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HSMP-386C-TR1G

hotHSMP-386C-TR1G

HSMP-386C-TR1G

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Part Number HSMP-386C-TR1G
Manufacturer Broadcom Limited
Description DIODE PIN GP 50V LO COST SOT-323
Datasheet HSMP-386C-TR1G Datasheet
Package SC-70, SOT-323
In Stock 41,000 piece(s)
Unit Price $ 0.3328 *
Lead Time Can Ship Immediately
Estimated Delivery Time Jan 24 - Jan 29 (Choose Expedited Shipping)
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Part Number # HSMP-386C-TR1G (Diodes - RF) is manufactured by Broadcom Limited and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

For HSMP-386C-TR1G specifications/configurations, quotation, lead time, payment terms of further enquiries please have no hesitation to contact us. To process your RFQ, please add HSMP-386C-TR1G with quantity into BOM. Heisener.com does NOT require any registration to request a quote of HSMP-386C-TR1G.

HSMP-386C-TR1G Specifications

ManufacturerBroadcom Limited
CategoryDiscrete Semiconductor Products - Diodes - RF
Datasheet HSMP-386C-TR1GDatasheet
PackageSC-70, SOT-323
Series-
Diode TypePIN - 1 Pair Series Connection
Voltage - Peak Reverse (Max)50V
Current - Max1A
Capacitance @ Vr, F0.2pF @ 50V, 1MHz
Resistance @ If, F1.5 Ohm @ 100mA, 100MHz
Power Dissipation (Max)-
Operating Temperature150°C (TJ)
Package / CaseSC-70, SOT-323
Supplier Device PackageSOT-323

HSMP-386C-TR1G Datasheet

Page 1

Page 2

HSMP-386x Surface Mount PIN Diodes Data Sheet Features • Unique Configurations in Surface Mount Packages – Add Flexibility – Save Board Space – Reduce Cost • Switching – Low Distortion Switching – Low Capacitance • Attenuating – Low Current Attenuating for Less Power Consumption • Matched Diodes for Consistent Performance • Better Thermal Conductivity for Higher Power Dissipation • Low Failure in Time (FIT) Rate[1] • Lead-free Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Description/Applications The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenu- ators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (CT) and Total Resistance (RT) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. Pin Connections and Package Marking, SOT-363 Notes: 1. Package marking provides orientation, identification, and date code. 2. See “Electrical Specifications” for appropriate package marking. L U x 1 2 3 6 5 4

Page 3

2 Package Lead Code Identification, SOT-23, SOT-143 (Top View) Package Lead Code Identification, SOT-323 (Top View) COMMON CATHODE #4 COMMON ANODE #3 SERIES #2 SINGLE #0 COMMON CATHODE F COMMON ANODE E SERIES C SINGLE B Package Lead Code Identification, SOT-363 (Top View) UNCONNECTED TRIO L 1 2 3 6 5 4 Electrical Specifications TC = 25°C, each diode PIN General Purpose Diodes, Typical Specifications TA = 25°C Package Minimum Typical Typical Part Number Marking Lead Breakdown Series Resistance Total Capacitance HSMP- Code Code Configuration Voltage VBR (V) RS (Ω) CT (pF) 3860 L0 0 Single 50 3.0/1.5* 0.20 3862 L2 2 Series 3863 L3 3 Common Anode 3864 L4 4 Common Cathode 386B L0 B Single 386C L2 C Series 386E L3 E Common Anode 386F L4 F Common Cathode 386L LL L Unconnected Trio Test Conditions VR = VBR IF = 10 mA VR = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 µA IF = 100 mA* Absolute Maximum Ratings[1] TC = +25°C Symbol Parameter Unit SOT-23 SOT-323 If Forward Current (1 µs Pulse) Amp 1 1 PIV Peak Inverse Voltage V 50 50 Tj Junction Temperature °C 150 150 Tstg Storage Temperature °C -65 to 150 -65 to 150 qjc Thermal Resistance [2] °C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. TC = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. RING QUAD D 1 3 2 4 See separate data sheet HSMP-386D

