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MAX3031ECUE+T

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MAX3031ECUE+T

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Part Number MAX3031ECUE+T
Manufacturer Maxim Integrated
Description IC RS-422 TRANSMIT QUAD 16TSSOP
Datasheet MAX3031ECUE+T Datasheet
Package 16-TSSOP (0.173", 4.40mm Width)
In Stock 1,513 piece(s)
Unit Price $ 1.6279 *
Lead Time Can Ship Immediately
Estimated Delivery Time Aug 14 - Aug 19 (Choose Expedited Shipping)
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Part Number # MAX3031ECUE+T (Interface - Drivers, Receivers, Transceivers) is manufactured by Maxim Integrated and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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MAX3031ECUE+T Specifications

ManufacturerMaxim Integrated
CategoryIntegrated Circuits (ICs) - Interface - Drivers, Receivers, Transceivers
Datasheet MAX3031ECUE+TDatasheet
Package16-TSSOP (0.173", 4.40mm Width)
Series-
TypeDriver
ProtocolRS422, RS485
Number of Drivers/Receivers4/0
Duplex-
Receiver Hysteresis-
Data Rate2Mbps
Voltage - Supply3 V ~ 3.6 V
Operating Temperature0°C ~ 70°C
Mounting TypeSurface Mount
Package / Case16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package16-TSSOP

MAX3031ECUE+T Datasheet

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General Description The MAX3030E–MAX3033E family of quad RS-422 transmitters send digital data transmission signals over twisted-pair balanced lines in accordance with TIA/EIA- 422-B and ITU-T V.11 standards. All transmitter outputs are protected to ±15kV using the Human Body Model. The MAX3030E–MAX3033E are available with either a 2Mbps or 20Mbps guaranteed baud rate. The 2Mbps baud rate transmitters feature slew-rate-limiting to mini- mize EMI and reduce reflections caused by improperly terminated cables. The 20Mbps baud rate transmitters feature low-static current consumption (ICC < 100µA), making them ideal for battery-powered and power-conscious applications. They have a maximum propagation delay of 16ns and a part-to-part skew less than 5ns, making these devices ideal for driving parallel data. The MAX3030E– MAX3033E feature hot-swap capability that eliminates false transitions on the data cable during power-up or hot insertion. The MAX3030E–MAX3033E are low-power, ESD-pro- tected, pin-compatible upgrades to the industry-stan- dard 26LS31 and SN75174. They are available in space-saving 16-pin TSSOP and SO packages. Applications Telecom Backplanes V.11/X.21 Interface Industrial PLCs Motor Control Features  Meet TIA/EIA-422-B (RS-422) and ITU-T V.11 Recommendation  ±15kV ESD Protection on Tx Outputs  Hot-Swap Functionality  Guaranteed 20Mbps Data Rate (MAX3030E, MAX3032E)  Slew-Rate-Controlled 2Mbps Data Rate (MAX3031E, MAX3033E)  Available in 16-Pin TSSOP and Narrow SO Packages  Low-Power Design (<330µW, VCC = 3.3V Static)  +3.3V Operation  Industry-Standard Pinout  Thermal Shutdown M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters ________________________________________________________________ Maxim Integrated Products 1 Ordering Information 19-2671; Rev 0; 10/02 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. PART TEMP RANGE PIN-PACKAGE MAX3030ECSE 0°C to +70°C 16 SO (Narrow) MAX3030ECUE 0°C to +70°C 16 TSSOP MAX3030EESE -40°C to +85°C 16 SO (Narrow) MAX3030EEUE -40°C to +85°C 16 TSSOP MAX3031ECSE 0°C to +70°C 16 SO (Narrow) MAX3031ECUE 0°C to +70°C 16 TSSOP MAX3031EESE -40°C to +85°C 16 SO (Narrow) MAX3031EEUE -40°C to +85°C 16 TSSOP MAX3032ECSE 0°C to +70°C 16 SO (Narrow) MAX3032ECUE 0°C to +70°C 16 TSSOP MAX3032EESE -40°C to +85°C 16 SO (Narrow) MAX3032EEUE -40°C to +85°C 16 TSSOP MAX3033ECSE 0°C to +70°C 16 SO (Narrow) MAX3033ECUE 0°C to +70°C 16 TSSOP MAX3033EESE -40°C to +85°C 16 SO (Narrow) MAX3033EEUE -40°C to +85°C 16 TSSOP 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 DI1 VCC DI4 DO4+ DO4- DO3- DO3+ DI3 TOP VIEW MAX3030E/ MAX3031E TSSOP/SO DO1+ DO1- DO2+ EN DO2- DI2 GND EN 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 DI1 VCC DI4 DO4+ DO4- DO3- DO3+ DI3 MAX3032E/ MAX3033E TSSOP/SO DO1+ DO1- DO2+ EN1&2 DO2- DI2 GND EN3&4 Pin Configurations

