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SI2404-C-FTR

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SI2404-C-FTR

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Part Number SI2404-C-FTR
Manufacturer Silicon Labs
Description IC ISOMODE SYST-SIDE DAA 24TSSOP
Datasheet SI2404-C-FTR Datasheet
Package 24-TSSOP (0.173", 4.40mm Width)
In Stock 6,604 piece(s)
Unit Price $ 13.4018 *
Lead Time Can Ship Immediately
Estimated Delivery Time Sep 27 - Oct 2 (Choose Expedited Shipping)
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Part Number # SI2404-C-FTR (Interface - Modems - ICs and Modules) is manufactured by Silicon Labs and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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SI2404-C-FTR Specifications

ManufacturerSilicon Labs
CategoryIntegrated Circuits (ICs) - Interface - Modems - ICs and Modules
Datasheet SI2404-C-FTRDatasheet
Package24-TSSOP (0.173", 4.40mm Width)
SeriesISOmodem?
Data FormatV.21, V.22, V.23, V.29, Bell 103, Bell 212A
Baud Rates2.4k
Voltage - Supply3 V ~ 3.6 V
Mounting TypeSurface Mount
Package / Case24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package24-TSSOP

SI2404-C-FTR Datasheet

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Rev. 1.3 12/10 Copyright © 2010 by Silicon Laboratories Si2457/34/15/04 Ordering Information This data sheet is valid only for those chipset combinations listed on page 50. Pin Assignments CLKIN/XTALI 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 XTALO RI VD MISO/RXD MOSI/TXD SCLK/CTS RESET C2A C1A INT GND VA ESC DCD SS/RTS1 Si2457/34/15/04 (16-Pin Option) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Si2457/34/15/04 (24-Pin Option) CLKIN/XTALI XTALO CLKOUT/EECS/A0 FSYNC/D6 VD3.3 GND VDA SS/RTS/D7 MISO/RXD/RD MOSI/TXD/WR SCLK/CTS/CS RESET AOUT/INT RI/D1 SDI/EESD/D2 VDB VD3.3 ESC/D3 DCD/D4 GND SDO/EECLK/D5 INT/DO C1A C2A QE 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DCT RX IB C1B C2B VREG RNG1 RNG2 VREG2 SC QE2 QB DCT3 IGND DCT21 Si3018/10 Si2457/34/15/04 V.90, V.34, V.32BIS, V.22BIS ISOMODEM® WITH GLOBAL DAA Features Applications Description The ISOmodem® family of products is a complete modem ranging in speed from 56,000 bps to 2400 bps. Offered as a chipset with the Si2457, Si2434, Si2415, or Si2404 system-side device and the Si3018/10 line-side device, the ISOmodem utilizes Silicon Laboratories’ patented direct access arrangement (DAA) technology to provide a programmable telephone line interface with an unparalleled level of integration. These compact solutions eliminate the need for a separate DSP, modem controller, codec, transformer, relay, opto-isolators, clocking crystal, and 2-4 wire hybrid. Available with a system-side packaging option of either a 16-pin SOIC or a 24-pin TSSOP, these devices are ideal for embedded modem applications due to their flexibility, small footprint, and minimal external component count. System Block Diagram  This data sheet applies to Si2457/34/ 15/04 Revision D  Data modem formats ITU-T, Bell 300 bps up to 56 kbps V.21,V.22, V.29 Fast Connect V.44, V.42, V.42bis, MNP2-5 Automatic rate negotiation  Type I and II caller ID decode  No external ROM or RAM required  UART, SPI, or parallel interface  Flexible clock options Low-cost 32.768 kHz oscillator 4.915 MHz oscillator 27 MHz clock input  Integrated DAA Over 6000 V capacitive isolation Parallel phone detect Globally-compliant line interface Overcurrent detection  AT command set support  SMS / MMS support  Firmware upgradeable  EEPROM interface  Lead-free, RoHS-compliant packages  Commercial or industrial temperature range  DTMF detection/generation  Set-top boxes  Point-of-sale terminals  Text / video telephones  Digital video recorder  Digital televisions  Remote monitoring Host CPU Host Interface Telco Si24xx System Side Si3018 Line Side Global DAA BOM Tip Ring UART SPI Parallel Capacitive Isolation Barrier   

