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SI8645BD-B-IS

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SI8645BD-B-IS

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Part Number SI8645BD-B-IS
Manufacturer Silicon Labs
Description DGTL ISO 5KV 4CH GEN PURP 16SOIC
Datasheet SI8645BD-B-IS Datasheet
Package 16-SOIC (0.295", 7.50mm Width)
In Stock 5,080 piece(s)
Unit Price $ 3.5900 *
Lead Time Can Ship Immediately
Estimated Delivery Time Oct 23 - Oct 28 (Choose Expedited Shipping)
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Part Number # SI8645BD-B-IS (Digital Isolators) is manufactured by Silicon Labs and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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SI8645BD-B-IS Specifications

ManufacturerSilicon Labs
CategoryIsolators - Digital Isolators
Datasheet SI8645BD-B-ISDatasheet
Package16-SOIC (0.295", 7.50mm Width)
SeriesAutomotive, AEC-Q100
TechnologyCapacitive Coupling
TypeGeneral Purpose
Isolated PowerNo
Number of Channels4
Inputs - Side 1/Side 24/0
Channel TypeUnidirectional
Voltage - Isolation5000Vrms
Common Mode Transient Immunity (Min)35kV/µs
Data Rate150Mbps
Propagation Delay tpLH / tpHL (Max)13ns, 13ns
Pulse Width Distortion (Max)4.5ns
Rise / Fall Time (Typ)2.5ns, 2.5ns
Voltage - Supply2.5 V ~ 5.5 V
Operating Temperature-40°C ~ 125°C
Package / Case16-SOIC (0.295", 7.50mm Width)
Supplier Device Package16-SOIC

SI8645BD-B-IS Datasheet

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Si864x Data Sheet Low-Power Quad-Channel Digital Isolators Silicon Lab's family of ultra-low-power digital isolators are CMOS devices offering sub- stantial data rate, propagation delay, power, size, reliability, and external BOM advan- tages over legacy isolation technologies. The operating parameters of these products remain stable across wide temperature ranges and throughout device service life for ease of design and highly uniform performance. All device versions have Schmitt trigger inputs for high noise immunity and only require VDD bypass capacitors. Data rates up to 150 Mbps are supported, and all devices achieve propagation delays of less than 10 ns. Enable inputs provide a single point control for enabling and disabling output drive. Ordering options include a choice of isolation ratings (1.0, 2.5, 3.75 and 5 kV) and a selectable fail-safe operating mode to control the default output state during power loss. All products >1 kV are safety certified by UL, CSA, VDE, and CQC, and products in wide-body packages support reinforced insulation withstanding up to 5 kVRMS. Automotive Grade is available for certain part numbers. These products are built using automotive-specific flows at all steps in the manufacturing process to ensure the robust- ness and low defectivity required for automotive applications. KEY FEATURES • High-speed operation • DC to 150 Mbps • No start-up initialization required • Wide Operating Supply Voltage • 2.5–5.5 V • Up to 5000 VRMS isolation • Reinforced VDE 0884-10, 10 kV surge- capable (Si864xxT) • 60-year life at rated working voltage • High electromagnetic immunity • Ultra low power (typical) 5 V Operation • 1.6 mA per channel at 1 Mbps • 5.5 mA per channel at 100 Mbps 2.5 V Operation • 1.5 mA per channel at 1 Mbps • 3.5 mA per channel at 100 Mbps • Tri-state outputs with ENABLE • Schmitt trigger inputs • Selectable fail-safe mode • Default high or low output (ordering option) • Precise timing (typical) • 10 ns propagation delay • 1.5 ns pulse width distortion • 0.5 ns channel-channel skew • 2 ns propagation delay skew • 5 ns minimum pulse width • Transient Immunity 50 kV/µs • AEC-Q100 qualification • Wide temperature range • –40 to 125 °C • RoHS-compliant packages • SOIC-16 wide body • SOIC-16 narrow body • QSOP-16 • Automotive-grade OPNs available • AIAG compliant PPAP documentation support • IMDS and CAMDS listing support Industrial Applications • Industrial automation systems • Medical electronics • Isolated switch mode supplies • Isolated ADC, DAC • Motor control • Power inverters • Communications systems Safety Regulatory Approvals • UL 1577 recognized • Up to 5000 VRMS for 1 minute • CSA component notice 5A approval • IEC 60950-1, 62368-1, 60601-1 (re- inforced insulation) • VDE certification conformity • Si864xxT options certified to rein- forced VDE 0884-10 • All other options certified to basic VDE 0884-10 and reinforced 60950-1 • CQC certification approval • GB4943.1 Automotive Applications • On-board chargers • Battery management systems • Charging stations • Traction inverters • Hybrid Electric Vehicles • Battery Electric Vehicles silabs.com | Building a more connected world. Rev. 2.13

