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EP3SE260H780I3N

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EP3SE260H780I3N

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Part Number EP3SE260H780I3N
Manufacturer Altera
Description IC FPGA 488 I/O 780HBGA
Datasheet EP3SE260H780I3N Datasheet
Package 780-BBGA, FCBGA
In Stock 1,022 piece(s)
Unit Price $ 15,121.3471 *
Lead Time Can Ship Immediately
Estimated Delivery Time Jun 3 - Jun 8 (Choose Expedited Shipping)
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EP3SE260H780I3N Specifications

ManufacturerAltera
CategoryIntegrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Datasheet EP3SE260H780I3NDatasheet
Package780-BBGA, FCBGA
SeriesStratix? III E
Number of LABs/CLBs10200
Number of Logic Elements/Cells255000
Total RAM Bits16672768
Number of I/O488
Number of Gates-
Voltage - Supply0.86 V ~ 1.15 V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case780-BBGA, FCBGA
Supplier Device Package780-HBGA (33x33)

EP3SE260H780I3N Datasheet

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© March 2010 Altera Corporation SIII51001-1.81. Stratix III Device Family OverviewThe Stratix® III family provides one of the most architecturally advanced, high-performance, low-power FPGAs in the marketplace. Stratix III FPGAs lower power consumption through Altera’s innovative Programmable Power Technology, which provides the ability to turn on the performance where needed and turn down the power consumption for blocks not in use. Selectable Core Voltage and the latest in silicon process optimizations are also employed to deliver the industry’s lowest power, high-performance FPGAs. Specifically designed for ease of use and rapid system integration, the Stratix III FPGA family offers two variants optimized to meet different application needs: ■ The Stratix III L family provides balanced logic, memory, and multiplier ratios for mainstream applications. ■ The Stratix III E family is memory- and multiplier-rich for data-centric applications. Modular I/O banks with a common bank structure for vertical migration lend efficiency and flexibility to the high-speed I/O. Package and die enhancements with dynamic on-chip termination, output delay, and current strength control provide best-in-class signal integrity. Based on a 1.1-V, 65-nm all-layer copper SRAM process, the Stratix III family is a programmable alternative to custom ASICs and programmable processors for high-performance logic, digital signal processing (DSP), and embedded designs. Stratix III devices include optional configuration bit stream security through volatile or non-volatile 256-bit Advanced Encryption Standard (AES) encryption. Where ultra-high reliability is required, Stratix III devices include automatic error detection circuitry to detect data corruption by soft errors in the configuration random-access memory (CRAM) and user memory cells. Features Summary Stratix III devices offer the following features: ■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Table 1–1) ■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory and FIFO buffers ■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18, and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and finite impulse response (FIR) filters ■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for robust signal integrity ■ Programmable Power Technology, which minimizes power while maximizing device performanceStratix III Device Handbook, Volume 1

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1–2 Chapter 1: Stratix III Device Family Overview Features Summary■ Selectable Core Voltage, available in low-voltage devices (L ordering code suffix), enables selection of lowest power or highest performance operation ■ Up to 16 global clocks, 88 regional clocks, and 116 peripheral clocks per device ■ Up to 12 phase-locked loops (PLLs) per device that support PLL reconfiguration, clock switchover, programmable bandwidth, clock synthesis, and dynamic phase shifting ■ Memory interface support with dedicated DQS logic on all I/O banks ■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+ SRAM on up to 24 modular I/O banks ■ Up to 1,104 user I/O pins arranged in 24 modular I/O banks that support a wide range of industry I/O standards ■ Dynamic On-Chip Termination (OCT) with auto calibration support on all I/O banks ■ High-speed differential I/O support with serializer/deserializer (SERDES) and dynamic phase alignment (DPA) circuitry for 1.6 Gbps performance ■ Support for high-speed networking and communications bus standards including SPI-4.2, SFI-4, SGMII, Utopia IV, 10 Gigabit Ethernet XSBI, Rapid I/O, and NPSI ■ The only high-density, high-performance FPGA with support for 256-bit AES volatile and non-volatile security key to protect designs ■ Robust on-chip hot socketing and power sequencing support ■ Integrated cyclical redundancy check (CRC) for configuration memory error detection with critical error determination for high availability systems support ■ Built-in error correction coding (ECC) circuitry to detect and correct data errors in M144K TriMatrix memory blocks ■ Nios® II embedded processor support ■ Support for multiple intellectual property megafunctions from Altera® MegaCore® functions and Altera Megafunction Partners Program (AMPPSM)Stratix III Device Handbook, Volume 1 © March 2010 Altera Corporation

