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LC4256V-75FT256AC

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LC4256V-75FT256AC

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Part Number LC4256V-75FT256AC
Manufacturer Lattice Semiconductor Corporation
Description IC CPLD 256MC 7.5NS 256FTBG
Datasheet LC4256V-75FT256AC Datasheet
Package 256-LBGA
In Stock 1,378 piece(s)
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Part Number # LC4256V-75FT256AC (Embedded - CPLDs (Complex Programmable Logic Devices)) is manufactured by Lattice Semiconductor Corporation and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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LC4256V-75FT256AC Specifications

ManufacturerLattice Semiconductor Corporation
CategoryIntegrated Circuits (ICs) - Embedded - CPLDs (Complex Programmable Logic Devices)
Datasheet LC4256V-75FT256ACDatasheet
Package256-LBGA
SeriesispMACH? 4000V
Programmable TypeIn System Programmable
Delay Time tpd(1) Max7.5ns
Voltage Supply - Internal3 V ~ 3.6 V
Number of Logic Elements/Blocks16
Number of Macrocells256
Number of Gates-
Number of I/O128
Operating Temperature0°C ~ 90°C (TJ)
Mounting TypeSurface Mount
Package / Case256-LBGA
Supplier Device Package256-FTBGA (17x17)

LC4256V-75FT256AC Datasheet

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www.latticesemi.com 1 DS1020_23.1 ispMACH 4000V/B/C/Z Family 3.3V/2.5V/1.8V In-System Programmable SuperFAST High Density PLDs May 2009 Data Sheet DS1020 ® TM © 2009 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. Features  High Performance • fMAX = 400MHz maximum operating frequency • tPD = 2.5ns propagation delay • Up to four global clock pins with programmable clock polarity control • Up to 80 PTs per output  Ease of Design • Enhanced macrocells with individual clock, reset, preset and clock enable controls • Up to four global OE controls • Individual local OE control per I/O pin • Excellent First-Time-FitTM and refit • Fast path, SpeedLockingTM Path, and wide-PT path • Wide input gating (36 input logic blocks) for fast counters, state machines and address decoders  Zero Power (ispMACH 4000Z) and Low Power (ispMACH 4000V/B/C) • Typical static current 10µA (4032Z) • Typical static current 1.3mA (4000C) • 1.8V core low dynamic power • ispMACH 4000Z operational down to 1.6V VCC  Broad Device Offering • Multiple temperature range support – Commercial: 0 to 90°C junction (Tj) – Industrial: -40 to 105°C junction (Tj) – Extended: -40 to 130°C junction (Tj) • For AEC-Q100 compliant devices, refer to LA-ispMACH 4000V/Z Automotive Data Sheet  Easy System Integration • Superior solution for power sensitive consumer applications • Operation with 3.3V, 2.5V or 1.8V LVCMOS I/O • Operation with 3.3V (4000V), 2.5V (4000B) or 1.8V (4000C/Z) supplies • 5V tolerant I/O for LVCMOS 3.3, LVTTL, and PCI interfaces • Hot-socketing • Open-drain capability • Input pull-up, pull-down or bus-keeper • Programmable output slew rate • 3.3V PCI compatible • IEEE 1149.1 boundary scan testable • 3.3V/2.5V/1.8V In-System Programmable (ISP™) using IEEE 1532 compliant interface • I/O pins with fast setup path • Lead-free package options Table 1. ispMACH 4000V/B/C Family Selection Guide ispMACH 4032V/B/C ispMACH 4064V/B/C ispMACH 4128V/B/C ispMACH 4256V/B/C ispMACH 4384V/B/C ispMACH 4512V/B/C Macrocells 32 64 128 256 384 512 I/O + Dedicated Inputs 30+2/32+4 30+2/32+4/ 64+10 64+10/92+4/ 96+4 64+10/96+14/ 128+4/160+4 128+4/192+4 128+4/208+4 tPD (ns) 2.5 2.5 2.7 3.0 3.5 3.5 tS (ns) 1.8 1.8 1.8 2.0 2.0 2.0 tCO (ns) 2.2 2.2 2.7 2.7 2.7 2.7 fMAX (MHz) 400 400 333 322 322 322 Supply Voltages (V) 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V 3.3/2.5/1.8V Pins/Package 44 TQFP 48 TQFP 44 TQFP 48 TQFP 100 TQFP 100 TQFP 128 TQFP 144 TQFP1 100 TQFP 144 TQFP1 176 TQFP 256 ftBGA2/ fpBGA2, 3 176 TQFP 256 ftBGA/ fpBGA3 176 TQFP 256 ftBGA/ fpBGA3 1. 3.3V (4000V) only. 2. 128-I/O and 160-I/O configurations. 3. Use 256 ftBGA package for all new designs. Refer to PCN#14A-07 for 256 fpBGA package discontinuance.

