0
+86-755-83210559 ext. 811
TOP
Contact Us
SalesDept@heisener.com +86-755-83210559 ext. 811
Language Translation
  • • English
  • • Español
  • • Deutsch
  • • Français
  • • Italiano
  • • Nederlands
  • • Português
  • • русский язык
  • • 日本語
  • • 한국어
  • • 简体中文
  • • 繁體中文

* Please refer to the English Version as our Official Version.

Change Country

If your country is not listed, please select International as your region.

  • International
Americas
  • Argentina
  • Brasil
  • Canada
  • Chile
  • Colombia
  • Costa Rica
  • Dominican Republic
  • Ecuador
  • Guatemala
  • Honduras
  • Mexico
  • Peru
  • Puerto Rico
  • United States
  • Uruguay
  • Venezuela
Asia/Pacific
  • Australia
  • China
  • Hong Kong
  • Indonesia
  • Israel
  • India
  • Japan
  • Korea, Republic of
  • Malaysia
  • New Zealand
  • Philippines
  • Singapore
  • Thailand
  • Taiwan
  • Vietnam
Europe
  • Austria
  • Belgium
  • Bulgaria
  • Switzerland
  • Czech Republic
  • Germany
  • Denmark
  • Estonia
  • Spain
  • Finland
  • France
  • United Kingdom
  • Greece
  • Croatia
  • Hungary
  • Ireland
  • Italy
  • Netherlands
  • Norway
  • Poland
  • Portugal
  • Romania
  • Russian Federation
  • Sweden
  • Slovakia
  • Turkey

LE75183ADSCT

hot LE75183ADSCT

LE75183ADSCT

For Reference Only

Part Number LE75183ADSCT
Manufacturer Microsemi Corporation
Description IC LINE CARD LCAS 1CH 20SOIC
Datasheet LE75183ADSCT Datasheet
Package 20-SOIC (0.295", 7.50mm Width)
In Stock 16496 piece(s)
Unit Price Request a Quote
Lead Time Can Ship Immediately
Estimated Delivery Time Dec 14 - Dec 19 (Choose Expedited Shipping)
Winter Hot Sale

* Free Shipping * Up to $100 Discount

Winter Hot Sale

Request for Quotation

LE75183ADSCT

Quantity
  • We are offering LE75183ADSCT for competitive price in the global market, please send us a quota request for pricing. Thank you!
  • To process your RFQ, please add LE75183ADSCT with quantity into BOM. Heisener.com does NOT require any registration to request a quote of LE75183ADSCT.
  • To learn about the specification of LE75183ADSCT, please search the datasheet by clicking the link above. If you couldn't find the correct datasheet, please refer to the manufacturer's official datasheet.
Payment Methods
Delivery Services

Do you have any question about LE75183ADSCT?

+86-755-83210559 ext. 811 SalesDept@heisener.com heisener007 2354944915 Send Message

Certified Quality

Heisener's commitment to quality has shaped our processes for sourcing, testing, shipping, and every step in between. This foundation underlies each component we sell.

ISO9001:2015, ICAS, IAF, UKAS

View the Certificates

LE75183ADSCT Specifications

ManufacturerMicrosemi Corporation
CategoryIntegrated Circuits (ICs) - Interface - Telecom
Datasheet LE75183ADSCT Datasheet
Package20-SOIC (0.295", 7.50mm Width)
Series-
FunctionLine Card Access Switch
Number of Circuits1
Voltage - Supply4.5 V ~ 5.5 V
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case20-SOIC (0.295", 7.50mm Width)
Supplier Device Package20-SOIC