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Chapter 1: Stratix III Device Family Overview 1–3 Features Summary Table 1–1 lists the Stratix III FPGA family features. The Stratix III logic family (L) offers balanced logic, memory, and multipliers to address a wide range of applications, while the enhanced family (E) offers more memory and multipliers per logic and is ideal for wireless, medical imaging, and military applications. Stratix III devices are available in space-saving FineLine BGA (FBGA) packages (refer to Table 1–2 and Table 1–3). Table 1–1. FPGA Family Features for Stratix III Devices Device/ Feature ALMs LEs M9K Blocks M144K Blocks MLAB Blocks Total Embedded RAM Kbits MLAB RAM Kbits (1) Total RAM Kbits(2) 18×18-bit Multipliers (FIR Mode) PLLs (3) Stratix III Logic Family EP3SL50 19K 47.5K 108 6 950 1,836 297 2,133 216 4 EP3SL70 27K 67.5K 150 6 1,350 2,214 422 2,636 288 4 EP3SL110 43K 107.5K 275 12 2,150 4,203 672 4,875 288 8 EP3SL150 57K 142.5K 355 16 2,850 5,499 891 6,390 384 8 EP3SL200 80K 200K 468 36 4,000 9,396 1,250 10,646 576 12 EP3SL340 135K 337.5K 1,040 48 6,750 16,272 2,109 18,381 576 12 Stratix III Enhanced Family EP3SE50 19K 47.5K 400 12 950 5,328 297 5,625 384 4 EP3SE80 32K 80K 495 12 1,600 6,183 500 6,683 672 8 EP3SE110 43K 107.5K 639 16 2,150 8,055 672 8,727 896 8 EP3SE260 102K 255K 864 48 5,100 14,688 1,594 16,282 768 12 Notes to Table 1–1: (1) MLAB ROM mode supports twice the number of MLAB RAM Kbits. (2) For total ROM Kbits, use this equation to calculate: Total ROM Kbits = Total Embedded RAM Kbits + [(# of MLAB blocks × 640)/1024] (3) The availability of the PLLs shown in this column is based on the device with the largest package. Refer to the Clock Networks and PLLs in Stratix III Devices chapter in volume 1 of the Stratix III Device Handbook for the availability of the PLLs for each device.© March 2010 Altera Corporation Stratix III Device Handbook, Volume 1

