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MC7448THX1267ND

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MC7448THX1267ND

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Part Number MC7448THX1267ND
Manufacturer NXP
Description IC MPU MPC74XX 1.267GHZ 360BGA
Datasheet MC7448THX1267ND Datasheet
Package 360-BCBGA, FCCBGA
In Stock 259 piece(s)
Unit Price $ 577.9814 *
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MC7448THX1267ND Specifications

ManufacturerNXP
CategoryIntegrated Circuits (ICs) - Embedded - Microprocessors
Datasheet MC7448THX1267ND Datasheet
Package360-BCBGA, FCCBGA
SeriesMPC74xx
Core ProcessorPowerPC G4
Number of Cores/Bus Width1 Core, 32-Bit
Speed1.267GHz
Co-Processors/DSPMultimedia; SIMD
Graphics AccelerationNo
Voltage - I/O1.5V, 1.8V, 2.5V
Operating Temperature-40°C ~ 105°C (TA)
Package / Case360-BCBGA, FCCBGA
Supplier Device Package360-FCCBGA (25x25)

MC7448THX1267ND Datasheet

Page 1

Page 2

© Freescale Semiconductor, Inc., 2007. All rights reserved. Freescale Semiconductor Technical Data This document describes part-number-specific changes to recommended operating conditions and revised electrical specifications, as applicable, from those described in the general MPC7448 RISC Microprocessor Hardware Specifications. The MPC7448 is a PowerPC™ microprocessor built on Power Architecture™ technology. Specifications provided in this document supersede those in the MPC7448 RISC Microprocessor Hardware Specifications, Rev. 3 or later, for the part numbers listed in Table A only. Specifications not addressed herein are unchanged. Because this document is frequently updated, refer to the website on the back page of this document or to your Freescale sales office for the latest version. Note that headings and table numbers in this document are not consecutively numbered. They are intended to correspond to the heading or table affected in the general hardware specification. Part numbers addressed in this document are listed in Table A. Freescale Part Numbers Affected: MC7448THX1000Nx MC7448THX1267Nx MC7448THX1400Nx MC7448THX1700LD PPC7448THX1000Nx PPC7448THX1267Nx PPC7448THX1400Nx MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series Document Number: MPC7448ECS02AD Rev. 2, 04/2007

Page 3

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 2 Freescale Semiconductor General Parameters 4 General Parameters Core power supply 1.3 V (1700L MHz revision level D devices) 1.15 V (1400N MHz devices) 1.1 V (1267N MHz revision level C devices) 1.05 V (1267N MHz revision level D devices) 1.0 V (1000N MHz devices) Note: See Section 5.1, “DC Electrical Characteristics,” for information regarding VDD specifications for 1400 MHz device. 5.1 DC Electrical Characteristics Table 4 provides the recommended operating conditions for the MPC7448 part numbers described here. NOTE Table 4 describes the nominal operating conditions of the device. For information on the operation of the device at supported derated core voltage conditions, see Section 5.3, “Voltage and Frequency Derating.” Table A. Part Numbers Addressed by This Data Sheet Freescale Part Number Operating Conditions Significant Differences from Hardware Specifications CPU Frequency (MHz) VDD Tj (•C) MC7448THX1000Nx 1000 1.0 V ± 50 mV –40 to 105 Modified core frequency and voltage to reduce power consumption, extended operating temperature.MC7448THX1267NC 1267 1.1 V ± 50 mV MC7448THX1267ND 1267 1.05 V ± 50 mV MC7448THX1400Nx 1400 1.15 V ± 50 mV 2 MC7448THX1700LD 1700 1.3 V +20/-50 mV PPC7448THX1000Nx 1 1000 1.0 V ± 50 mV PPC7448THX1267NC1 1267 1.1 V ± 50 mV PPC7448THX1267ND1 1267 1.05 V ± 50 mV PPC7448THX1400Nx1 1400 1.15 V ± 50 mV 2 Note: 1. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These parts have only preliminary reliability and characterization data. Before pilot production prototypes can be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur as pilot production prototypes are shipped. 2 See Section 5.1, “DC Electrical Characteristics,” for information regarding VDD specifications for 1400 MHz device.

