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STM32F103RCT6

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STM32F103RCT6

For Reference Only

Part Number STM32F103RCT6
Manufacturer STMicroelectronics
Description IC MCU 32BIT 256KB FLASH 64LQFP
Datasheet STM32F103RCT6 Datasheet
Package 64-LQFP
In Stock 24,414 piece(s)
Unit Price $ 7.8000 *
Lead Time Can Ship Immediately
Estimated Delivery Time Sep 27 - Oct 2 (Choose Expedited Shipping)
Request for Quotation

Part Number # STM32F103RCT6 (Embedded - Microcontrollers) is manufactured by STMicroelectronics and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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STM32F103RCT6 Specifications

ManufacturerSTMicroelectronics
CategoryIntegrated Circuits (ICs) - Embedded - Microcontrollers
Datasheet STM32F103RCT6Datasheet
Package64-LQFP
SeriesSTM32 F1
Core ProcessorARM? Cortex?-M3
Core Size32-Bit
Speed72MHz
ConnectivityCAN, I2C, IrDA, LIN, SPI, UART/USART, USB
PeripheralsDMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number of I/O51
Program Memory Size256KB (256K x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size48K x 8
Voltage - Supply (Vcc/Vdd)2 V ~ 3.6 V
Data ConvertersA/D 16x12b; D/A 2x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 85°C (TA)
Mounting Type-
Package / Case64-LQFP
Supplier Device Package-

STM32F103RCT6 Datasheet

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July 2018 DS5792 Rev 13 1/143 STM32F103xC, STM32F103xD, STM32F103xE High-density performance line Arm®-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Datasheet − production data Features • Core: Arm® 32-bit Cortex®-M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division • Memories – 256 to 512 Kbytes of Flash memory – up to 64 Kbytes of SRAM – Flexible static memory controller with 4 Chip Select. Supports Compact Flash, SRAM, PSRAM, NOR and NAND memories – LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4-to-16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC with calibration – 32 kHz oscillator for RTC with calibration • Low power – Sleep, Stop and Standby modes – VBAT supply for RTC and backup registers • 3 × 12-bit, 1 µs A/D converters (up to 21 channels) – Conversion range: 0 to 3.6 V – Triple-sample and hold capability – Temperature sensor • 2 × 12-bit D/A converters • DMA: 12-channel DMA controller – Supported peripherals: timers, ADCs, DAC, SDIO, I2Ss, SPIs, I2Cs and USARTs • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex®-M3 Embedded Trace Macrocell™ • Up to 112 fast I/O ports – 51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant • Up to 11 timers – Up to four 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input – 2 × 16-bit motor control PWM timers with dead- time generation and emergency stop – 2 × watchdog timers (Independent and Window) – SysTick timer: a 24-bit downcounter – 2 × 16-bit basic timers to drive the DAC • Up to 13 communication interfaces – Up to 2 × I2C interfaces (SMBus/PMBus) – Up to 5 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) – Up to 3 SPIs (18 Mbit/s), 2 with I2S interface multiplexed – CAN interface (2.0B Active) – USB 2.0 full speed interface – SDIO interface • CRC calculation unit, 96-bit unique ID • ECOPACK® packages Table 1.Device summary Reference Part number STM32F103xC STM32F103RC STM32F103VC STM32F103ZC STM32F103xD STM32F103RD STM32F103VD STM32F103ZD STM32F103xE STM32F103RE STM32F103ZE STM32F103VE LQFP64 10 × 10 mm, LQFP100 14 × 14 mm, LQFP144 20 × 20 mm LFBGA100 10 × 10 mm LFBGA144 10 × 10 mm WLCSP64 www.st.com

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Contents STM32F103xC, STM32F103xD, STM32F103xE 2/143 DS5792 Rev 13 Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.2 Full compatibility throughout the family . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.1 Arm® Cortex®-M3 core with embedded Flash and SRAM . . . . . . . . . . 15 2.3.2 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.3 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . 15 2.3.4 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.5 FSMC (flexible static memory controller) . . . . . . . . . . . . . . . . . . . . . . . . 15 2.3.6 LCD parallel interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.3.7 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 16 2.3.8 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . 16 2.3.9 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2.3.10 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.11 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.12 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.13 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 2.3.14 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.3.15 DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2.3.16 RTC (real-time clock) and backup registers . . . . . . . . . . . . . . . . . . . . . . 18 2.3.17 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2.3.18 I²C bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.19 Universal synchronous/asynchronous receiver transmitters (USARTs) 21 2.3.20 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.21 Inter-integrated sound (I2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 2.3.22 SDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.23 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.24 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.25 GPIOs (general-purpose inputs/outputs) . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.26 ADC (analog to digital converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 2.3.27 DAC (digital-to-analog converter) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2.3.28 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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DS5792 Rev 13 3/143 STM32F103xC, STM32F103xD, STM32F103xE Contents 4 2.3.29 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 24 2.3.30 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 3 Pinouts and pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 4 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 5.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 5.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 5.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 5.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 45 5.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 45 5.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 5.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 5.3.6 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 5.3.7 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 5.3.8 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 5.3.9 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 5.3.10 FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 5.3.11 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 5.3.12 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 87 5.3.13 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 5.3.14 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 5.3.15 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 5.3.16 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 5.3.17 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 5.3.18 CAN (controller area network) interface . . . . . . . . . . . . . . . . . . . . . . . . 106 5.3.19 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

