MAX3209EEUU

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General Description The MAX3209E is a complete, dual DTE RS-232 serial port (6 transmitters, 10 receivers) for motherboards and desktop PCs that ensures compliance with the stringent ESD requirements of the European Community. The device minimizes board space and power consumption by eliminating the need for a negative power supply; it integrates two serial ports and a charge pump into a sin- gle 38-pin TSSOP package. The MAX3209E features a 50µA low-power standby mode for compliance with system power-management requirements. During standby, while the device oper- ates from the single +3V to +5.5V logic supply, one receiver on each port remains active, allowing automatic system wake-up when peripheral communications resume. All transmitter outputs and receiver inputs are protected to ±15kV using IEC 1000-4-2 Air-Gap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge, and ±15kV using the Human Body Model, making the device ideal for use in harsh environments or mission-critical equip- ment. In addition, the MAX3209E withstands ±4kV per IEC 1000-4-4 Electrical Fast Transient/Burst Stressing. As a result of its robust charge-pump structure, the MAX3209E guarantees mouse driveability and true RS- 232 operation at data rates up to 460kbps, ensuring compatibility with PC-to-PC communication software (such as LapLink™). ________________________Applications Desktop PCs Motherboards Instruments Equipment Requiring IEC 1000-4-2 Compliance Telecommunications Network Servers Features  Two Complete Serial Ports in a Single 38-Pin TSSOP Package  Requires Only +12V Supply and Logic Supply (+3V to +5.5V)  No Negative Supply Required  One Receiver Active per Port in Standby for System Wake-Up  460kbps Data Rate; LapLink Compatible  Enhanced ESD Protection ±15kV—Human Body Model ±8kV—IEC 1000-4-2, Contact Discharge ±15kV—IEC 1000-4-2, Air-Gap Discharge  ±4kV Fast Transient Burst Immunity per IEC 1000-4-4  Low 50µA Standby Current  Operates with Either +3V or +5V Logic  Guaranteed Mouse Driveability  Small 0.1µF Capacitors  Flow-Through Pinout M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops ________________________________________________________________ Maxim Integrated Products 1 19-1471; Rev 5; 9/02 Ordering Information Typical Operating Circuit appears at end of data sheet. Pin Configurations continued at end of data sheet. LapLink is a trademark of Traveling Software. 40 36373839 18 21 23 22 24 25 19 2016 17 6 5 4 3 2 1 7 8 9 10 11 12 13 14 15 26 27 28 29 30 3132333435 N.C. R 7O U T R 1O U T MAX3209E 6 X 6 QFN TOP VIEW R 2O U T R 3O U T R 4O U T R 5O U T R 5I N R 4I N R 3I N R 2I N R 1I N R 6O U T R 9O U T R 8O U T R 10 IN R 10 O U T R 8I N R 9I N R 6I N R 7I N T3OUT T2OUT T1OUT V- C- GND T4OUT T5OUT T6OUT N.C. T6IN T5IN T4IN C+ VDD VSTBY T1IN T2IN T3IN Pin Configurations For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. PART TEMP RANGE PIN-PACKAGE 38 TSSOP0°C to +70°CMAX3209ECUU MAX3209EEUU MAX3209EEGL -40°C to +85°C -40°C to +85°C 38 TSSOP 6 ✕ 6 40 QFN

