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BA80BC0FP-E2

hot BA80BC0FP-E2

BA80BC0FP-E2

For Reference Only

Part Number BA80BC0FP-E2
Manufacturer Rohm Semiconductor
Description IC REG LINEAR 8V 1A TO252-3
Datasheet BA80BC0FP-E2 Datasheet
Package TO-252-3, DPak (2 Leads + Tab), SC-63
In Stock 3870 piece(s)
Unit Price $ 0.4564 *
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BA80BC0FP-E2 Specifications

ManufacturerRohm Semiconductor
CategoryIntegrated Circuits (ICs) - PMIC - Voltage Regulators - Linear
Datasheet BA80BC0FP-E2 Datasheet
PackageTO-252-3, DPak (2 Leads + Tab), SC-63
Series-
Output ConfigurationPositive
Output TypeFixed
Number of Regulators1
Voltage - Input (Max)16V
Voltage - Output (Min/Fixed)8V
Current - Output1A
Current - Supply4.5mA ~ 6mA
Protection FeaturesOver Current, Over Temperature
Operating Temperature-40°C ~ 105°C
Mounting TypeSurface Mount
Package / CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Supplier Device PackageTO-252-3

BA80BC0FP-E2 Datasheet

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Datasheet ○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. 1/16 TSZ02201-0R6R0A600120-1-2 TSZ22111・14・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 1A Variable/Fixed Output LDO Regulators BAxxBC0 Series(Fixed) BAxxBC0W Series(Fixed) BA00BC0WCP-V5(Variable) ●General Description The BAxxBC0 are low-saturation regulators with an output current of 1.0 A and an output voltage accuracy of ±2%. A broad output voltage range is offered, from 1.5V to 10V, and built-in overcurrent protection and thermal shutdown (TSD) circuits prevent damage due to short-circuiting and overloading, respectively. ●Features Output voltage accuracy: ±2% Broad output range available: 1.5 V -10 V (BAxxBC0 series) Low saturation-voltage type with PNP output Built-in overcurrent protection circuit Built-in thermal shutdown circuit Integrated shutdown switch (BAxxBC0WT, BAxxBC0WT-5, or BAxxBC0WFP Series, BA00BC0WCP-V5) ●Key Specifications Input Power Supply Voltage: 16.0V(Max.) Output voltage:(BA00BC0xx) Variable (BAxxBC0) Fixed Output current: 1A(Max.) Shutdown current: 0μA(Typ.) Operating temperature range: -40℃ to +105℃ ●Applications All electronic devices that use microcontrollers and logic circuits ●Packages W (Typ.) x D (Typ.) x H (Max.) TO252-3 6.50mm x 9.50mm x 2.50mm TO252-5 6.50mm x 9.50mm x 2.50mm TO220CP-V5 10.00mm x 20.12mm x 4.60mm TO220FP-3 10.00mm x 30.50mm x 4.60mm TO220FP-5 10.00mm x 30.50mm x 4.60mm TO220FP-5(V5) 10.00mm x 31.50mm x 8.15mm ●Lineup Matrix Part Number Output Voltage (V) Package 1.5 1.8 2.5 3.0 3.3 5.0 6.0 7.0 8.0 9.0 10.0 Variable BAxxBC0WT TO220FP-5 BAxxBC0WT-V5 - - - - - TO220FP-5 (V5) BAxxBC0WFP TO252-5 BAxxBC0T - TO220FP-3 BAxxBC0FP - TO252-3 BA00BC0WCP-V5 - - - - - - - - - - - TO220CP-V5 TO220CP-V5 TO220FP-3 TO220FP-5 TO220FP-5 (V5) TO252-3 TO252-5

