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IXDN609PI

hot IXDN609PI

IXDN609PI

For Reference Only

Part Number IXDN609PI
Manufacturer IXYS Integrated Circuits Division
Description IC GATE DVR 9A NON-INV 8DIP
Datasheet IXDN609PI Datasheet
Package 8-DIP (0.300", 7.62mm)
In Stock 6502 piece(s)
Unit Price $ 0.8526 *
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IXDN609PI

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IXDN609PI Specifications

ManufacturerIXYS Integrated Circuits Division
CategoryIntegrated Circuits (ICs) - PMIC - Gate Drivers
Datasheet IXDN609PI Datasheet
Package8-DIP (0.300", 7.62mm)
Series-
Driven ConfigurationLow-Side
Channel TypeSingle
Number of Drivers1
Gate TypeIGBT, N-Channel, P-Channel MOSFET
Voltage - Supply4.5 V ~ 35 V
Logic Voltage - VIL, VIH0.8V, 3V
Current - Peak Output (Source, Sink)9A, 9A
Input TypeNon-Inverting
Rise / Fall Time (Typ)22ns, 15ns
Operating Temperature-55°C ~ 150°C (TJ)
Mounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)
Supplier Device Package8-DIP

IXDN609PI Datasheet

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INTEGRATED CIRCUITS DIVISION DS-IXD_609-R09 www.ixysic.com 1 Features • 9A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V • Matched Rise and Fall Times • Low Propagation Delay Time • Low, 10A Supply Current • Low Output Impedance Applications • Efficient Power MOSFET and IGBT Switching • Switch Mode Power Supplies • Motor Controls • DC to DC Converters • Class-D Switching Amplifiers • Pulse Transformer Driver Description The IXDD609/IXDI609/IXDN609 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. The IXD_609 high-current output can source and sink 9A of peak current while producing voltage rise and fall times of less than 25ns. The input is CMOS compatible, and is virtually immune to latch up. Proprietary circuitry eliminates cross-conduction and current “shoot-through.” Low propagation delay and fast, matched rise and fall times make the IXD_609 family ideal for high-frequency and high-power applications. The IXDD609 is configured as a non-inverting driver with an enable, the IXDN609 is configured as a non-inverting driver, and the IXDI609 is configured as an inverting driver. The IXD_609 family is available in a standard 8-pin DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC with an exposed metal back (SI); an 8-pin DFN (D2); a 5-pin TO-263 (YI); and a 5-pin TO-220 (CI). Ordering Information Part Number Logic Configuration Package Type Packing Method Quantity IXDD609D2TR 8-Pin DFN Tape & Reel 2000 IXDD609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100 IXDD609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000 IXDD609SIA 8-Pin SOIC Tube 100 IXDD609SIATR 8-Pin SOIC Tape & Reel 2000 IXDD609PI 8-Pin DIP Tube 50 IXDD609CI 5-Pin TO-220 Tube 50 IXDD609YI 5-Pin TO-263 Tube 50 IXDI609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100 IXDI609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000 IXDI609SIA 8-Pin SOIC Tube 100 IXDI609SIATR 8-Pin SOIC Tape & Reel 2000 IXDI609PI 8-Pin DIP Tube 50 IXDI609CI 5-Pin TO-220 Tube 50 IXDI609YI 5-Pin TO-263 Tube 50 IXDN609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100 IXDN609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000 IXDN609SIA 8-Pin SOIC Tube 100 IXDN609SIATR 8-Pin SOIC Tape & Reel 2000 IXDN609PI 8-Pin DIP Tube 50 IXDN609CI 5-Pin TO-220 Tube 50 IXDN609YI 5-Pin TO-263 Tube 50 IN EN OUT IN OUT IN OUT IXD_609 9-Ampere Low-Side Ultrafast MOSFET Drivers

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INTEGRATED CIRCUITS DIVISION IXD_609 2 www.ixysic.com R09 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

