 Output Short-Circuit Current ±15 mA Output Leakage Current ±25 μA SD = low, VOUT = 12 V TIMING CHARACTERISTICS Maximum Data Rate 460 kbps VCC = 3.3 V, RL = 3 kΩ to 7 kΩ, CL = 50 pF to 1000 pF, one Tx switching Receiver Propagation Delay TPHL 0.4 1 μs TPLH 0.4 1 μs Transmitter Propagation Delay 0.3 1.2 μs RL = 3 kΩ, CL = 1000 pF Receiver Output Enable Time 200 ns Receiver Output Disable Time 200 ns Transmitter Skew 30 ns Receiver Skew 300 ns Transition Region Slew Rate 5.5 10 30 V/μs Measured from +3 V to −3 V or −3 V to +3 V, VCC = +3.3 V; RL = 3 kΩ, CL = 1000 pF, TA = 25°C 1 ADM1385: Input leakage current typically −10 μA when TIN = GND.

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ADM3202/ADM3222/ADM1385 Rev. E | Page 4 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 2. Parameter Rating VCC −0.3 V to +6 V V+ (VCC − 0.3 V) to +14 V V− +0.3 V to –14 V Input Voltages TIN −0.3 V to (V+, +0.3 V) RIN ±30 V Output Voltages TOUT ±15 V ROUT −0.3 V to (VCC + 0.3 V) Short-Circuit Duration TOUT Continuous Power Dissipation (Derates 6 mW/°C above 50°C) 450 mW Thermal Impedance, θJA N-16/N-18 (2-Layer Test Board) 117°C/W RW-16/RW-18 (4-Layer Test Board) 56°C/W R-16 (4-Layer Test Board) 81°C/W RU-16 (4-Layer Test Board) 113°C/W RU-20 (4-Layer Test Board) 110°C/W RS-20 (4-Layer Test Board) 83°C/W Operating Temperature Range Industrial (A Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) JEDEC industry standard J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION

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ADM3202/ADM3222/ADM1385 Rev. E | Page 5 of 16 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS PIN CONFIGURATIONS (N, R, RU, AND RW PACKAGES) C1+ 1 V+ 2 C1– 3 C2+ 4 VCC16 GND15 T1OUT14 R1IN13 C2– 5 R1OUT12 V– 6 T1IN11 T2OUT 7 T2IN10 R2IN 8 R2OUT9 ADM3202 TOP VIEW (Not to Scale) 00 07 1- 00 4 Figure 4. N, R, RU, and RW Packages Pin Configuration EN 1 C1+ 2 V+ 3 C1– 4 SD18 VCC17 GND16 T1OUT15 C2+ 5 C2– 6 V– 7 R1IN14 R1OUT13 T1IN12 T2OUT 8 T2IN11 R2IN 9 R2OUT10 ADM3222 TOP VIEW (Not to Scale) 00 07 1- 00 5 Figure 5. N and RW Packages Pin Configuration PIN CONFIGURATIONS (RS AND RU PACKAGES) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 C1+ V+ C1– V– C2– C2+ EN VCC GND T1OUT NC R1OUT R1IN R2OUT R2IN T2OUT NC T2IN T1IN SD ADM3222 (SSOP/TSSOP) TOP VIEW (Not to Scale) NC = NO CONNECT 00 07 1- 00 6 Figure 6. RS and RU Packages Pin Configuration DD 1 C1+ 2 V+ 3 C1– 4 SD20 VCC19 GND18 T1OUT17 C2+ 5 C2– 6 V– 7 R1IN16 R1OUT15 T1IN14 T2OUT 8 T2IN13 R2IN 9 R2OUT12 NC 10 NC11 NC = NO CONNECT ADM1385 (SSOP) TOP VIEW (Not to Scale) 00 07 1- 00 7 Figure 7. RS Package Pin Configuration Table 3. Pin Function Descriptions Mnemonic Description VCC Power Supply Input (3.3 V ± 0.3 V). V+ Internally Generated Positive Supply (+6 V nominal). V– Internally Generated Negative Supply (−6 V nominal). GND Ground Pin. Must be connected to 0 V. C1+, C1– External Capacitor 1 is connected between these pins. A 0.1 μF capacitor is recommended but larger capacitors up to 47 μF can be used. C2+, C2– External Capacitor 2 is connected between these pins. A 0.1 μF capacitor is recommended but larger capacitors up to 47 μF can be used. TxIN Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. TxOUT Transmitter (Driver) Outputs. These are RS-232 signal levels (typically ±9 V). RxIN Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on each input. RxOUT Receiver Outputs. These are CMOS output logic levels. EN (ADM3222 only) Receiver Enable. Active low. When low, the receiver outputs are enabled. When high, they are three-stated. SD (ADM3222 only) Shutdown Control. Active low. When low, the charge pump is shut down and the transmitter outputs are disabled. SD (ADM1385 only) Shutdown Control. When low, the charge pump is shut down and all transmitters and receivers are disabled. DD (ADM1385 only) Driver Disable. When low, the charge pump is turned off and the transmitters are disabled. The receivers remain active. NC No Connect.