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2/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Lineup Maximum output current(Max.) Shutdown Switch Package Output voltage(Typ.) Orderable Part Number 1A With Switch TO252-5 Reel of 2000 1.5 V BA15BC0WFP-E2 1.8 V BA18BC0WFP-E2 2.5 V BA25BC0WFP-E2 3.0 V BA30BC0WFP-E2 3.3 V BA33BC0WFP-E2 5.0 V BA50BC0WFP-E2 6.0 V BA60BC0WFP-E2 7.0 V BA70BC0WFP-E2 8.0 V BA80BC0WFP-E2 9.0 V BA90BC0WFP-E2 10.0 V BAJ0BC0WFP-E2 Variable BA00BC0WFP-E2 TO220FP-5 Tube of 500 1.5 V BA15BC0WT 1.8 V BA18BC0WT 2.5 V BA25BC0WT 3.0 V BA30BC0WT 3.3 V BA33BC0WT 5.0 V BA50BC0WT 6.0 V BA60BC0WT 7.0 V BA70BC0WT 8.0 V BA80BC0WT 9.0 V BA90BC0WT 10.0 V BAJ0BC0WT Variable BA00BC0WT TO220FP-5 (V5) Tube of 500 1.5 V BA15BC0WT-V5 1.8 V BA18BC0WT-V5 2.5 V BA25BC0WT-V5 3.3 V BA33BC0WT-V5 5.0 V BA50BC0WT-V5 9.0 V BA90BC0WT-V5 Variable BA00BC0WT-V5 TO220CP-V5 Reel of 500 Variable BA00BC0WCP-V5E2 No Switch TO252-3 Reel of 2000 1.5 V BA15BC0FP-E2 1.8 V BA18BC0FP-E2 2.5 V BA25BC0FP-E2 3.0 V BA30BC0FP-E2 3.3 V BA33BC0FP-E2 5.0 V BA50BC0FP-E2 6.0 V BA60BC0FP-E2 7.0 V BA70BC0FP-E2 8.0 V BA80BC0FP-E2 9.0 V BA90BC0FP-E2 10.0 V BAJ0BC0FP-E2 TO220FP-3 Tube of 500 1.5 V BA15BC0T 1.8 V BA18BC0T 2.5 V BA25BC0T 3.0 V BA30BC0T 3.3 V BA33BC0T 5.0 V BA50BC0T 6.0 V BA60BC0T 7.0 V BA70BC0T 8.0 V BA80BC0T 9.0 V BA90BC0T 10.0 V BAJ0BC0T

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3/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Block Diagrams / Standard Example Application Circuits / Pin Configurations / Pin Descriptions [BAxxBC0T] / [BAxxBC0FP] [BAxxBC0WT] / [BAxxBC0WT-V5] / [BAxxBC0WFP] Fig.1 [BA00BC0WT] / [BA00BC0WCP-V5] / [BA00BC0WFP] / [BA00BC0WT-V5] Fig.2 Fig.3 Pin No. Pin name Function 1 CTL Output voltage on/off control 2 Vcc Supply voltage input 3 N.C./GND NC pin/GND*1 4 OUT Power supply output 5 N.C. NC pin FIN GND GND*2 *1 NC pin for TO252-5 and GND pin for TO220FP-5 and TO220FP-5 (V5). *2 TO252-5 only. Pin No. Pin name Function 1 Vcc Supply voltage input 2 N.C./GND NC pin/GND *1 3 OUT Voltage output FIN GND GND*2 *1 NC pin for TO252-3 and GND pin for TO220FP-3 and TO220FP-5 (V5). *2 TO252-3 only. TSD OCP Driver Vref 1 0.33μF CTL GND(TO252-5) OUT Fin 4 22μF 2 Vcc N.C. 5 Vcc R2 R1 3 N.C. (TO252-5) GND (TO220FP-5, -5(V5) TSD OCP Driver Vref 1 0.33μF CTL GND(TO252-5) OUT Fin 4 22μF 2 Vcc C 5 Vcc R2 R1 3 N.C. (TO252-5) GND (TO220FP-5, -5(V5) Pin No. Pin name Function 1 CTL Output voltage on/off control 2 Vcc Supply voltage input 3 N.C./GND NC pin/GND*1 4 OUT Power supply output 5 C ADJ pin FIN GND GND*2 *1 NC pin for TO252-5 and GND pin for TO220FP-5 and TO220FP-5 (V5). *2 TO252-5 only. 1 2 3 4 5 1 2 3 4 5 TO220FP-5 TO220FP-5 (V5) 1 2 3 4 5 1 2 3 4 5 TO220FP-5 TO220FP-5 (V5) TO220FP-3 1 2 3TO252-3 TOP VIEW 1 2 3 TO252-5 TOP VIEW TOP VIEW PIN External capacitor setting range Vcc (1Pin) Approximately 0.33μF. OUT (3Pin) 22μF to 1000μF PIN External capacitor setting range Vcc (2Pin) Approximately 0.33μF. OUT (4Pin) 22μF to 1000μF PIN External capacitor setting range Vcc (2Pin) Approximately 0.33μF. OUT (4Pin) 22μF to 1000μF TO220CP-V5 TO252-5 FIN 1 2 3 4 5 FIN 1 2 3 4 5 1 2 3 4 5 TSD OCP Driver Vref 1 Vcc N.C. OUT 2 3 22 μ F GND Fin 0.33μ F (TO252-3) GND (TO252-3) R1 R2 (TO220FP-3, TO220FP-5(V5))