Page 4

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 Freescale Semiconductor 3 General Parameters Table 7 provides the power consumption for the MPC7448 part numbers described by this document; see Section 11.1, “Part Numbers Addressed by This Specification,” for more information. The MPC7448 RISC Microprocessor Hardware Specifications presents guidelines on the use of these parameters for system design. For information on power consumption when dynamic frequency switching is enabled, see Section 9.8.5, “Dynamic Frequency Switching (DFS),” in the hardware specifications. The power consumptions provided in Table 7 represent the power consumption of each speed grade when operated at the rated maximum core frequency (see Table 8). Freescale sorts devices by power as well as by core frequency, and power limits for each speed grade are independent of each other. Each device is tested at its maximum core frequency only. (Note that Deep Sleep Mode power consumption is independent of clock frequency.) Operating a device at a frequency lower than its rated maximum is fully supported provided the clock frequencies are within the specifications given in Table 8, and a device operated below its rated maximum will have lower power consumption. However, inferences should not be made about a device’s power consumption based on the power specifications of another (lower) speed grade. For example, a 1400 MHz device operated at 1267 MHz will not exhibit the same power consumption as a 1267 MHz device operated at 1267 MHz. NOTE The power consumption information in this table applies when the device operates at the nominal core voltage indicated in Table 4. For power consumption at derated core voltage conditions, see Section 5.3, “Voltage and Frequency Derating.” Table 4. Recommended Operating Conditions1 Characteristic Symbol Recommended Value Unit Notes 1000N MHz 1267N MHz3 Revision Level C 1267N MHz3 Revision Level D 1400N MHz3 1700L MHz Core supply voltage VDD 1.0 V ± 50 mV 1.1 V ± 50 mV 1.05 V ± 50 mV 1.15 V ± 50 mV 1.3 V +20/-50 mV V PLL supply voltage AVDD 1.0 V ± 50 mV 1.1 V ± 50 mV 1.05 V ± 50 mV 1.15 V ± 50 mV 1.3 V +20/-50 mV V 2 Die-junction temperature Tj –40 to 105 –40 to 105 –40 to 105 –40 to 105 –40 to 105 •C Notes: 1. These are the recommended and tested operating conditions. Some speed grades in addition support voltage derating; see Section 5.3, “Voltage and Frequency Derating.” Proper device operation outside of these conditions and those specified in Section 5.3, “Voltage and Frequency Derating,” is not guaranteed. 2. This voltage is the input to the filter discussed in Section 9.2.2, “PLL Power Supply Filtering,” in the hardware specifications and not necessarily the voltage at the AVDD pin, which may be reduced from VDD by the filter. 3. VDD and AVDD may be reduced in order to reduce power consumption if further maximum core frequency constraints are observed. See Section 5.3, “Voltage and Frequency Derating,” for specific information.