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INTEGRATED CIRCUITS DIVISION IXD_6091 Specifications 1.1 Pin Configurations 1.2 Pin Definitions 1.3 Absolute Maximum Ratings Unless stated otherwise, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions 1 4 3 2 8 5 6 7 V CC IN EN GND V CC OUT OUT GND 1 4 3 2 5 V CC OUT GND IN EN 1 4 3 2 8 5 6 7 V CC IN NC GND V CC OUT OUT GND 1 4 3 2 5 V CC OUT GND IN NC 1 4 3 2 8 5 6 7 V CC IN NC GND V CC OUT OUT GND 1 4 3 2 5 V CC OUT GND IN NC IXDD609 D2 / PI / SI / SIA IXDI609 PI / SI / SIA IXDN609 PI / SI / SIA IXDD609 CI / YI IXDI609 CI / YI IXDN609 CI / YI Pin Name Description IN Logic Input EN Output Enable - Drive pin low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device NC Not connected Parameter Symbol Minimum Maximum Units Supply Voltage VCC -0.3 40 V Input Voltage VIN, VEN -5 VCC+0.3 V Output Current IOUT - ±9 A Junction Temperature TJ -55 +150 °C Storage Temperature TSTG -65 +150 °C Parameter Symbol Range Units Supply Voltage VCC 4.5 to 35 V Operating Temperature Range TA -40 to +125 °CR09 www.ixysic.com 3

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INTEGRATED CIRCUITS DIVISION IXD_6091.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). 1.6 Electrical Characteristics: TA = - 40°C to +125°C Test Conditions: 4.5V < VCC < 35V unless otherwise noted. Parameter Conditions Symbol Minimum Typical Maximum Units Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 Input Current 0V < VIN < VCC IIN - - ±10 A EN Input Voltage, High IXDD609 only VENH 2/3VCC - - V EN Input Voltage, Low IXDD609 only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - V Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 0.6 1  Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 0.4 0.8 Output Current, Continuous Limited by package power dissipation IDC - - ±2 A Rise Time VCC=18V, CLOAD=10nF tr - 22 35 ns Fall Time VCC=18V, CLOAD=10nF tf - 15 25 On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly - 40 60 Off-Time Propagation Delay VCC=18V, CLOAD=10nF toffdly - 42 60 Enable to Output-High Delay Time (IXDD609 Only) VCC=18V tENOH - 25 60 Disable to High Impedance State Delay Time (IXDD609 Only) VCC=18V tDOLD - 35 60 Enable Pull-Up Resistor - REN - 200 - k Power Supply Current VCC=18V, VIN=3.5V ICC - 1 2 mA VCC=18V, VIN=0V - <1 10 A VCC=18V, VIN=VCC - <1 10 Parameter Conditions Symbol Minimum Maximum Units Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - V Input Voltage, Low 4.5V < VCC < 18V VIL - 0.65 Input Current 0V < VIN < VCC IIN - ±10 A Output Voltage, High - VOH VCC-0.025 - V Output Voltage, Low - VOL - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 2  Output Resistance, Low State VCC=18V, IOUT=100mA ROL - 1.5 Output Current, Continuous Limited by package power dissipation IDC - ±1 A Rise Time VCC=18V, CLOAD=10nF tr - 40 ns Fall Time VCC=18V, CLOAD=10nF tf - 30 On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly - 75 Off-Time Propagation Delay VCC=18V, CLOAD=10nF toffdly - 75 Enable to Output-High Delay Time IXDD609 only, VCC=18V tENOH - 75 Disable to High Impedance State Delay Time IXDD609 only, VCC=18V tDOLD - 75 Power Supply Current VCC=18V, VIN=3.5V ICC - 2.5 mA VCC=18V, VIN=0V - 150 A VCC=18V, VIN=VCC - 1504 www.ixysic.com R09

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INTEGRATED CIRCUITS DIVISION IXD_6091.7 Thermal Characteristics 2 IXD_609 Performance 2.1 Timing Diagrams 2.2 Characteristics Test Diagram Package Parameter Symbol Rating Units D2 (8-Pin DFN) Thermal Impedance, Junction-to-Ambient JA 35 °C/W CI (5-Pin TO-220) 36 PI (8-Pin DIP) 125 SI (8-Pin Power SOIC) 85 SIA (8-Pin SOIC) 120 YI (5-Pin TO-263) 46 CI (5-Pin TO-220) Thermal Impedance, Junction-to-Case JC 3 °C/WSI (8-Pin Power SOIC) 10 YI (5-Pin TO-263) 2 10% 90% t ondly t offdly t r t f V IH V IL IN OUT 10% 90% t ondly t offdly t f t r V IH V IL IN OUT EN IN OUT GND V CCV CC + - V IN 0.1μF 10μF Tektronix Current Probe 6302CLOAD V CCR09 www.ixysic.com 5

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INTEGRATED CIRCUITS DIVISION IXD_6093 Block Diagrams & Truth Tables 3.1 IXDD609 3.2 IXDI609 3.3 IXDN609 IN EN OUT 0 1 or open 0 1 1 or open 1 x 0 Z IN OUT 0 1 1 0 GND IN EN V CC OUT IN V CC GND OUT IN OUT 0 0 1 1 IN V CC GND OUT6 www.ixysic.com R09