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M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS DC ELECTRICAL CHARACTERISTICS (3V ≤ VCC ≤ 3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25°C.) (Note 1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (All Voltages Are Referenced to Device Ground, Unless Otherwise Noted) VCC ........................................................................................+6V EN1&2, EN3&4, EN, EN............................................-0.3V to +6V DI_ ............................................................................-0.3V to +6V DO_+, DO_- (normal condition) .................-0.3V to (VCC + 0.3V) DO_+, DO_- (power-off or three-state condition).....-0.3V to +6V Driver Output Current per Pin.........................................±150mA Continuous Power Dissipation (TA = +70°C) 16-Pin SO (derate 8.70mW/°C above +70°C)..............696mW 16-Pin TSSOP (derate 9.40mW/°C above +70°C) .......755mW Operating Temperature Ranges MAX303_EC_ ......................................................0°C to +70°C MAX303_EE_ ...................................................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10s) .................................+300°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS DRIVER OUTPUT: DO_+, DO_- VOD1 RL = 100Ω, Figure 1 2.0 VOD2 RL = ∞, Figure 1 3.6 Differential Driver Output VOD3 RL = 3.9kΩ (for compliance with V.11), Figure 1 3.6 V Change in Differential Output Voltage ∆VOD RL = 100Ω (Note 2) -0.4 +0.4 V Driver Common-Mode Output Voltage VOC RL = 100Ω, Figure 1 3 V Change in Common-Mode Voltage ∆VOC RL = 100Ω (Note 2) -0.4 +0.4 V Three-State Leakage Current IOZ VOUT = VCC or GND, driver disabled ±10 µA Output Leakage Current IOFF VCC = 0V, VOUT = 3V or 6V 20 µA Driver Output Short-Circuit Current ISC VOUT = 0V, VIN = VCC or GND (Note 3) -150 mA INPUTS: EN, EN, EN1&2, EN3&4 Input High Voltage VIH 2.0 V Input Low Voltage VIL 0.4 V Input Current ILEAK ±2 µA Hot-Swap Driver Input Current IHOTSWAP EN, EN, EN1&2, EN3&4 (Note 4) ±200 µA SUPPLY CURRENT Supply Current ICC No load 100 µA THERMAL PROTECTION Thermal-Shutdown Threshold TSH 160 °C Thermal-Shutdown Hysteresis 10 °C ESD Protection DO_ Human Body Model ±15 kV

