SP3010-04UTG

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© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Description Applications The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. Features • ESD, IEC 61000-4-2, ±8kV contact, ±15kV air • EFT, IEC 61000-4-4, 40A (5/50ns) • Lightning, IEC 61000- 4-5 2nd edition, 3A (tP=8/20μs) • Low capacitance of 0.45pF (TYP) per I/O • Low leakage current of 0.1μA (TYP) at 5V • Small form factor μDFN( JEDEC MO-229) package saves board space • RoHS compliant and lead-free • LCD/PDP TVs • DVD Players • Desktops • MP3/PMP • Set Top Boxes • Mobile Phones • Notebooks • Digital Cameras Pinout 5 4 3 2 1 6 7 8 9 10 Functional Block Diagram GND (Pins 3,8) Pin 5 Pin 2 Pin 1 Pin 4 *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example SP3010 Series 0.45pF Diode Array O ut si de W or ld Signal Ground HDMI Port HDMI Chipset D0+ D0- CLK+ CLK- D2+ D2- D1+ D1- * Package is shown as transparent SP3010-04 SP3010-04 Ground Ground Case Ground Ground Ground Additional Information Datasheet Resources Samples

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© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3.0 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 6.0 V Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 0.1 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 10.8 V IPP=2A, tp=8/20µs, Fwd 12.3 V Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 1.5 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V 0.45 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Insertion Loss (S21) I/O to GNDCapacitance vs. Bias Voltage Clamping Voltage vs. IPP 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O Bias Voltage (V) I/ O C ap ac it an ce (p F) 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 1.51.0 2.0 2.5 3.0 Peak Pulse Current-IPP (A) C la m p V o lt ag e (V C ) -30 -25 -20 -15 -10 -5 0 10 100 1000 10000 Frequency (MHz) A tt en u at io n (d B ) Pulse Waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) P er ce n t o f I PP

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© 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3010 Series Time Te m pe ra tu re TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Ramp-up Ramp-down Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System Part Marking System SP 3010 04 U T G Series Package µDFN-10 (2.5x1.0mm) T= Tape & Reel G= Green Number of Channels -04 = 4 Channel TVS Diode Arrays (SPA® Diodes) Q * 4 Product Series Q = SP3010 Assembly Site Number of Channels Part Number Package Marking Min. Order Qty. SP3010-04UTG µDFN-10 Q*4 3000 Ordering Information