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SI3050-E1-FTR

hot SI3050-E1-FTR

SI3050-E1-FTR

For Reference Only

Part Number SI3050-E1-FTR
Manufacturer Silicon Labs
Description IC VOICE DAA SYSTEM SIDE 20TSSOP
Datasheet SI3050-E1-FTR Datasheet
Package 20-TSSOP (0.173", 4.40mm Width)
In Stock 3836 piece(s)
Unit Price $ 3.8194 *
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SI3050-E1-FTR Specifications

ManufacturerSilicon Labs
CategoryIntegrated Circuits (ICs) - Interface - Telecom
Datasheet SI3050-E1-FTR Datasheet
Package20-TSSOP (0.173", 4.40mm Width)
Series-
FunctionDirect Access Arrangement (DAA)
InterfaceGCI, PCM, SPI
Number of Circuits1
Voltage - Supply3 V ~ 3.6 V
Current - Supply8.5mA
Operating Temperature0°C ~ 70°C
Mounting TypeSurface Mount
Package / Case20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package20-TSSOP

SI3050-E1-FTR Datasheet

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Rev. 1.5 10/11 Copyright © 2011 by Silicon Laboratories Si3050 + Si3011/18/19 Si3050+Si3011/18/19 PROGRAMMABLE VOICE DAA SOLUTIONS Features Applications Description The Si3050+Si3011/18/19 Voice DAA chipset provides a highly-programmable and globally-compliant foreign exchange office (FXO) analog interface. The solution implements Silicon Laboratories' patented isolation capacitor technology, which eliminates the need for costly isolation transformers, relays, or opto-isolators, while providing superior surge immunity for robust field performance. The Voice DAA is available as a chipset, a system-side device (Si3050) paired with a line-side device (Si3011/18/19). The Si3050 is available in a 20-pin TSSOP or a 24-pin QFN. The Si3011/18/19 is available in a 16-pin TSSOP, a 16-pin SOIC, or a 20-pin QFN and requires minimal external components. The Si3050 interfaces directly to standard telephony PCM interfaces. Functional Block Diagram  PCM highway data interface  µ-law/A-law companding  SPI control interface  GCI interface  80 dB dynamic range TX/RX  Line voltage monitor  Loop current monitor  +6 dBm or +3.2 dBm TX/RX level mode  Parallel handset detection  3 µA on-hook line monitor current  Overload detection  Programmable line interface AC termination DC termination Ring detect threshold Ringer impedance  TIP/RING polarity detection  Integrated codec and 2- to 4-wire analog hybrid  Programmable digital hybrid for near-end echo reduction  Polarity reversal detection  Programmable digital gain in 0.1 dB increments  Integrated ring detector  Type I and II caller ID support  Pulse dialing support  3.3 V power supply  Daisy-chaining for up to 16 devices  Greater than 5000 V isolation  Patented isolation technology  Ground start and loop start support  Available in Pb-free RoHS-compliant packages  DSL IADs  VoIP gateways  PBX and IP-PBX systems  Voice mail systems  DECT base stations Hybrid, AC and DC Terminations Ring Detect Off-Hook IB SC DCT VREG2 DCT2 DCT3 RNG1 RNG2 QB QE QE2 RX Si3018/19 VREG Si3050 Control Data Interface Isolation Interface CS SCLK SDI SDO SDI THRU Control Logic PCLK DTX DRX FSYNC Line Data Interface RG TGD TGDE RESET AOUT/INT RGDT Isolation Interface US Patent# 5,870,046 US Patent# 6,061,009 Ordering Information See page 106. Package Options Si3050 Si3011/18/19 GND RESET C2A C1A VA VDD GND 15 14 13 17 18 16 AO U T/ IN T R G N C N C TG D TG D E 10 11 1287 9 CS FSYNC PCKLK DTX DRX RGDT 4 5 6 2 1 3 SC LK SD IT H R N C N C SD O SD I 222324 20 1921 Si3050 Top View IGND PAD 1 Q E R N G 2 DCT3 QB QE2 C2B NC C1B IG N D R N G 1 SC RX IB D C T2 NC D C T IG N D VR EG 2 VR EG N C 2 5 4 3 6 15 12 13 14 7 1098 11 17181920 16

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Si3050 + Si3011/18/19 2 Rev. 1.5