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M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters _______________________________________________________________________________________ 3 SWITCHING CHARACTERISTICS—MAX3030E, MAX3032E (3V ≤ VCC ≤ 3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Driver Propagation Delay Low to High tDPLH Driver Propagation Delay High to Low tDPHL RL = 100Ω, CL = 50pF, Figures 2, 3 8 16 ns Differential Transition Time, Low to High tR Differential Transition Time, High to Low tF RL = 100Ω, CL = 50pF (10% to 90%), Figures 2, 3 10 ns Differential Skew (Same Channel) |tDPLH - tDPHL| tSK1 Skew Driver to Driver (Same Device) tSK2 RL = 100Ω, CL = 50pF, VCC = 3.3V ±2 ns Skew Part to Part tSK3 RL = 100Ω, CL = 50pF, VCC = 3.3V, ∆TMAX = +5°C 5 ns Maximum Data Rate 20 Mbps Driver Enable to Output High tDZH S2 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 50 ns Driver Enable to Output Low tDZL S1 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 50 ns Driver Disable Time from Low tDLZ S1 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 50 ns Driver Disable Time from High tDHZ S2 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 50 ns SWITCHING CHARACTERISTICS—MAX3031E, MAX3033E (3V ≤ VCC ≤ 3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Driver Propagation Delay Low to High tDPLH Driver Propagation Delay High to Low tDPHL RL = 100Ω, CL = 50pF, Figures 2, 3 40 70 ns Differential Transition Time, Low to High tR Differential Transition Time, High to Low tF RL = 100Ω, CL = 50pF (10% to 90%), Figures 2, 3 15 50 ns Differential Skew (Same Channel) |tDPLH - tDPHL| tSK1 Skew Driver to Driver (Same Device) tSK2 RL = 100Ω, CL = 50pF, VCC = 3.3V ±10 ns

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M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters 4 _______________________________________________________________________________________ SWITCHING CHARACTERISTICS—MAX3031E, MAX3033E (continued) (3V ≤ VCC ≤ 3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25°C.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Skew Part to Part tSK3 RL = 100Ω, CL = 50pF, VCC = 3.3V, ∆TMAX = +5°C 18 ns Maximum Data Rate 2 Mbps Driver Enable to Output High tDZH S2 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 100 ns Driver Enable to Output Low tDZL S1 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 100 ns Driver Disable Time from Low tDLZ S1 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 150 ns Driver Disable Time from High tDHZ S2 closed, RL = 500Ω, CL = 50pF, Figures 4, 5 150 ns Note 1: All currents into the device are positive; all currents out of the device are negative. All voltages are referenced to device ground, unless otherwise noted. Note 2: ∆VOD and ∆VOC are the changes in VOD and VOC, respectively, when DI changes state. Note 3: Only one output shorted at a time. Note 4: This input current is for the hot-swap enable (EN_, EN, EN) inputs and is present until the first transition only. After the first transition, the input reverts to a standard high-impedance CMOS input with input current ILEAK. DIFFERENTIAL OUTPUT VOLTAGE vs. OUTPUT CURRENT M A X 3 0 3 0 E t o c0 1 OUTPUT CURRENT (mA) D IF FE R EN TI A L O U TP U T V O LT A G E (V ) 906030 1 2 3 4 0 0 120 TA = 0°C TA = +25°C TA = +85°C OUTPUT CURRENT vs. TRANSMITTER OUTPUT LOW VOLTAGE M A X 3 0 3 0 E t o c0 2 OUTPUT LOW VOLTAGE (V) O U TP U T C U R R EN T (m A ) 321 50 100 150 200 0 0 4 OUTPUT CURRENT vs. TRANSMITTER OUTPUT HIGH VOLTAGE M A X 3 0 3 0 E t o c0 3 OUTPUT HIGH VOLTAGE (V) O U TP U T C U R R EN T (m A ) 321 25 50 75 100 125 150 0 0 4 Typical Operating Characteristics (VCC = +3.3V and TA = +25°C, unless otherwise noted.)