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Si2457/34/15/04 2 Rev. 1.3

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Si2457/34/15/04 Rev. 1.3 3 TABLE OF CONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3. Bill of Materials: Si2457/34/15/04 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1. Host Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2. Command Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.3. Data Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.4. Fast Connect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.5. V.80 Synchronous Access Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.6. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.7. Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.8. Data Compression . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.9. Error Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.10. Wire Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.11. Caller ID Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.12. Parallel Phone Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4.13. Overcurrent Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.14. Global Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.15. Firmware Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.16. DTMF Detection / Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.17. SMS/MMS Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.18. Codec Interface (24-Pin Version Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.19. EEPROM Interface (24-Pin Version Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.20. AT Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 4.21. Extended AT Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 5. S-Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 6. User-Access Registers (U-Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 7. Pin Descriptions: Si2457/34/15/04 (16-Pin Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 8. Pin Descriptions: Si2457/34/15/04 (24-Pin Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 9. Pin Descriptions: Si3018/10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 10. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 11. Package Markings (Top Markings) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 11.1. Si2457-D-FT Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 11.2. Si2457-D-FS Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 11.3. Si2434-D-FT Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 11.4. Si2434-D-FS Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 11.5. Si2415-D-FT Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 11.6. Si2415-D-FS Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 11.7. Si2404-D-FT Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 11.8. Si2404-D-FS Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.9. Si3010-F-FS Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 11.10. Si3018-F-FS Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 12. Package Outline: 24-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 13. 24-Pin TSSOP Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 14. Package Outline: 16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 15. 16-Pin SOIC Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

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Si2457/34/15/04 4 Rev. 1.3 1. Electrical Specifications Table 1. Recommended Operating Conditions Parameter1 Symbol Test Condition Min2 Typ Max2 Unit Ambient Temperature TA F-grade G-grade 0 –40 25 25 70 85 °C Si2457/34/15/04 Supply Voltage, Digital3 VD 3.0 3.3 3.6 V Notes: 1. The Si2457/34/15/04 specifications are guaranteed when the typical application circuit (including component tolerance) and any Si2457/34/15/04 and any Si3018 are used. See "2. Typical Application Schematic" on page 11. 2. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated. 3. The digital supply, VD, operates from 3.0 to 3.6 V. Table 2. Loop Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for F-grade, TA = –40 to 85 °C for G-grade) Parameter Symbol Test Condition Min Typ Max Unit DC Termination Voltage VTR IL = 20 mA, ILIM 1 = 0 DCV = 00, MINI = 11, DCR = 0 — — 6.0 V DC Termination Voltage VTR IL = 120 mA, ILIM = 0 DCV = 00, MINI = 11, DCR = 0 9 — — V DC Termination Voltage VTR IL = 20 mA, ILIM = 0 DCV = 11, MINI = 00, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 120 mA, ILIM = 0 DCV = 11, MINI = 00, DCR = 0 9 — — V DC Termination Voltage VTR IL = 20 mA, ILIM = 1 DCV = 11, MINI = 00, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 60 mA, ILIM = 1 DCV = 11, MINI = 00, DCR = 0 40 — — V DC Termination Voltage VTR IL = 50 mA, ILIM = 1 DCV = 11, MINI = 00, DCR = 0 — — 40 V On-Hook Leakage Current ILK VTR = –48 V — — 5 µA Operating Loop Current ILP MINI = 00, ILIM = 0 10 — 120 mA Operating Loop Current ILP MINI = 00, ILIM = 1 10 — 60 mA DC Ring Current DC current flowing through ring detection circuitry — 1.5 3 µA Ring Detect Voltage2 VRD RT = 0 12 15 18 VRMS Ring Detect Voltage2 VRD RT = 1 18 21 25 VRMS Ring Frequency FR 15 — 68 Hz Ringer Equivalence Number REN — — 0.2 Notes: 1. ILIM = U67, bit 9; DCV = U67, bits 3:2; MINI = U67, bits 13:12; DCR = U67, bit 7; RT = U67, bit 0. 2. The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected above the maximum.