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INTEGRATED CIRCUITS DIVISION IXD_6094 Typical Performance Characteristics Load Capacitance (pF) 0 2000 4000 6000 8000 10000 R is e T im e ( n s ) 0 10 20 30 40 50 60 70 Rise Time vs. Load Capacitance V CC =4.5V V CC =8V V CC =12V V CC =18V V CC =25V V CC =30V V CC =35V Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 R is e & F a ll T im e s ( n s ) 5 6 7 8 9 10 11 Rise and Fall Times vs. Temperature (V IN =0-5V, V CC =18V, f=10kHz, C L =2.5nF) t r t f Supply Voltage (V) 0 5 10 15 20 25 30 35 F a ll T im e ( n s ) 0 10 20 30 40 50 60 Fall Time vs. Supply Voltage (Input=0-5V, f=10kHz, T A =25ºC) C L =10nF C L =5.4nF C L =1.5nF Supply Voltage (V) 0 5 10 15 20 25 30 35 R is e T im e ( n s ) 0 10 20 30 40 50 60 70 Rise Time vs. Supply Voltage (Input=0-5V, f=10kHz, T A =25ºC) C L =10nF C L =5.4nF C L =1.5nF Load Capacitance (pF) 0 2000 4000 6000 8000 10000 F a ll T im e ( n s ) 0 10 20 30 40 50 60 Fall Time vs. Load Capacitance V CC =4.5V V CC =8V V CC =12V V CC =18V V CC =25V V CC =30V V CC =35V Supply Voltage (V) 0 5 10 15 20 25 30 35 In p u t T h re s h o ld ( V ) 1.0 1.5 2.0 2.5 3.0 3.5 Input Threshold vs. Supply Voltage Min V IH Max V IL Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 In p u t T h re s h o ld V o lt a g e ( V ) 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 Input Threshold Voltage vs. Temperature (V CC =18V, C L =2.5nF) Min V IH Max V IL Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 P ro p a g a ti o n D e la y ( n s ) 30 35 40 45 50 55 Propagation Delay vs. Temperature (V CC =18V, f=1kHz, C L =5.4nF) t ondly t offdly Input Voltage (V) 2 4 6 8 10 12 P ro p a g a ti o n D e la y ( n s ) 0 20 40 60 80 100 120 140 160 180 Propagation Delay vs. Input Voltage (V IN =5V, V CC =12V, f=1kHz, C L =5.4nF) t ondly t offdly 119753 Supply Voltage (V) 0 5 10 15 20 25 30 35 P ro p a g a ti o n D e la y ( n s ) 0 50 100 150 200 Propagation Delay vs. Supply Voltage (V IN =0-5V, f=1kHz, C L =5.4nF) t offdly t ondly Supply Voltage (V) 0 5 10 15 20 25 30 35 E n a b le T h re s h o ld ( V ) 0 5 10 15 20 25 Enable Threshold vs. Supply Voltage Min V ENH Max V ENLR09 www.ixysic.com 7

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INTEGRATED CIRCUITS DIVISION IXD_609Load Capacitance (pF) 1000 10000 S u p p ly C u rr e n t (m A ) 0 100 200 300 400 500 Supply Current vs. Load Capacitance (V CC =18V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 5000 Load Capacitance (pF) 1000 10000 S u p p ly C u rr e n t (m A ) 0 50 100 150 200 250 300 Supply Current vs. Load Capacitance (V CC =12V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 5000 Load Capacitance (pF) 1000 10000 S u p p ly C u rr e n t (m A ) 0 50 100 150 200 Supply Current vs. Load Capacitance (V CC =8V) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 5000 Frequency (kHz) 1 10 100 1000 10000 S u p p ly C u rr e n t (m A ) 0.1 1 10 100 1000 Supply Current vs. Frequency (V CC =18V) C L =10nF C L =5.4nF C L =1.5nF Frequency (kHz) 1 10 100 1000 10000 S u p p ly C u rr e n t (m A ) 0.1 1 10 100 1000 Supply Current vs. Frequency (V CC =12V) C L =10nF C L =5.4nF C L =1.5nF Frequency (kHz) 1 10 100 1000 10000 S u p p ly C u rr e n t (m A ) 0.01 0.1 1 10 100 1000 Supply Current vs. Frequency (V CC =8V) C L =10nF C L =5.4nF C L =1.5nF Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 S u p p ly C u rr e n t (m A ) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Quiescent Supply Current vs. Temperature V IN =3.5V V IN =5V V IN =10V V IN =0V & 18V Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 S u p p ly C u rr e n t (m A ) 0.35 0.40 0.45 0.50 0.55 0.60 0.65 Dynamic Supply Current vs. Temperature (V IN =5V, V CC =18V, f=1kHz, C L =1.5nF) Supply Voltage (V) 0 5 10 15 20 25 30 35 O u tp u t S o u rc e C u rr e n t (A ) 0 -5 -10 -15 -20 -25 -30 Output Source Current vs. Supply Voltage (f=422Hz, C L =66nF) Supply Voltage (V) 0 5 10 15 20 25 30 35 O u tp u t S in k C u rr e n t (A ) 0 5 10 15 20 25 30 Output Sink Current vs. Supply Voltage (f=422Hz, C L =66nF)8 www.ixysic.com R09