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Si3050 + Si3011/18/19 Rev. 1.5 3 TABLE OF CONTENTS Section Page 1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 4. AOUT PWM Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 5. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 5.1. Line-Side Device Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21 5.2. Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.3. Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.4. Isolation Barrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.5. Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 5.6. Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 5.7. In-Circuit Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 5.8. Exception Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 5.9. Revision Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 5.10. Transmit/Receive Full-Scale Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 5.11. Parallel Handset Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 5.12. Line Voltage/Loop Current Sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 5.13. Off-Hook . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 5.14. Ground Start Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 5.15. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 5.16. DC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 5.17. AC Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 5.18. Ring Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33 5.19. Ring Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 5.20. Ringer Impedance and Threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 5.21. Pulse Dialing and Spark Quenching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34 5.22. Receive Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.23. Billing Tone Filter (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35 5.24. On-Hook Line Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 5.25. Caller ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36 5.26. Overload Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 5.27. Gain Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 5.28. Transhybrid Balance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 5.29. Filter Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 5.30. Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 5.31. Communication Interface Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 5.32. PCM Highway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 5.33. Companding in PCM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 5.34. 16 kHz Sampling Operation in PCM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 5.35. SPI Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47 5.36. GCI Highway . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50

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Si3050 + Si3011/18/19 4 Rev. 1.5 5.37. Companding in GCI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.38. 16 kHz Sampling Operation in GCI Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.39. Monitor Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 5.40. Summary of Monitor Channel Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 5.41. Device Address Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 5.42. Command Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 5.43. Register Address Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 5.44. SC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 5.45. Receive SC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 5.46. Transmit SC Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61 6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62 7. Pin Descriptions: Si3011/18/19 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103 8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .106 9. Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .107 10. Package Outline: 20-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108 10.1. PCB Land Pattern: Si3050 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110 11. Package Outline: 24-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111 12. PCB Land Pattern: Si3050 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113 13. Package Outline: 16-Pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 13.1. PCB Land Pattern: Si3011/18/19 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .117 14. Package Outline: 16-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .118 14.1. PCB Land Pattern: Si3011/18/19 TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .120 15. Package Outline: 20-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .121 16. PCB Land Pattern: Si3011/18/19 QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123 Silicon Labs Si3050 Support Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .125 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .128

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Si3050 + Si3011/18/19 Rev. 1.5 5 1. Electrical Specifications Table 1. Recommended Operating Conditions and Thermal Information Parameter1 Symbol Test Condition Min2 Typ Max2 Unit Ambient Temperature TA F-Grade 0 25 70 °C G-Grade –40 25 85 Si3050 Supply Voltage, Digital VD 3.0 3.3 3.6 V Thermal Resistance (Si3011/18/19)3 JA SOIC-16 — 77 — °C/WTSSOP-16 — 89 — QFN-20 — 120 — Thermal Resistance (Si3050)3 JA TSSOP-20 — 84 — °C/W QFN-24 — 67 — Notes: 1. The Si3050 specifications are guaranteed when the typical application circuit (including component tolerance) and any Si3050 and any Si3011/18/19 are used. See "2. Typical Application Schematic" on page 17 for the typical application circuit. 2. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise stated. 3. Operation above 125 °C junction temperature may degrade device reliability.

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Si3050 + Si3011/18/19 6 Rev. 1.5 Figure 1. Test Circuit for Loop Characteristics Table 2. Loop Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, see Figure 1 on page 6) Parameter Symbol Test Condition Min Typ Max Unit DC Termination Voltage VTR IL = 20 mA, ILIM = 0 DCV = 00, MINI = 11, DCR = 0 — — 6.0 V DC Termination Voltage VTR IL = 120 mA, ILIM = 0 DCV = 00, MINI = 11, DCR = 0 9 — — V DC Termination Voltage VTR IL = 20 mA, ILIM = 0 DCV = 11, MINI = 00, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 120 mA, ILIM = 0 DCV = 11, MINI = 00, DCR = 0 9 — — V DC Termination Voltage VTR IL = 20 mA, ILIM = 1 DCV = 11, MINI = 00, DCR = 0 — — 7.5 V DC Termination Voltage VTR IL = 60 mA, ILIM = 1 DCV = 11, MINI = 00, DCR = 0 40 — — V DC Termination Voltage VTR IL = 50 mA, ILIM = 1 DCV = 11, MINI = 00, DCR = 0 — — 40 V On-Hook Leakage Current ILK VTR = –48 V — — 5 µA Operating Loop Current ILP MINI = 00, ILIM = 0 10 — 120 mA Operating Loop Current ILP MINI = 00, ILIM = 1 10 — 60 mA DC Ring Current dc current flowing through ring detection circuitry — 1.5 3 µA Ring Detect Voltage* VRD RT2 = 0, RT = 0 13.5 15 16.5 Vrms Ring Detect Voltage* VRD RT2 = 0, RT = 1 19.35 21.5 23.65 Vrms Ring Detect Voltage* VRD RT2 = 1, RT = 1 40.5 45 49.5 Vrms Ring Frequency FR 13 — 68 Hz Ringer Equivalence Number REN — — 0.2 *Note: The ring signal is guaranteed to not be detected below the minimum. The ring signal is guaranteed to be detected above the maximum. TIP RING + – Si3011/18/19 VTR IL 10F 600 

