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ADM7150ACPZ-3.3-R7

hotADM7150ACPZ-3.3-R7

ADM7150ACPZ-3.3-R7

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Part Number ADM7150ACPZ-3.3-R7
Manufacturer Analog Devices Inc.
Description IC REG LINEAR 3.3V 800MA 8LFCSP
Datasheet ADM7150ACPZ-3.3-R7 Datasheet
Package 8-WFDFN Exposed Pad, CSP
In Stock 381 piece(s)
Unit Price $ 4.9631 *
Lead Time Can Ship Immediately
Estimated Delivery Time Aug 11 - Aug 16 (Choose Expedited Shipping)
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Part Number # ADM7150ACPZ-3.3-R7 (PMIC - Voltage Regulators - Linear) is manufactured by Analog Devices Inc. and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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ADM7150ACPZ-3.3-R7 Specifications

ManufacturerAnalog Devices Inc.
CategoryIntegrated Circuits (ICs) - PMIC - Voltage Regulators - Linear
Datasheet ADM7150ACPZ-3.3-R7Datasheet
Package8-WFDFN Exposed Pad, CSP
Series-
Output ConfigurationPositive
Output TypeFixed
Number of Regulators1
Voltage - Input (Max)16V
Voltage - Output (Min/Fixed)3.3V
Voltage - Output (Max)-
Voltage Dropout (Max)-
Current - Output800mA
Current - Quiescent (Iq)-
Current - Supply (Max)7mA ~ 12mA
PSRR94dB ~ 62dB (1kHz ~ 1MHz)
Control FeaturesEnable
Protection FeaturesOver Temperature, Short Circuit
Operating Temperature-40°C ~ 125°C
Mounting TypeSurface Mount
Package / Case8-WFDFN Exposed Pad, CSP
Supplier Device Package8-LFCSP-WD (3x3)

ADM7150ACPZ-3.3-R7 Datasheet

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800 mA Ultralow Noise, High PSRR, RF Linear Regulator Data Sheet ADM7150 FEATURES Input voltage range: 4.5 V to 16 V Maximum output current: 800 mA Low noise 1.0 µV rms total integrated noise from 100 Hz to 100 kHz 1.6 µV rms total integrated noise from 10 Hz to 100 kHz Noise spectral density: 1.7 nV√Hz typical from 10 kHz to 1 MHz Power supply rejection ratio (PSRR) at 400 mA load >90 dB from 1 kHz to 100 kHz, VOUT = 5 V >60 dB at 1 MHz, VOUT = 5 V Dropout voltage: 0.6 V at VOUT = 5 V, 800 mA load Initial voltage accuracy: ±1% Voltage accuracy over line, load and temperature: ±2% Quiescent current (IGND): 4.3 mA at no load Low shutdown current: 0.1 µA Stable with a 10 µF ceramic output capacitor Fixed output voltage options: 1.8 V, 2.8 V, 3.0 V, 3.3 V, 4.5 V, 4.8 V, and 5.0 V (16 outputs between 1.5 V and 5.0 V are available) Exposed pad 8-lead LFCSP and 8-lead SOIC packages APPLICATIONS Regulated power noise sensitive applications RF mixers, phase-locked loops (PLLs), voltage-controlled oscillators (VCOs), and PLLs with integrated VCOs Communications and infrastructure Cable digital-to-analog converter (DAC) drivers Backhaul and microwave links TYPICAL APPLICATION CIRCUIT VOUT REF REF_SENSE GND VIN EN BYP VREG ADM7150 CREG 10µF CBYP 1µF CREF 1µF CIN 10µF COUT 10µF OFF ON VIN = 6.2V VOUT = 5.0V 11 04 3- 00 1 Figure 1. 5 V Output Circuit GENERAL DESCRIPTION The ADM7150 is a low dropout (LDO) linear regulator that operates from 4.5 V to 16 V and provides up to 800 mA of output current. Using an advanced proprietary architecture, it provides high power supply rejection (>90 dB from 1 kHz to 1 MHz), ultralow output noise (<1.7 nV√Hz), and achieves excellent line and load transient response with a 10 µF ceramic output capacitor. The ADM7150 is available in 1.8 V, 2.8 V, 3.0 V, 3.3 V, 4.5 V, 4.8 V, and 5.0 V fixed outputs. In addition, 16 fixed output voltages between 1.5 V and 5.0 V are available upon request. The ADM7150 regulator typical output noise is 1.0 µV rms from 100 Hz to 100 kHz for fixed output voltage options, and the noise spectral density is 1.7 nV/√Hz from 10 kHz to 1 MHz. The ADM7150 is available in 8-lead, 3 mm × 3 mm LFCSP and 8-lead SOIC packages, making it not only a very compact solution but also providing excellent thermal performance for applications requiring up to 800 mA of output current in a small, low profile footprint. See the ADM7151 adjustable LDO to generate additional output voltages. 100k 1 10 100 1k 10k 0.1 1 10 100 1k 10k 100k 1M N O IS E SP EC TR A L D EN SI TY (n V/ √H z) FREQUENCY (Hz) CBYP = 1µF CBYP = 10µF CBYP = 100µF CBYP = 1mF 11 04 3- 00 2 Figure 2. Noise Spectral Density (NSD) vs. Frequency for Various CBYP Rev. 0 Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com

