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MK22FX512VLQ12

hotMK22FX512VLQ12

MK22FX512VLQ12

For Reference Only

Part Number MK22FX512VLQ12
Manufacturer NXP
Description IC MCU 32BIT 512KB FLASH 144LQFP
Datasheet MK22FX512VLQ12Datasheet
Package 144-LQFP
In Stock 310 piece(s)
Unit Price $ 10.1195 *
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MK22FX512VLQ12

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MK22FX512VLQ12Specifications

ManufacturerNXP
CategoryIntegrated Circuits (ICs) - Embedded - Microcontrollers
Datasheet MK22FX512VLQ12Datasheet
Package144-LQFP
SeriesKinetis K20
Core ProcessorARM? Cortex?-M4
Core Size32-Bit
Speed120MHz
ConnectivityCAN, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
PeripheralsDMA, I2S, LVD, POR, PWM, WDT
Number of I/O100
Program Memory Size512KB (512K x 8)
Program Memory TypeFLASH
RAM Size64K x 8
Voltage - Supply (Vcc/Vdd)1.71 V ~ 3.6 V
Data ConvertersA/D 42x16b, D/A 2x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Package / Case144-LQFP
Supplier Device Package144-LQFP (20x20)

MK22FX512VLQ12Datasheet

Page 1

Page 2

Kinetis K22F Sub-Family Data Sheet 120 MHz ARM® Cortex®-M4-based Microcontroller with FPU The K22 product family members are optimized for cost-sensitive applications requiring low-power, USB connectivity, processing efficiency with floating point unit. It shares the comprehensive enablement and scalability of the Kinetis family. This product offers: • Up to 1 MB of flash memory with up to 128 KB of SRAM • Small package with high memory density • Run power consumption down to 279 μA/MHz. Static power consumption down to 5.1 μA with full state retention and 5 μs wakeup. Lowest Static mode down to 268 nA • USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO voltage regulator Performance • Up to 120 MHz ARM Cortex-M4-based core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz Memories and memory interfaces • Up to 1 MB program flash memory and 128 KB RAM • Up to 128 KB FlexNVM and 4 KB FlexRAM on FlexMemory devices • FlexBus external bus interface System peripherals • Multiple low-power modes; low leakage wakeup unit • Memory protection unit with multi-master protection • 16-channel DMA controller • External watchdog monitor and software watchdog Security and integrity modules • Hardware CRC module • 128-bit unique identification (ID) number per chip Analog modules • Two 16-bit SAR ADCs • Two 12-bit DACs • Three analog comparators (CMP) • Voltage reference Communication interfaces • USB full-/low-speed On-the-Go controller • USB Device Charger detect • Controller Area Network (CAN) module • Three SPI modules • Three I2C modules • Six UART modules • Secure Digital host controller (SDHC) • I2S module Timers • Two 8-channel Flex-Timers (PWM/Motor Control) • Two 2-channel Flex-Timers (PWM/Quad Decoder) • Periodic interrupt timers and 16-bit low-power timer • Carrier modulator transmitter • Real-time clock • Programmable delay block Clocks • 3 to 32 MHz and 32 kHz crystal oscillator • PLL, FLL, and multiple internal oscillators Operating Characteristics • Voltage range: 1.71 to 3.6 V • Flash write voltage range: 1.71 to 3.6 V • Temperature range (ambient): –40 to 105°C MK22FX512VLQ12 MK22FN1M0VLQ12 MK22FX512VMD12 MK22FN1M0VMD12 144 LQFP 20 x 20 x 1.6 mm Pitch 0.5 mm 144 BGA 13 x 13 x 1.7 mm Pitch 1 mm Freescale Semiconductor, Inc. K22P144M120SF5 Data Sheet: Technical Data Rev 4, 11/2014 Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2013–2015 Freescale Semiconductor, Inc. All rights reserved.