LE75183ADSCT Datasheet

Page 1

Page 2

™ Document ID#:081126 Version 6 April 2011 Ordering Information 1. The green package meets RoHS Directive 2002/95/EC of the European Council to minimize the environmental impact of electrical equipment. 2. For delivery using a tape and reel packing system, add a "T" suffix to the OPN (Ordering Part Number) when placing an order. Device Package Type Packing2 Le75183ADSC 20 Pin SOIC (GULL) TubeLe75183BDSC Le75183CDSC Le75183AFQC 32 Pin QFN TrayLe75183BFQC LE75183CFQC LE75183AFSC 28 Pin SOIC (GULL) TubeLe75183BFSC Le75183CZFSC Le75183 Line Card Access Switch VE750 Series Data SheetFeatures • Small size/surface-mount packaging • Monolithic IC reliability • Low impulse noise • Make-before-break, break-before-make operation • Clean, bounce-free switching • Low, matched ON-resistance • Built-in current limiting, thermal shutdown and SLIC protection • 5 V only operation, very low power consumption • Battery monitor, all OFF state upon loss of battery • No EMI • Latched logic level inputs, no drive circuitry • Only one external protector required • TTL logic control compatible • Default power up state Applications • Central office • DLC • PBX • DAML • HFC/FITL Related Literature • 081123 Le75282 Dual Intelligent Line Card Access Switch Data Sheet • 081105 Le75181 Ringing Access Switch Data Sheet • 080754 Le58QL061/063 QLSLAC Data Sheet • 080676 Le5711 Dual SLIC Data Sheet • 081047 Le5712 Dual SLIC Data Sheet1 Zarlink Semic Zarlink, ZL and the Zarlink Semiconductor logo Copyright 2007-2010, Zarlink SemiDescription The VoiceEdge™ family VE750 series of Line Card Access Switches (LCAS), which includes the Le75181, Le75282 and Le75183 devices, is a family of monolithic solid-state switches that is designed to provide both power ringing access and test access on the analog line card. These devices, while not a pin- for-pin replacement for the traditional electromechanical relay (EMR) solution, provide the equivalent switching functionality. The VE750 series of LCAS is meant as a solid-state alternative to the EMRs. The Le75183A/B/C devices are pin-for-pin compatible with Zarlink’s L7583A/B/C devices. Zarlink also offers a range of compatible SLIC devices and codec/filters that can be used with the VE750 series LCAS for complete line card solutions that can be used worldwide in analog line card applications.onductor Inc. are trademarks of Zarlink Semiconductor Inc. conductor Inc. All Rights Reserved.

Page 3

Le75183 Data Sheet Table of Contents 2 Zarlink Semiconductor Inc. 1.0 Product Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.0 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.0 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3.1 Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.0 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5.0 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 Environmental Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.2 Electrical Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.3 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6.0 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.1 Summary of Assumptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6.2 Supply Currents and Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.0 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 7.1 Device Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 8.0 Zero Cross Current Turn Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.0 Switching Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10.0 Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11.0 Loss of Battery Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 12.0 Impulse Noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.0 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.1 Integrated SLIC Device Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.1.1 Diode Bridge/SCR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.1.2 Current Limiting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 13.1.3 Temperature Shutdown Mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 13.1.4 External Secondary Protector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 14.0 Typical Performance Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 15.0 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 16.0 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16.1 28-Pin, Plastic SOIC (GULL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 16.2 20-Pin, Plastic SOIC (GULL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 16.3 32-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 17.0 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.1 Revision A1 to B1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.2 Revision B1 to C1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.3 Revision C1 to C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.4 Revision C2 to Ver 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 17.5 Revision Ver 5 to Ver 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Page 4

Le75183 Data Sheet List of Figures 3 Zarlink Semiconductor Inc. Figure 1 - Le75183A/C Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2 - Le75183B Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3 - Protection Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 4 - Switches 3, 7, 9, and 10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 5 - Switch 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 6 - Switches 1, 2, and 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 7 - Switches 6, 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 8 - Typical LCAS Application, A/C Versions, Idle or Talk State Shown . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Page 5