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ADM7150 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Typical Application Circuit ............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Input and Output Capacitor Recommended Specifications ... 4 Absolute Maximum Ratings ............................................................ 5 Thermal Data ................................................................................ 5 Thermal Resistance ...................................................................... 5 ESD Caution .................................................................................. 5 Pin Configurations and Function Descriptions ........................... 6 Typical Performance Characteristics ..............................................7 Theory of Operation ...................................................................... 15 Applications Information .............................................................. 16 Capacitor Selection .................................................................... 16 Enable (EN) and Undervoltage Lockout (UVLO) ................. 17 Start-Up Time ............................................................................. 18 REF, BYP, and, VREG pins ........................................................ 18 Current-Limit and Thermal Overload Protection ................. 19 Thermal Considerations ............................................................ 19 Printed Circuit Board Layout Considerations........................ 21 Outline Dimensions ....................................................................... 22 Ordering Guide .......................................................................... 22 REVISION HISTORY 9/13—Revision 0: Initial Version Rev. 0 | Page 2 of 24

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Data Sheet ADM7150 SPECIFICATIONS VIN = VOUT + 1.2 V or VIN = 4.5 V, whichever is greater, VEN = VIN, IOUT = 10 mA, CIN = COUT = CREG = 10 µF, CREF = CBYP = 1 µF. TA = 25°C for typical specifications. TJ = −40°C to +125°C for minimum/maximum specifications, unless otherwise noted. Table 1. Parameter Symbol Test Conditions/Comments Min Typ Max Unit INPUT VOLTAGE RANGE VIN 4.5 16 V OPERATING SUPPLY CURRENT IGND IOUT = 0 µA 4.3 7.0 mA IOUT = 800 mA 8.6 12 mA SHUTDOWN CURRENT IIN-SD VEN = 0 V 0.1 3 µA OUTPUT NOISE OUTNOISE 10 Hz to 100 kHz, independent of output voltage 1.6 µV rms 100 Hz to 100 kHz, independent of output voltage 1.0 µV rms NOISE SPECTRAL DENSITY NSD 10 kHz to 1 MHz, independent of output voltage 1.7 nV/√Hz POWER SUPPLY REJECTION RATIO PSRR 1 kHz to 100 kHz, VIN = 6.2 V, VOUT = 5 V at 800 mA 86 dB 1 MHz, VIN = 6.2 V, VOUT = 5 V at 800 mA 54 dB 1 kHz to 100 kHz, VIN = 6.2 V, VOUT = 5 V at 400 mA 95 dB 1 MHz, VIN = 6.2 V, VOUT = 5 V at 400 mA 62 dB 1 kHz to 100 kHz, VIN = 5 V, VOUT = 3.3 V at 800 mA 94 dB 1 MHz, VIN = 5 V, VOUT = 3.3 V at 800 mA 62 dB 1 kHz to 100 kHz, VIN = 5 V, VOUT = 3.3 V at 400 mA 95 dB 1 MHz, VIN = 5 V, VOUT = 3.3 V at 400 mA 68 dB VOUT VOLTAGE ACCURACY VOUT = VREF Voltage Accuracy VOUT IOUT = 10 mA, TJ = 25°C −1 +1 % 1 mA < IOUT < 800 mA, over line, load and temperature −2 +2 % VOUT REGULATION Line Regulation ΔVOUT/ΔVIN VIN = VOUT + 1.2 V or VOUT + 4.5 V, whichever is greater, to 16 V −0.01 +0.01 %/V Load Regulation1 ΔVOUT/ΔIOUT IOUT = 1 mA to 800 mA 0.4 1.0 %/A VOUT CURRENT-LIMIT THRESHOLD2 ILIMIT 1.0 1.2 1.6 A DROPOUT VOLTAGE3 VDROPOUT IOUT = 400 mA, VOUT = 5 V 0.3 0.5 V IOUT = 800 mA, VOUT = 5 V 0.6 1.0 V PULL-DOWN RESISTANCE VOUT Pull-Down Resistance VOUT-PULL VEN = 0 V, VOUT = 1 V 600 Ω VREG Pull-Down Resistance VREG-PULL VEN = 0 V, VREG = 1 V 34 kΩ VREF Pull-Down Resistance VREF-PULL VEN = 0 V, VREF = 1 V 800 Ω VBYP Pull-Down Resistance VBYP-PULL VEN = 0 V, VBYP = 1 V 500 Ω START-UP TIME4 VOUT = 5 V VOUT Start-Up Time tSTART-UP 2.8 ms VREG Start-Up Time tREG-START-UP 1.0 ms VREF Start-Up Time tREF-START-UP 1.8 ms THERMAL SHUTDOWN Thermal Shutdown Threshold TSSD TJ rising 155 °C Thermal Shutdown Hysteresis TSSD-HYS 15 °C UNDERVOLTAGE THRESHOLDs Input Voltage Rising UVLORISE 4.49 V Input Voltage Falling UVLOFALL 3.85 V Hysteresis UVLOHYS 240 mV VREG5 UNDERVOLTAGE THRESHOLDS VREG Rise VREGUVLORISE 3.1 V VREG Fall VREGUVLOFALL 2.55 V Hysteresis VREGUVLOHYS 210 mV Rev. 0 | Page 3 of 24