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M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters _______________________________________________________________________________________ 5 SUPPLY CURRENT vs. SUPPLY VOLTAGE M A X 3 0 3 0 E t o c0 4 SUPPLY VOLTAGE (V) S U P P LY C U R R EN T (µ A ) 321 20 40 60 80 100 0 0 4 DRIVERS ENABLED TA = +85°C TA = +25°C TA = 0°C MAX3030E/MAX3032E SUPPLY CURRENT vs. DATA RATE M A X 3 0 3 0 E t o c0 5 DATA RATE (bps) S U P P LY C U R R EN T (m A ) 10M1M100k10k1k 5 10 15 20 25 30 0 0.1k 100M NO RESISTIVE LOAD, CL = 200pF, ALL FOUR TRANSMITTERS SWITCHING MAX3031E/MAX3033E SUPPLY CURRENT vs. DATA RATE M A X 3 0 3 0 E t o c0 6 DATA RATE (bps) S U P P LY C U R R EN T (m A ) 1M100k10k1k 0.5 1.0 1.5 2.0 2.5 0 0.1k 10M NO RESISTIVE LOAD, CL = 200pF, ALL FOUR TRANSMITTERS SWITCHING MAX3030E/MAX3032E SUPPLY CURRENT vs. DATA RATE M A X 3 0 3 0 E t o c0 7 DATA RATE (bps) S U P P LY C U R R EN T (m A ) 10M1M100k10k1k 90 100 110 120 130 80 0.1k 100M ALL FOUR TRANSMITTERS LOADED AND SWITCHING RL = 100Ω, CL = 200pF MAX3031E/MAX3033E SUPPLY CURRENT vs. DATA RATE M A X 3 0 3 0 E t o c0 8 DATA RATE (bps) S U P P LY C U R R EN T (m A ) 1M100k10k1k 91 94 97 100 88 0.1k 10M ALL FOUR TRANSMITTERS LOADED AND SWITCHING RL = 100Ω, CL = 200pF MAX3030E DRIVER PROPAGATION DELAY (LOW TO HIGH) MAX3030E toc09 10ns/div DIFFERENTIAL OUTPUT 2V/div DI_ 1V/div MAX3030E DRIVER PROPAGATION DELAY (HIGH TO LOW) MAX3030E toc10 10ns/div DIFFERENTIAL OUTPUT 2V/div DI_ 1V/div MAX3031E DRIVER PROPAGATION DELAY (LOW TO HIGH) MAX3030E toc11 20ns/div DIFFERENTIAL OUTPUT 2V/div DI_ 1V/div MAX3031E DRIVER PROPAGATION DELAY (HIGH TO LOW) MAX3030E toc12 20ns/div DIFFERENTIAL OUTPUT 2V/div DI_ 1V/div Typical Operating Characteristics (continued) (VCC = +3.3V and TA = +25°C, unless otherwise noted.)

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M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters 6 _______________________________________________________________________________________ Pin Description ENABLE RESPONSE TIME MAX3030E toc13 20ns/div ENABLE 1V/div DIFFERENTIAL OUTPUT 2V/div MAX3033E EYE DIAGRAM MAX3030E toc14 100ns/div DO_+ 1V/div DO_- 1V/div Typical Operating Characteristics (continued) (VCC = +3.3V and TA = +25°C, unless otherwise noted.) PIN MAX3030E/ MAX3031E MAX3032E/ MAX3033E NAME FUNCTION 1, 7, 9, 15 1, 7, 9, 15 DI1, DI2, DI3, DI4 Transmitter Inputs. When the corresponding transmitter is enabled, a low on DI_ forces the noninverting output low and inverting output high. Similarly, a high on DI_ forces noninverting output high and inverting output low. 2, 6, 10, 14 2, 6, 10, 14 DO1+, DO2+, DO3+, DO4+ Noninverting RS-422 Outputs 3, 5, 11, 13 3, 5, 11, 13 DO1-, DO2-, DO3-, DO4- Inverting RS-422 Outputs 4 — EN Transmitter Enable Input: Active HIGH. Drive EN HIGH to enable all transmitters. When EN is HIGH, drive EN LOW to disable (three-state) all the transmitters. The transmitter outputs are high impedance when disabled. EN is hot-swap protected (see the Hot Swap section). 8 8 GND Ground 12 — EN Transmitter Enable Input: Active LOW. Drive EN LOW to enable all transmitters. When EN is LOW, drive EN HIGH to disable all the transmitters. The transmitter outputs are high impedance when disabled. EN is hot-swap protected (see the Hot Swap section). — 4 EN1&2 Transmitter Enable Input for Channels 1 and 2. Drive EN1&2 HIGH to enable the corresponding transmitters. Drive EN1&2 LOW to disable the corresponding transmitters. The transmitter outputs are high impedance when disabled. EN1&2 is hot- swap protected (see the Hot Swap section). — 12 EN3&4 Transmitter Enable Input for Channels 3 and 4. Drive EN3&4 HIGH to enable the corresponding transmitters. Drive EN3&4 LOW to disable the corresponding transmitters. The transmitter outputs are high impedance when disabled. EN3&4 is hot- swap protected (see the Hot Swap section). 16 16 VCC Positive Supply; +3V ≤ VCC ≤ +3.6V. Bypass VCC to GND with a 0.1µF capacitor.