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Si3050 + Si3011/18/19 Rev. 1.5 7 Table 3. DC Characteristics, VD = 3.0 to 3.6 V (VD = 3.0 to 3.6 V, TA = 0 to 70 °C) Parameter Symbol Test Condition Min Typ Max Unit High Level Input Voltage1 VIH 2.0 — — V Low Level Input Voltage1 VIL — — 0.8 V High Level Output Voltage VOH IO = –2 mA 2.4 — — V Low Level Output Voltage VOL IO = 2 mA — — 0.35 V AOUT High Level Voltage VAH IO = 10 mA 2.4 — — V AOUT Low Level Voltage VAL IO = 10 mA — — 0.35 V Input Leakage Current IL –10 — 10 µA Power Supply Current, Digital2 ID VD pin — 8.5 10 mA Total Supply Current, Sleep Mode2 ID PDN = 1, PDL = 0 — 5.0 6.0 mA Total Supply Current, Deep Sleep2,3 ID PDN = 1, PDL = 1 — 1.3 1.5 mA Notes: 1. VIH/VIL do not apply to C1A/C2A. 2. All inputs at 0.4 or VD – 0.4 (CMOS levels). All inputs are held static except clock and all outputs unloaded (Static IOUT = 0 mA). 3. RGDT is not functional in this state.

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Si3050 + Si3011/18/19 8 Rev. 1.5 Table 4. AC Characteristics (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, Fs = 8000 Hz, see "2. Typical Application Schematic" on page 17) Parameter Symbol Test Condition Min Typ Max Unit Sample Rate Fs 8 — 16 kHz PCLK Input Frequency PCLK 256 — 8192 kHz Receive Frequency Response Low –3 dBFS Corner, FILT = 0 — 5 — Hz Receive Frequency Response Low –3 dBFS Corner, FILT = 1 — 200 — Hz Transmit Full-Scale Level1 VFS FULL = 0 (0 dBm) — 1.1 — VPEAK FULL = 1 (+3.2 dBm)2 — 1.58 — VPEAK FULL2 = 1 (+6.0 dBm)2 — 2.16 — VPEAK Receive Full-Scale Level1,3 VFS FULL = 0 (0 dBm) — 1.1 — VPEAK FULL = 1 (+3.2 dBm)2 — 1.58 — VPEAK FULL2 = 1 (+6.0 dBm)2 — 2.16 — VPEAK Dynamic Range4,5,6 DR ILIM = 0, DCV = 11, MINI=00DCR = 0, IL = 100 mA — 80 — dB Dynamic Range4,5,6 DR ILIM = 0, DCV = 00, MINI=11DCR = 0, IL = 20 mA — 80 — dB Dynamic Range4,5,6 DR ILIM = 1, DCV = 11, MINI=00DCR = 0, IL = 50 mA — 80 — dB Transmit Total Harmonic Distortion6,7 THD ILIM = 0, DCV = 11, MINI=00 DCR = 0, IL = 100 mA — –72 — dB Transmit Total Harmonic Distortion6,7 THD ILIM = 0, DCV = 00, MINI=11 DCR = 0, IL = 20 mA — –78 — dB Receive Total Harmonic Distortion6,7 THD ILIM = 0, DCV = 00, MINI=11 DCR = 0, IL = 20 mA — –78 — dB Receive Total Harmonic Distortion6,7 THD ILIM = 1,DCV = 11, MINI=00 DCR = 0, IL = 50 mA — –78 — dB Notes: 1. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1 on page 6. 2. With FULL = 1, the transmit and receive full-scale level of +3.2 dBm can be achieved with a 600  ac termination. While the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all reference impedances. With FULL2 = 1, the transmit and receive full-scale level of +6.0 dBm can be achieved with a 600  termination. In this mode, the DAA will transmit and receive +1.5 dBV into all reference impedances. 3. Receive full-scale level produces –0.9 dBFS at DTX. 4. DR = 20 x log (RMS VFS/RMS Vin) + 20 x log (RMS Vin/RMS noise). The RMS noise measurement excludes harmonics. Here, VFS is the 0 dBm full-scale level per Note 1 above. 5. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. 6. Vin = 1 kHz, –3 dBFS. 7. THD = 20 x log (RMS distortion/RMS signal). 8. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log (RMS VIN/RMS noise). VCID is the 1.5 V full-scale level with the enhanced caller ID circuit. With the typical CID circuit, the VCID full-scale level is 6 V peak, and the DRCID decreases to 50 dB. 9. Refer to Tables 10–11 for relative gain accuracy characteristics (passband ripple). 10. Analog hybrid only. ZACIM controlled by ACIM in Register 30.