Page 5

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 4 Freescale Semiconductor General Parameters 5.2.1 Clock AC Specifications Table 8 provides the clock AC timing specifications for the MPC7448 part numbers discussed here. NOTE The core frequency information in this table applies when the device operates at the nominal core voltage indicated in Table 4. For core frequency specifications at derated core voltage conditions, see Section 5.3, “Voltage and Frequency Derating.” Table 7. Power Consumption for MPC7448 at Maximum Rated Frequency Die Junction (Tj) (•C) Maximum Processor Core Frequency (Speed Grade, MHz) Unit Notes 1000N 1267N 7 1400N 1700L Full-Power Mode Typical 65 9.5 8.4 11.0 21.0 W 1, 2 Thermal 105 12.0 10.3 13.7 25.6 W 1, 5 Maximum 105 13.9 12.0 15.9 29.8 W 1, 3 Nap Mode Typical 105 6.5 6.5 8.3 13.0 W 1, 6 Sleep Mode Typical 105 6.3 6.3 8.0 12.5 W 1, 6 Deep Sleep Mode (PLL Disabled) Typical 105 6.0 6.0 7.7 12.0 W 1, 6 Notes: 1. These values specify the power consumption for the core power supply (VDD) at nominal voltage and apply to all valid processor bus frequencies and configurations. The values do not include I/O supply power (OVDD) or PLL supply power (AVDD). OVDD power is system dependent but is typically < 5% of VDD power. Worst case power consumption for AVDD < 13 mW. 2. Typical nominal power consumption is an average value measured at the nominal recommended VDD (see Table 4) and 65°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter is not 100% tested but periodically sampled. 3. Maximum power consumption is the average measured at nominal VDD and maximum operating junction temperature (see Table 4) while running an entirely cache-resident, contrived sequence of instructions to keep all the execution units maximally busy. 4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep mode. As a result, power consumption for this mode is not tested. 5. Typical thermal power consumption is an average value measured at the nominal recommended VDD (see Table 4) and 105°C while running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz. This parameter is not 100% tested but periodically sampled. 6. Typical power consumption for these modes is measured at the nominal recommended VDD (see Table 4) and 105°C in the mode described. This parameter is not 100% tested but is periodically sampled. 7. Power consumption for the 1267 MHz device is intentionally constrained via testing and sorting to assure low power consumption for this device.

Page 6

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 Freescale Semiconductor 5 General Parameters 5.3 Voltage and Frequency Derating To reduce power consumption, these devices support voltage and frequency derating in which the core voltage (VDD) may be reduced if the reduced maximum processor core frequency requirements are observed. The supported derated core voltage, resulting maximum processor core frequency (fcore), and power consumption are provided in Table 11. Only those parameters in Table 11 are affected; all other parameter specifications are unaffected. Table 8. Clock AC Timing Specifications At recommended operating conditions. See Table 4. Characteristic Symbol Maximum Processor Core Frequency (MHz) Unit Notes1000N 1267N 1400N 1700L Min Max Min Max Min Max Min Max Processor frequency DFS mode disabled fcore 500 1000 500 1267 500 1400 600 1700 MHz 1, 8, 9 Processor frequency DFS mode enabled fcore_DFS 250 500 250 633 250 700 300 850 MHz 10 VCO frequency fVCO 500 1000 500 1267 500 1400 600 1700 MHz 1, 9 Notes: 1. Caution: The SYSCLK frequency and PLL_CFG[0:5] settings must be chosen such that the resulting SYSCLK (bus) frequency, processor core frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating frequencies. Refer to the PLL_CFG[0:5] signal description in Section 9.1.1, “PLL Configuration,” in the hardware specifications for valid PLL_CFG[0:5] settings. 8. This reflects the maximum and minimum core frequencies when the dynamic frequency switching feature (DFS) is disabled. fcore_DFS provides the maximum and minimum core frequencies in a DFS mode. 9. Caution: These values specify the maximum processor core and VCO frequencies when the device is operated at the nominal core voltage. If operating the device at the derated core voltage, the processor core and VCO frequencies must be reduced. See Section 5.3, “Voltage and Frequency Derating,” for more information. 10.This specification supports the Dynamic Frequency Switching (DFS) feature and is applicable only when one of the DFS modes (divide-by-2 or divide-by-4) is enabled. When DFS is disabled, the core frequency must conform to the maximum and minimum frequencies stated for fcore. Table 11. Supported Voltage, Core Frequency, and Power Consumption Derating Maximum Rated Core Frequency (Device Marking) Supported Derated Core Voltage (VDD) Maximum Derated Core Frequency (fcore) Full-Power Mode Power Consumption Typical Thermal Maximum 1000N N/A 1267N 1.0 V ± 50 mV 1000 MHz 6.0 W 7.3 W 8.5 W 1400N 1.0 V ± 50 mV 1000 MHz 8.0 W 9.9 W 11.5 W 1700L N/A