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 2 Table 2. ispMACH 4000Z Family Selection Guide ispMACH 4000 Introduction The high performance ispMACH 4000 family from Lattice offers a SuperFAST CPLD solution. The family is a blend of Lattice’s two most popular architectures: the ispLSI® 2000 and ispMACH 4A. Retaining the best of both families, the ispMACH 4000 architecture focuses on significant innovations to combine the highest performance with low power in a flexible CPLD family. The ispMACH 4000 combines high speed and low power with the flexibility needed for ease of design. With its robust Global Routing Pool and Output Routing Pool, this family delivers excellent First-Time-Fit, timing predictabil- ity, routing, pin-out retention and density migration. The ispMACH 4000 family offers densities ranging from 32 to 512 macrocells. There are multiple density-I/O com- binations in Thin Quad Flat Pack (TQFP), Chip Scale BGA (csBGA) and Fine Pitch Thin BGA (ftBGA) packages ranging from 44 to 256 pins/balls. Table 1 shows the macrocell, package and I/O options, along with other key parameters. The ispMACH 4000 family has enhanced system integration capabilities. It supports 3.3V (4000V), 2.5V (4000B) and 1.8V (4000C/Z) supply voltages and 3.3V, 2.5V and 1.8V interface voltages. Additionally, inputs can be safely driven up to 5.5V when an I/O bank is configured for 3.3V operation, making this family 5V tolerant. The ispMACH 4000 also offers enhanced I/O features such as slew rate control, PCI compatibility, bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. The ispMACH 4000 family members are 3.3V/ 2.5V/1.8V in-system programmable through the IEEE Standard 1532 interface. IEEE Standard 1149.1 boundary scan testing capability also allows product testing on automated test equipment. The 1532 interface signals TCK, TMS, TDI and TDO are referenced to VCC (logic core). Overview The ispMACH 4000 devices consist of multiple 36-input, 16-macrocell Generic Logic Blocks (GLBs) interconnected by a Global Routing Pool (GRP). Output Routing Pools (ORPs) connect the GLBs to the I/O Blocks (IOBs), which contain multiple I/O cells. This architecture is shown in Figure 1. ispMACH 4032ZC ispMACH 4064ZC ispMACH 4128ZC ispMACH 4256ZC Macrocells 32 64 128 256 I/O + Dedicated Inputs 32+4/32+4 32+4/32+12/ 64+10/64+10 64+10/96+4 64+10/96+6/ 128+4 tPD (ns) 3.5 3.7 4.2 4.5 tS (ns) 2.2 2.5 2.7 2.9 tCO (ns) 3.0 3.2 3.5 3.8 fMAX (MHz) 267 250 220 200 Supply Voltage (V) 1.8 1.8 1.8 1.8 Max. Standby Icc (µA) 20 25 35 55 Pins/Package 48 TQFP 56 csBGA 48 TQFP 56 csBGA 100 TQFP 132 csBGA 100 TQFP 132csBGA 100 TQFP 132 csBGA 176 TQFP