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1–4 Chapter 1: Stratix III Device Family Overview Features SummaryTable 1–2 lists the Stratix III FPGA package options and I/O pin counts. All Stratix III devices support vertical migration within the same package (for example, you can migrate between the EP3SL50 and EP3SL70 devices in the 780-pin FineLine BGA package). Vertical migration allows you to migrate to devices whose dedicated pins, configuration pins, and power pins are the same for a given package across device densities. To ensure that a board layout supports migratable densities within one package offering, enable the applicable vertical migration path within the Quartus® II software. On the Assignments menu, point to Device and click Migration Devices. You can migrate from the L family to the E family without increasing the number of LEs available. This minimizes the cost of vertical migration. Table 1–3 lists the Stratix III FineLine BGA (FBGA) package sizes. Table 1–2. Package Options and I/O Pin Counts (Note 1) Device 484-Pin FineLine BGA (2) 780-Pin FineLine BGA (2) 1152-Pin FineLine BGA (2) 1517-Pin FineLine BGA (3) 1760-Pin FineLine BGA (3) EP3SL50 296 488 — — — EP3SL70 296 488 — — — EP3SL110 — 488 744 — — EP3SL150 — 488 744 — — EP3SL200 — 488 (5) 744 976 — EP3SL340 — — 744 (4) 976 1,120 EP3SE50 296 488 — — — EP3SE80 — 488 744 — — EP3SE110 — 488 744 — — EP3SE260 — 488 (5) 744 976 — Notes to Table 1–2: (1) The arrows indicate vertical migration. (2) All I/O pin counts include eight dedicated clock inputs (CLK1p, CLK1n, CLK3p, CLK3n, CLK8p, CLK8n, CLK10p, and CLK10n) that can be used for data inputs. (3) All I/O pin counts include eight dedicated clock inputs (CLK1p, CLK1n, CLK3p, CLK3n, CLK8p, CLK8n, CLK10p, and CLK10n) and eight dedicated corner PLL clock inputs (PLL_L1_CLKp, PLL_L1_CLKn, PLL_L4_CLKp, PLL_L4_CLKn, PLL_R4_CLKp, PLL_R4_CLKn, PLL_R1_CLKp, and PLL_R1_CLKn) that can be used for data inputs. (4) The EP3SL340 FPGA is offered only in the H1152 package, but not offered in the F1152 package. (5) The EP3SE260 and EP3SL200 FPGAs are offered only in the H780 package, but not offered in the F780 package. Table 1–3. FineLine BGA Package Sizes Dimension 484 Pin 780 Pin 1152 Pin 1517 Pin 1760 Pin Pitch (mm) 1.00 1.00 1.00 1.00 1.00 Area (mm2) 529 841 1,225 1,600 1,849 Length/Width (mmmm) 23/23 29/29 35/35 40/40 43/43Stratix III Device Handbook, Volume 1 © March 2010 Altera Corporation

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Chapter 1: Stratix III Device Family Overview 1–5 Features SummaryTable 1–4 lists the Stratix III Hybrid FineLine BGA (HBGA) package sizes. Stratix III devices are available in up to three speed grades: –2, –3, and –4, with –2 being the fastest. Stratix III devices are offered in both commercial and industrial temperature range ratings with leaded and lead-free packages. Selectable Core Voltage is available in specially marked low-voltage devices (L ordering code suffix). Table 1–5 lists the Stratix III device speed grades. Table 1–4. Hybrid FineLine BGA Package Sizes Dimension 780 Pin 1152 Pin Pitch (mm) 1.00 1.00 Area (mm2) 1,089 1,600 Length/Width (mmmm) 33/33 40/40 Table 1–5. Speed Grades for Stratix III Devices (Part 1 of 2) Device Temperature Grade 484 -Pin FineLine BGA 780-Pin FineLine BGA 780-Pin Hybrid FineLine BGA 1152-Pin FineLine BGA 1152-Pin Hybrid FineLine BGA 1517-Pin FineLine BGA 1760-Pin FineLine BGA EP3SL50 Commercial –2, –3, –4, –4L –2, –3,–4, –4L — — — — — Industrial –3, –4, –4L –3, –4, –4L — — — — — EP3SL70 Commercial –2, –3, –4, –4L –2, –3, –4, –4L — — — — — Industrial –3, –4, –4L –3, –4, –4L — — — — — EP3SL110 Commercial — –2, –3, –4, –4L — –2, –3, –4, –4L — — — Industrial — –3, –4, –4L — –3, –4, –4L — — — EP3SL150 Commercial — –2,–3, –4, –4L — –2, –3, –4, –4L — — — Industrial — –3, –4, –4L — –3, –4, –4L — — — EP3SL200 Commercial — — –2,–3, –4, –4L –2,–3, –4, –4L — –2,–3, –4, –4L — Industrial (1) — — –3, –4, –4L –3, –4, –4L — –3, –4, –4L — EP3SL340 Commercial — — — — –2, –3, –4 –2, –3, –4 –2, –3, –4 Industrial (1) — — — — –3, –4, –4L –3, –4, –4L –3, –4, –4L EP3SE50 Commercial –2, –3, –4, –4L –2, –3, –4, –4L — — — — — Industrial –3, –4, –4L –3, –4, –4L — — — — — EP3SE80 Commercial — –2, –3, –4, –4L — –2, –3, –4, –4L — — — Industrial — –3, –4, –4L — –3, –4, –4L — — — EP3SE110 Commercial — –2,–3, –4, –4L — –2, –3, –4, –4L — — — Industrial — –3, –4, –4L — –3, –4, –4L — — —© March 2010 Altera Corporation Stratix III Device Handbook, Volume 1