Page 4

3 HSMP-386x Typical Parameters at TC = 25°C Part Number Total Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance HSMP- RT (Ω) t (ns) Trr (ns) CT (pF) 386x 22 500 80 0.20 Test Conditions IF = 1 mA IF = 50 mA VR = 10 V VR = 50 V f = 100 MHz TR = 250 mA IF = 20 mA f = 1 MHz 90% Recovery Typical Performance, TC = 25°C, each diode Figure 1. RF Capacitance vs. Reverse Bias. 0.15 0.30 0.25 0.20 0.35 0 2 64 10 128 1614 18 20 TO TA L C A PA C IT A N C E (p F) REVERSE VOLTAGE (V) 1 GHz 100 MHz 1 MHz 120 115 110 105 100 95 90 85 1 10 30 IF – FORWARD BIAS CURRENT (mA) Figure 3. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switch Diodes. IN PU T IN TE R C EP T PO IN T (d B m ) Diode Mounted as a Series Switch in a 50 Microstrip and Tested at 123 MHz FORWARD CURRENT (mA) Figure 4. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. T r r – R EV ER SE R EC O VE R Y TI M E (n s) 10 100 1000 10 20 30 VR = 5V VR = 10V VR = 20V Figure 2. Typical RF Resistance vs. Forward Bias Current. 0.01 100 1000 1 10 R ES IS TA N C E (O H M S) BIAS CURRENT (mA) 10 100 10.1 TA = +85 C TA = +25 C TA = –55 C 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 I F – F O R W A R D C U R R EN T (m A ) VF – FORWARD VOLTAGE (mA) Figure 5. Forward Current vs. Forward Voltage. 125 C 25 C –50 C Equivalent Circuit Model HSMP-386x Chip* 0.12 pF 1.5 Ω RjRs Cj Rj = 12 Ω I 0.9  RT = 1.5 + Rj CT = CP + Cj � I = Forward Bias Current in mA * See AN1124 for package models 

Page 5

4 Typical Applications for Multiple Diode Products Figure 10. Four Diode π Attenuator. See AN1048 for details. INPUT RF IN/OUT Figure 10. Four Diode p Attenuator. See AN1048 for details. FIXED BIAS VOLTAGE VARIABLE BIAS Figure 6. Simple SPDT Switch, Using Only Positive Current. Figure 7. High Isolation SPDT Switch, Dual Bias. Figure 8. Switch Using Both Positive and Negative Current. Figure 9. Very High Isolation SPDT Switch, Dual Bias. RF COMMON RF 1 BIAS 1 RF 2 BIAS 2 RF COMMON RF 1 RF 2 BIAS RF COMMON RF 2RF 1 BIAS RF COMMON BIAS BIAS RF 2RF 1

Page 6

5 Typical Applications for Multiple Diode Products (continued) RF in RF out 1 +V 0 2 0 +V  “ON” “OFF” 456 1 1 1 2 2 3 1 123 4 0 5 6 b1 b2 b3 2 3 11 1 RF in RF out 2 2 3 4 5 6 1 0 0 2 +V –V  “ON” “OFF” Figure 12. HSMP-386L Unconnected Trio used in a Positive Voltage, High Isolation Switch. Figure 14. HSMP-386L Unconnected Trio used in a Dual Voltage, High Isolation Switch. Figure 13. HSMP-386L used in a SP3T Switch. Figure 11. High Isolation SPST Switch (Repeat Cells as Required). BIAS Figure 11. High Isolation SPST Switch (Repeat Cells as Required).

Page 7

6 Assembly Information SOT-323 PCB Footprint Recommended PCB pad layouts for the miniature SOT packages are shown in Figures 15, 16, 17. These layouts provide ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.039 0.079 0.022 Dimensions in inches Figure 15. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products. 0.026 0.079 0.018 0.039 Dimensions in inches Figure 16. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products. 0.039 1 0.039 1 0.079 2.0 0.031 0.8 Dimensions in inches mm 0.035 0.9 Figure 17. Recommended PCB Pad Layout for Avago’s SOT-23 Products. Ordering Information Specify part number followed by option. For example: HSMP - 386x - XXX Bulk or Tape and Reel Option Part Number; x = Lead Code Surface Mount PIN Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement.”

