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MC10H117FN

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MC10H117FN

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Part Number MC10H117FN
Manufacturer ON Semiconductor
Description IC 2-3INPUT OR/AND DUAL 20PLCC
Datasheet MC10H117FN Datasheet
Package 20-LCC (J-Lead)
In Stock 1,353 piece(s)
Unit Price Request a Quote
Lead Time Can Ship Immediately
Estimated Delivery Time Jun 2 - Jun 7 (Choose Expedited Shipping)
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Part Number # MC10H117FN (Logic - Gates and Inverters - Multi-Function, Configurable) is manufactured by ON Semiconductor and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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MC10H117FN Specifications

ManufacturerON Semiconductor
CategoryIntegrated Circuits (ICs) - Logic - Gates and Inverters - Multi-Function, Configurable
Datasheet MC10H117FNDatasheet
Package20-LCC (J-Lead)
Series10H
Logic TypeAND/OR/INVERT Gate
Number of Circuits2
Number of Inputs8 Input (2, 2, 2, 2)
Schmitt Trigger InputNo
Output TypeDifferential
Current - Output High, Low-
Voltage - Supply-
Operating Temperature0°C ~ 75°C
Mounting TypeSurface Mount
Package / Case20-LCC (J-Lead)
Supplier Device Package20-PLCC (9x9)

MC10H117FN Datasheet

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© Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 1 Publication Order Number: MC10H117/D MC10H117 Dual 2−Wide 2−3−Input OR−AND/OR−AND Gate Description The MC10H117 dua l 2−wide 2−3−i npu t OR−AND/ OR−AND−Invert gate is a general purpose logic element designed for use in data control, such as digital multiplexing or data distribution. Pin 9 is common to both gates. This MECL 10H™ part is a functional/pinout duplication of the standard MECL 10K™ family part, with 100% improvement in propagation delay, and no increase in power−supply current. Features • Propagation Delay, 1.0 ns Typical • Power Dissipation 100 mW/Gate Typical (same as MECL 10K) • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K Compatible • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. CDIP−16 L SUFFIX CASE 620A MARKING DIAGRAMS* PDIP−16 P SUFFIX CASE 648 http://onsemi.com *For additional marking information, refer to Application Note AND8002/D. See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. ORDERING INFORMATION SOEIAJ−16 CASE 966 16 1 16 1 MC10H117P AWLYYWWG 1 16 MC10H117L AWLYYWW A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = Pb−Free Package 10H117 ALYWG PLLC−20 FN SUFFIX CASE 775 20 1 10H117G AWLYYWW 1 20

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MC10H117 http://onsemi.com 2 Figure 1. Logic Diagram Figure 2. Pin Assignment VCC1 AOUT AOUT A1IN A1IN A2IN A2IN VEE VCC2 BOUT BOUT B1IN B1IN B2IN B2IN A2IN, B2IN 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 12 13 11 10 9 7 6 5 4 3 2 14 15 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8 Pin assignment is for Dual−in−Line Package. Table 1. MAXIMUM RATINGS Symbol Characteristic Rating Unit VEE Power Supply (VCC = 0) −8.0 to 0 Vdc VI Input Voltage (VCC = 0) 0 to VEE Vdc Iout Output Current Continuous Surge 50 100 mA TA Operating Temperature Range 0 to +75 °C Tstg Storage Temperature Range Plastic Ceramic −55 to +150 −55 to +165 °C °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1) 0° 25° 75° Symbol Characteristic Min Max Min Max Min Max Unit IE Power Supply Current 29 26 29 mA IinH Input Current High Pins 4, 5, 12, 13 Pins 6, 7, 10, 11 Pin 9 465 545 710 275 320 415 275 320 415 A IinL Input Current Low 0.5 0.5 0.3 A VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc 1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained. Outputs are terminated through a 50  resistor to −2.0 V.