Le75183 Data Sheet1.0 Product Description The Le75183A/B/C Line Card Access Switch is a monolithic solid-state device providing the equivalent switching functionality of three 2 form C switches. The Le75183 is designed to provide power ringing access, line test access (test out), and SLIC test access (test in) to tip and ring in central office, digital loop carrier, private branch exchange, digitally added main line, and hybrid fiber coax/fiber-in-the-loop analog line card applications. An additional pair of solid-state contacts are also available to provide access for testing of the ringing generator. The Le75183A/B has seven states: the idle talk state (line break switches closed, all other switches open), the power ringing state (ringing access switches closed, all other switches open), loop access (test out) state (loop access (test out) switches closed, all other switches open), SLIC test state (test in switches closed, all other switches open), simultaneous loop and SLIC access state (loop and test in switches closed, all others open), ringing generator test state (ring test switches closed, all others open), and an all OFF state. The seven states in the Le75183A/B are also in the Le75183C, with an additional simultaneous test-out and ring-test state, making the Le75183C appropriate for digital loop carrier and other Telcordia TR-57 applications. The Le75183 offers break-before-make or make-before-break switching, with simple logic level input control. Because of the solid-state construction, voltage transients generated when switching into an inductive ringing lead during ring cadence or ring trip are minimized, possibly eliminating the need for external zero cross switching circuitry. State control is via logic level inputs, so no additional driver circuitry is required. The line break switch is a linear switch that has exceptionally low ON-resistance and an excellent ON-resistance matching characteristic. The ringing access switch has a breakdown voltage rating >480 V which is sufficiently high, with proper protection, to prevent breakdown in the presence of a transient fault condition (i.e., passing the transient on to the ringing generator). Incorporated into the Le75183A and Le75183C is a diode bridge/SCR clamping circuit, current-limiting circuitry, and a thermal shutdown mechanism to provide protection to the SLIC device and subsequent circuitry during fault conditions. This is shown in block diagram as version A/C. Positive and negative lightning is reduced by the current-limiting circuitry and steered to ground via diodes and the integrated SCR. Power cross is also reduced by the current-limiting and thermal shutdown circuits. The Le75183B version provides only an integrated diode bridge along with current limiting and thermal shutdown (see block diagram for version B). This will cause positive faults to be directed to ground and negative faults to battery. In either polarity, faults are reduced by the current-limit and/or thermal shutdown mechanisms. To protect the Le75183 from an overvoltage fault condition, use of a secondary protector is required. The secondary protector must limit the voltage seen at the tip/ring terminals to prevent the breakdown voltage of the switches from being exceeded. To minimize stress on the solid-state contacts, use of a foldback- or crowbar- type secondary protector is recommended. With proper choice of secondary protection, a line card using the Le75183 will meet all relevant ITU-T, LSSGR, FCC, or UL* protection requirements. The Le75183 operates off of a 5 V supply only. This gives the device extremely low idle and active power dissipation and allows use with virtually any range of battery voltage. This makes the Le75183 especially appropriate for remote power applications such as DAML or FOC/FITL or other Telcordia TA 909 applications where power dissipation is particularly critical. A battery voltage is also used by the Le75183, only as a reference for the integrated protection circuit. The Le75183 will enter an all OFF state upon loss of battery. During power ringing, to turn on and maintain the ON state, the ring access switch and ring test switch will draw a nominal 2 mA from the ring generator. The default power up state of Le75183 is in all OFF state, unless otherwise being overwritten by external controls. The Le75183 device is packaged in a 20-pin, plastic SOIC (GULL) (Le75183ADSC/BDSC/CDSC), a 32-pin QFN (Le75183AFQC/BFQC/CFQC), and a 28-pin, plastic SOIC (GULL) (Le75183AFSC/BFSC/CZFSC). The 28-pin package is available to support existing designs. For new designs, it may be advantageous to use the other two smaller size packages. 4 Zarlink Semiconductor Inc.

Page 6

Le75183 Data Sheet2.0 Block Diagrams Figure 1 - Le75183A/C Block Diagram Figure 2 - Le75183B Block Diagram SCR & Trip Circuit Le75183A/C FGND TBAT TLINE TRINGING VDD TSD TTESTin TTESTout DGND VBAT RBAT RLINE RRINGING INTESTin INRING RTESTin RTESTout LATCH INTESTout Control Logic SW1 SW2 SW4SW3 SW6SW5 SW7 SW9 SW10 SW8 Le75183B FGND TBAT TLINE TRINGING VDD TSD TTESTin TTESTout DGND VBAT RBAT RLINE RRINGING INTESTin INRING RTESTin RTESTout LATCH INTESTout Control Logic SW1 SW2 SW4SW3 SW6SW5 SW7 SW9 SW10 SW85 Zarlink Semiconductor Inc.