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ADM3202/ADM3222/ADM1385 Rev. E | Page 6 of 16 TYPICAL PERFORMANCE CHARACTERISTICS LOAD CAPACITANCE (pF) 8 6 4 2 0 –2 –4 –6 –8 0 1200200 400 600 800 TOUT (HIGH) TOUT (LOW) T x O /P V O L T A G E ( V ) 1000 00 07 1- 00 8 Figure 8. Transmitter Output Voltage High/Low vs. Load Capacitance @ 460 kbps VCC (V) 8 2.7 2.9 3.1 3.3 3.5 Tx O/P HIGH T x O /P ( V ) 6 4 2 0 –2 –4 –6 –8 Tx O/P LOW 00 07 1- 00 9 Figure 9. Transmitter Output Voltage vs. VCC LOAD CURRENT (mA) 8 0 2 4 6 8 T x O /P ( V ) 6 4 2 0 –2 –4 –6 –8 10 12 Tx O/P LOW Tx O/P HIGH 00 07 1- 01 0 Figure 10. Transmitter Output Voltage Low/High vs. Load Current LOAD CURRENT (mA) 8 0 2 4 6 8 V+ V + , V – (V ) 6 4 2 0 –2 –4 –6 –8 V– 10 12 00 07 1- 01 1 Figure 11. Charge Pump V+, V− vs. Load Current VCC (V) 350 2.7 2.9 3.1 3.3 3.5 IM P E D A N C E ( Ω ) 300 250 200 150 100 50 0 V+ (IMPEDANCE) V– (IMPEDANCE) 0 00 71 -0 12 Figure 12. Charge Pump Impedance vs. VCC LOAD CAPACITANCE (pF) 20 0 1000 2000 3000 ICC @ 230kbps I C C ( m A ) 18 16 14 12 10 2 0 8 6 4 ICC @ 460kbps 00 07 1- 01 3 Figure 13. Power Supply Current vs. Load Capacitance

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ADM3202/ADM3222/ADM1385 Rev. E | Page 7 of 16 1 CH 1 5.00V CH 2 5.00V M1.00µs CH1 0V T 2 T 0 00 71 -0 1 4 Figure 14. 460 kbps Data Transmission