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MC10H117 http://onsemi.com 3 Table 3. AC CHARACTERISTICS 0° 25° 75° Symbol Characteristic Min Max Min Max Min Max Unit tpd Propagation Delay 0.45 1.35 0.45 1.35 0.5 1.5 ns tr Rise Time 0.5 1.5 0.5 1.6 0.5 1.7 ns tf Fall Time 0.5 1.5 0.5 1.6 0.5 1.7 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. ORDERING INFORMATION Device Package Shipping† MC10H117FN PLLC−20 46 Units / Rail MC10H117FNG PLLC−20 (Pb−Free) 46 Units / Rail MC10H117FNR2 PLLC−20 500 / Tape & Reel MC10H117FNR2G PLLC−20 (Pb−Free) 500 / Tape & Reel MC10H117L CDIP−16 25 Unit / Rail MC10H117M SOEIAJ−16 50 Unit / Rail MC10H117MG SOEIAJ−16 (Pb−Free) 50 Unit / Rail MC10H117MEL SOEIAJ−16 2000 / Tape & Reel MC10H117MELG SOEIAJ−16 (Pb−Free) 2000 / Tape & Reel MC10H117P PDIP−16 25 Unit / Rail MC10H117PG PDIP−16 (Pb−Free) 25 Unit / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

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MC10H117 http://onsemi.com 4 PACKAGE DIMENSIONS −M− −N− −L− Y BRK W V D D SL−MM0.007 (0.180) N ST SL−MM0.007 (0.180) N ST SL−MS0.010 (0.250) N STX G1 B U Z VIEW D−D 20 1 SL−MM0.007 (0.180) N ST SL−MM0.007 (0.180) N ST SL−MS0.010 (0.250) N ST C G VIEW S E J R Z A 0.004 (0.100) −T− SEATING PLANE SL−MM0.007 (0.180) N ST SL−MM0.007 (0.180) N ST H VIEW S K K1 F G1 20 LEAD PLLC CASE 775−02 ISSUE E NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. DIMENSIONS IN INCHES. 3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM −T−, SEATING PLANE. 5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.385 0.395 9.78 10.03 B 0.385 0.395 9.78 10.03 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC H 0.026 0.032 0.66 0.81 J 0.020 −−− 0.51 −−− K 0.025 −−− 0.64 −−− R 0.350 0.356 8.89 9.04 U 0.350 0.356 8.89 9.04 V 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 X 0.042 0.056 1.07 1.42 Y −−− 0.020 −−− 0.50 Z 2 10 2 10 G1 0.310 0.330 7.88 8.38 K1 0.040 −−− 1.02 −−−    

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MC10H117 http://onsemi.com 5 PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE A HE A1 DIM MIN MAX MIN MAX INCHES −−− 2.05 −−− 0.081 MILLIMETERS 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.10 0.20 0.007 0.011 9.90 10.50 0.390 0.413 5.10 5.45 0.201 0.215 1.27 BSC 0.050 BSC 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 −−− 0.78 −−− 0.031 A1 HE Q1 LE  10  0  10  LE Q1  NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). M L DETAIL P VIEW P c A b e M0.13 (0.005) 0.10 (0.004) 1 16 9 8 D Z E A b c D E e L M Z CDIP−16 L SUFFIX CERAMIC DIP PACKAGE CASE 620A−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5 THIS DRAWING REPLACES OBSOLETE CASE OUTLINE 620−10. F E N K C SEATING PLANE AM0.25 (0.010) T M L DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.750 0.785 19.05 19.93 B 0.240 0.295 6.10 7.49 C −−− 0.200 −−− 5.08 D 0.015 0.020 0.39 0.50 E 0.050 BSC 1.27 BSC F 0.055 0.065 1.40 1.65 G 0.100 BSC 2.54 BSC H 0.008 0.015 0.21 0.38 K 0.125 0.170 3.18 4.31 L 0.300 BSC 7.62 BSC M 0 15 0 15 N 0.020 0.040 0.51 1.01     A B A B 16 1 9 8 G 16X D BM0.25 (0.010) T T 16X J

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