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hot RT9008GE


For Reference Only

Part Number RT9008GE
Manufacturer Richtek USA Inc.
Description IC LDO 10A LOW DROPOUT SOT-23-6
Datasheet RT9008GE Datasheet
Package SOT-23-6
In Stock 14348 piece(s)
Unit Price $ 0.1519 *
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RT9008GE Specifications

ManufacturerRichtek USA Inc.
CategoryIntegrated Circuits (ICs) - PMIC - Voltage Regulators - Linear Regulator Controllers
Datasheet RT9008GE Datasheet
Package / CaseSOT-23-6
Supplier Device PackageSOT-23-6

RT9008GE Datasheet

Page 1

Page 2

RT9008 1 DS9008-01 April 2011 Ordering Information Note : Richtek products are : RoHS compliant and compatible with the current require- ments of IPC/JEDEC J-STD-020. Suitable for use in SnPb or Pb-free soldering processes. Low Dropout Linear Regulator Controller with Soft-Start General Description The RT9008 is a wide input range, low dropout voltage regulator controller with soft-start function. The part drives an external N-MOSFET and can operate with VCC power range from 4.5V to 13.5V. With this flexible topology and wide input voltage range, the RT9008 is suitable for various applications. The soft-start function can reduce the input inrush current by adjusting the external capacitor. The RT9008 uses the small footprint package of the SOT-23-6. Marking Information For marking information, contact our sales representative directly or through a Richtek distributor located in your area. Features Programmable Output Voltage High Current Driver for High Current FET Adjustable Soft Start Time High Accuracy ±2% Reference Voltage Quick Line and Load Transient Response Enable Control Small Footprint Package SOT-23-6 RoHS Compliant and 100% Lead (Pb)-Free Applications Desktop/Notebook PC DSC Processor Power Sequencing (TOP VIEW) SOT-23-6 Pin Configurations Typical Application Circuit EN GND FB VCC DRI SS 4 2 3 56 OUT REF R1 + R2 V = V x ( ) R2 VCC EN SS DRI FBGND RT9008 R1 R2 COUT VIN CCC CSS VCC CIN 4 2 3 5 6 1 Chip Enable VOUT Q1 RT9008 Package Type E : SOT-23-6 Lead Plating System P : Pb Free G : Green (Halogen Free and Pb Free)

Page 3

RT9008 2 DS9008-01 April Function Block Diagram Functional Pin Description Pin No. Pin Name Pin Function 1 EN Enable Input Pin. (Active High) 2 GND Ground. 3 FB Output Voltage Feedback Reference Input. 4 SS Soft Start Control. 5 DRI Driver Output. 6 VCC Power Supply Input. + - Shutdown Logic 0.8V Reference GND FBSS DRI VCC EN Test Circuit VCC EN SS DRI FB GND RT9008 CCC VCC 4 2 3 5 6 1 Chip Enable 1µF CFB VFB A VDRI 5V 12V Figure 1. Typical Test Circuit Figure 2. DRI Source/Sink Current Test Circuit VCC EN SS DRI FBGND RT9008 R1 R2 COUT VIN CCC CSS VCC CIN 4 2 3 5 6 1 Chip Enable VOUT Q1 1µF/X7R 100µF/EC 100µF/EC 1k 2k 100pF/ Ceramic PHD3055

Page 4

RT9008 3 DS9008-01 April 2011 Absolute Maximum Ratings (Note 1) Supply Input Voltage, VCC----------------------------------------------------------------------------------------------- 15V Enable Voltage ------------------------------------------------------------------------------------------------------------- 7V Power Dissipation, PD @ TA = 25°C SOT-23-6 -------------------------------------------------------------------------------------------------------------------- 0.4W Package Thermal Resistance (Note 2) SOT-23-6, θJA --------------------------------------------------------------------------------------------------------------- 250°C/W Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C Junction Temperature Range-------------------------------------------------------------------------------------------- 150°C Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C ESD Susceptibility (Note 3) HBM (Human Body Mode) ---------------------------------------------------------------------------------------------- 2kV MM (Machine Mode) ------------------------------------------------------------------------------------------------------ 200V Recommended Operating Conditions (Note 4) Supply Input Voltage, VCC---------------------------------------------------------------------------------------------- 4.5V to 13.5V Enable Voltage ------------------------------------------------------------------------------------------------------------ 0V to 5.5V Junction Temperature Range------------------------------------------------------------------------------------------- −40°C to 125°C Ambient Temperature Range------------------------------------------------------------------------------------------- −40°C to 85°C Electrical Characteristics (VCC = 12V, TA = 25°C, unless otherwise specified). Parameter Symbol Test Condition Min Typ Max Unit POR Threshold Voltage VCC_POR VCC Rising 4.0 4.2 4.5 V POR Hysteresis VCC_PORHY -- 0.2 -- V VCC Quiescent Current IQ VCC = 12V -- 0.3 0.8 mA Driver Source Current IDRI_SR VCC = 12V, VDRI = 6V 5 -- -- mA Driver Sink Current IDRI_SK VCC = 12V, VDRI = 6V 5 -- -- mA Feedback Reference Voltage VREF VCC = 12V, VDRI = 5V 0.784 0.8 0.816 V Reference Line Regulation VREF_Line VCC = 4.5V to 15V -- 3 6 mV Amplifier Voltage Gain VCC = 12V, No Load -- 70 dB PSRR at 100Hz, No Load PSRR VCC = 12V, No Load 50 -- dB Chip Enable Logic-High Voltage VIH 1.4 -- 5.5 EN Threshold Logic-Low Voltage VIL 0 -- 0.4 V Shutdown Current ISHDN VCC= 12V, VEN = 0V -- -- 5 μA Soft-Start SS pin Source Current ISS VSS = 0V 2 5 10 μA Output Turn-On Rise Time VOUT = 1.2V, COUT = 1000μF, CSS = 4.7nF -- 1 -- ms