Page 3

Ordering Information 1 Part Number Memory Maximum number of I\O's Flash (KB) SRAM (KB) MK22FX512VLQ12 512 KB 128 100 MK22FN1M0VLQ12 1 MB 128 100 MK22FX512VMD12 512 KB 128 100 MK22FN1M0VMD12 1 MB 128 100 1. To confirm current availability of ordererable part numbers, go to http://www.freescale.com and perform a part number search. Related Resources Type Description Resource Selector Guide The Freescale Solution Advisor is a web-based tool that features interactive application wizards and a dynamic product selector. Solution Advisor Product Brief The Product Brief contains concise overview/summary information to enable quick evaluation of a device for design suitability. K20PB1 Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. K22P144M50SF5RM1 Data Sheet The Data Sheet includes electrical characteristics and signal connections. K22P144M50SF51 Package drawing Package dimensions are provided in package drawings. • LQFP 144-pin: 98ASS23177W1 • MAPBGA-144 pin: 98ASA00222D1 1. To find the associated resource, go to http://www.freescale.com and perform a search using this term. 2 Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. Freescale Semiconductor, Inc.

Page 4

Memories and Memory Interfaces Program flash RAM 12-bit DAC 6-bit DAC CRC Programmable Analog Timers Communication InterfacesSecurity and Integrity SPI Carrier modulator transmitter FlexMemory Clocks Frequency- Core Debug interfaces DSP Interrupt controller comparator Analog Voltage reference Low power timer Human-Machine Interface (HMI) GPIO System DMA Internal watchdogs and external Low-leakage wakeup locked loop Serial programming interface Phase- locked loop reference Internal clocks delay block timers interrupt Periodic real-time Independent clock oscillators Low/high frequency UART ® Cortex™-M4ARM Floating point Kinetis K21D Family USB charger detect USB voltage regulator USB OTG LS/FS/HS USB LS/FS transceiver I S2 Tamper detect Hardware encryption number Random generator I C2FlexTimers16-bit ADC Figure 1. K20 block diagram Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. 3 Freescale Semiconductor, Inc.

Page 5

Table of Contents 1 Ratings....................................................................................5 1.1 Thermal handling ratings................................................. 5 1.2 Moisture handling ratings................................................ 5 1.3 ESD handling ratings.......................................................5 1.4 Voltage and current operating ratings............................. 5 2 General................................................................................... 6 2.1 AC electrical characteristics.............................................6 2.2 Nonswitching electrical specifications..............................7 2.2.1 Voltage and current operating requirements.....7 2.2.2 LVD and POR operating requirements............. 8 2.2.3 Voltage and current operating behaviors.......... 8 2.2.4 Power mode transition operating behaviors......10 2.2.5 Power consumption operating behaviors.......... 10 2.2.6 EMC radiated emissions operating behaviors...14 2.2.7 Designing with radiated emissions in mind....... 15 2.2.8 Capacitance attributes...................................... 15 2.3 Switching specifications...................................................15 2.3.1 Device clock specifications............................... 15 2.3.2 General switching specifications....................... 16 2.4 Thermal specifications.....................................................17 2.4.1 Thermal operating requirements....................... 17 2.4.2 Thermal attributes............................................. 17 3 Peripheral operating requirements and behaviors.................. 19 3.1 Core modules.................................................................. 19 3.1.1 Debug trace timing specifications..................... 19 3.1.2 JTAG electricals................................................ 19 3.2 System modules.............................................................. 22 3.3 Clock modules................................................................. 22 3.3.1 MCG specifications........................................... 22 3.3.2 Oscillator electrical specifications..................... 25 3.3.3 32 kHz oscillator electrical characteristics.........27 3.4 Memories and memory interfaces................................... 27 3.4.1 Flash (FTFE) electrical specifications............... 27 3.4.2 EzPort switching specifications......................... 32 3.4.3 Flexbus switching specifications....................... 33 3.5 Security and integrity modules........................................ 36 3.6 Analog............................................................................. 36 3.6.1 ADC electrical specifications.............................37 3.6.2 CMP and 6-bit DAC electrical specifications.....41 3.6.3 12-bit DAC electrical characteristics................. 43 3.6.4 Voltage reference electrical specifications........ 46 3.7 Timers..............................................................................47 3.8 Communication interfaces............................................... 47 3.8.1 USB electrical specifications............................. 47 3.8.2 USB DCD electrical specifications.................... 48 3.8.3 USB VREG electrical specifications..................48 3.8.4 CAN switching specifications............................ 49 3.8.5 DSPI switching specifications (limited voltage range)................................................................49 3.8.6 DSPI switching specifications (full voltage range)................................................................51 3.8.7 I2C switching specifications.............................. 52 3.8.8 UART switching specifications.......................... 53 3.8.9 SDHC specifications......................................... 53 3.8.10 I2S switching specifications.............................. 54 4 Dimensions............................................................................. 66 4.1 Obtaining package dimensions....................................... 66 5 Pinout......................................................................................67 5.1 K22 Signal Multiplexing and Pin Assignments.................67 5.2 K22 Pinouts..................................................................... 73 6 Revision History...................................................................... 75 7 Copyright................................................................................. 0 8 Legal....................................................................................... 0 4 Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. Freescale Semiconductor, Inc.