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Si2457/34/15/04 Rev. 1.3 5 Figure 1. Test Circuit for Loop Characteristics Table 3. DC Characteristics, VD = 3.0 to 3.6 V (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for F-grade, TA = –40 to 85 °C for G-grade) Parameter Symbol Test Condition Min Typ Max Unit High Level Input Voltage VIH 2.0 — — V Low Level Input Voltage VIL — — 0.8 V High Level Output Voltage VOH IO = –2 mA 2.4 — — V Low Level Output Voltage VOL IO = 2 mA — — 0.35 V Input Leakage Current IL –10 — 10 µA Pullup Resistance Pins RPU 50 125 200 k Total Supply Current* ID — 17 35 mA Total Supply Current, Wake on Ring* ID — 4.4 — mA Total Supply Current, Powerdown* ID PDN = 1 — 80 — µA *Note: All inputs at 0 or VD. All inputs held static except clock and all outputs unloaded (Static IOUT = 0 mA). Si3018 TIP RING 10 µF 600  ILVTR + –

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Si2457/34/15/04 6 Rev. 1.3 Table 4. AC Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for F-grade, Fs = 8 kHz, TA = –40 to 85 °C for G-grade) Parameter Symbol Test Condition Min Typ Max Unit Sample Rate Fs — 8 — kHz Clock Input Frequency FXTL default — 4.9152 — MHz Clock Input Frequency FXTL 27 MHz Mode 1 — 27 — MHz Clock Input Frequency FXTL 32 kHz Mode 1 — 32.768 — kHz Receive Frequency Response Low –3 dBFS Corner, FILT = 0 — 5 — Hz Receive Frequency Response Low –3 dBFS Corner, FILT = 1 — 200 — Hz Transmit Full Scale Level2 VFS — 1.1 — VPEAK Receive Full Scale Level2,3 VFS — 1.1 — VPEAK Dynamic Range4 DR ILIM = 0, DCV = 11, MINI = 00 DCR = 0, IL = 100 mA — 80 — dB Dynamic Range4 DR ILIM = 0, DCV = 00, MINI = 11 DCR = 0, IL = 20 mA — 80 — dB Dynamic Range4 DR ILIM = 1, DCV = 11, MINI = 00 DCR = 0, IL = 50 mA — 80 — dB Transmit Total Harmonic Distor- tion5 THD ILIM = 0, DCV = 11, MINI = 00 DCR = 0, IL = 100 mA — –72 — dB Transmit Total Harmonic Distor- tion5 THD ILIM = 0, DCV = 00, MINI = 11 DCR = 0, IL = 20 mA — –78 — dB Receive Total Harmonic Distor- tion5 THD ILIM = 0, DCV = 00, MINI = 11 DCR = 0, IL = 20 mA — –78 — dB Receive Total Harmonic Distor- tion5 THD ILIM = 1,DCV = 11, MINI=00 DCR = 0, IL = 50 mA — –78 — dB Dynamic Range (Caller ID Mode) DRCID VIN = 1 kHz, –13 dBm — 50 — dB Notes: 1. Refer to “AN93: ISOmodem® Chipset Family Designer's Guide” for configuring clock input reset strapping. 2. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1 on page 5. 3. Receive full scale level produces –0.9 dBFS at DTX. 4. DR = 20 x log |Vin| + 20 x log (rms signal/rms noise). Applies to both transmit and receive paths. Vin = 1 kHz, –3 dBFS. 5. Vin = 1 kHz, –3 dBFS. THD = 20 x log (rms distortion/rms signal).

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Si2457/34/15/04 Rev. 1.3 7 Table 5. Absolute Maximum Ratings Parameter Symbol Value Unit DC Supply Voltage VD 4.1 V Input Current, Si2457/34/15/04 Digital Input Pins IIN ±10 mA Digital Input Voltage VIND –0.3 to (VD + 0.3) V CLKIN/XTALI Input Voltage VXIND –0.3 to (VD + 0.3) V Operating Temperature Range TA –10 to 100 °C Storage Temperature Range TSTG –40 to 150 °C Note: Permanent device damage may occur if the above absolute maximum ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 6. Switching Characteristics1 (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for F-grade, TA = –40 to 85 °C for G-grade) Parameter Symbol Min Typ Max Unit UART Timing Parameters Baud Rate Accuracy tBD –1 — 1 % Reset Timing Parameters RESET to RESET tRS 5.0 2 — — ms RESET to 1st AT Command tAT 300 — — ms Parallel Timing Parameters Address Setup tAS 15 — — ns Address Hold tAH 0 — — ns WR Low Pulse Width tWL 50 — — ns Write Data Setup Time tWDSU 20 — — ns Write Cycle Time tWC 120 — — ns Chip Select Setup tCSS 10 — — ns Chip Select Hold tCSH 0 — — ns RD Low Pulse Width tRL 50 — — ns RD Low to Data Driven Time tRLDD — — 20 ns Data Hold tDH 10 — — ns RD High to Hi-Z Time tDZ — — 30 ns Notes: 1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. 2. With 32.768 kHz clocking, allow 500 ms for the reset low-to-high minimum pulse on power-up and wake-from-power- down conditions.