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 3 Figure 1. Functional Block Diagram The I/Os in the ispMACH 4000 are split into two banks. Each bank has a separate I/O power supply. Inputs can support a variety of standards independent of the chip or bank power supply. Outputs support the standards com- patible with the power supply provided to the bank. Support for a variety of standards helps designers implement designs in mixed voltage environments. In addition, 5V tolerant inputs are specified within an I/O bank that is con- nected to VCCO of 3.0V to 3.6V for LVCMOS 3.3, LVTTL and PCI interfaces. ispMACH 4000 Architecture There are a total of two GLBs in the ispMACH 4032, increasing to 32 GLBs in the ispMACH 4512. Each GLB has 36 inputs. All GLB inputs come from the GRP and all outputs from the GLB are brought back into the GRP to be connected to the inputs of any other GLB on the device. Even if feedback signals return to the same GLB, they still must go through the GRP. This mechanism ensures that GLBs communicate with each other with consistent and predictable delays. The outputs from the GLB are also sent to the ORP. The ORP then sends them to the associ- ated I/O cells in the I/O block. Generic Logic Block The ispMACH 4000 GLB consists of a programmable AND array, logic allocator, 16 macrocells and a GLB clock generator. Macrocells are decoupled from the product terms through the logic allocator and the I/O pins are decou- pled from macrocells through the ORP. Figure 2 illustrates the GLB. I/O Block ORP ORP 16 16 G O E 0 G O E 1 V C C G N D T C K T M S T D I T D O 36 Generic Logic Block Generic Logic Block I/O Block ORP ORP 16 36 Generic Logic Block Generic Logic Block I/O Block I/ O B a n k 0 I/ O B a n k 1 I/O Block 36 36 C L K 0 /I C L K 1 /I C L K 2 /I C L K 3 /I 16 16 G lo b a l R o u ti n g P o o l V C C O 0 G N D V C C O 1 G N D 16 16 16

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 4 Figure 2. Generic Logic Block AND Array The programmable AND Array consists of 36 inputs and 83 output product terms. The 36 inputs from the GRP are used to form 72 lines in the AND Array (true and complement of the inputs). Each line in the array can be con- nected to any of the 83 output product terms via a wired-AND. Each of the 80 logic product terms feed the logic allocator with the remaining three control product terms feeding the Shared PT Clock, Shared PT Initialization and Shared PT OE. The Shared PT Clock and Shared PT Initialization signals can optionally be inverted before being fed to the macrocells. Every set of five product terms from the 80 logic product terms forms a product term cluster starting with PT0. There is one product term cluster for every macrocell in the GLB. Figure 3 is a graphical representation of the AND Array. L o g ic A llo c a to r 36 Inputs from GRP 1 6 M a c ro c e lls T o O R P To GRP To Product Term Output Enable Sharing 1+OE 1 6 M C F e e d b a c k S ig n a ls Clock Generator 1+OE 1+OE 1+OE 1+OE 1+OE 1+OE C L K 0 C L K 1 C L K 2 C L K 3 1+OE A N D A rr a y 3 6 I n p u ts , 8 3 P ro d u c t T e rm s

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 5 Figure 3. AND Array Enhanced Logic Allocator Within the logic allocator, product terms are allocated to macrocells in product term clusters. Each product term cluster is associated with a macrocell. The cluster size for the ispMACH 4000 family is 4+1 (total 5) product terms. The software automatically considers the availability and distribution of product term clusters as it fits the functions within a GLB. The logic allocator is designed to provide three speed paths: 5-PT fast bypass path, 20-PT Speed Locking path and an up to 80-PT path. The availability of these three paths lets designers trade timing variability for increased performance. The enhanced Logic Allocator of the ispMACH 4000 family consists of the following blocks: • Product Term Allocator • Cluster Allocator • Wide Steering Logic Figure 4 shows a macrocell slice of the Logic Allocator. There are 16 such slices in the GLB. Figure 4. Macrocell Slice PT0 PT1 Cluster 0PT2 PT3 PT4 In[0] In[34] In[35] Note: Indicates programmable fuse. PT80 PT81 PT82 Shared PT Clock Shared PT Initialization Shared PTOE PT76 PT77 PT78 PT79 PT75 Cluster 15 to n+1 to n-1 to n-2 from n-1 from n-4 from n+2 from n+1 5-PT From n-4 1-80 PTs To n+4 Fast 5-PT Path To XOR (MC) Cluster Individual Product Term Allocator Cluster Allocator SuperWIDE™ Steering Logic n