Page 8

7 Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly Average ramp-up rate (Liquidus Temperature (TS(max) to Peak) 3°C/ second max Preheat Temperature Min (TS(min)) 150°C Temperature Max (TS(max)) 200°C Time (min to max) (tS) 60-180 seconds Ts(max) to TL Ramp-up Rate 3°C/second max Time maintained above: Temperature (TL) 217°C Time (tL) 60-150 seconds Peak Temperature (TP) 260 +0/-5°C Time within 5 °C of actual Peak temperature (tP) 20-40 seconds Ramp-down Rate 6°C/second max Time 25 °C to Peak Temperature 8 minutes max Note 1: All temperatures refer to topside of the package, measured on the package body surface Figure 18. Surface Mount Assembly Profile. 25 Time Te m pe ra tu re Tp T L tp tL t 25° C to Peak Ramp-up ts Ts min Ramp-down Preheat Critical Zone T L to Tp Ts max SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. Avago’s diodes have been qualified to the time-temper- ature profile shown in Figure 18. This profile is represen- tative of an IR reflow type of surface mount assembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evapo- rating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to components due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 260°C. These parameters are typical for a surface mount assembly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder.

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8 Package Dimensions Outline 23 (SOT-23) Package Characteristics Lead Material ........................................... Copper (SOT-323/363); Alloy 42 (SOT-23) Lead Finish ......................................................................... Tin 100% (Lead-free option) Maximum Soldering Temperature ............................................ 260°C for 5 seconds Minimum Lead Strength ........................................................................... 2 pounds pull Typical Package Inductance ...................................................................................... 2 nH Typical Package Capacitance ..............................................0.08 pF (opposite leads) Outline SOT-323 (SC-70, 3 Lead) Outline 363 (SC-70, 6 Lead) e B e2 e1 E1 C E XXX L D A A1 Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.79 0.000 0.30 0.08 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.20 3.13 1.50 1.02 2.04 0.60 2.70 0.69 SYMBOL A A1 B C D E1 e e1 e2 E L e B e1 E1 C E XXX L D A A1 Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.80 0.00 0.15 0.08 1.80 1.10 1.80 0.26 MAX. 1.00 0.10 0.40 0.25 2.25 1.40 2.40 0.46 SYMBOL A A1 B C D E1 e e1 E L 1.30 typical 0.65 typical EHE D e A1 b AA2 DIMENSIONS (mm) MIN. 1.15 1.80 1.80 0.80 0.80 0.00 0.15 0.08 0.10 MAX. 1.35 2.25 2.40 1.10 1.00 0.10 0.30 0.25 0.46 SYMBOL E D HE A A2 A1 e b c L 0.650 BCS L c

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9 USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL Note: "AB" represents package marking code. "C" represents date code. END VIEW 8 mm 4 mm TOP VIEW ABC ABC ABC ABC END VIEW 8 mm 4 mm TOP VIEW Note: "AB" represents package marking code. "C" represents date code. ABC ABC ABC ABC Device Orientation Tape Dimensions and Product Orientation For Outline SOT-23 For Outlines SOT-23, -323 For Outline SOT-363 9 MAX A0 P P0 D P2 E F W D1 Ko 8 MAX B0 13.5 MAX t1 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A0 B0 K0 P D1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0.05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 CAVITY DIAMETER PITCH POSITION D P0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W t1 8.00 + 0.30 - 0.10 0.229 ± 0.013 0.315 + 0.012 - 0.004 0.009 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F P2 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE BETWEEN CENTERLINE

HSMP-386C-TR1G Reviews

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Aubr*****aniels

December 21, 2020

Every time I order, I get it correctly filled and faster than most of website. For a friendly use operate system, you guys are the best!

Layt*****athur

December 21, 2020

Nice to have an assortment on hand, just in case. Happy with this purchase.

Audr*****Gaba

December 15, 2020

Very professional sellers, they have adopted MSL packaging for different parts.

Meil*****Dunlap

December 12, 2020

Arrived safely. All OK. Thanks

Abb*****owery

December 12, 2020

Good seller, incredible reliable.Item as described. Very professional

Isma*****cott

December 11, 2020

All current moves in switching devices with the proper selection of amp rating capability. I chose these to do a job that had to handle only 1/3 of it's rated capacity. So they were the perfect choice. To date they work as expected; perfectly.

Dah***** Hill

December 2, 2020

Happy with purchase, would do business again

Mate*****cker

December 1, 2020

Good and works well. What else is there to say about it.

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