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1–6 Chapter 1: Stratix III Device Family Overview Architecture FeaturesArchitecture Features The following section describes the various features of the Stratix III family FPGAs. Logic Array Blocks and Adaptive Logic Modules The Logic Array Block (LAB) is composed of basic building blocks known as Adaptive Logic Modules (ALMs) that can be configured to implement logic, arithmetic, and register functions. Each LAB consists of ten ALMs, carry chains, shared arithmetic chains, LAB control signals, local interconnect, and register chain connection lines. ALMs are part of a unique, innovative logic structure that delivers faster performance, minimizes area, and reduces power consumption. ALMs expand the traditional 4-input look-up table architecture to 7 inputs, increasing performance by reducing LEs, logic levels, and associated routing. In addition, ALMs maximize DSP performance with dedicated functionality to efficiently implement adder trees and other complex arithmetic functions. The Quartus II Compiler places associated logic in an LAB or adjacent LABs, allowing the use of local, shared arithmetic chain, and register chain connections for performance and area efficiency. The Stratix III LAB has a new derivative called Memory LAB (or MLAB), which adds SRAM memory capability to the LAB. MLAB is a superset of the LAB and includes all LAB features. MLABs support a maximum of 320 bits of simple dual-port Static Random Access Memory (SRAM). Each ALM in an MLAB can be configured as a 16×2 block, resulting in a configuration of 16×20 simple dual port SRAM block. MLAB and LAB blocks always co-exist as pairs in all Stratix III families, allowing up to 50% of the logic (LABs) to be traded for memory (MLABs). f For more information about LABs and ALMs, refer to the Logic Array Blocks and Adaptive Logic Modules in Stratix III Devices chapter. f For more information about MLAB modes, features and design considerations, refer to the TriMatrix Embedded Memory Blocks in Stratix III Devices chapter. EP3SE260 Commercial — — –2, –3, –4, –4L –2,– 3, –4, –4L — –2, –3, –4, –4L — Industrial (1) — — –3, –4, –4L –3, –4, –4L — –3, –4,–4L — Note to Table 1–5: (1) For EP3SL340, EP3SL200, and EP3SE260 devices, the industrial junction temperature range for –4L is 0–100°C, regardless of supply voltage. Table 1–5. Speed Grades for Stratix III Devices (Part 2 of 2) Device Temperature Grade 484 -Pin FineLine BGA 780-Pin FineLine BGA 780-Pin Hybrid FineLine BGA 1152-Pin FineLine BGA 1152-Pin Hybrid FineLine BGA 1517-Pin FineLine BGA 1760-Pin FineLine BGAStratix III Device Handbook, Volume 1 © March 2010 Altera Corporation