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1. Ordering Guide Table 1.1. Ordering Guide for Valid OPNs1, 2 Ordering Part Number (OPN) Number of Inputs VDD1 Side Number of Inputs VDD2 Side Max Data Rate (Mbps) Default Output State Isolation Rating (kV) Temp (°C) Package QSOP-16 Packages Si8640BA-B-IU 4 0 150 Low 1.0 –40 to 125 °C QSOP-16 Si8640BB-B-IU 4 0 150 Low 2.5 –40 to 125 °C QSOP-16 Si8640EB-B-IU 4 0 150 High 2.5 –40 to 125 °C QSOP-16 Si8641BA-B-IU 3 1 150 Low 1.0 –40 to 125 °C QSOP-16 Si8641BA-C-IU 3 1 150 Low 1.0 –40 to 125 °C QSOP-16 Si8641BB-B-IU 3 1 150 Low 2.5 –40 to 125 °C QSOP-16 Si8641EB-B-IU 3 1 150 High 2.5 –40 to 125 °C QSOP-16 Si8642BA-B-IU 2 2 150 Low 1.0 –40 to 125 °C QSOP-16 Si8642BA-C-IU 2 2 150 Low 1.0 –40 to 125 °C QSOP-16 Si8642BB-B-IU 2 2 150 Low 2.5 –40 to 125 °C QSOP-16 Si8642EA-B-IU 2 2 150 High 1.0 –40 to 125 °C QSOP-16 Si8642EB-B-IU 2 2 150 High 2.5 –40 to 125 °C QSOP-16 Si8645BA-B-IU 4 0 150 Low 1.0 –40 to 125 °C QSOP-16 Si8645BA-C-IU 4 0 150 Low 1.0 –40 to 125 °C QSOP-16 Si8645BB-B-IU 4 0 150 Low 2.5 –40 to 125 °C QSOP-16 SOIC-16 Packages Si8640BB-B-IS1 4 0 150 Low 2.5 –40 to 125 °C NB SOIC-16 Si8640BB-B-IS 4 0 150 Low 2.5 –40 to 125 °C WB SOIC-16 Si8640BC-B-IS1 4 0 150 Low 3.75 –40 to 125 °C NB SOIC-16 Si8640BD-B-IS2 4 0 150 Low 5.0 –40 to 125 ˚C WB SOIC-16 (8 mm creepage)4 Si8640BD-B-IS 4 0 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8640EC-B-IS1 4 0 150 High 3.75 –40 to 125 °C NB SOIC-16 Si8640ED-B-IS2 4 0 150 High 5.0 –40 to 125 ˚C WB SOIC-16 (8 mm creepage)4 Si8640ED-B-IS 4 0 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8641BB-B-IS1 3 1 150 Low 2.5 –40 to 125 °C NB SOIC-16 Si8641BB-B-IS 3 1 150 Low 2.5 –40 to 125 °C WB SOIC-16 Si8641BC-B-IS1 3 1 150 Low 3.75 –40 to 125 °C NB SOIC-16 Si8641BD-B-IS2 3 1 150 Low 5.0 –40 to 125 °C WB SOIC-16 (8 mm creepage)4 Si864x Data Sheet Ordering Guide silabs.com | Building a more connected world. Rev. 2.13 | 2