Page 5

RT9008 4 DS9008-01 April Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity single layer test board of JEDEC 51-3 thermal measurement standard. Note 3. Devices are ESD sensitive. Handling precaution is recommended. Note 4. The device is not guaranteed to function outside its operating conditions.

Page 6

RT9008 5 DS9008-01 April 2011 Typical Operating Characteristics DRI Sink Current vs. Temperature 12 15 18 21 24 27 30 -50 -25 0 25 50 75 100 125 Temperature D R I S in k C u rr e n t (m A ) VFB = 1V, VCC = 12V, VDRI = 6V (°C) DRI Source Current vs. Temperature 35 40 45 50 55 60 -50 -25 0 25 50 75 100 125 Temperature D R I S o u rc e C u rr e n t (m A ) VFB = 0.6V, VCC = 12V, VDRI = 6V (°C) Quiescent Current vs. Temperature 0.00 0.10 0.20 0.30 0.40 0.50 0.60 -50 -25 0 25 50 75 100 125 Temperature Q u ie sc e n t C u rr e n t ( m A ) VIN = 1.5V, VCC = 12V (°C) Feedback Voltage vs. Temperature 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 -50 -25 0 25 50 75 100 125 Temperature F e e d b a ck V o lta g e ( V ) VIN = 1.5V, VCC = 12V (°C) Sink Current vs. DRI Voltage 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 3 DRI Voltage (V) S in k C u rr e n t ( m A ) R ef er t o Te st C irc ui t F ig ur e 2 VFB = 1V, VCC = 12V VFB = 0.6V, VCC = 12V Source Current vs. DRI Voltage 0 10 20 30 40 50 0 2 4 6 8 10 12 DRI Voltage (V) S o u rc e C u rr e n t ( m A )

Page 7

RT9008 6 DS9008-01 April 0 10 -10 1.5 2.5 Time (100μs/Div) Line Transient Response VOUT (mV/Div) VIN (V/Div) VIN = 1.5V to 2.5V, ILOAD = 100mA CIN = 2.2μF, COUT = 100μF 0 20 -20 0 5 Time (250μs/Div) Load Transient Response VOUT (mV/Div) ILOAD (A/Div) VIN = 2.5V, VOUT = 1.2V, CIN = COUT = 100μF Time (1ms/Div) Power Off from EN VEN (5V/Div) VOUT (500mV/Div) VIN = 5V, VOUT = 1.2V, ILOAD = 80mA Soft Start Time vs. CSS 0 1000 2000 3000 4000 5000 0 4 8 12 16 20 24 CSS (nF) S o ft S ta rt T im e ( u s) EN Threshold Voltage vs. Temperature 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 -50 -25 0 25 50 75 100 125 Temperature E N T h re sh o ld V o lta g e ( V ) Rising Falling (°C) Time (500μs/Div) Power On from EN VEN (5V/Div) VOUT (500mV/Div) VIN = 5V, VOUT = 1.2V, ILOAD = 80mA