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M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VDD = +10.8V to +13.2V, VSTBY = +3V to +5.5V, C1 = C2 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C, VDD = +12V, VSTBY = +3.3V.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VDD.........................................................................-0.3V to +15V VSTBY....................................................................... -0.3V to +7V V- ........................................................................... +0.3V to -15V Input Voltages T_IN ......................................................................-0.3V to +7V R_IN .................................................................................±30V Output Voltages T_OUT..............................................................................±15V R_OUT.................................................-0.3V to (VSTBY + 0.3V) Short-Circuit Duration T_OUT (one at a time) ............................................Continuous R_OUT (one at a time)............................................Continuous Continuous Power Dissipation (TA = +70°C) TSSOP (derate 11.8mW/°C above +70°C) ..................941mW QFN 6 ✕ 6mm (derate 23.2mW/°C above +70°C)......1860mW Operating Temperature Ranges MAX3209EC_ _ ...................................................0°C to +70°C MAX3209EE_ _ ................................................-40°C to +85°C Storage Temperature Range ............................-65°C to +150°C Lead Temperature (soldering, 10s) ................................+300°C TA = +25°C VDD = VSTBY = 0, VOUT = ±2V VT_OUT = 0 Transmitter input at GND T_IN, VSTBY = +3V to +5.25V All transmitter outputs loaded with 3kΩ to GND T_IN VDD = +12V, no load, all transmitter inputs at VSTBY, all receiver inputs at VSTBY or uncon- nected R_OUT CONDITIONS V2.4RS-232 Input Threshold High V0.4RS-232 Input Threshold Low V-25 25Receiver Input Voltage Range Ω300Transmitter Output Resistance mA±10 ±60 RS-232 Output Short-Circuit Current VOutput Voltage Swing ±5.0 V VSTBY - 0.3 VOHROutput Voltage High 10.8 13.2VDD µA25Input Pull-Up Current V2.1VIHTInput Logic Threshold High V0.4VILTInput Logic Threshold Low 3 5.5STBY 0.5 1IDD mA Supply Current UNITSMIN TYP MAXSYMBOLPARAMETER VSTBY = 3.3V V0.2 1RS-232 Input Hysteresis TA = +25°C kΩ3 5 7RS-232 Input Resistance TA = +25°C Operating Voltage Range V VDD = 0, VSTBY = +3.3V, no load, all transmit- ter inputs at VSTBY, all receiver inputs at VSTBY or unconnected 50 100ISTBY µA R_OUT; ISINK = 1.6mA V0.4VOLROutput Voltage Low VDD = 0, VSTBY = 5V µA0.05 ±5 Receiver Output Leakage Current VSTBY - 0.6 ISOURCE = 40µA ISOURCE = 1mA RS-232 RECEIVER INPUTS RS-232 TRANSMITTER OUTPUTS TRANSMITTER LOGIC INPUTS DC CHARACTERISTICS RECEIVER LOGIC OUTPUTS

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M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops _______________________________________________________________________________________ 3 ELECTRICAL CHARACTERISTICS (continued) (VDD = +10.8V to +13.2V, VSTBY = +3V to +5.5V, C1 = C2 = 0.1µF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C, VDD = +12V, VSTBY = +3.3V.) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS ESD/BURST CHARACTERISTICS Human Body Model ±15 IEC 1000-4-2 (Contact Discharge) ±8ESD Protection IEC 1000-4-2 (Air-Gap Discharge) ±15 kV Electrical Fast Transient/Burst Immunity IEC 1000-4-4 ±4 kV TRANSMITTER TIMING CHARACTERISTICS (Figure 1) Data Rate DR RL = 3kΩ to 7kΩ, CL = 50pF to 1000pF, two transmitters switching 460 kbps Mouse Driveability T1IN = T2IN = GND, T3IN = VCC, T3OUT loaded with 3kΩ to GND, T1OUT and T2OUT loaded with 2.5mA each +6 -5 V Transmitter Output Propagation Delay, Low to High tPLHT CL = 1000pF 1 µs Transmitter Output Propagation Delay, High to Low tPHLT CL = 1000pF 1 µs RL = 3kΩ to 7kΩ, VSTBY = 3.3V, CL = 50pF to 470pF, TA = +25°C, measured from +3V to -3V or -3V to +3V 6 12 30 Transmitter Output Slew Rate SR RL = 3kΩ to 7kΩ, VSTBY = 3.3V, CL = 50pF to 1000pF, TA = +25°C, measured from +3V to -3V or -3V to +3V 4 12 30 V/µs RECEIVER TIMING CHARACTERISTICS Receiver Output Propagation Delay, Low to High tPLHR CL = 150pF 0.4 1 µs Receiver Output Propagation Delay, High to Low tPHLR CL = 150pF 0.4 1 µs