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4/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Absolute Maximum Ratings (Ta = 25°C) Parameter Symbol Limits Unit Power supply voltage VCC 18*1 V Power dissipation TO252-3 Pd 1200*2 mW TO252-5 1300*3 TO220FP-3 2000*4 TO220FP-5 2000*4 TO220FP-5 (V5) 2000*4 TO220CP-V5 2000*4 Operating temperature range Topr −40 to +105 °C Ambient storage temperature Tstg −55 to +150 °C Maximum junction temperature Tjmax 150 °C *1 Must not exceed Pd. *2 Derated at 9.6mW/°C at Ta>25°C when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). *3 Derated at 10.4mW/°C at Ta>25°C when mounted on a glass epoxy board (70 mm × 70 mm × 1.6 mm). *4 Derated at 16mW/°C at Ta> 25°C ●Recommended Operating Ratings Parameter Symbol Min. Max. Unit Input power supply voltage VCC*5 3.0 16.0 V Input power supply voltage VCC*6 Vo+1.0 16.0 V Output current IO - 1 A Variable output voltage setting value VO 1.5 12 V *5 When output voltage is 1.5 V, 1.8 V, or 2.5 V. *6 When output voltage is 3.0 V or higher. ●Electrical Characteristics BAxxBC0 Series BAxxBC0W Series (Unless otherwise specified, Ta = 25°C; VCTL = 3 V; VCCDC*7) Parameter Symbol Min. Typ. Max. Unit Conditions Output voltage VO VO (T) ×0.98 VO (T) VO (T) × 1.02 V Io = 200mA Shutdown circuit current Isd - 0 10 μA VCTL = 0 V while in off mode Minimum I/O voltage difference *8 ∆Vd - 0.3 0.5 V Io = 200mA,Vcc = 0.95 × Vo Output current capacity IO 1 - - A Input stability *9 Reg.I - 15 35 mV Vcc= Vo+1.0V→16V, Io = 200mA Load stability Reg.L - 35 75 mV Io = 0mA →1 A Temperature coefficient of output voltage *10 Tcvo - ±0.02 - %/°C Io = 5mA、Tj = 0°C to 125℃ Vo (T): Set output voltage *7 Vo = 1.5 V, 1.8 V, 2.5 V : Vcc = 3.3 V, Vo = 3.0 V, 3.3 V : Vcc = 5 V, Vo = 5.0 V : Vcc : 8 V, Vo = 6.0 V : Vcc = 9 V, Vo = 8.0 V : Vcc = 11 V, Vo = 9.0 V : Vcc = 12 V, Vo = 10.0 V : Vcc = 13 V *8 Vo ≥ 3.3 V *9 Change Vcc from 3.0 V to 6 V if 1.5 V ≤ Vo ≤ 2.5 V. *10 Not 100% tested BA00BC0W Series (Unless otherwise specified, Ta=25℃, Vcc=3.3V, VCTL=3V, Io=200mA, Vo=2.5V setting) Parameter Symbol Min. Typ. Max. Unit Conditions Shutdown circuit current Isd - 0 10 μA VCTL = 0V while in OFF mode Bias Current Ib - 0.5 0.9 mA IO = 0mA Reference voltage(CTL terminal) Vc 1.225 1.250 1.275 V IO = 50mA Minimum I/O voltage difference ∆Vd - 0.3 0.5 V IO = 500mA, VCC = 2.5V Output current capacity Io 1 - - A Ripple Rejection R.R. 44 55 - dB f=120Hz, ein※12=-20dBV, Io=100mA Input stability Reg.I - 15 30 mV Vcc = Vo + 1.0 V→16V, Io = 200mA Load stability Reg.L - 35 75 mV IO = 0mA →1A Temperature coefficient of output voltage *11 Tcvo - ±0.02 - %/°C IO = 5mA, Tj=0°C to 125°C Output Short Current Ios - 0.40 - A Vcc=16V CTL ON Mode Voltage Vth1 2.0 - - V ACTIVE MODE, IO = 0mA CTL OFF Mode Voltage Vth2 - - 0.8 V OFF MODE, IO = 0mA CTL Input Current Iin 40 80 130 μA IO = 0mA *11 Not 100% tested *12 ein=Input Voltage Ripple