Page 7

Le75183 Data Sheet3.0 Connection Diagrams 28-Pin SOIC FGND 1 NC 2 NC 3 NC 4 TTESTin 5 TBAT 6 TLINE 7 TRINGING 8 NC 9 TTESTout 10 NC 11 VDD 12 TSD 13 DGND 14 21 22 23 24 25 26 27 28 VBAT NC NC NC RTESTin RBAT RLINE NC 20 RRINGING 19 RTESTout 18 LATCH 17 INTESTin 16 INRING 15 INTESTout 20-Pin SOIC FGND 1 2 3 4 TTESTin 5 TBAT 6 TLINE 7 TRINGING 8 NC 9 TTESTout 10 VDD TSD DGND 13 14 15 16 17 18 19 20 VBAT RTESTin RBAT RLINE 12 RRINGING 11 RTESTout LATCH INTESTin INRING INTESTout 1 32-pin QFN EXPOSED PAD NC RTESTout NC RRINGING NC RLINE NC RBAT 21 20 19 18 17 22 23 24 NC TTESTout NC TBAT NC TLINE NC TRINGING 2 3 4 5 6 7 8 V D DN C T S D L A T C H IN R IN G IN T E S T in D G N D IN T E S T o u t 109 1211 1413 1615 N C N C R T E S T in V B A T N C F G N D T T E S T in N C 32 31 30 29 28 27 26 25 Top View6 Zarlink Semiconductor Inc.

Page 8

Le75183 Data Sheet3.1 Pin Descriptions Pin Name Type Description DGND Ground Digital ground. FGND Ground Fault ground. INRING Input Logic level switch input control. Internally 75 kΩ typical pull up. INTESTIN Input Logic level switch input control. Internally 75 kΩ typical pull down. INTESTOUT Input Logic level switch input control. Internally 75 kΩ typical pull up. LATCH Input Data input control, active-high, transparent low. Internally 75 kΩ typical pull down. NC — No connection. RBAT Input/Output Connect to RING on SLIC side. RLINE Input/Output Connect to RING on line side. RRINGING Input/Output Connect to ringing generator. RTESTin Input/Output Test (in) access on RING. RTESTout Input/Output Test (out) access on RING. TBAT Input/Output Connect to TIP on SLIC side. TLINE Input/Output Connect to TIP on line side. TRINGING Input/Output Connect to return ground for ringing generator. TTESTin Input/Output Test (in) access on TIP. TTESTout Input/Output Test (out) access on TIP. TSD Input/Output Temperature shutdown pin. Can be used as a logic level input or an output. See Tables 12 and 13, Truth Tables, and the Switching Behavior section of this data sheet for input pin description. As an output flag, will read HIGH when the device is in its operational mode and LOW in the thermal shutdown mode. To disable the thermal shutdown mechanism, tie this pin to HIGH (not recommended) VBAT Battery Battery voltage. Used as a reference for protection circuit. VDD Power 5 V supply. EPAD — Exposed pad in QFN package. No internal electrical connection. Not recommended to make any external electrical connection (such as VBAT or ground) to the EPAD. D: Internally 75 kΩ typical pull down. U: Internally 75 kΩ typical pull up.7 Zarlink Semiconductor Inc.

Page 9

Le75183 Data Sheet4.0 Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or above these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability. Note: For LCAS in the QFN package, it is desirable that the exposed pad be soldered to an equally sized exposed copper surface (with no further electrical connection such as VBAT or ground) for mechanical stability. Parameter Min. Max. Unit Operating Temperature Range –40 110 °C Storage Temperature Range –40 150 °C Relative Humidity Range 5 95 % Pin Soldering Temperature (t=10s max) — 260 °C 5 V Power Supply -0.3 7 V Battery Supply — –85 V Logic Input Voltage -0.3 VDD+0.3 V Input-to-output Isolation — 330 V Pole-to-pole Isolation (All except SW6, SW8) — 330 V Pole-to-pole Isolation (Ringing Access Switch, SW8) — 480 V Pole-to-pole Isolation (Ringing Test Switch, SW6) — 260 V ESD Immunity (Human Body Model) JESD22 Class 1C compliant8 Zarlink Semiconductor Inc.