Page 6

1 Ratings 1.1 Thermal handling ratings Symbol Description Min. Max. Unit Notes TSTG Storage temperature –55 150 °C 1 TSDR Solder temperature, lead-free — 260 °C 2 1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life. 2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.2 Moisture handling ratings Symbol Description Min. Max. Unit Notes MSL Moisture sensitivity level — 3 — 1 1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. 1.3 ESD handling ratings Symbol Description Min. Max. Unit Notes VHBM Electrostatic discharge voltage, human body model -2000 +2000 V 1 VCDM Electrostatic discharge voltage, charged-device model -500 +500 V 2 ILAT Latch-up current at ambient temperature of 105°C -100 +100 mA 3 1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components. 3. Determined according to JEDEC Standard JESD78, IC Latch-Up Test. 1.4 Voltage and current operating ratings Ratings Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. 5 Freescale Semiconductor, Inc.

Page 7

Symbol Description Min. Max. Unit VDD Digital supply voltage –0.3 3.8 V IDD Digital supply current — 185 mA VDIO Digital input voltage (except RESET, EXTAL, and XTAL) –0.3 5.5 V VAIO Analog1, RESET, EXTAL, and XTAL input voltage –0.3 VDD + 0.3 V ID Maximum current single pin limit (applies to all digital pins) –25 25 mA VDDA Analog supply voltage VDD – 0.3 VDD + 0.3 V VUSB0_DP USB0_DP input voltage –0.3 3.63 V VUSB0_DM USB0_DM input voltage –0.3 3.63 V VBAT RTC battery supply voltage –0.3 3.8 V 1. Analog pins are defined as pins that do not have an associated general purpose I/O port function. 2 General 2.1 AC electrical characteristics Unless otherwise specified, propagation delays are measured from the 50% to the 50% point, and rise and fall times are measured at the 20% and 80% points, as shown in the following figure. 80% 20% 50% VIL Input Signal VIH Fall Time HighLow Rise Time Midpoint1 The midpoint is VIL + (VIH - VIL) / 2 Figure 2. Input signal measurement reference All digital I/O switching characteristics assume: 1. output pins • have CL=30pF loads, • are configured for fast slew rate (PORTx_PCRn[SRE]=0), and • are configured for high drive strength (PORTx_PCRn[DSE]=1) 2. input pins • have their passive filter disabled (PORTx_PCRn[PFE]=0) General 6 Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. Freescale Semiconductor, Inc.