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M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops 4 _______________________________________________________________________________________ 0 0.1 0.2 0.3 0.4 0.5 0.6 0 21 3 4 5 6 7 8 9 RECEIVER OUTPUT LOW VOLTAGE vs. SINK CURRENT M A X 3 2 0 9 E -0 3 ISINK (mA) R EC EI V ER O U TP U T LO W V O LT A G E (V ) 0 1.5 1.0 0.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 105 15 20 25 30 RECEIVER OUTPUT HIGH VOLTAGE vs. SOURCE CURRENT M A X 3 2 0 9 E -0 4 ISOURCE (mA) R EC EI V ER O U TP U T H IG H V O LT A G E (V ) 0 15 10 5 20 25 30 0 20001000 3000 4000 5000 SUPPLY CURRENT vs. LOAD CAPACITANCE M A X 3 2 0 9 E -0 2 LOAD CAPACITANCE (pF) S U P P LY C U R R EN T (m A ) 120kbps 240kbps 460kbps 2 TRANSMITTERS AT DATA RATE 4 TRANSMITTERS AT 1/16 DATA RATE 3kΩ + CL 5 15 10 25 20 30 35 10.8 12.011.4 12.6 13.2 SUPPLY CURRENT vs. SUPPLY VOLTAGE M A X 3 2 0 9 E -0 1 SUPPLY VOLTAGE (V) S U P P LY C U R R EN T (m A ) 460kbps 240kbps 120kbps C1 = C2 = 0.1µF 2 TRANSMITTERS AT DATA RATE 4 TRANSMITTERS AT 1/16 DATA RATE ALL TRANSMITTERS AT 3kΩ + 1000pF Typical Operating Characteristics (VSTBY = +5V, VDD = +12V, C1 = C2 = 0.1µF, TA = +25°C, unless otherwise noted.)

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Detailed Description ±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro- static discharges (ESD) encountered during handling and assembly. The MAX3209E driver outputs and receiver inputs have extra protection against static electricity found in normal operation. Maxim’s engi- neers developed state-of-the-art structures to protect these pins against ±15kV ESD, without damage. After an ESD event, the MAX3209E continues working without latchup. ESD protection can be tested in several ways. The transmitter outputs and receiver inputs are character- ized for protection to the following: 1) ±15kV using the Human Body Model 2) ±8kV using the Contact-Discharge Method specified in IEC 1000-4-2 (formerly IEC 801-2) 3) ±15kV using the Air-Gap Method specified in IEC 1000-4-2 (formerly IEC 801-2) ESD Test Conditions ESD performance depends on a number of conditions. Contact Maxim for a reliability report that documents test setup, methodology, and results. Human Body Model Figure 2a shows the Human Body Model, and Figure 2b shows the current waveform it generates when dis- charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter- est, which is then discharged into the device through a 1.5kΩ resistor. IEC 1000-4-2 Since January 1996, all equipment manufactured and/or sold in the European community has been required to meet the stringent IEC 1000-4-2 specifica- tion. The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAX3209E helps you design equipment that meets Level 4 (the highest level) of IEC 1000-4-2, without additional ESD- protection components. The main difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2. Because series resistance is lower in the IEC 1000-4-2 ESD test model (Figure 3a), the ESD withstand voltage measured to this standard is gen- erally lower than that measured using the Human Body Model. Figure 3b shows the current waveform for the ±8kV IEC 1000-4-2 Level 4 ESD Contact-Discharge test. The Air-Gap test involves approaching the device with a charge probe. The Contact-Discharge method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD testing uses a 200pF stor- age capacitor and zero-discharge resistance. It mimics the stress caused by handling during manufacturing and assembly. Of course, all pins (not just RS-232 M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops _______________________________________________________________________________________ 5 Pin Description PIN TSSOP QFN NAME FUNCTION 1–5, 15–19 11–15, 36–40 R_OUT TTL/CMOS Receiver Outputs 6, 7, 8, 12, 13, 14 1, 2, 3, 7, 8, 9 T_IN TTL/CMOS Transmitter Inputs 9 4 VSTBY Standby Power Supply for R5 and R10 10 5 VDD +12V Single-Supply Voltage 11 6 C+ Positive Terminal of the Inverting Charge-Pump Capacitor 20–24, 34–38 16–20, 31–35 R_IN RS-232 Receiver Inputs 25, 26, 27, 31, 32, 33 22, 24, 28, 30 T_OUT RS-232 Transmitter Outputs 28 25 GND Ground (for QFN package, connect the exposed pad and corner tabs to GND) 29 26 C- Negative Terminal of the Inverting Charge-Pump Capacitor 30 27 V- -12V Generated by the Inverting Charge Pump — 10, 21 N.C. No Connection. Not internally connected.