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Ordering Part Number (OPN) Number of Inputs VDD1 Side Number of Inputs VDD2 Side Max Data Rate (Mbps) Default Output State Isolation Rating (kV) Temp (°C) Package Si8641BD-B-IS 3 1 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8641EC-B-IS1 3 1 150 High 3.75 –40 to 125 °C NB SOIC-16 Si8641ED-B-IS2 3 1 150 High 5.0 –40 to 125 °C WB SOIC-16 (8 mm creepage)4 Si8641ED-B-IS 3 1 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8642BB-B-IS1 2 2 150 Low 2.5 –40 to 125 °C NB SOIC-16 Si8642BB-B-IS 2 2 150 Low 2.5 –40 to 125 °C WB SOIC-16 Si8642BC-B-IS1 2 2 150 Low 3.75 –40 to 125 °C NB SOIC-16 Si8642BD-B-IS2 2 2 150 Low 5.0 –40 to 125 °C WB SOIC-16 (8 mm creepage)4 Si8642BD-B-IS 2 2 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8642EC-B-IS1 2 2 150 High 3.75 –40 to 125 °C NB SOIC-16 Si8642ED-B-IS2 2 2 150 High 5.0 –40 to 125 °C WB SOIC-16 (8 mm creepage)4 Si8642ED-B-IS 2 2 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8645BB-B-IS1 4 0 150 Low 2.5 –40 to 125 °C NB SOIC-16 Si8645BB-B-IS 4 0 150 Low 2.5 –40 to 125 °C WB SOIC-16 Si8645BC-B-IS1 4 0 150 Low 3.75 –40 to 125 °C NB SOIC-16 Si8645BD-B-IS 4 0 150 Low 5.0 –40 to 125 °C WB SOIC-16 Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability Si8640BT-IS 4 0 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8640ET-IS 4 0 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8641BT-IS 3 1 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8641ET-IS 3 1 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8642BT-IS 2 2 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8642ET-IS 2 2 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8645BT-IS 4 0 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8645ET-IS 4 0 150 Low 5.0 –40 to 125 °C WB SOIC-16 Note: 1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica- tions and peak solder temperatures. 2. “Si” and “SI” are used interchangeably. 3. An "R" at the end of the part number denotes tape and reel packaging option. 4. The package designated IS2 has a design that eliminates tie bars, thus allowing for extra creepage distance while maintaining standard WB SOIC-16 package dimensions and land pattern. Si864x Data Sheet Ordering Guide silabs.com | Building a more connected world. Rev. 2.13 | 3