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M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters _______________________________________________________________________________________ 7 Test Circuits and Timing Diagrams DI_ VOD RL CL CL CL DO_+ DO_- Figure 2. Differential Driver Propagation Delay and Transition Time Test Circuit VOC VOD DI_+ DI_- RL 2 RL 2 Figure 1. Differential Driver DC Test Circuit OUTPUT UNDER TEST CL RL VCC S1 S2 ENABLE SIGNAL IS ONE OF THE POSSIBLE ENABLE CONFIGURATIONS (SEE TRUTH TABLE). Figure 4. Driver Enable/Disable Delays Test Circuit DI 3V 0V DO_- DO_+ VO 0V -VO VO 1.5V 1.5V tDPLH tDPHL 1/2 VO 10% tR 90% 90% 1/2 VO 10% tF VDIFF = V (DO_+) - V (DO_-) VDIFF tSKEW = |tDPLH - tDPHL| Figure 3. Differential Driver Propagation Delay and Transition Waveform OUTPUT NORMALLY LOW OUTPUT NORMALLY HIGH 3V 0V VOL 0V 1.5V 1.5V 1.5V 1.5V EN VOH tDZL tDZH tDLZ tDHZ VOL + 0.3V VOH - 0.3V ENABLE SIGNAL IS ONE OF THE POSSIBLE ENABLE CONFIGURATIONS (SEE TRUTH TABLE). Figure 5. Driver Enable/Disable Waveform DI VCC GND A A DO_- DO_+ Figure 6. Short-Circuit Measurements

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M A X 3 0 3 0 E – M A X 3 0 3 3 E Detailed Description The MAX3030E–MAX3033E are high-speed quad RS- 422 transmitters designed for digital data transmission over balanced lines. They are designed to meet the requirements of TIA/EIA-422-B and ITU-T V.11. The MAX3030E–MAX3033E are available in two pinouts to be compatible with both the 26LS31 and SN75174 industry-standard devices. Both are offered in 20Mbps and 2Mbps baud rate. All versions feature a low-static current consumption (ICC < 100µA) that makes them ideal for battery-powered and power-conscious appli- cations. The 20Mbps version has a maximum propaga- tion delay of 16ns and a part-to-part skew less than 5ns, allowing these devices to drive parallel data. The 2Mbps version is slew-rate-limited to reduce EMI and reduce reflections caused by improperly terminated cables. Outputs have enhanced ESD protection providing ±15kV tolerance. All parts feature hot-swap capability that eliminates false transitions on the data cable dur- ing power-up or hot insertion. ±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro- static discharges encountered during handling and assembly. The driver outputs and receiver inputs have extra protection against static electricity. Maxim’s engi- neers developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation and power-down. After an ESD event, the MAX3030E–MAX3033E keep working without latchup. ESD protection can be tested in various ways; the transmitter outputs of this product family are character- ized for protection to ±15kV using the Human Body Model. Other ESD test methodologies include IEC10004-2 Contact Discharge and IEC1000-4-2 Air- Gap Discharge (formerly IEC801-2). ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. Human Body Model Figure 8 shows the Human Body Model, and Figure 9 shows the current waveform it generates when dis- charged into low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5kΩ resistor. ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters 8 _______________________________________________________________________________________ DI VCC GND A A DO_- DO_+ Figure 7. Power-Off Measurements Test Circuits and Timing Diagrams (continued) CHARGE-CURRENT- LIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 100pF RC 1MΩ RD 1.5kΩ HIGH- VOLTAGE DC SOURCE DEVICE UNDER TEST Figure 8. Human Body ESD Test Model IP 100% 90% 36.8% tRL TIME tDL CURRENT WAVEFORM PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) Ir 10% 0 0 AMPS Figure 9. Human Body Current Waveform