Page 10

Le75183 Data Sheet5.0 Operating Ranges Package Assembly Green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and antimony-free materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly. Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile. 5.1 Environmental Ranges Zarlink guarantees the performance of this device over commercial (0 to 70º C) and industrial (-40 to 85ºC) temperature ranges by conducting electrical characterization over each range and by conducting a production test with single insertion coupled to periodic sampling. These characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE Component Reliability Assurance Requirements for Telecommunications Equipment. 5.2 Electrical Ranges *VBAT is used only as a reference for internal protection circuitry. If VBAT rises above typically –10 V, the device will enter an all OFF state and remain in this state until the battery voltage drops below typically –15 V. *Applied voltage is 100 Vp-p square wave at 100 Hz. 5.3 Handling Precautions Although protection circuitry has been designed into this device, proper precautions should be taken to avoid exposure to electrostatic discharge (ESD) during handling and mounting. Zarlink employs a human-body model (HBM) and a charged-device model (CDM) for ESD-susceptibility testing and protection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used to define the model. No industry-wide standard has been adopted for CDM. However, a standard HBM (resistance = 1500Ω, capacitance = 100 pF) is widely used and therefore can be used for comparison purposes. The HBM ESD threshold presented here was obtained by using these circuit parameters. Ambient Temperature −40° to 85°C Supply Min. Typ. Max. Unit VDD 4.5 5 5.5 V VBAT* –19 — –72 V9 Zarlink Semiconductor Inc.

LE75183ADSCT Guarantees

Service Guarantee

Service Guarantees

We guarantee 100% customer satisfaction.

Our experienced sales team and tech support team back our services to satisfy all our customers.

Quality Guarantee

Quality Guarantees

We provide 90 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.

LE75183ADSCT Related Products

hotLE75183ADSCT 1N4747AUR Microsemi Corporation, DIODE ZENER 20V 1W DO213AB, DO-213AB, MELF, - View
hotLE75183ADSCT SMBJ5934C/TR13 Microsemi Corporation, DIODE ZENER 24V 2W SMBJ, DO-214AA, SMB, - View
hotLE75183ADSCT 1PMT5940CE3/TR7 Microsemi Corporation, DIODE ZENER 43V 3W DO216AA, DO-216AA, - View
hotLE75183ADSCT LE75282BBVCT Microsemi Corporation, IC LINE CARD LCAS 2CH 44TQFP, 44-TQFP, - View
hotLE75183ADSCT LE75183DFSCT Microsemi Corporation, IC LINE CARD LCAS 1CHIPLE 28SOIC, 28-SOIC (0.295", 7.50mm Width), - View
hotLE75183ADSCT LE75183DFQCT Microsemi Corporation, IC LINE CARD LCAS 1CHIPLE 32QFN, 32-VQFN Exposed Pad, - View
hotLE75183ADSCT LE75183CDSCT Microsemi Corporation, IC LINE CARD LCAS 1CHIPLE 20SOIC, 20-SOIC (0.295", 7.50mm Width), - View
hotLE75183ADSCT LE75183DDSCT Microsemi Corporation, IC LINE CARD LCAS 1CHIPLE 20SOIC, 20-SOIC (0.295", 7.50mm Width), - View
hotLE75183ADSCT LE75183DDSC Microsemi Corporation, IC LINE CARD LCAS 1CHIPLE 20SOIC, 20-SOIC (0.295", 7.50mm Width), - View
hotLE75183ADSCT LE75181BBSC Microsemi Corporation, IC LINE CARD LCAS 1CH 16SOIC, 16-SOIC (0.295", 7.50mm Width), - View
hotLE75183ADSCT LE75181ABSC Microsemi Corporation, IC LINE CARD LCAS 1CH 16SOIC, 16-SOIC (0.295", 7.50mm Width), - View
hotLE75183ADSCT LE75282BBVC Microsemi Corporation, IC LINE CARD LCAS 2CH 44TQFP, 44-TQFP, - View

LE75183ADSCT Tags

  • LE75183ADSCT
  • LE75183ADSCT PDF
  • LE75183ADSCT datasheet
  • LE75183ADSCT specification
  • LE75183ADSCT image
  • Microsemi Corporation
  • Microsemi Corporation LE75183ADSCT
  • buy LE75183ADSCT
  • LE75183ADSCT price
  • LE75183ADSCT distributor
  • LE75183ADSCT supplier
  • LE75183ADSCT wholesales

LE75183ADSCT is Available in