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Automotive Grade OPNs Automotive-grade devices are built using automotive-specific flows at all steps in the manufacturing process to ensure robustness and low defectivity. These devices are supported with AIAG-compliant Production Part Approval Process (PPAP) documentation, and fea- ture International Material Data System (IMDS) and China Automotive Material Data System (CAMDS) listing. Qualifications are compli- ant with AEC-Q100, and a zero-defect methodology is maintained throughout definition, design, evaluation, qualification, and mass pro- duction steps. Table 1.2. Ordering Guide for Automotive Grade OPNs1, 2, 4, 5 Ordering Part Number (OPN) Number of Inputs VDD1 Side Number of Inputs VDD2 Side Max Data Rate (Mbps) Default Output State Isolation Rating (kV) Temp (°C) Package QSOP-16 Packages Si8642EA-AU 2 2 150 High 1.0 –40 to 125 °C QSOP-16 SOIC-16 Packages Si8640BB-AS 4 0 150 Low 2.5 –40 to 125 °C WB SOIC-16 Si8640BD-AS 4 0 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8640ED-AS 4 0 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8641BB-AS1 3 1 150 Low 2.5 –40 to 125 °C NB SOIC-16 Si8641BC-AS1 3 1 150 Low 3.75 –40 to 125 °C NB SOIC-16 Si8641BD-AS 3 1 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8641ED-AS 3 1 150 High 5.0 –40 to 125 °C WB SOIC-16 Si8642BB-AS1 2 2 150 Low 2.5 –40 to 125 °C NB SOIC-16 Si8642BD-AS 2 2 150 Low 5.0 –40 to 125 °C WB SOIC-16 Si8642EC-AS1 2 2 150 High 3.75 –40 to 125 °C NB SOIC-16 Si8642ED-AS 2 2 150 High 5.0 –40 to 125 °C WB SOIC-16 Product Options with Reinforced VDE 0884-10 Rating with 10 kV Surge Capability Si8642ET-AS 2 2 150 High 5.0 –40 to 125 °C WB SOIC-16 Note: 1. All packages are RoHS-compliant with peak reflow temperatures of 260 °C according to the JEDEC industry standard classifica- tions. 2. “Si” and “SI” are used interchangeably. 3. An "R" at the end of the part number denotes tape and reel packaging option. 4. Automotive-Grade devices (with an "–A" suffix) are identical in construction materials, topside marking, and electrical parameters to their Industrial-Grade (with a "–I" suffix) version counterparts. Automotive-Grade products are produced utilizing full automotive process flows and additional statistical process controls throughout the manufacturing flow. The Automotive-Grade part number is included on shipping labels. 5. Additional Ordering Part Numbers may be available in Automotive-Grade. Please contact your local Silicon Labs sales represen- tative for further information. Si864x Data Sheet Ordering Guide silabs.com | Building a more connected world. Rev. 2.13 | 4

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Table of Contents 1. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2. Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Eye Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Device Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.1 Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.2 Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.3 Layout Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.3.1 Supply Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.3.2 Output Pin Termination. . . . . . . . . . . . . . . . . . . . . . . . . .10 3.4 Fail-Safe Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.5 Typical Performance Characteristics. . . . . . . . . . . . . . . . . . . . . . .11 4. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 12 5. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 6. Package Outline (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . 29 7. Land Pattern (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . . 31 8. Package Outline (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . .32 9. Land Pattern (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . 34 10. Package Outline (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . 35 11. Land Pattern (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . . 37 12. Top Marking (16-Pin Wide Body SOIC) . . . . . . . . . . . . . . . . . . . . 38 13. Top Marking (16-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . .39 14. Top Marking (16-Pin QSOP) . . . . . . . . . . . . . . . . . . . . . . . . 40 15. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 silabs.com | Building a more connected world. Rev. 2.13 | 5

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2. Functional Description 2.1 Theory of Operation The operation of an Si864x channel is analogous to that of an opto coupler, except an RF carrier is modulated instead of light. This simple architecture provides a robust isolated data path and requires no special considerations or initialization at start-up. A simplified block diagram for a single Si864x channel is shown in the figure below. Figure 2.1. Simplified Channel Diagram A channel consists of an RF Transmitter and RF Receiver separated by a semiconductor-based isolation barrier. Referring to the trans- mitter, input A modulates the carrier provided by an RF oscillator using on/off keying. The Receiver contains a demodulator that de- codes the input state according to its RF energy content and applies the result to output B via the output driver. This RF on/off keying scheme is superior to pulse code schemes as it provides best-in-class noise immunity, low power consumption, and improved immunity to magnetic fields. See the following figure for more details. Figure 2.2. Modulation Scheme Si864x Data Sheet Functional Description silabs.com | Building a more connected world. Rev. 2.13 | 6

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2.2 Eye Diagram The figure below illustrates an eye diagram taken on an Si8640. For the data source, the test used an Anritsu (MP1763C) Pulse Pattern Generator set to 1000 ns/div. The output of the generator's clock and data from an Si8640 were captured on an oscilloscope. The re- sults illustrate that data integrity was maintained even at the high data rate of 150 Mbps. The results also show that 2 ns pulse width distortion and 350 ps peak jitter were exhibited. Figure 2.3. Eye Diagram Si864x Data Sheet Functional Description silabs.com | Building a more connected world. Rev. 2.13 | 7