Page 8

2.2 Nonswitching electrical specifications 2.2.1 Voltage and current operating requirements Table 1. Voltage and current operating requirements Symbol Description Min. Max. Unit Notes VDD Supply voltage 1.71 3.6 V VDDA Analog supply voltage 1.71 3.6 V VDD – VDDA VDD-to-VDDA differential voltage –0.1 0.1 V VSS – VSSA VSS-to-VSSA differential voltage –0.1 0.1 V VBAT RTC battery supply voltage 1.71 3.6 V VIH Input high voltage • 2.7 V ≤ VDD ≤ 3.6 V • 1.71 V ≤ VDD ≤ 2.7 V 0.7 × VDD 0.75 × VDD — — V V VIL Input low voltage • 2.7 V ≤ VDD ≤ 3.6 V • 1.71 V ≤ VDD ≤ 2.7 V — — 0.35 × VDD 0.3 × VDD V V VHYS Input hysteresis 0.06 × VDD — V IICDIO Digital pin negative DC injection current — single pin • VIN < VSS-0.3V -5 — mA 1 IICAIO Analog2, EXTAL, and XTAL pin DC injection current — single pin • VIN < VSS-0.3V (Negative current injection) • VIN > VDD+0.3V (Positive current injection) -5 — — +5 mA 3 IICcont Contiguous pin DC injection current —regional limit, includes sum of negative injection currents or sum of positive injection currents of 16 contiguous pins • Negative current injection • Positive current injection -25 — — +25 mA VODPU Open drain pullup voltage level VDD VDD V 4 VRAM VDD voltage required to retain RAM 1.2 — V VRFVBAT VBAT voltage required to retain the VBAT register file VPOR_VBAT — V 1. All 5 V tolerant digital I/O pins are internally clamped to VSS through an ESD protection diode. There is no diode connection to VDD. If VIN is less than VDIO_MIN, a current limiting resistor is required. If VIN greater than VDIO_MIN (=VSS-0.3V) is observed, then there is no need to provide current limiting resistors at the pads. The negative DC injection current limiting resistor is calculated as R=(VDIO_MIN-VIN)/|IICDIO|. 2. Analog pins are defined as pins that do not have an associated general purpose I/O port function. Additionally, EXTAL and XTAL are analog pins. General Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. 7 Freescale Semiconductor, Inc.

Page 9

3. All analog pins are internally clamped to VSS and VDD through ESD protection diodes. If VIN is less than VAIO_MIN or greater than VAIO_MAX, a current limiting resistor is required. The negative DC injection current limiting resistor is calculated as R=(VAIO_MIN-VIN)/|IICAIO|. The positive injection current limiting resistor is calculated as R=(VIN-VAIO_MAX)/| IICAIO|. Select the larger of these two calculated resistances if the pin is exposed to positive and negative injection currents. 4. Open drain outputs must be pulled to VDD. 2.2.2 LVD and POR operating requirements Table 2. VDD supply LVD and POR operating requirements Symbol Description Min. Typ. Max. Unit Notes VPOR Falling VDD POR detect voltage 0.8 1.1 1.5 V VLVDH Falling low-voltage detect threshold — high range (LVDV=01) 2.48 2.56 2.64 V VLVW1H VLVW2H VLVW3H VLVW4H Low-voltage warning thresholds — high range • Level 1 falling (LVWV=00) • Level 2 falling (LVWV=01) • Level 3 falling (LVWV=10) • Level 4 falling (LVWV=11) 2.62 2.72 2.82 2.92 2.70 2.80 2.90 3.00 2.78 2.88 2.98 3.08 V V V V 1 VHYSH Low-voltage inhibit reset/recover hysteresis — high range — 80 — mV VLVDL Falling low-voltage detect threshold — low range (LVDV=00) 1.54 1.60 1.66 V VLVW1L VLVW2L VLVW3L VLVW4L Low-voltage warning thresholds — low range • Level 1 falling (LVWV=00) • Level 2 falling (LVWV=01) • Level 3 falling (LVWV=10) • Level 4 falling (LVWV=11) 1.74 1.84 1.94 2.04 1.80 1.90 2.00 2.10 1.86 1.96 2.06 2.16 V V V V 1 VHYSL Low-voltage inhibit reset/recover hysteresis — low range — 60 — mV VBG Bandgap voltage reference 0.97 1.00 1.03 V tLPO Internal low power oscillator period — factory trimmed 900 1000 1100 μs 1. Rising threshold is the sum of falling threshold and hysteresis voltage Table 3. VBAT power operating requirements Symbol Description Min. Typ. Max. Unit Notes VPOR_VBAT Falling VBAT supply POR detect voltage 0.8 1.1 1.5 V General 8 Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. Freescale Semiconductor, Inc.