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Chapter 1: Stratix III Device Family Overview 1–7 Architecture FeaturesMultiTrack Interconnect In the Stratix III architecture, connections between ALMs, TriMatrix memory, DSP blocks, and device I/O pins are provided by the MultiTrack interconnect structure with DirectDrive technology. The MultiTrack interconnect consists of continuous, performance-optimized row and column interconnects that span fixed distances. A routing structure with fixed length resources for all devices allows predictable and repeatable performance when migrating through different device densities. The MultiTrack interconnect provides 1-hop connection to 34 adjacent LABs, 2-hop connections to 96 adjacent LABs and 3-hop connections to 160 adjacent LABs. DirectDrive technology is a deterministic routing technology that ensures identical routing resource usage for any function regardless of placement in the device. The MultiTrack interconnect and DirectDrive technology simplify the integration stage of block-based designing by eliminating the reoptimization cycles that typically follow design changes and additions. The Quartus II Compiler also automatically places critical design paths on faster interconnects to improve design performance. f For more information, refer to the MultiTrack Interconnect in Stratix III Devices chapter. TriMatrix Embedded Memory Blocks TriMatrix embedded memory blocks provide three different sizes of embedded SRAM to efficiently address the needs of Stratix III FPGA designs. TriMatrix memory includes the following blocks: ■ 320-bit MLAB blocks optimized to implement filter delay lines, small FIFO buffers, and shift registers ■ 9-Kbit M9K blocks that can be used for general purpose memory applications ■ 144-Kbit M144K blocks that are ideal for processor code storage, packet and video frame buffering Each embedded memory block can be independently configured to be a single- or dual-port RAM, ROM, or shift register via the Quartus II MegaWizardTM Plug-In Manager. Multiple blocks of the same type can also be stitched together to produce larger memories with minimal timing penalty. TriMatrix memory provides up to 16,272 Kbits of embedded SRAM at up to 600 MHz operation. f For more information about TriMatrix memory blocks, modes, features, and design considerations, refer to the TriMatrix Embedded Memory Blocks in Stratix III Devices chapter. DSP Blocks Stratix III devices have dedicated high-performance digital signal processing (DSP) blocks optimized for DSP applications requiring high data throughput. Stratix III devices provide you with the ability to implement various high-performance DSP functions easily. Complex systems such as WiMAX, 3GPP WCDMA, CDMA2000, voice over Internet Protocol (VoIP), H.264 video compression, and high-definition television (HDTV) require high-performance DSP blocks to process data. These system designs typically use DSP blocks to implement finite impulse response (FIR) filters, complex FIR filters, infinite impulse response (IIR) filters, fast Fourier transform (FFT) functions, and discrete cosine transform (DCT) functions.© March 2010 Altera Corporation Stratix III Device Handbook, Volume 1

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1–8 Chapter 1: Stratix III Device Family Overview Architecture FeaturesStratix III devices have up to 112 DSP blocks. The architectural highlights of the Stratix III DSP block are the following: ■ High-performance, power optimized, fully pipelined multiplication operations ■ Native support for 9-bit, 12-bit, 18-bit, and 36-bit word lengths ■ Native support for 18-bit complex multiplications ■ Efficient support for floating point arithmetic formats (24-bit for Single Precision and 53-bit for Double Precision) ■ Signed and unsigned input support ■ Built-in addition, subtraction, and accumulation units to efficiently combine multiplication results ■ Cascading 18-bit input bus to form tap-delay lines ■ Cascading 44-bit output bus to propagate output results from one block to the next block ■ Rich and flexible arithmetic rounding and saturation units ■ Efficient barrel shifter support ■ Loopback capability to support adaptive filtering DSP block multipliers can optionally feed an adder/subtractor or accumulator in the block depending on user configuration. This option saves ALM routing resources and increases performance, because all connections and blocks are inside the DSP block. Additionally, the DSP Block input registers can efficiently implement shift registers for FIR filter applications, and the Stratix III DSP blocks support rounding and saturation. The Quartus II software includes megafunctions that control the mode of operation of the DSP blocks based on user parameter settings. f For more information, refer to the DSP Blocks in Stratix III Devices chapter. Clock Networks and PLLs Stratix III devices provide dedicated Global Clock Networks (GCLKs), Regional Clock Networks (RCLKs), and Periphery Clock Networks (PCLKs). These clocks are organized into a hierarchical clock structure that provides up to 104 unique clock domains (16 GCLK + 88 RCLK) within the Stratix III device and allows for up to 38 (16 GCLK + 22 RCLK) unique GCLK/RCLK clock sources per device quadrant. Stratix III devices deliver abundant PLL resources with up to 12 PLLs per device and up to 10 outputs per PLL. Every output can be independently programmed, creating a unique, customizable clock frequency. Inherent jitter filtration and fine granularity control over multiply, divide ratios, and dynamic phase-shift reconfiguration provide the high-performance precision required in today’s high-speed applications. Stratix III PLLs are feature rich, supporting advanced capabilities such as clock switchover, reconfigurable phase shift, PLL reconfiguration, and reconfigurable bandwidth. PLLs can be used for general-purpose clock management supporting multiplication, phase shifting, and programmable duty cycle. Stratix III PLLs also support external feedback mode, spread-spectrum input clock tracking, and post-scale counter cascading.Stratix III Device Handbook, Volume 1 © March 2010 Altera Corporation

