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NC7SZ00L6X

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NC7SZ00L6X

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Part Number NC7SZ00L6X
Manufacturer ON Semiconductor
Description IC GATE NAND 1CH 2-INP 6MICROPAK
Datasheet NC7SZ00L6X Datasheet
Package 6-UFDFN
In Stock 20,220 piece(s)
Unit Price $ 0.1088 *
Lead Time Can Ship Immediately
Estimated Delivery Time Dec 4 - Dec 9 (Choose Expedited Shipping)
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Part Number # NC7SZ00L6X (Logic - Gates and Inverters) is manufactured by ON Semiconductor and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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NC7SZ00L6X Specifications

ManufacturerON Semiconductor
CategoryIntegrated Circuits (ICs) - Logic - Gates and Inverters
Datasheet NC7SZ00L6XDatasheet
Package6-UFDFN
Series7SZ
Logic TypeNAND Gate
Number of Circuits1
Number of Inputs2
Features-
Voltage - Supply1.65 V ~ 5.5 V
Current - Quiescent (Max)2µA
Current - Output High, Low32mA, 32mA
Logic Level - Low-
Logic Level - High-
Max Propagation Delay @ V, Max CL4.3ns @ 5V, 50pF
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Supplier Device Package6-MicroPak
Package / Case6-UFDFN

NC7SZ00L6X Datasheet

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To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. Is Now Part of ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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December 2010 © 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te NC7SZ00 TinyLogic® UHS Two-Input NAND Gate Features Ultra-High Speed: tPD 2.4ns (Typical) into 50pF at 5V VCC High Output Drive: ±24mA at 3V VCC Broad VCC Operating Range: 1.65V to 5.5V Matches Performance of LCX Operated at 3.3V VCC Power Down High-Impedance Inputs/Outputs Over-Voltage Tolerance inputs facilitate 5V to 3V Translation Proprietary Noise/EMI Reduction Circuitry Ultra-Small MicroPak™ Packages Space-Saving SOT23 and SC70 Packages Description The NC7SZ00 is a single two-input NAND gate from Fairchild’s Ultra-High Speed (UHS) series of TinyLogic®. The device is fabricated with advanced CMOS technology to achieve ultra-high speed with high output drive while maintaining low static power dissipation over a broad VCC operating range. The device is specified to operate over the 1.65V to 5.5V VCC operating range. The inputs and output are high impedance when VCC is 0V. Inputs tolerate voltages up to 6V, independent of VCC operating voltage. Related Resources MS-503 — Family Characteristics TinyLogic® HS/HST and UHS Series Ordering Information Part Number Top Mark Package Packing Method NC7SZ00M5X 7Z00 5-Lead SOT23, JEDEC MO-178 1.6mm 3000 Units on Tape & Reel NC7SZ00P5X Z00 5-Lead SC70, EIAJ SC-88a, 1.25mm Wide 3000 Units on Tape & Reel NC7SZ00L6X YY 6-Lead MicroPak™, 1.00mm Wide 5000 Units on Tape & Reel NC7SZ00FHX YY 6-Lead, MicroPak2™, 1x1mm Body, .35mm Pitch 5000 Units on Tape & Reel

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 2 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te Connection Diagrams IEEE/IEC Figure 1. Logic Symbol Pin Configurations Figure 2. SC70 and SOT23 (Top View) Figure 3. MicroPak™ (Top Through View) Pin Definitions Pin # SC70 / SOT23 Pin # MicroPak™ Name Description 1 1 A Input 2 2 B Input 3 3 GND Ground 4 4 Y Output 5 6 VCC Supply Voltage 5 NC No Connect Function Table Inputs Output A B Y L L H L H H H L H H H L H = HIGH Logic Level L = LOW Logic Level

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 3 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC Supply Voltage -0.5 6.0 V VIN DC Input Voltage -0.5 6.0 V VOUT DC Output Voltage -0.5 6.0 V IIK DC Input Diode Current VIN < -0.5V -50 mA VIN > 6.0V +20 IOK DC Output Diode Current VOUT < -0.5V -50 mA VOUT > 6V, VCC=GND +20 IOUT DC Output Current ±50 mA ICC or IGND DC VCC or Ground Current ±50 mA TSTG Storage Temperature Range -65 +150 °C TJ Junction Temperature Under Bias +150 °C TL Junction Lead Temperature (Soldering, 10 Seconds) +260 °C PD Power Dissipation at +85°C SOT-23 200 mW SC70-5 150 MicroPak™-6 130 MicroPak2™-6 120 ESD Human Body Model, JEDEC:JESD22-A114 4000 V Charge Device Model, JEDEC:JESD22-C101 2000 Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit VCC Supply Voltage Operating 1.65 5.50 V Supply Voltage Data Retention 1.5 5.5 VIN Input Voltage 0 5.5 V VOUT Output Voltage 0 VCC V TA Operating Temperature -40 +85 °C tr, tf Input Rise and Fall Times VCC at 1.8V, 2.5V ±0.2V 0 20 ns/V VCC at 3.3V ± 0.3V 0 10 VCC at 5.0V ± 0.5V 0 5 θJA Thermal Resistance SOT-23 300 °C/W SC70-5 435 MicroPak™-6 500 MicroPak2™-6 560 Note: 1. Unused inputs must be held HIGH or LOW. They may not float.