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INTEGRATED CIRCUITS DIVISION IXD_609Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 O u tp u t S o u rc e C u rr e n t (A ) -9.0 -9.5 -10.0 -10.5 -11.0 -11.5 -12.0 Output Source Current vs. Temperature (V CC =18V, f=422Hz, C L =66nF) Temperature (ºC) -40 -20 0 20 40 60 80 100 120 140 O u tp u t S in k C u rr e n t (A ) 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 Output Sink Current vs. Temperature (V CC =18V, f=422Hz, C L =66nF) Supply Voltage (V) 0 5 10 15 20 25 30 35 O u tp u t R e s is ta n c e ( Ω ) 0.0 0.5 1.0 1.5 High State Output Resistance vs. Supply Voltage (I OUT = -10mA) Supply Voltage (V) 0 5 10 15 20 25 30 35 O u tp u t R e s is ta n c e ( Ω ) 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Low State Output Resistance vs. Supply Voltage (I OUT = +10mA )R09 www.ixysic.com 9

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INTEGRATED CIRCUITS DIVISION IXD_6095 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. 5.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. Device Moisture Sensitivity Level (MSL) Classification IXD_609 All Versions except IXD_609YI MSL 1 IXD_609YI MSL 3 Device Classification Temperature (TC) Dwell Time (tp) Maximum Cycles IXD_609CI 245°C for 30 seconds 30 seconds 1 IXD_609YI 245°C for 30 seconds 30 seconds 3 IXD_609PI 250°C for 30 seconds 30 seconds 3 IXD_609SI / IXD_609SIA / IXD_609D2 260°C for 30 seconds 30 seconds 310 www.ixysic.com R09

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INTEGRATED CIRCUITS DIVISION IXD_6095.5 Mechanical Dimensions 5.5.1 SIA (8-Pin SOIC) 5.5.2 SI (8-Pin Power SOIC with Exposed Metal Back) Dimensions MIN / MAX 1.75 MAX (0.069 MAX) 1.25 MIN (0.049 MIN) 0.10 / 0.25 (0.004 / 0.010) 0.10 (0.004) 4 4.80 / 5.00 (0.189 / 0.197) TOP VIEW PIN #1 5.80 / 6.20 (0.228 / 0.244) 5 3.80 / 4.00 (0.150 / 0.157) 0.31 / 0.51 (0.012 / 0.020) 8x SEATING PLANE GAUGE PLANE 8°- 0° 0.10 / 0.25 (0.004 / 0.010) 0.40 / 1.27 (0.016 / 0.050) A 0.25 (0.010) PCB Land Pattern 1.55 (0.061) 0.60 (0.024) 3.75 (0.148) A Notes: 1. Controlling dimension: millimeters. 2. All dimensions are in mm (inches). 3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F. 4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 6. Lead thickness includes plating. 6x 1.27 0.05 Dimensions MIN / MAX 1.70 MAX (0.067 MAX) 1.25 MIN (0.049 MIN) 0 / 0.15 (0 / 0.006) 0.10 (0.004) 4 4.80 / 5.00 (0.189 / 0.197) TOP VIEW PIN #1 5.80 / 6.20 (0.228 / 0.244) 5 3.80 / 4.00 (0.150 / 0.157) 0.31 / 0.51 (0.012 / 0.020) 8x BOTTOM VIEW 2.05 / 2.41 (0.081 / 0.095) 2.81 / 3.30 (0.111 / 0.130) SEATING PLANE GAUGE PLANE 8°- 0° 0.10 / 0.25 (0.004 / 0.010) 0.40 / 1.27 (0.016 / 0.050) A 0.25 (0.010) PCB Land Pattern 1.55 (0.061) 0.60 (0.024) 3.85 (0.152) 2.23 (0.088) 3.055 (0.120) A 6x 1.27 0.05 Notes: 1. Controlling dimension: millimeters. 2. All dimensions are in mm (inches). 3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F. 4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end. 5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current. 7. Lead thickness includes plating.R09 www.ixysic.com 11