Page 10

Chapter 1: Stratix III Device Family Overview 1–9 Architecture Featuresf For more information, refer to the Clock Networks and PLLs in Stratix III Devices chapter. I/O Banks and I/O Structure Stratix III devices contain up to 24 modular I/O banks, each of which contains 24, 32, 36, 40, or 48 I/Os. This modular bank structure improves pin efficiency and eases device migration. The I/O banks contain circuitry to support external memory interfaces at speeds up to 533 MHz and high-speed differential I/O interfaces meeting up to 1.6 Gbps performance. It also supports high-speed differential inputs and outputs running at speeds up to 800 MHz. Stratix III devices support a wide range of industry I/O standards, including single-ended, voltage referenced single-ended, and differential I/O standards. The Stratix III I/O supports programmable bus hold, programmable pull-up resistor, programmable slew rate, programmable drive strength, programmable output delay control, and open-drain output. Stratix III devices also support on-chip series (RS) and on-chip parallel (RT) termination with auto calibration for single-ended I/O standards and on-chip differential termination (RD) for LVDS I/O standards on Left/Right I/O banks. Dynamic OCT is also supported on bi-directional I/O pins in all I/O banks. f For more information, refer to the Stratix III Device I/O Features chapter. External Memory Interfaces The Stratix III I/O structure has been completely redesigned to provide flexibility and enable high-performance support for existing and emerging external memory standards such as DDR, DDR2, DDR3, QDR II, QDR II+, and RLDRAM II at frequencies of up to 533 MHz. Packed with features such as dynamic on-chip termination, trace mismatch compensation, read/write leveling, half-rate registers, and 4-to 36-bit programmable DQ group widths, Stratix III I/Os supply the built-in functionality required for rapid and robust implementation of external memory interfaces. Double data-rate support is found on all sides of the Stratix III device. Stratix III devices provide an efficient architecture to quickly and easily fit wide external memory interfaces exactly where you want them. A self-calibrating soft IP core (ALTMEMPHY), optimized to take advantage of the Stratix III device I/O, along with the Quartus II timing analysis tool (TimeQuest), provide the total solution for the highest reliable frequency of operation across process voltage and temperature. f For more information about external memory interfaces, refer to the External Memory Interfaces in Stratix III Devices chapter. High-Speed Differential I/O Interfaces with DPA Stratix III devices contain dedicated circuitry for supporting differential standards at speeds up to 1.6 Gbps. The high-speed differential I/O circuitry supports the following high-speed I/O interconnect standards and applications: Utopia IV, SPI-4.2, SFI-4, 10 Gigabit Ethernet XSBI, Rapid I/O, and NPSI. Stratix III devices support 2×, 4×, 6×, 7×, 8×, and 10× SERDES modes for high-speed differential I/O interfaces and © March 2010 Altera Corporation Stratix III Device Handbook, Volume 1

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