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5/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Typical Performance Curves (Unless otherwise specified, Ta = 25°C, Vcc = 8 V, VCTL = 2 V, IO = 0 mA) 0 0.5 1.0 1.5 3 Fig.4 Circuit Current C IR C U IT C U R R E N T : I C C [m A ] Fig.7 Load Stability 0 1 2 4 5 6 O U T P U T V O LT A G E : V O U T [V ] Fig.5 Input Stability (Io=0mA) 0 1 2 4 5 6 3 O U T P U T V O LT A G E : V O U T [V ] Fig.6 Input Stability (Io = 1 A) 0 1 2 4 5 6 3 O U T P U T V O LT A G E : V O U T [V ]

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6/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Typical Performance Curves - continued Fig.10 Output Voltage vs Temperature Fig.11 Circuit Current Temperature Fig.9 Ripple Rejection Fig.8 I/O Voltage Difference 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 OUTPUT CURRENT : IOUT [A] D R O P O U T V O L TA G E : Δ V d [ V ] [BA50BC0WFP]

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7/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Typical Performance Curves - continued Fig.13 CTL Voltage vs Output Voltage Fig.12 Circuit Current Classified by Load Fig.14 CTL Voltage vs CTL Current [BA50BC0WFP] 0 0.1 0.2 0.3 0.4 0.5 0.6 0 2 4 6 8 10 12 14 16 18 CONTROL VOLTAGE : V CTL [V] C O N T R O L C U R R E N T : IC T L [u A ] [BA50BC0WFP] Fig.15 Thermal Shutdown Circuit [V ] [BA50BC0WFP]

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8/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 Application Information ●I/O equivalence circuit ●Power Dissipation • TO220FP-3/TO220FP-5/TO220FP-5 V5) • TO252-3/TO252-5 The characteristics of the IC are greatly influenced by the operating temperature. If the temperature exceeds the maximum junction temperature Tjmax, deterioration or damage may occur. Implement proper thermal designs to ensure that power dissipation is within the permissible range in order to prevent instantaneous damage resulting from heat and maintain the reliability of the IC for long-term operation. The following method is used to calculate the power consumption Pc (W). Pc = (Vcc – Vo) × Io + Vcc × Icca Power dissipation Pd ≧ Pc The load current Io is calculated: Calculation Example: Vcc = 6.0 V and Vo = 5.0 V at Ta = 85°C 31kΩ 2kΩ 27kΩ CTL Vcc R2 R1 Vcc OUT Fig.16 Fig.17 * For the BA00BC0WT, connect R1 and R2 externally between the C and GND pins and between the OUT and C pins. Fig.18 Fig.19 0 15 25 20 10 5 25 50 75 125 150100 0 AMBIENT TEMPERATURE:Ta [°C] (1)20.0 (2)2.0 (2) During IC without heat sink operation. θj-a = 62.5 (°C/W) (1) When using an infinite heat sink. θj-c = 6.25 (°C/W) P O W E R D IS S IP A T IO N : P d [W ] 0 1.2 2.0 1.6 0.8 0.4 25 50 75 125 150100 0 AMBIENT TEMPERATURE:Ta [°C] 1.30 IC mounted on a ROHM standard board Board size: 70 × 70 × 1.6 mm Copper foil area: 7 × 7 mm TO252-5 θja=96.2 (°C/W) TO252-3 θja=104.2 (°C/W) P O W E R D ID D IP A T IO N : P d [W ] TO252-5 TO252-3 θja = 96.2°C/W → −10.4mW/°C 25°C = 1300mW → 85°C = 676mW Vcc : Input voltage Vo : Output current IO : Load current Icca : Circuit current Io ≦ Pd − Vcc × Icca Vcc − Vo Io≦ 0.676 − 6.0 × Icca 6.0 − 5.0 Io ≦ 550mA (Icca ≈ 20mA) Equation: VO = Vc × (R1 + R2) / R1 (Vc = 1.25 V (Typ.)) The recommended R1 value is approximately 30 kΩ to 150 kΩ.