Page 10

2.2.3 Voltage and current operating behaviors Table 4. Voltage and current operating behaviors Symbol Description Min. Typ Max. Unit Notes VOH Output high voltage — high drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOH = -8mA • 1.71 V ≤ VDD ≤ 2.7 V, IOH = -3mA VDD – 0.5 VDD – 0.5 — — — — V V Output high voltage — low drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOH = -2mA • 1.71 V ≤ VDD ≤ 2.7 V, IOH = -0.6mA VDD – 0.5 VDD – 0.5 — — — — V V IOHT Output high current total for all ports — — 100 mA VOL Output low voltage — high drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 9mA • 1.71 V ≤ VDD ≤ 2.7 V, IOL = 3mA — — — — 0.5 0.5 V V 1 Output low voltage — low drive strength • 2.7 V ≤ VDD ≤ 3.6 V, IOL = 2mA • 1.71 V ≤ VDD ≤ 2.7 V, IOL = 0.6mA — — — — 0.5 0.5 V V IOLT Output low current total for all ports — — 100 mA IIND Input leakage current, digital pins • VSS ≤ VIN ≤ VIL • All digital pins • VIN = VDD • All digital pins except PTD7 • PTD7 — — — 0.002 0.002 0.004 0.5 0.5 1 μA μA μA 2, 3 IIND Input leakage current, digital pins • VIL < VIN < VDD • VDD = 3.6 V • VDD = 3.0 V • VDD = 2.5 V • VDD = 1.7 V — — — — 18 12 8 3 26 19 13 6 μA μA μA μA 2 IIND Input leakage current, digital pins • VDD < VIN < 5.5 V — 1 50 μA IOZ Hi-Z (off-state) leakage current (per pin) — — 0.25 μA RPU Internal pullup resistors 20 35 50 kΩ 4 RPD Internal pulldown resistors 20 35 50 kΩ 5 1. Open drain outputs must be pulled to VDD. 2. Measured at VDD=3.6V 3. Internal pull-up/pull-down resistors disabled. 4. Measured at VDD supply voltage = VDD min and Vinput = VSS General Kinetis K22F Sub-Family Data Sheet, Rev4, 11/2014. 9 Freescale Semiconductor, Inc.

MK22FX512VLQ12Reviews

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Avia*****Potter

February 5, 2020

The products are good, the amount is correct. The values are correct.

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January 12, 2020

Great kit, cost half the price of other stores. Includes most items that someone would need.

Fran*****dley

January 9, 2020

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December 14, 2019

Super easy search and order process. Lots of Shipping and Payment Options, you can always find the best way for the purchase.

Fre*****Allen

December 4, 2019

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Liv*****oyd

November 30, 2019

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Arl*****orpal

November 14, 2019

Worked wonderfully. Went through the instructions to the tea to make sure it was done correctly.

Dian*****eill

November 8, 2019

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Georg*****carthy

October 30, 2019

DELIVERY AND COMMUNICATION EXTRA SELLER TOP 5 STARS on my list

Alexa*****Hammond

October 2, 2019

Excellent ! MK22FX512VLQ12 item arrived very quickly and was packaged well, no issues.

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