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ADM7150 Data Sheet Parameter Symbol Test Conditions/Comments Min Typ Max Unit EN INPUT 4.5 V ≤ VIN ≤ 16 V EN Input Logic High ENHIGH 3.2 V EN Input Logic Low ENLOW 0.8 V EN Input Logic Hysteresis ENHYS VIN = 5 V 225 mV EN Input Leakage Current IEN-LKG VEN = VIN or GND 0.1 1.0 µA 1 Based on an end-point calculation using 1 mA and 800 mA loads. See Figure 7, Figure 16, and Figure 22 for typical load regulation performance for loads less than 1 mA. 2 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 5.0 V output voltage is defined as the current that causes the output voltage to drop to 90% of 5.0 V, or 4.5 V. 3 Dropout voltage is defined as the input-to-output voltage differential when the input voltage is set to achieve the nominal output voltage. Dropout applies only for output voltages above 4.5 V. 4 Start-up time is defined as the time between the rising edge of VEN to VOUT, VREG, or VREF being at 90% of its nominal value. 5 The output voltage is turned off until the VREG UVLO rise threshold is crossed. The VREG output is turned off until the input voltage UVLO rise threshold is crossed. INPUT AND OUTPUT CAPACITOR RECOMMENDED SPECIFICATIONS Table 2. Parameter Symbol Test Conditions/Comments Min Typ Max Unit CAPACITANCE TA = −40°C to +125°C Minimum Input1 CIN 7.0 µF Minimum Regulator1 CREG 7.0 µF Minimum Output1 COUT 7.0 µF Minimum Bypass CBYP 0.1 µF Minimum Reference CREF 0.7 µF CAPACITOR Equivalent Series Resistance (ESR) RESR TA = −40°C to +125°C CREG, COUT, CIN, CREF 0.001 0.2 Ω CBYP 0.001 2.0 Ω 1 The minimum input, regulator, and output capacitance must be greater than 7.0 μF over the full range of operating conditions. The full range of operating conditions in the application must be considered during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended; however, Y5V and Z5U capacitors are not recommended for use with any LDO. Rev. 0 | Page 4 of 24

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Data Sheet ADM7150 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN to GND −0.3 V to +18 V VREG to GND −0.3 V to VIN, or +6 V (whichever is less) VOUT to GND −0.3 V to VREG, or +6 V (whichever is less) VOUT to BYP ±0.3 V EN to GND −0.3 V to +18 V BYP to GND −0.3 V to VREG, or +6 V (whichever is less) REF to GND −0.3 V to VREG, or +6 V (whichever is less) REF_SENSE to GND −0.3 V to +6 V Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Operating Ambient Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADM7150 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θJA). Maximum junction temperature (TJ) is calculated from the ambient temperature (TA) and power dissipation (PD) using the formula TJ = TA + (PD × θJA) Junction to ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction to ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit board. See JESD51-7 and JESD51-9 for detailed information on the board construction. ΨJB is the junction to board thermal characterization parameter with units of °C/W. ΨJB of the package is based on modeling and the calculation using a 4-layer board. The JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths rather than a single path as in thermal resistance (θJB). Therefore, ΨJB thermal paths include convection from the top of the package as well as radiation from the package, factors that make ΨJB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the formula TJ = TB + (PD × ΨJB) See JESD51-8 and JESD51-12 for more detailed information about ΨJB. THERMAL RESISTANCE θJA, θJC, and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA θJC ΨJB Unit 8-Lead LFCSP 36.7 23.5 13.3 °C/W 8-Lead SOIC 36.9 27.1 18.6 °C/W ESD CAUTION Rev. 0 | Page 5 of 24