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9/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 31kΩ 2kΩ 27kΩ CTL Refer to the above and implement proper thermal designs so that the IC will not be used under excessive power dissipation conditions under the entire operating temperature range. The power consumption Pc of the IC in the event of shorting (i.e. the Vo and GND pins are shorted) can be obtained from the following equation: Pc = Vcc × (Icca + Ishort) (Ishort: short current). ●Peripheral Circuit Considerations • Vcc pin Insert a capacitor (0.33μF approx.) between VCC and GND. The capacitance will vary depending on the application. Use a suitable capacitance and implement designs with sufficient margins. • GND pin Verify that there is no potential difference between the ground of the application board and the IC. If there is a potential difference, the set voltage will not be output accurately, resulting in unstable IC operation. Therefore, lower the impedance by designing the ground pattern as wide and as short as possible. • CTL terminal The CTL terminal turns on at an operating power supply voltage of 2.0 V or higher and turns off at 0.8 V or lower. There is no particular order when turning the power supply and CTL terminals on or off. Fig.20 Input Equivalent Circuit ●Vo Terminal Insert a capacitor between the Vo and GND pins in order to prevent output oscillation. Fig.21 Output Equivalent Circuit Fig.22 ESR vs. IO (22μF) The capacitance may vary greatly with temperature changes, thus making it impossible to completely prevent oscillation. Therefore, use a tantalum aluminum electrolytic capacitor with a low ESR (Equivalent Serial Resistance). The output will oscillate if the ESR is too high or too low, so refer to the ESR characteristics in Fig.22 and operate the IC within the stable region. Use a capacitor within a capacitance between 22μF and 1,000μF. Below figure, it is ESR-to-Io stability Area characteristics, measured by 22μF-ceramic-capacitor and resistor connected in series. This characteristic is not equal value perfectly to 22µF-aluminum electrolytic capacitor in order to measurement method. Note, however, that the stable range suggested in the figure depends on the IC and the resistance load involved, and can vary with the board’s wiring impedance, input impedance, and/or load impedance. Therefore, be certain to ascertain the final status of these items for actual use. Keep capacitor capacitance within a range of 22µF to 1000μF. It is also recommended that a 0.33μF bypass capacitor be connected as close to the input pin-GND as location possible. However, in situations such as rapid fluctuation of the input voltage or the load, please check the operation in real application to determine proper capacitance. OUT 22 μF IC 200 400 600 800 10000 0.05 0.075 0.1 0.2 0.5 1.0 2.0 Io [mA] E S R [Ω ] Oscillation region Oscillation region Stable region 10.0

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10/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Operational Notes 1. Absolute maximum ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. GND voltage The potential of GND pin must be minimum potential in all operating conditions. 3. Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions. 4. Inter-pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if pins are shorted together. 5. Actions in strong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction. 6. Testing on application boards When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting or storing the IC. 7. Regarding input pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each potential is as follows: When GND > PIN A and GND > PIN B, the P-N junction operates as a parasitic diode. When GND > PIN B, the P-N junction operates as a parasitic transistor. Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. 8. Ground Wiring Pattern When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any external components, either. 9. Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed. 10. Overcurrent Protection Circuit An overcurrent protection circuit is incorporated in order to prevention destruction due to short-time overload currents. Continued use of the protection circuits should be avoided. Please note that the current increases negatively impact the temperature. 11. Damage to the internal circuit or element may occur when the polarity of the Vcc pin is opposite to that of the other pins in applications. (I.e. Vcc is shorted with the GND pin while an external capacitor is charged.) Use a maximum capacitance of 1000μF for the output pins. Inserting a diode to prevent back-current flow in series with Vcc or bypass diodes between Vcc and each pin is recommended.

