EPM240F100C5N

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© August 2009 Altera Corporation MII51006-1.66. Reference and Ordering InformationSoftware MAX® II devices are supported by the Altera® Quartus® II design software with new, optional MAX+PLUS® II look and feel, which provides HDL and schematic design entry, compilation and logic synthesis, full simulation and advanced timing analysis, and device programming. Refer to the Design Software Selector Guide for more details about the Quartus II software features. The Quartus II software supports the Windows XP/2000/NT, Sun Solaris, Linux Red Hat v8.0, and HP-UX operating systems. It also supports seamless integration with industry-leading EDA tools through the NativeLink interface. Device Pin-Outs Printed device pin-outs for MAX II devices are available on the Altera website (www.altera.com). Ordering Information Figure 6–1 describes the ordering codes for MAX II devices. For more information about a specific package, refer to the Package Information chapter in the MAX II Device Handbook. Figure 6–1. MAX II Device Packaging Ordering Information Package Type T: F: Thin quad flat pack (TQFP) FineLine BGA 240: 570: 1270: 2210: Speed Grade Family Signature EPM: MAX II Operating Temperature Pin Count Device Type 240 Logic Elements 570 Logic Elements 1,270 Logic Elements 2,210 Logic Elements ES: Optional Suffix Engineering sample Indicates specific device options or shipment method 3, 4, 5, 6, 7, or 8, with 3 being the fastest Number of pins for a particular package C: I: A: Commercial temperature (T J = 0° C to 85° C) Industrial temperature (T J = -40° C to 100° C) Automotive temperature (T J = -40° C to 125° C) EPM 240 G T 100 C 3 ES Product-Line Suffix G: Z: Blank (no identifier): Indicates device type 1.8-V VCCINT low-power device 1.8-V VCCINT zero-power device 2.5-V or 3.3-V VCCINT device N: Lead-free packaging M: Micro FineLine BGAMAX II Device Handbook