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ADM7150 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 3BYP 4GND 1VREG 2VOUT 6 REF 5 REF_SENSE 8 VIN 7 ENADM7150 TOP VIEW (Not to Scale) NOTES 1. EXPOSED PAD ON THE BOTTOM OF THE PACKAGE. EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. CONNECT THE EXPOSED PAD TO THE GROUND PLANE ON THE BOARD TO ENSURE PROPER OPERATION. 1 10 43 -0 03 Figure 3. 8-Lead LFCSP Pin Configuration ADM7150 TOP VIEW (Not to Scale) VREG 1 VOUT 2 BYP 3 GND 4 VIN8 EN7 REF6 REF_SENSE5 1 1 04 3- 00 4 NOTES 1. EXPOSED PAD ON THE BOTTOM OF THE PACKAGE. EXPOSED PAD ENHANCES THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GND INSIDE THE PACKAGE. CONNECT THE EXPOSED PAD TO THE GROUND PLANE ON THE BOARD TO ENSURE PROPER OPERATION. Figure 4. 8-Lead SOIC Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1 VREG Regulated Input Supply to LDO Amplifier. Bypass VREG to GND with a 10 µF or greater capacitor. Do not connect a load to ground. 2 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 10 µF or greater capacitor. 3 BYP Low Noise Bypass Capacitor. Connect a 1 µF capacitor to GND to reduce noise. Do not connect a load to ground. 4 GND Ground Connection. 5 REF_SENSE REF_SENSE must be connected to the REF pin for proper operation. Do not connect to VOUT or GND. 6 REF Low Noise Reference Voltage Output. Bypass REF to GND with a 1 µF capacitor. Short REF_SENSE to REF for fixed output voltages. Do not connect a load to ground. 7 EN Enable. Drive EN high to turn on the regulator and drive EN low to turn off the regulator. For automatic startup, connect EN to VIN. 8 VIN Regulator Input Supply. Bypass VIN to GND with a 10 µF or greater capacitor. EPAD Exposed Pad on the Bottom of the Package. The exposed pad enhances thermal performance and is electrically connected to GND inside the package. Connect the exposed pad to the ground plane on the board to ensure proper operation. Rev. 0 | Page 6 of 24

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Data Sheet ADM7150 TYPICAL PERFORMANCE CHARACTERISTICS VIN = VOUT + 1.2 V, or VIN = 4.5 V, whichever is greater, VEN = VIN, IOUT = 10 mA, CIN = COUT = CREG = 10 µF, CREF = CBYP = 1 µF, TA = 25°C, unless otherwise noted. SH U TD O W N C U R R EN T (µ A ) TEMPERATURE (°C) –0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 –50 –25 0 25 50 75 100 125 VIN = 6.2V VIN = 6.5V VIN = 7V VIN = 10V VIN = 16V 11 04 3- 00 5 Figure 5. Shutdown Current vs. Temperature at Various Input Voltages, VOUT = 5 V V O U T (V ) JUNCTION TEMPERATURE (°C) 1258525–5–40 4.95 4.96 4.97 4.98 4.99 5.00 5.01 5.02 5.03 5.04 5.05 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA 11 04 3- 00 6 Figure 6. Output Voltage (VOUT) vs. Junction Temperature (TJ), VOUT = 5 V V O U T (V ) ILOAD (mA) 1000100101 4.95 4.96 4.97 4.98 4.99 5.00 5.01 5.02 5.03 5.04 5.05 11 04 3- 00 7 Figure 7. Output Voltage (VOUT) vs. Load Current (ILOAD), VOUT = 5 V V O U T (V ) VIN (V) 1612 141086 4.95 4.96 4.97 4.98 4.99 5.00 5.01 5.02 5.03 5.04 5.05 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA 11 04 3- 00 8 Figure 8. Output Voltage (VOUT) vs. Input Voltage (VIN), VOUT = 5 V G R O U N D C U R R EN T (m A ) JUNCTION TEMPERATURE (°C) 1258525–5–40 0 2 4 6 8 10 12 14 16 18 20 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA 11 04 3- 00 9 Figure 9. Ground Current vs. Junction Temperature (TJ), VOUT = 5 V G R O U N D C U R R EN T (m A ) ILOAD (mA) 1000100101 0 1 2 3 4 5 6 7 8 9 10 1 1 04 3- 01 0 Figure 10. Ground Current vs. Load Current (ILOAD), VOUT = 5 V Rev. 0 | Page 7 of 24