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11/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 Fig.23 Bypass Diode Fig.24 Example of Simple Bipolar IC Architecture Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. ~ ~ GND P 基板 N P N N P+P+ (端子 A) 抵抗 ~ ~ GND N P N N P+ P+ (端子 B) トランジスタ(NPN) B N E C GND P 基板 寄生素子 Transistor (NPN) Resistor PIN A) substrate Parasitic elements PIN N P N (PINA) GND Parasitic elements ~ ~ GND (PINB) B C E Parasitic elements or transistors ~ ~ P substrate Parasitic elements VCC Output pin Diode for preventing back current flow Bypass Diode

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12/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Ordering Information B A x x B C 0 x x x - E2 Part Number Output voltage 00:Variable Other:Fixed Current capacity BC0 : 1A Shutdown switch W : Include None:Without Packages FP : TO252-3 TO252-5 T : TO220FP-3 TO220FP-5 TO220FP-5(V5) CP : TO220CP-V5 Packaging and forming specification E2: Embossed tape and reel None: Container tube ●Physical Dimension Tape and Reel Information (Unit : mm) TO252-3 21 3 0 .8 0.65 0.65 1 .5 2 .5 0.75 FIN 6.5±0.2 2.3±0.2 2.3±0.2 0.5±0.1 1.0±0.2 2.3±0.2 9 .5 ±0 .5 0.5±0.1 5 .5 ±0 .2 1 .5 ±0 .2 5.1 +0.2 -0.1 C0.5 Direction of feed1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs E2 ( ) (Unit : mm) TO252-5 1 2 3 54 0 .8 0.5 1.27 1 .5 2 .5 FIN 6.5±0.2 2.3±0.2 0.5±0.1 1.0±0.2 9 .5 ±0 .5 0.5±0.1 5 .5 ±0 .2 1 .5 ±0 .2 C0.5 5.1 +0.2 -0.1 Direction of feed1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs E2 ( ) (Unit : mm) TO220CP-V5 1 6 .9 2 0.92 φ3.2±0.1 4.5±0.1 0.82±0.1 8 .0 ±0 .2 1.58 0.42±0.1 1 2 .0 ±0 .2 1.7781.444 4 .9 2 ±0 .2 10.0 +0.3 -0.1 2.8 +0.2 -0.1 1 3 .6 0 1 5 .2 - 0 .2 + 0 .4 4.12 1 .0 ±0 .2 (1 .0 ) (2.85) Direction of feed1pin Reel ∗ Order quantity needs to be multiple of the minimum quantity. Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 500pcs E2 ( )

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13/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 (Unit : mm) TO220FP-5(V5) 0 .7 7.0 10.0 1.778 1 2 3 4 5 1.2 0.8 1 .8 ±0 .2 8 .0 ±0 .2 1 2 .0 ±0 .2 1 7 .0 3 1 .5 M a x . φ3.2±0.1 −0 .2 +0 .4 + 0.3 − 0.1 + 0.3 − 0.1 2.8 4.5 0.5±0.1 −0.1 +0.2 +0.3 −0.1 (2.85) 4.25 (2 .0 ) 2 3 .4 1 7 .5 2 5 .8 8.15 ∗ Order quantity needs to be multiple of the minimum quantity. TubeContainer Quantity Direction of feed 500pcs Direction of products is fixed in a container tube (Unit : mm) TO220FP-3 2 31 +0 .4 φ3.2±0.1 0.55 1 7 .0 1 2 .0 ±0 .2 8 .0 ±0 .2 2.54±0.5 1 3 .5 M in . 5 .0 ±0 .2 0.8 2.54±0.5 1.3 −0.1 +0.3 10.0 7.0 1 .8 ±0 .2 −0 .2 −0.1 +0.3 2.6±0.5 −0.05 +0.1 +0.2 −0.1 −0.1 +0.3 4.5 2.8 ∗ Order quantity needs to be multiple of the minimum quantity. TubeContainer Quantity Direction of feed 500pcs Direction of products is fixed in a container tube (Unit : mm) TO220FP-5 7.0 10.0 2.8 4.5 1.778 0.5±0.1 1.2 0.8 1 .8 ±0 .2 8 .0 ±0 .2 0 .71 2 .0 ±0 .2 1 7 .0 1 3 .5 M in . φ3.2±0.1 −0 .2 +0 .4 +0.3 −0.1 −0.1 +0.2+0.3 −0.1 +0.3 −0.1 2 3 4 51 2.85 ∗ Order quantity needs to be multiple of the minimum quantity. TubeContainer Quantity Direction of feed 500pcs Direction of products is fixed in a container tube