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Machine Model The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis- tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec- tion during manufacturing, not just inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports. Hot Swap When circuit boards are plugged into a “hot” back- plane, there can be disturbances to the differential sig- nal levels that could be detected by receivers connected to the transmission line. This erroneous data could cause data errors to an RS-422 system. To avoid this, the MAX3030E–MAX3033E have hot-swap capa- ble inputs. When a circuit board is plugged into a “hot” backplane, there is an interval during which the processor is going through its power-up sequence. During this time, the processor’s output drivers are high impedance and are unable to drive the enable inputs of the MAX3030E– MAX3033E (EN, EN, EN_) to defined logic levels. Leakage currents from these high-impedance drivers, of as much as 10µA, could cause the enable inputs of the MAX3030E–MAX3033E to drift high or low. Additionally, parasitic capacitance of the circuit board could cause capacitive coupling of the enable inputs to either GND or VCC. These factors could cause the enable inputs of the MAX3030E–MAX3033E to drift to levels that may enable the transmitter outputs. To avoid this problem, the hot-swap input provides a method of holding the enable inputs of the MAX3030E–MAX3033E in the disabled state as VCC ramps up. This hot-swap input is able to overcome the leakage currents and par- asitic capacitances that can pull the enable inputs to the enabled state. Hot-Swap Input Circuitry In the MAX3030E–MAX3033E, the enable inputs feature hot-swap capability. At the input there are two NMOS devices, M1 and M2 (Figure 10). When VCC is ramping up from zero, an internal 6µs timer turns on M2 and sets the SR latch, which also turns on M1. Transistors M2, a 2mA current sink, and M1, a 100µA current sink, pull EN to GND through a 5.6kΩ resistor. M2 is designed to pull the EN input to the disabled state against an external parasitic capacitance of up to 100pF that is trying to enable the EN input. After 6µs, the timer turns M2 off and M1 remains on, holding the EN input low against three- state output leakages that might enable EN. M1 remains on until an external source overcomes the required input current. At this time the SR latch resets and M1 turns off. When M1 turns off, EN reverts to a standard, high- impedance CMOS input. Whenever VCC drops below 1V, the hot-swap input is reset. The EN1&2 and EN3&4 input structures are identical to the EN input. For the EN input, there is a complementary circuit employing two PMOS devices pulling the EN input to VCC. Hot-Swap Line Transient The circuit of Figure 11 shows a typical offset termina- tion used to guarantee a greater than 200mV offset when a line is not driven. The 50pF capacitor repre- M A X 3 0 3 0 E – M A X 3 0 3 3 E ±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters _______________________________________________________________________________________ 9 EN DE (HOT SWAP) 5.6kΩ TIMER TIMER VCC 6µs M2M1 2mA100µA Figure 10. Simplified Structure of the Driver Enable Pin (EN) VCC DI_ (VCC OR GND) 3.3V DO_+ DO_- 50pF0.1kΩ 1kΩ 1kΩ Figure 11. Differential Power-Up Glitch (Hot Swap)

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MAX3031ECUE+T

Certified Quality

Heisener's commitment to quality has shaped our processes for sourcing, testing, shipping, and every step in between. This foundation underlies each component we sell.

ISO9001:2015, ICAS, IAF, UKAS

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