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 6 Product Term Allocator The product term allocator assigns product terms from a cluster to either logic or control applications as required by the design being implemented. Product terms that are used as logic are steered into a 5-input OR gate associ- ated with the cluster. Product terms that used for control are steered either to the macrocell or I/O cell associated with the cluster. Table 3 shows the available functions for each of the five product terms in the cluster. The OR gate output connects to the associated I/O cell, providing a fast path for narrow combinatorial functions, and to the logic allocator. Table 3. Individual PT Steering Cluster Allocator The cluster allocator allows clusters to be steered to neighboring macrocells, thus allowing the creation of functions with more product terms. Table 4 shows which clusters can be steered to which macrocells. Used in this manner, the cluster allocator can be used to form functions of up to 20 product terms. Additionally, the cluster allocator accepts inputs from the wide steering logic. Using these inputs, functions up to 80 product terms can be created. Table 4. Available Clusters for Each Macrocell Wide Steering Logic The wide steering logic allows the output of the cluster allocator n to be connected to the input of the cluster alloca- tor n+4. Thus, cluster chains can be formed with up to 80 product terms, supporting wide product term functions and allowing performance to be increased through a single GLB implementation. Table 5 shows the product term chains. Product Term Logic Control PTn Logic PT Single PT for XOR/OR PTn+1 Logic PT Individual Clock (PT Clock) PTn+2 Logic PT Individual Initialization or Individual Clock Enable (PT Initialization/CE) PTn+3 Logic PT Individual Initialization (PT Initialization) PTn+4 Logic PT Individual OE (PTOE) Macrocell Available Clusters M0 — C0 C1 C2 M1 C0 C1 C2 C3 M2 C1 C2 C3 C4 M3 C2 C3 C4 C5 M4 C3 C4 C5 C6 M5 C4 C5 C6 C7 M6 C5 C6 C7 C8 M7 C6 C7 C8 C9 M8 C7 C8 C9 C10 M9 C8 C9 C10 C11 M10 C9 C10 C11 C12 M11 C10 C11 C12 C13 M12 C11 C12 C13 C14 M13 C12 C13 C14 C15 M14 C13 C14 C15 — M15 C14 C15 — —

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 7 Table 5. Product Term Expansion Capability Every time the super cluster allocator is used, there is an incremental delay of tEXP. When the super cluster alloca- tor is used, all destinations other than the one being steered to, are given the value of ground (i.e., if the super clus- ter is steered to M (n+4), then M (n) is ground). Macrocell The 16 macrocells in the GLB are driven by the 16 outputs from the logic allocator. Each macrocell contains a pro- grammable XOR gate, a programmable register/latch, along with routing for the logic and control functions. Figure 5 shows a graphical representation of the macrocell. The macrocells feed the ORP and GRP. A direct input from the I/O cell allows designers to use the macrocell to construct high-speed input registers. A programmable delay in this path allows designers to choose between the fastest possible set-up time and zero hold time. Figure 5. Macrocell Enhanced Clock Multiplexer The clock input to the flip-flop can select any of the four block clocks along with the shared PT clock, and true and complement forms of the optional individual term clock. An 8:1 multiplexer structure is used to select the clock. The eight sources for the clock multiplexer are as follows: • Block CLK0 • Block CLK1 Expansion Chains Macrocells Associated with Expansion Chain (with Wrap Around) Max PT/ Macrocell Chain-0 M0 M4 M8 M12 M0 75 Chain-1 M1 M5 M9 M13 M1 80 Chain-2 M2 M6 M10 M14 M2 75 Chain-3 M3 M7 M11 M15 M3 70 Single PT Block CLK0 Block CLK1 Block CLK2 Block CLK3 PT Clock (optional) Shared PT Clock CE D/T/L Q R P Shared PT Initialization PT Initialization/CE (optional) PT Initialization (optional) From Logic Allocator Power-up Initialization To ORP To GRP From I/O CellDelay