Page 7

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 6 Freescale Semiconductor Part Numbering and Marking 9.2 Power Supply Design and Sequencing The power supply design and sequencing requirements of the devices described here are identical to those described in the MPC7448 RISC Microprocessor Hardware Specifications. 11 Part Numbering and Marking 11.1 Part Numbers Addressed by This Specification Table 17 provides the ordering information for the MPC7448 parts described in this document. Table 17. Part Marking Nomenclature xx 7448 T xx nnnn m x Product Code Part Identifier Specification Modifier Package Processor Frequency Application Modifier Revision Level MC PPC1 7448 T = Extended Temperature Device HX = HCTE BGA 1000 N: 1.0 V ± 50 mV – 40 to 105 °C C: 2.1: PVR = 0x8004_0201 D: 2.2: PVR = 0x8004_0202 1267 Revision C only N: 1.1 V ± 50 mV – 40 to 105 °C 1267 Revision D only N: 1.05 V ± 50 mV – 40 to 105 °C 1400 N: 1.15 V ± 50 mV – 40 to 105 °C MC 1700 L: 1.3 V +20/-50 mV – 40 to 105 °C D:2.2: PVR = 0x8004_0202 Notes: 1. The P prefix in a Freescale part number designates a “Pilot Production Prototype” as defined by Freescale SOP 3-13. These parts have only preliminary reliability and characterization data. Before pilot production prototypes can be shipped, written authorization from the customer must be on file in the applicable sales office acknowledging the qualification status and the fact that product changes may still occur as pilot production prototypes are shipped.

Page 8

MPC7448 Hardware Specifications Addendum for the MC7448Txxnnnnmx Series, Rev. 2 Freescale Semiconductor 7 Document Revision History 11.3 Part Marking Parts are marked as the example shown in Figure 23. Figure 23. Part Marking for BGA Device Document Revision History Table B provides a revision history for this part number specification. Table B. Document Revision History Revision Date Substantive Change(s) 2 04/2007 Added 1700LD device information. On first page changed title part number from being N application modifier specific (MC7448TxxxnnnnNx) to generic MC7448Txxnnnnmx. On first page under Freescale Part Numbers Affected added MC7448THX1700LD. Table A: Added a 1700L MHz revision D row. Section 4, “General Parameters”: Added 1700L MHz revision level D information and added N application modifier information to the 1000, 1267, and 1400 devices. Table 4, Table 7, and Table 8: Added 1700L columns. Table 4, Table 7, Table 8, and Table 11: Added added N application modifier information to the 1000, 1267, and 1400 column headings. Table 11: Added 1700L row. Table 17: Changed ‘N’ application modifier at top of table to generic ‘m’. Added 1700L information for revision level D. Figure 23: Updated part marking replacing ‘N’ application modifier with ‘m’. 1 10/2006 Added revision level D device information. On first page under Freescale Part Numbers Affected added PPC7448THX1000Nx, PPC7448THX1267Nx, and PPC7448THX1400Nx. Table A and list on first page: x stands for C or D revision level. Table A: Added 1267 MHz revision D row and 4 PPC part number rows. Section 4, “General Parameters”: Added 1267 MHz revision level D information. Table 4: Added 1267 MHz revision D only column. Table 17: Added PVR and 1267 information for revision level D, added PPC product code, and footnote 1. 0 6/2006 Initial release. Notes: YWWLAZ is the assembly traceability code. AWLYYWW is the test code, where YYWW is the date code (YY = year, WW = work week) MMMMMM is the M00 (mask) number. xx7448T xxnnnnmx AWLYYWW MMMMMM YWWLAZ 7448 BGA

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