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ADM3202/ADM3222/ADM1385 Rev. E | Page 8 of 16 GENERAL DESCRIPTION The ADM3202/ADM3222/ADM1385 are RS-232 line drivers/ receivers. Step-up voltage converters coupled with level-shifting transmitters and receivers allow RS-232 levels to be developed while operating from a single 3.3 V supply. CMOS technology is used to keep the power dissipation to an absolute minimum, allowing maximum battery life in portable applications. The ADM3202/ADM3222/ADM1385 are modifications, enhancements, and improvements of the AD230 to AD241 family and derivatives. They are essentially plug-in compatible and do not have any materially different applications. CIRCUIT DESCRIPTION The internal circuitry consists of these main sections: • A charge pump voltage converter • 3.3 V logic to EIA-232 transmitters • EIA-232 to 5 V logic receivers Charge Pump DC to DC Voltage Converter The charge pump voltage converter consists of a 200 kHz oscillator and a switching matrix. The converter generates a ±6.6 V supply from the input 3.3 V level. This is done in two stages by using a switched capacitor technique as illustrated in Figure 18 and Figure 19. First, the 3.3 V input supply is doubled to 6.6 V by using Capacitor C1 as the charge storage element. The +6.6 V level is then inverted to generate −6.6 V using C2 as the storage element. C3 is shown connected between V+ and VCC but is equally effective if connected between V+ and GND. Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be increased, if desired. Capacitor C3 is shown connected between V+ and VCC. It is also acceptable to connect this capacitor between V+ and GND. If desired, larger capacitors (up to 10 μF) can be used for Capacitors C1 to C4. C1+ C2+ C1– C2– VCC V– V+ T1IN T1OUT T2IN T2OUT R1OUT R1IN R2OUT R2IN CMOS INPUTS EIA/TIA-232 OUTPUTS CMOS OUTPUTS EIA/TIA-232 INPUTS* T1 T2 R1 R2 + + + 0.1µF 10V 0.1µF 10V GND ADM3202 C3 0.1µF 6.3V +3.3V INPUT +3.3V TO +6.6V VOLTAGE DOUBLER +6.6V TO –6.6V VOLTAGE INVERTER C5 0.1µF + C4 0.1µF 10V + *INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT 00 07 1- 01 5 Figure 15. ADM3202 Typical Operating Circuit C1+ C2+ C1– C2– VCC V– V+ T1IN T1OUT T2IN T2OUT R1OUT R1IN R2OUT EN R2IN SD CMOS INPUTS EIA/TIA-232 OUTPUTS CMOS OUTPUTS EIA/TIA-232 INPUTS* T1 T2 R1 R2 + + + 0.1µF 10V 0.1µF 10V GND ADM3222 C3 0.1µF 6.3V +3.3V INPUT +3.3V TO +6.6V VOLTAGE DOUBLER +6.6V TO –6.6V VOLTAGE INVERTER C5 0.1µF + C4 0.1µF 10V + *INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT 00 07 1- 01 6 Figure 16. ADM3222 Typical Operating Circuit C1+ C2+ C1– C2– VCC V– V+ T1IN T1OUT T2IN T2OUT R1OUT R1IN R2OUT DD R2IN SD CMOS INPUTS EIA/TIA-232 OUTPUTS CMOS OUTPUTS EIA/TIA-232 INPUTS* T1 T2 R1 R2 + + 0.1µF 10V 0.1µF 10V GND ADM1385 +3.3V INPUT +3.3V TO +6.6V VOLTAGE DOUBLER +6.6V TO –6.6V VOLTAGE INVERTER C5 0.1µF + + + *INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT 0 00 7 1 -0 17 C3 0.1µF 10V C4 0.1µF 10V Figure 17. ADM1385 Typical Operating Circuit C1 + C3 + S3 S4 S1 S2 INTERNAL OSCILLATOR VCC GND VCC V+ = 2VCC 00 07 1- 01 8 Figure 18. Charge Pump Voltage Doubler C2 + C4 + S3 S4 S1 S2 INTERNAL OSCILLATOR V+ GND V– = –(V+) GND FROM VOLTAGE DOUBLER 00 07 1- 01 9 Figure 19. Charge Pump Voltage Inverter

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ADM3202/ADM3222/ADM1385 Rev. E | Page 9 of 16 Transmitter (Driver) Section The drivers convert 3.3 V logic input levels into RS-232 output levels. With VCC = 3.3 V and driving an RS-232 load, the output voltage swing is typically ±6 V. Receiver Section The receivers are inverting level-shifters that accept RS-232 input levels and translate them into 3 V logic output levels. The inputs have internal 5 kΩ, pull-down resistors to ground and are protected against overvoltages up to ±30 V. Unconnected inputs are pulled to 0 V by the internal 5 kΩ, pull-down resistor. This results in a Logic 1 output level for unconnected inputs or for inputs connected to GND. The receivers have Schmitt-trigger inputs with a hysteresis level of 0.4 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times. HIGH BAUD RATE The ADM3202/ADM3222 feature high slew rates permitting data transmission at rates well in excess of the EIA/RS-232E specifications. RS-232 voltage levels are maintained at data rates up to 460 kbps even under worst-case loading conditions. This allows high speed data links between two terminals and is suitable for the new generation ISDN modem standards that require data rates of 230 kbps. The slew rate is internally controlled to less than 30 V/μs to minimize EMI interference.

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