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M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops 6 _______________________________________________________________________________________ inputs and outputs) require this protection during man- ufacturing. Therefore, the Machine Model is less rele- vant to the I/O ports than are the Human Body Model and IEC 1000-4-2. ±4kV Electrical Fast Transient/Burst Testing (IEC 1000-4-4) IEC 1000-4-4 Electrical Fast Transient/Burst (EFT/B) is an immunity test for the evaluation of electrical and electronic systems during operating conditions. The test was adapted for evaluation of integrated circuits with power applied. Repetitive fast transients with severe pulsed EMI were applied to signal and control ports. Over 15,000 distinct discharges per minute are sent to each interface port of the IC or equipment under test (EUT) simultaneously with a minimum test duration time of one minute. This simulates stress due to dis- placement current from electrical transients on AC mains, or other telecommunication lines in close prox- imity. Short rise times and very specific repetition rates are essential to the validity of the test. Stress placed on the EUT is severe. In addition to the controlled individual discharges placed on the EUT, extraneous noise and ringing on the transmission line can multiply the number of discharges as well as increase the magnitude of each discharge. All cabling was left unterminated to simulate worst case reflections. The MAX3209E was set up as specified in IEC 1000-4-4 and the Typical Operating Circuit of this data sheet. The amplitude, pulse rise time, pulse duration, pulse repetition period, burst duration, and burst period (Figure 5) of the burst generator were all verified with a tF2 tF1 tPHL tPLH tR1 tR2 1.5V 3.0V 0 0 DRIVER INPUT VOUT VOH VOL 3.3V 3.0V -3.0V -3.3V RL CL SIGNAL GENERATOR Figure 1. Slew-Rate Test Circuit and Timing Diagram CHARGE-CURRENT LIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 100pF RC 1MΩ RD 1500Ω HIGH- VOLTAGE DC SOURCE DEVICE UNDER TEST IP 100% 90% 36.8% tRL TIME tDL CURRENT WAVEFORM PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE) Ir 10% 0 0 AMPERES CHARGE-CURRENT LIMIT RESISTOR DISCHARGE RESISTANCE STORAGE CAPACITOR Cs 150pF RC 50MΩ to 100MΩ RD 330Ω HIGH- VOLTAGE DC SOURCE DEVICE UNDER TEST Figure 3a. IEC 1000-4-2 ESD Test Model Figure 2b. Human Body Model Current Waveform Figure 2a. Human Body ESD Test Model

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M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops _______________________________________________________________________________________ 7 digital oscilloscope according to the specifications in IEC 1000-4-4 sec. 6.1.1 and 6.1.2. A simplified diagram of the EFT/B generator is shown in Figure 4. The burst stresses were applied to R1IN–R10IN and T1OUT– T6OUT simultaneously. IEC 1000-4-4 provides several levels of test severity (see Table 1). The MAX3209E passes the 4000V stress, a special category “X” the beyond the highest level for severe (transient) industrial environments for telecom- munication lines. The stresses are applied while the MAX3209E is pow- ered up. Test results are reported as: 1) Normal performance within the specification limits. 2) Temporary degradation or loss of function or perfor- mance which is self-recoverable. 3) Temporary degradation, loss of function or perfor- mance requiring operator intervention, such as sys- tem reset. 4) Degradation or loss of function not recoverable due to damage. The MAX3209E meets classification 2 listed above. Additionally, the MAX3209E will not latchup during the IEC burst stress events. Applications Information R5 and R10 Active in Standby Mode The MAX3209E is placed in standby mode when VDD is not present, provided that VSTBY remains at +3V to +5.5V. In standby mode, receivers R5 and R10 remain active, consuming 100µA max while unloaded. Standby mode allows activity to be sensed on the serial ports so that main power can be restored by the power-man- agement unit, as shown in Figure 6. Layout Considerations Use proper layout to ensure other devices on your board are not damaged in an ESD strike. Currents as high as 60A can instantaneously pass into ground, so be sure to minimize the ground-lead return path to the power supply. A separate return path to the power sup- ply is recommend. Trace widths should be greater than 40 mils. Bypass VDD and VSTBY with 0.1µF capacitors as close to the part as possible to ensure maximum ESD protection. The MAX3209E is not sensitive to power-supply sequencing, and therefore requires no external protec- tion diodes. Interconnection with 3V and 5V Logic The MAX3209E can directly interface with various 3V and 5V logic families, including ACT and HCT CMOS. See Table 2 for more information on possible combina- tions of interconnections. Mouse Driveability The MAX3209E has been specifically designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manufacturers such as Microsoft and Logitech. The MAX3209E successfully drove all serial mice tested and met their respective current and volt- age requirements. tR = 0.7ns to 1ns 30ns 60ns t 100% 90% 10% I P EA K I Figure 3b. IEC 1000-4-2 ESD-Generator Current Waveform COAXIAL OUTPUT CGRM RS SPARK-GAP CD RC U U = HIGH-VOLTAGE SOURCE RC = CHARGING RESISTOR CG = ENERGY STORAGE CAPACITOR RS = PULSE-DURATION SHAPING RESISTOR RM = IMPEDANCE MATCHING RESISTOR CD = DC BLOCKING CAPACITOR Figure 4. Simplified circuit diagram of a fast transient/burst generator