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14/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Marking Diagrams TO220FP-3 (TOP VIEW) Part Number Marking LOT Number TO252-3 (TOP VIEW) Part Number Marking LOT Number TO252-5 (TOP VIEW) Part Number Marking LOT Number TO220CP-V5 (TOP VIEW) Part Number Marking LOT Number TO220FP-5 (TOP VIEW) Part Number Marking LOT Number TO220FP-5 (V5) (TOP VIEW) Part Number Marking LOT Number

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15/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 Orderable Part Number Package Part Number Marking BA15BC0WFP-E2 TO252-5 15BC0W BA18BC0WFP-E2 18BC0W BA25BC0WFP-E2 25BC0W BA30BC0WFP-E2 30BC0W BA33BC0WFP-E2 33BC0W BA50BC0WFP-E2 50BC0W BA60BC0WFP-E2 60BC0W BA70BC0WFP-E2 70BC0W BA80BC0WFP-E2 80BC0W BA90BC0WFP-E2 90BC0W BAJ0BC0WFP-E2 J0BC0W BA00BC0WFP-E2 00BC0W BA15BC0WT TO220FP-5 15BC0W BA18BC0WT 18BC0W BA25BC0WT 25BC0W BA30BC0WT 30BC0W BA33BC0WT 33BC0W BA50BC0WT 50BC0W BA60BC0WT 60BC0W BA70BC0WT 70BC0W BA80BC0WT 80BC0W BA90BC0WT 90BC0W BAJ0BC0WT J0BC0W BA00BC0WT 00BC0W BA15BC0WT-V5 TO220FP-5 (V5) 15BC0W BA18BC0WT-V5 18BC0W BA25BC0WT-V5 25BC0W BA33BC0WT-V5 33BC0W BA50BC0WT-V5 50BC0W BA90BC0WT-V5 90BC0W BA00BC0WT-V5 00BC0W BA00BC0WCP-V5E2 TO220CP-V5 00BC0W BA15BC0FP-E2 TO252-3 BA15BC0 BA18BC0FP-E2 BA18BC0 BA25BC0FP-E2 BA25BC0 BA30BC0FP-E2 BA30BC0 BA33BC0FP-E2 BA33BC0 BA50BC0FP-E2 BA50BC0 BA60BC0FP-E2 BA60BC0 BA70BC0FP-E2 BA70BC0 BA80BC0FP-E2 BA80BC0 BA90BC0FP-E2 BA90BC0 BAJ0BC0FP-E2 BAJ0BC0 BA15BC0T TO220FP-3 BA15BC0 BA18BC0T BA18BC0 BA25BC0T BA25BC0 BA30BC0T BA30BC0 BA33BC0T BA33BC0 BA50BC0T BA50BC0 BA60BC0T BA60BC0 BA70BC0T BA70BC0 BA80BC0T BA80BC0 BA90BC0T BA90BC0 BAJ0BC0T BAJ0BC0

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16/16 BAxxBC0 Series BAxxBC0W Series BA00BC0WCP-V5 Datasheet TSZ02201-0R6R0A600120-1-2 TSZ22111・15・001 www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 26.Jun.2012 Rev.001 ●Revision History Date Revision Changes 26.Jun.2012 001 New Release

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Datasheet Notice - GE Rev.002© 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

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Datasheet Notice - GE Rev.002© 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

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