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INTEGRATED CIRCUITS DIVISION IXD_6095.5.3 Tape & Reel Information for SI and SIA Packages 5.5.4 YI (5-Pin TO-263) Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K 0 = 2.10 (0.083) W=12.00 (0.472)B 0 =5.30 (0.209) User Direction of Feed A 0 =6.50 (0.256) P1=8.00 (0.315) H b1 c1 b c SECTION: C-C PLATING (Note 3) BASE METAL E (Note 2) D1 D (Note 2) L1 e ~4x C C E3 D2 * b ~5x E1 NOTES: 1. Reference JEDEC TO-263 Type “BA”. 2. Dimension does not include mold flash; mold flash shall not exceed 0.127mm (0.005 inch) per side. 3. Minimum plating: 1000 microinches. 4. Controlling dimension: millimeters. MIN MINMAX MAX MM INCH SYMBOL 1.702 BSC 0.067 BSC 0.254 BSC 0.010 BSC 0.460 TYP 0.018 TYP 0.506 TYP 0.02 TYP 4.8264.064 0.160 0.190 0.2540.000 0.000 0.010 0.9910.508 0.020 0.039 0.8890.508 0.020 0.035 0.7370.381 0.015 0.029 0.5840.381 0.015 0.023 1.6511.143 0.045 0.065 9.6528.382 0.330 0.380 7.7006.858 0.270 0.303 10.6689.652 0.380 0.420 8.0006.223 0.245 0.315 15.87514.605 0.575 0.625 2.7941.778 0.070 0.110 1.6761.000 0.039 0.066 8º- - 8º A θ A1 b b1 c c1 c2 D D1 E E1 e H L L1 L3 R R1 6.8695.092 0.200 0.270E3 1.5621.358 0.053 0.062D2 A1 L L3 θ R R A c2 A1 L L3 θ R1 R1 JEDEC TO-263 Optional Tip Lead Form Recommended PCB Pattern 10.75 (0.423) 2.20 (0.087) 8.40 (0.331) 8.05 (0.317) 10.50 (0.413) 1.05 (0.041) 3.80 (0.150) 1.702 (0.067) Dimensions mm (inches) Pin 1 Indicator Circular feature will be present on devices with the Optional Tip Lead Form. * 12 www.ixysic.com R09

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INTEGRATED CIRCUITS DIVISION IXD_6095.5.5 PI (8-Pin DIP) 5.5.6 CI (5-Pin TO-220) Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7.239 TYP. (0.285) 7.620 ± 0.254 (0.300 ± 0.010) 4.064 TYP (0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) 9.652 - 10.668 (0.380 - 0.420) 14.224 - 16.510 (0.560 - 0.650) 12.700 - 14.732 (0.500 - 0.580) C C 8.382 - 9.017 (0.330 - 0.355) 2.540 - 3.048 (0.100 - 0.120) 1.702 4x BSC (0.067 4x BSC) 0.381 - 1.016 5x (0.015 - 0.040 5x) SECTION C-C 0.381 - 1.016 (0.015 - 0.040) 0.356 - 0.610 (0.014 - 0.024) 0.381 - 0.965 (0.015 - 0.038) 0.356 - 0.559 (0.014 - 0.022) PLATING BASE METAL 3.556 - 4.826 (0.140 - 0.190) 0.508 - 1.397 (0.020 - 0.055) 5.842 - 6.858 (0.230 - 0.270) 2.032 - 2.921 (0.080 - 0.115) 0.356 - 0.610 (0.014 - 0.024) 6.858 - 8.890 (0.270 - 0.350) 12.192 - 12.878 (0.480 - 0.507) 9.652 - 10.668 (0.380 - 0.420) 7.550 - 8.100 (0.297 - 0.319) THERMAL PAD LEAD TIP 0.355 M B A M A B 0.381 M B A M 3.810 - 3.860 (0.150 - 0.152) 0.127 BSC (0.005 BSC) 4.826 - 5.334 (0.190 - 0.210) 6.300 - 6.700 (0.248 - 0.264) 5.842 - 6.858 (0.230 - 0.270) Dimensions mm (inches)R09 www.ixysic.com 13

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