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Si2457/34/15/04 8 Rev. 1.3 Figure 2. SPI Slave Timing Read Cycle Time tRC 120 — — ns Write to Read Cycle Time tWRC 120 — — ns Serial Peripheral Interface (SPI) Timing Parameters SS Falling to First SCLK Edge tSE 41 — — ns Last SCLK Edge to SS Rising tSD 41 — — ns SS Rising to MISO High-Z tSDZ — — 93 ns SCLK High Time tCKH 102 — — ns SCLK Low Time tCKL 102 — — ns MOSI Valid to SCLK Sample Edge tSIS 41 — — ns SCLK Sample Edge to MOSI Change tSIH 41 — — ns SCLK Shift Edge to MISO Change tSOH — — 93 ns SCLK cycle time tSCK 224 — — ns Inactive time between SS actives tNSS_INACT 81 — — ns Table 6. Switching Characteristics1 (Continued) (VD = 3.0 to 3.6 V, TA = 0 to 70 °C for F-grade, TA = –40 to 85 °C for G-grade) Parameter Symbol Min Typ Max Unit Notes: 1. All timing is referenced to the 50% level of the waveform. Input test levels are VIH = VD – 0.4 V, VIL = 0.4 V. 2. With 32.768 kHz clocking, allow 500 ms for the reset low-to-high minimum pulse on power-up and wake-from-power- down conditions. SCLK* T SE SS T CKH T CKL MOSI T SIS T SIH MISO T SD T SOH T SEZ T SDZ

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Si2457/34/15/04 Rev. 1.3 9 Figure 3. Parallel Interface Read Timing Figure 4. Parallel Interface Write Timing t CSH t CSS t AS t AH ADDRESS = 0 or 1 t RL t RC t RLDD t DH tRLDD VALID DATA VALID DATA A0 D[7:0] CS RD t DZ tCSHtCSS t AS tAH tW CtW L ADDRESS = 0 or 1 t W DSU t DH VALID DATA VALID DATA A0 D[7:0] CS W R

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I've placed many orders from Heisener . I have never had an error with any order, the order has always went out the same day, and the items are always well packaged.

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July 10, 2020

The capacitors were exactly the ones I wanted. Perfect fit.

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Every time I order, I get it correctly filled and faster than most of website. For a friendly use operate system, you guys are the best!

SI2404-C-FTR Guarantees

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If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.

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MB9AF341NBBGL-GE1 MB9AF341NBBGL-GE1 Cypress Semiconductor Corp, IC MCU 32BIT 96KB FLASH 112BGA, 112-LFBGA, ISOmodem? View
RXD-418-KH2 RXD-418-KH2 Linx Technologies Inc., RECEIVER RF 418MHZ SMT KH2 SER, 28-SMD, No Lead, ISOmodem? View
RNC60J1054BSB14 RNC60J1054BSB14 Vishay Dale, RES 1.05M OHM 1/4W .1% AXIAL, Axial, ISOmodem? View
AT0603DRD0713KL AT0603DRD0713KL Yageo, RES SMD 13K OHM 0.5% 1/10W 0603, 0603 (1608 Metric), ISOmodem? View
RZE05DHFR RZE05DHFR Sullins Connector Solutions, CONN EDGE DUAL FMALE 10POS 0.039, -, ISOmodem? View
RCM22DCBI-S189 RCM22DCBI-S189 Sullins Connector Solutions, CONN EDGE DUAL FMALE 44POS 0.156, -, ISOmodem? View
PL610-33D5C PL610-33D5C Microchip Technology, PICOXO DIVIDE BY 794 FOR 32.768K, -, ISOmodem? View
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SI2404-C-FTR

Certified Quality

Heisener's commitment to quality has shaped our processes for sourcing, testing, shipping, and every step in between. This foundation underlies each component we sell.

ISO9001:2015, ICAS, IAF, UKAS

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