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 8 • Block CLK2 • Block CLK3 • PT Clock • PT Clock Inverted • Shared PT Clock • Ground Clock Enable Multiplexer Each macrocell has a 4:1 clock enable multiplexer. This allows the clock enable signal to be selected from the fol- lowing four sources: • PT Initialization/CE • PT Initialization/CE Inverted • Shared PT Clock • Logic High Initialization Control The ispMACH 4000 family architecture accommodates both block-level and macrocell-level set and reset capability. There is one block-level initialization term that is distributed to all macrocell registers in a GLB. At the macrocell level, two product terms can be “stolen” from the cluster associated with a macrocell to be used for set/reset func- tionality. A reset/preset swapping feature in each macrocell allows for reset and preset to be exchanged, providing flexibility. Note that the reset/preset swapping selection feature affects power-up reset as well. All flip-flops power up to a known state for predictable system initialization. If a macrocell is configured to SET on a signal from the block-level initialization, then that macrocell will be SET during device power-up. If a macrocell is configured to RESET on a signal from the block-level initialization or is not configured for set/reset, then that macrocell will RESET on power- up. To guarantee initialization values, the VCC rise must be monotonic, and the clock must be inactive until the reset delay time has elapsed. GLB Clock Generator Each ispMACH 4000 device has up to four clock pins that are also routed to the GRP to be used as inputs. These pins drive a clock generator in each GLB, as shown in Figure 6. The clock generator provides four clock signals that can be used anywhere in the GLB. These four GLB clock signals can consist of a number of combinations of the true and complement edges of the global clock signals. Figure 6. GLB Clock Generator CLK0 CLK1 CLK2 CLK3 Block CLK0 Block CLK1 Block CLK2 Block CLK3

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Lattice Semiconductor ispMACH 4000V/B/C/Z Family Data Sheet 9 Output Routing Pool (ORP) The Output Routing Pool allows macrocell outputs to be connected to any of several I/O cells within an I/O block. This provides greater flexibility in determining the pinout and allows design changes to occur without affecting the pinout. The output routing pool also provides a parallel capability for routing macrocell-level OE product terms. This allows the OE product term to follow the macrocell output as it is switched between I/O cells. Additionally, the out- put routing pool allows the macrocell output or true and complement forms of the 5-PT bypass signal to bypass the output routing multiplexers and feed the I/O cell directly. The enhanced ORP of the ispMACH 4000 family consists of the following elements: • Output Routing Multiplexers • OE Routing Multiplexers • Output Routing Pool Bypass Multiplexers Figure 7 shows the structure of the ORP from the I/O cell perspective. This is referred to as an ORP slice. Each ORP has as many ORP slices as there are I/O cells in the corresponding I/O block. Figure 7. ORP Slice Output Routing Multiplexers The details of connections between the macrocells and the I/O cells vary across devices and within a device dependent on the maximum number of I/Os available. Tables 5-9 provide the connection details. Table 6. ORP Combinations for I/O Blocks with 8 I/Os I/O Cell Available Macrocells I/O 0 M0, M1, M2, M3, M4, M5, M6, M7 I/O 1 M2, M3, M4, M5, M6, M7, M8, M9 I/O 2 M4, M5, M6, M7, M8, M9, M10, M11 I/O 3 M6, M7, M8, M9, M10, M11, M12, M13 I/O 4 M8, M9, M10, M11, M12, M13, M14, M15 I/O 5 M10, M11, M12, M13, M14, M15, M0, M1 I/O 6 M12, M13, M14, M15, M0, M1, M2, M3 I/O 7 M14, M15, M0, M1, M2, M3, M4, M5 Output Routing Multiplexer OE Routing Multiplexer ORP Bypass Multiplexer From Macrocell From PTOE To I/O Cell To I/O Cell Output OE 5-PT Fast Path

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May 21, 2020

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May 17, 2020

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