Page 8

RT9008 7 DS9008-01 April 2011 Application Information Output Voltage Setting As shown in application circuit, the output voltage can be easy set by the external resistor divider of R1 and R2. OUT REF R1V V (1 ) R2 = + Where VREF is the feedback reference voltage (0.8V typical). Chip Enable Operation Pull the EN pin low (< 0.4V) to shutdown the device. During shutdown mode, the standby current is lower than 5μA. The external capacitor and load current determine the output voltage decay rate. Drive the EN pin high (>1.4V) to turn on the device again. Soft-Start Soft-Start provides for the monotonic, glitch-free turn-on of the regulator. Soft-start limits the input inrush current which may cause a glitch, especially if the source impedance is high. The soft-start is achieved by the controller ramping up to the error amplifier reference input. The RT9008 soft-start time is 190us when the soft-start capacitor is 1nF, 920μs for 4.7nF and 1.9ms for 10nF. Capacitors Selection Careful selection of the external capacitors is highly recommended for the best performance of the RT9008. Regarding the supply voltage capacitor (CCC) connecting a ceramic capacitor 1μF between the VCC and GND is a must. The capacitor CCC improves the supply voltage stability to provide chip normal operation. As to the input capacitor ,CIN, connecting a 100μF between the VIN, and GND is recommended to increase stability. With large capacitor value could result in better performance for both PSRR and line transient response. When driving external pass element, a 100μF electrolytic capacitor on the output capacitor (COUT) is recommended for stability. With larger capacitor, the RT9008 can reduce noise the improve load transient response and PSRR. MOSFET Selection and Thermal Consideration The RT9008 is designed to drive an external N-MOSFET pass element. MOSFET selection criteria include threshold voltage VGS (VTH), maximum continuous drain current ID, on-resistance RDS(ON), maximum drain-to-source voltage VDS and package thermal resistance θJA. The most critical specification is the MOSFET RDS(ON). The maximum allowed RDS(ON) can be calculated by the following formula : IN OUT DS(ON) LOAD V VR I −= For example, if the maximum load current is 2A, the input voltage is 1.5V and the output voltage is 1.2V, then RDS(ON) = (1.5V − 1.2V)/2A = 150mΩ. The MOSFET's RDS(ON) have to be selected to be lower than 150mΩ. A Philips PHD3055E MOSFET with an RDS(ON) of 120mΩ (typ.) is a good choice. After that, consider the thermal resistance from junction to ambient θJA of the MOSFET's package. The power dissipation is calculated by : PD = (VIN − VOUT) x ILOAD The thermal resistance from junction to ambient θJA can be calculated by : D AJ (JA) P )T(T − =θ In this example, PD = (1.5V − 1.2V) x 2A = 0.6W. The PHD3055E's θJA is 75°C/W for its D-PAK package, which translates to a 45°C temperature rise above ambient. The package provides exposed backsides that directly transfer heat to the PCB board. The RT9008 maximum power dissipation depends on the thermal resitance of the IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = (TJ(MAX) − TA) / θJA

Page 9

RT9008 8 DS9008-01 April Where TJ(MAX) is the maximum operation junction temperature, TA is the ambient temperature and the θJA is the junction to ambient resistance. For recommended operating conditions specification of the RT9008, the maximum junction temperature is 125°C. The junction to ambient thermal resistance θJA for SOT- 23-6 package is 250°C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum allowed power dissipation at TA = 25°C can be calculated by following formula : For SOT-23-6 package, PD(MAX) = (125°C − 25°C)/(250°C/W) = 0.400 W The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For RT9008 package, the Figure 3 of derating curve allows the designer to see the effect of rising ambient temperature on the maximum power dissipation allowed. Figure 3. Derating Curves for RT9008 Package Layout Considerations There are three critical layout considerations. One is the divider resistors should be located as close to the RT9008 FB pin as possible to minimize noise The second is the placement of capacitors. The CIN and COUT have to be placed near the N-MOSFET for improving performance. The third is the copper area for pass element, it should be as large as possible when the pass element operating under high power situation that could rise the junction temperature. Considering the package thermal resistance limitation, the copper area should be large enough to handle the power dissipation shown as Figure 4. Figure 4. PCB Layout Guide 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0 25 50 75 100 125 Ambient Temperature (°C) P o w e r D is si p a tio n ( W ) SOT-23-6 Single Layer PCB VCC DRI GNDGND VOUT VIN EN GND FB VCC DRI SS 4 2 3 56 R1 R2 COUT CIN CCC

RT9008GE Reviews

Average User Rating
5 / 5 (119)
★ ★ ★ ★ ★
5 ★
4 ★
3 ★
2 ★
1 ★


January 31, 2020

Excellent service and product arrives in reasonable shipping rates. Well done!


January 3, 2020

Arrived as described and well packaged. Sent very quickly after payment.


December 9, 2019

They work great and I hope to find more used for the extra ones.


October 26, 2019

Fast shipping. Got it in few dayss from Hong Kong


October 22, 2019

I have used 2 of the 10 units so far and they work fine.

Bro***** Suri

October 21, 2019

I enjoy doing business with Heisener, please keep up the GREAT Service!


October 12, 2019

Awesome!!! great prices, easy to order and great service, thank you!

San***** Nori

October 12, 2019

Heisener has been the best in this industry for many years. Very quick and easy if you know what you are looking for. if you don't know exactly what you are looking for, you are going to be lost.


October 7, 2019

No complaints. Works perfectly every single one of them! great quality! No bent pins either!


September 29, 2019

Super easy search and order process. Lots of Shipping and Payment Options, you can always find the best way for the purchase.

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