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3. Device Operation Device behavior during start-up, normal operation, and shutdown is shown in Figure 3.1 Device Behavior during Normal Operation on page 10, where UVLO+ and UVLO– are the respective positive-going and negative-going thresholds. Refer to the following tables to determine outputs when power supply (VDD) is not present and for logic conditions when enable pins are used. Table 3.1. Si86xx Logic Operation VI Input1, 2 EN Input1, 2, 3, 4 VDDI State1, 5, 6 VDDO State1, 5, 6 VO Output1, 2 Comments H H or NC P P H Enabled, normal operation. L H or NC P P L X7 L P P Hi-Z8 Disabled. X7 H or NC UP P L9 H9 Upon transition of VDDI from unpowered to powered, VO returns to the same state as VI in less than 1 µs. X7 L UP P Hi-Z8 Disabled. X7 X7 P UP Undetermined Upon transition of VDDO from unpowered to powered, VO returns to the same state as VI within 1 µs, if EN is in either the H or NC state. Upon transition of VDDO from unpow- ered to powered, VO returns to Hi-Z within 1 µs if EN is L. Note: 1. VDDI and VDDO are the input and output power supplies. VI and VO are the respective input and output terminals. EN is the enable control input located on the same output side. 2. X = not applicable; H = Logic High; L = Logic Low; Hi-Z = High Impedance. 3. It is recommended that the enable inputs be connected to an external logic high or low level when the Si86xx is operating in noisy environments. 4. No Connect (NC) replaces EN1 on Si8640/45. No Connect replaces EN2 on the Si8645. No Connects are not internally connec- ted and can be left floating, tied to VDD, or tied to GND. 5. “Powered” state (P) is defined as 2.5 V < VDD < 5.5 V. 6. “Unpowered” state (UP) is defined as VDD = 0 V. 7. Note that an I/O can power the die for a given side through an internal diode if its source has adequate current. 8. When using the enable pin (EN) function, the output pin state is driven into a high-impedance state when the EN pin is disabled (EN = 0). 9. See 1. Ordering Guide for details. This is the selectable fail-safe operating mode (ordering option). Some devices have default output state = H, and some have default output state = L, depending on the ordering part number (OPN). For default high devi- ces, the data channels have pull-ups on inputs/outputs. For default low devices, the data channels have pull-downs on inputs/ outputs. Si864x Data Sheet Device Operation silabs.com | Building a more connected world. Rev. 2.13 | 8

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Table 3.2. Enable Input Truth Part Number EN11, 2 EN21, 2 Operation Si8640 — H Outputs B1, B2, B3, B4 are enabled and follow the input state. — L Outputs B1, B2, B3, B4 are disabled and in high impedance state.3 Si8641 H X Output A4 enabled and follows the input state. L X Output A4 disabled and in high impedance state.3 X H Outputs B1, B2, B3 are enabled and follow the input state. X L Outputs B1, B2, B3 are disabled and in high impedance state.3 Si8642 H X Outputs A3 and A4 are enabled and follow the input state. L X Outputs A3 and A4 are disabled and in high impedance state.3 X H Outputs B1 and B2 are enabled and follow the input state. X L Outputs B1 and B2 are disabled and in high impedance state.3 Si8645 — — Outputs B1, B2, B3, B4 are enabled and follow the input state. Note: 1. Enable inputs EN1 and EN2 can be used for multiplexing, for clock sync, or other output control. EN1, EN2 logic operation is summarized for each isolator product in Table 2. These inputs are internally pulled-up to local VDD allowing them to be connec- ted to an external logic level (high or low) or left floating. To minimize noise coupling, do not connect circuit traces to EN1 or EN2 if they are left floating. If EN1, EN2 are unused, it is recommended they be connected to an external logic level, especially if the Si86xx is operating in a noisy environment. 2. X = not applicable; H = Logic High; L = Logic Low. 3. When using the enable pin (EN) function, the output pin state is driven into a high-impedance state when the EN pin is disabled (EN = 0). Si864x Data Sheet Device Operation silabs.com | Building a more connected world. Rev. 2.13 | 9

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