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ADM7150 Data Sheet G R O U N D C U R R EN T (m A ) VIN (V) 1615141312111098765 0 1 2 3 4 5 6 7 8 9 10 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA 11 04 3- 01 1 Figure 11. Ground Current vs. Input Voltage (VIN), VOUT = 5 V D R O PO U T VO LT A G E (m V) ILOAD (mA) 1000100101 0 700 600 500 400 300 200 100 11 04 3- 01 2 Figure 12. Dropout Voltage vs. Load Current (ILOAD), VOUT = 5 V V O U T (V ) VIN (V) 6.05.85.65.45.25.04.84.6 4.0 5.2 5.0 4.8 4.6 4.4 4.2 VDROPOUT = 5mA VDROPOUT = 10mA VDROPOUT = 100mA VDROPOUT = 200mA VDROPOUT = 400mA VDROPOUT = 800mA 11 04 3- 01 3 Figure 13. Output Voltage (VOUT) vs. Input Voltage (VIN) in Dropout, VOUT = 5 V G R O U N D C U R R EN T (m A ) VIN (V) 6.05.85.65.45.25.04.84.6 0 12 10 8 6 4 2 IGND = 5mA IGND = 10mA IGND = 100mA IGND = 200mA IGND = 400mA IGND = 800mA 11 04 3- 01 4 Figure 14. Ground Current vs. Input Voltage (VIN) in Dropout, VOUT = 5 V 11 04 3- 01 5 V O U T (V ) JUNCTION TEMPERATURE (°C) 1258525–5–40 3.26 3.27 3.28 3.29 3.30 3.31 3.32 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA Figure 15. Output Voltage (VOUT) vs. Junction Temperature (TJ), VOUT = 3.3 V V O U T (V ) ILOAD (mA) 1000100101 3.26 3.32 3.31 3.30 3.29 3.28 3.27 11 04 3- 01 6 Figure 16. Output Voltage (VOUT) vs. Load Current (ILOAD), VOUT = 3.3 V Rev. 0 | Page 8 of 24

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Data Sheet ADM7150 11 04 3- 01 7 V O U T (V ) VIN (V) 16128 141064 3.26 3.32 3.31 3.30 3.29 3.28 3.27 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA Figure 17. Output Voltage (VOUT) vs. Input Voltage (VIN), VOUT = 3.3 V 11 04 3- 01 8 G R O U N D C U R R EN T (m A ) JUNCTION TEMPERATURE (°C) 1258525–5–40 0 10 9 8 7 6 5 4 3 2 1 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA Figure 18. Ground Current vs. Junction Temperature (TJ), VOUT = 3.3 V G R O U N D C U R R EN T (m A ) ILOAD (mA) 1000100101 0 1 2 3 4 5 6 7 8 9 10 11 04 3- 01 9 Figure 19. Ground Current vs. Load Current (ILOAD), VOUT = 3.3 V 1 1 04 3- 02 0 G R O U N D C U R R EN T (m A ) VIN (V) 16128 141064 0 10 9 8 7 6 5 4 3 2 1 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA Figure 20. Ground Current vs. Input Voltage (VIN), VOUT = 3.3 V V O U T (V ) JUNCTION TEMPERATURE (°C) 1258525–5–40 1.780 1.785 1.790 1.795 1.800 1.805 1.810 1.815 1.820 LOAD = 1mA LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA 11 04 3- 02 1 Figure 21. Output Voltage (VOUT) vs. Junction Temperature (TJ), VOUT = 1.8 V 1000100101 V O U T (V ) ILOAD (mA) 1.780 1.785 1.790 1.795 1.800 1.805 1.810 1.815 1.820 11 04 3- 02 2 Figure 22. Output Voltage (VOUT) vs. Load Current (ILOAD), VOUT = 1.8 V Rev. 0 | Page 9 of 24

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Royal*****rajan

July 8, 2020

Good and works well. What else is there to say about it.

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July 4, 2020

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July 1, 2020

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June 25, 2020

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June 24, 2020

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June 21, 2020

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June 18, 2020

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Bri*****Mata

June 13, 2020

I took the chance and used it and I worked fine for me.

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June 11, 2020

Item works as described, fast delivery, nice contact!

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June 2, 2020

It arrived earlier than the deadline. All is OK. Thank you

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ADM7150ACPZ-3.3-R7

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