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 4 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te DC Electrical Characteristics Symbol Parameter VCC Conditions TA=25°C TA=-40 to +85°C Units Min. Typ. Max. Min. Max. VIH HIGH Level Input Voltage 1.65 to 1.95 0.75VCC 0.75VCC V 2.30 to 5.50 0.70VCC 0.70VCC VIL LOW Level Input Voltage 1.65 to 1.95 0.25VCC 0.25VCC V 2.30 to 5.50 0.30VCC 0.30VCC VOH HIGH Level Output Voltage 1.65 VIN=VIL IOH=-100µA 1.55 1.65 1.55 V 1.80 1.70 1.80 1.70 2.30 2.20 2.30 2.20 3.00 2.90 3.00 2.90 4.50 4.40 4.50 4.40 1.65 IOH=-4mA 1.29 1.52 1.29 1.80 IOH=-8mA 1.90 2.15 1.90 2.30 IOH=-16mA 2.40 2.80 2.40 3.00 IOH=-24mA 2.30 2.68 2.30 4.50 IOH=-32mA 3.80 4.20 3.80 VOL LOW Level Output Voltage 1.65 VIN=VIH IOL=100µA 0.00 0.10 0.08 V 2.30 0.00 0.10 0.10 3.00 0.00 0.10 0.10 3.00 0.00 0.10 0.10 4.50 0.00 0.10 0.10 1.65 IOL=4mA 0.80 0.24 0.24 2.30 IOL=8mA 0.10 0.30 0.30 3.00 IOL=16mA 0.15 0.40 0.40 3.00 IOL=24mA 0.22 0.55 0.55 4.50 IOL=32mA 0.22 0.55 0.55 IIN Input Leakage Current 0 to 5.5 VIN=5.5V, GND ±1 ±10 µA IOFF Power Off 0 VIN or VOUT=5.5V 1 10 µA ICC Quiescent Supply Current 1.65 to 5.50 VIN=5.5V, GND 2 20 µA

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 5 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te AC Electrical Characteristics Symbol Parameter VCC Conditions TA=25°C TA=-40 to +85°C Units Figure Min. Typ. Max. Min. Max. tPHL, tPLH Propagation Delay 1.65 CL=15pF, RL=1MΩ 2.0 5.4 11.4 2.0 12.0 ns Figure 4 Figure 5 1.80 2.0 4.5 9.5 2.0 10.0 2.50 ± 0.20 0.8 3.0 6.5 0.8 7.0 3.30 ± 0.30 0.5 2.4 4.5 0.5 4.7 5.00 ± 0.50 0.5 2.0 3.9 0.5 4.1 3.30 ± 0.30 CL=50pF, RL=500Ω 1.5 2.9 5.0 1.5 5.2 5.00 ± 0.50 0.8 2.4 4.3 0.8 4.5 CIN Input Capacitance 0.00 4 pF CPD Power Dissipation Capacitance(2) 3.30 24 pF Figure 6 5.00 30 Note: 2. CPD is defined as the value of the internal equivalent capacitance derived from dynamic operating current consumption (ICCD) at no output lading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression: ICCD=(CPD)(VCC)(fIN)+(ICCstatic). Figure 4. AC Test Circuit Figure 5. AC Waveforms Note: 3. Input=AC Waveform; tr=tf=1.8ns; PRR=10MHz; Duty Cycle =50%. Figure 6. ICCD Test Circuit

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 6 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te Physical Dimensions 5 1 4 32 LAND PATTERN RECOMMENDATION B A L C 0.10 C 0.20 C A B 0.60 REF 0.55 0.35 SEATING PLANE 0.25 GAGE PLANE 8° 0° NOTES: UNLESS OTHEWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MO-178, ISSUE B, VARIATION AA, B) ALL DIMENSIONS ARE IN MILLIMETERS. 1.45 MAX 1.30 0.90 0.15 0.05 1.90 0.95 0.500.30 3.00 2.60 1.70 1.50 3.00 2.80 SYMM C 0.950.95 2.60 0.70 1.00 SEE DETAIL A 0.22 0.08 C) MA05Brev5 TOP VIEW (0.30) Figure 7. 5-Lead SOT23, JEDEC MO-178 1.6mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/packaging/SOT23-5L_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status M5X Leader (Start End) 125 (Typical) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 7 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te Physical Dimensions Figure 8. 5-Lead, SC70, EIAJ SC-88a, 1.25mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/analog/pdf/sc70-5_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status P5X Leader (Start End) 125 (Typical) Empty Sealed Carrier 3000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed

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© 1996 Fairchild Semiconductor Corporation www.fairchildsemi.com NC7SZ00 • Rev. 1.0.4 8 N C 7S Z 00 — T in yL o g ic ® U H S T w o -In p u t N A N D G a te Physical Dimensions 2. DIMENSIONS ARE IN MILLIMETERS 1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD 4. FILENAME AND REVISION: MAC06AREV4 Notes: 3. DRAWING CONFORMS TO ASME Y14.5M-1994 TOP VIEW RECOMMENED LAND PATTERN BOTTOM VIEW 1.45 1.00 A B0.05 C 0.05 C 2X 2X 0.55MAX 0.05 C (0.49) (1) (0.75) (0.52) (0.30) 6X 1X 6X PIN 1 DETAIL A 0.075 X 45 CHAMFER 0.25 0.15 0.35 0.25 0.40 0.30 0.5(0.05) 1.0 5X DETAIL A PIN 1 TERMINAL 0.40 0.30 0.45 0.350.10 0.00 0.10 C B A 0.05 C C 0.05 C 0.05 0.00 5X 5X 6X (0.13) 4X 6X PIN 1 IDENTIFIER (0.254) 5. PIN ONE IDENTIFIER IS 2X LENGTH OF ANY 5 OTHER LINE IN THE MARK CODE LAYOUT. Figure 9. 6-Lead, MicroPak™, 1.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Tape and Reel Specifications Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package Designator Tape Section Cavity Number Cavity Status Cover Type Status L6X Leader (Start End) 125 (Typical) Empty Sealed Carrier 5000 Filled Sealed Trailer (Hub End) 75 (Typical) Empty Sealed

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