Page 10

Si3050 + Si3011/18/19 Rev. 1.5 9 Dynamic Range (Caller ID mode)8 DRCID VIN = 1 kHz, –13 dBFS — 62 — dB Caller ID Full-Scale Level8 VCID — 1.5 — VPEAK Gain Accuracy6,9 2-W to DTX, TXG2, RXG2, TXG3, and RXG3 = 0000 –0.5 0 0.5 dB Transhybrid Balance10 300–3.4 kHz, ZACIM = ZLINE 20 — — dB Transhybrid Balance10 1 kHz, ZACIM = ZLINE — 30 — dB Two-Wire Return Loss 300–3.4 kHz, all ac terminations 25 — — dB Two-Wire Return Loss 1 kHz, all ac terminations — 32 — dB Table 5. Absolute Maximum Ratings Parameter Symbol Value Unit DC Supply Voltage VD –0.5 to 3.6 V Input Current, Si3050 Digital Input Pins IIN ±10 mA Digital Input Voltage VIND –0.3 to (VD + 0.3) V Ambient Operating Temperature Range TA –40 to 100 °C Storage Temperature Range TSTG –65 to 150 °C Note: Permanent device damage can occur if the above Absolute Maximum Ratings are exceeded. Functional operation should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods might affect device reliability. Table 4. AC Characteristics (Continued) (VD = 3.0 to 3.6 V, TA = 0 to 70 °C, Fs = 8000 Hz, see "2. Typical Application Schematic" on page 17) Parameter Symbol Test Condition Min Typ Max Unit Notes: 1. Measured at TIP and RING with 600 termination at 1 kHz, as shown in Figure 1 on page 6. 2. With FULL = 1, the transmit and receive full-scale level of +3.2 dBm can be achieved with a 600  ac termination. While the transmit and receive level in dBm varies with reference impedance, the DAA will transmit and receive 1 dBV into all reference impedances. With FULL2 = 1, the transmit and receive full-scale level of +6.0 dBm can be achieved with a 600  termination. In this mode, the DAA will transmit and receive +1.5 dBV into all reference impedances. 3. Receive full-scale level produces –0.9 dBFS at DTX. 4. DR = 20 x log (RMS VFS/RMS Vin) + 20 x log (RMS Vin/RMS noise). The RMS noise measurement excludes harmonics. Here, VFS is the 0 dBm full-scale level per Note 1 above. 5. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths. 6. Vin = 1 kHz, –3 dBFS. 7. THD = 20 x log (RMS distortion/RMS signal). 8. DRCID = 20 x log (RMS VCID/RMS VIN) + 20 x log (RMS VIN/RMS noise). VCID is the 1.5 V full-scale level with the enhanced caller ID circuit. With the typical CID circuit, the VCID full-scale level is 6 V peak, and the DRCID decreases to 50 dB. 9. Refer to Tables 10–11 for relative gain accuracy characteristics (passband ripple). 10. Analog hybrid only. ZACIM controlled by ACIM in Register 30.

SI3050-E1-FTR Reviews

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Cast*****Noble

December 1, 2019

the parts work as they should. Amazing price perfect all round many thanks

Deand*****intosh

November 30, 2019

Perfectly satisfied with item. Top supplier on my list.

Mor***** Lara

November 26, 2019

happy with the IC and received with perfect packaging, good comunication with seller thanks.

Valen*****Howell

September 14, 2019

These are a great value at this price.

Mali*****eema

September 12, 2019

EXACTLY what I was looking for -- one piece with a low forward voltage drop to isolate some DC power sources. They work fantastic!

Wre*****owe

August 8, 2019

Very friendly online shopping site - easy to navigate and it keeps vital datasheet for each product online purchase.

Celes*****rding

July 1, 2019

Perfectly functioning!! on time and as described!

Trev*****imon

June 21, 2019

Super easy to replace and labelled terminals made it a quick replacement.

Ley*****Moyer

June 6, 2019

Exactly as listed and arrived very fast, excellent price and service!

Tar*****ills

May 9, 2019

Received Quickly. Excellent Communication. Capacitors Look Excellent

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