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M A X 3 2 0 9 E Chip Information TRANSISTOR COUNT: 774 ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops 8 _______________________________________________________________________________________ ON I/O, SIGNAL, DATA, AND CONTROL PORTS EFT LEVEL PEAK VOLTAGE REPITITION RATE (kHz) INDUSTRIAL ELECTROMAGNETIC ENVIRONMENT 1 250 5 Well protected 2 500 5 Protected 3 1000 5 Typical 4 2000 5 Severe X 4000 5 MAX3209E Table 1. Test Severity Levels for Communication Lines SYSTEM POWER- SUPPLY VOLTAGE (V) VSTBY SUPPLY VOLTAGE (V) COMPATIBILITY 3.3 3.3 Compatible with all CMOS families. 5 5 Compatible with all TTL and CMOS fami- lies. 5 3.3 Compatible with ACT and HCT CMOS, and with AC, HC, or CD4000 CMOS. Table 2. Logic Family Compatibility with Various Supply Voltages Figure 6. MAX3209E in Standby Mode POWER-MANAGEMENT UNIT VSTBY VDD GND R5 R10 R_ T_ ALL OTHER RECEIVERS INACTIVE ALL TRANSMITTERS INACTIVE +12V SUPER I/O MAX3209E IMPULSION PULSE BURST 15ms U U BURST DURATION BURST PERIOD 300ms Figure 5. General Graph of a Fast Transient Burst

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M A X 3 2 0 9 E ±15kV ESD-Protected, 12V, Dual RS-232 Serial Port with Low-Power Standby for Motherboards/Desktops _______________________________________________________________________________________ 9 RS-232 INTERCONNECTING CABLE T1 T2 T3 T4 T5 R1 R2 T3 T4 T5 R3 R4 R5 R8 R9 R10 R2 R1 R3 T1 T2 TTL/CMOS LOGIC I/O TTL/CMOS LOGIC I/O MOUSE V+ GND VSS GND C1+ C1- V- 0.1µF C1 0.1µF 0.1µF C2 V+ V- TX T6 R6 -12V 0.1µF0.1µF0.1µF +5V VSTBY VDD MAX3186MAX3209E VCC VDD +12V +5V +12V 0.1µF R7 Typical Operating Circuit 37 36 35 34 33 32 31 30 29 28 27 26 25 24 2 3 4 5 6 7 8 9 10 11 12 13 14 15 R4IN R3IN R2IN R1IN T3OUT T2OUT R6IN T1OUT V- C- GND T4OUT T5OUT T6OUT R6OUT T6IN T5IN T4IN C+ VDD VSTBY T1IN T2IN T3IN R1OUT R2OUT R3OUT R4OUT 381 R5INR5OUT TSSOP TOP VIEW MAX3209E 23 22 21 20 16 17 18 19 R10IN R7IN R8IN R9IN R10OUT R9OUT R8OUT R7OUT Pin Configurations (continued)