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Contents STM32F103xC, STM32F103xD, STM32F103xE 4/143 DS5792 Rev 13 5.3.20 DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 5.3.21 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 6.1 LFBGA144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 6.2 LFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 6.3 WLCSP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 6.4 LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122 6.5 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 6.6 LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 6.7 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 6.7.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 6.7.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . . 133 7 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

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DS5792 Rev 13 5/143 STM32F103xC, STM32F103xD, STM32F103xE List of tables 6 List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. STM32F103xC, STM32F103xD and STM32F103xE features and peripheral counts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 3. STM32F103xx family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 4. High-density timer feature comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 5. High-density STM32F103xC/D/E pin definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 6. FSMC pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 7. Voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 8. Current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 9. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 10. General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 11. Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 12. Embedded reset and power control block characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 13. Embedded internal reference voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table 14. Maximum current consumption in Run mode, code with data processing running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 15. Maximum current consumption in Run mode, code with data processing running from RAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 16. Maximum current consumption in Sleep mode, code running from Flash or RAM. . . . . . . 49 Table 17. Typical and maximum current consumptions in Stop and Standby modes . . . . . . . . . . . . 50 Table 18. Typical current consumption in Run mode, code with data processing running from Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table 19. Typical current consumption in Sleep mode, code running from Flash or RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 20. Peripheral current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Table 21. High-speed external user clock characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Table 22. Low-speed external user clock characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Table 23. HSE 4-16 MHz oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Table 24. LSE oscillator characteristics (fLSE = 32.768 kHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Table 25. HSI oscillator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Table 26. LSI oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Table 27. Low-power mode wakeup timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Table 28. PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 29. Flash memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 30. Flash memory endurance and data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table 31. Asynchronous non-multiplexed SRAM/PSRAM/NOR read timings . . . . . . . . . . . . . . . . . . 67 Table 32. Asynchronous non-multiplexed SRAM/PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . 68 Table 33. Asynchronous multiplexed PSRAM/NOR read timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table 34. Asynchronous multiplexed PSRAM/NOR write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 35. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 36. Synchronous multiplexed PSRAM write timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Table 37. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 38. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Table 39. Switching characteristics for PC Card/CF read and write cycles . . . . . . . . . . . . . . . . . . . . 81 Table 40. Switching characteristics for NAND Flash read and write cycles . . . . . . . . . . . . . . . . . . . . 85 Table 41. EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Table 42. EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Table 43. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

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List of tables STM32F103xC, STM32F103xD, STM32F103xE 6/143 DS5792 Rev 13 Table 44. Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 45. I/O current injection susceptibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 46. I/O static characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Table 47. Output voltage characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Table 48. I/O AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Table 49. NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Table 50. TIMx characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Table 51. I2C characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Table 52. SCL frequency (fPCLK1= 36 MHz.,VDD_I2C = 3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Table 53. SPI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Table 54. I2S characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Table 55. SD / MMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Table 56. USB startup time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104 Table 57. USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Table 58. USB: full-speed electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Table 59. ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 Table 60. RAIN max for fADC = 14 MHz. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Table 61. ADC accuracy - limited test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 Table 62. ADC accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Table 63. DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Table 64. TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Table 65. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Table 66. LFBGA144 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 115 Table 67. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Table 68. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA). . . . . . . . . . . . . . . . . . 118 Table 69. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Table 70. WLCSP64 recommended PCB design rules (0.5 mm pitch) . . . . . . . . . . . . . . . . . . . . . . 121 Table 71. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Table 72. LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126 Table 73. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package mechanical data . . . . . . . . . 129 Table 74. Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 Table 75. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Page 8

DS5792 Rev 13 7/143 STM32F103xC, STM32F103xD, STM32F103xE List of figures 8 List of figures Figure 1. STM32F103xC, STM32F103xD and STM32F103xE performance line block diagram . . . 12 Figure 2. Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 3. STM32F103xC/D/E BGA144 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 4. STM32F103xC/D/E performance line BGA100 ballout. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 5. STM32F103xC/D/E performance line LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 6. STM32F103xC/D/E performance line LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 7. STM32F103xC/D/E performance line LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 8. STM32F103xC/D/E performance line WLCSP64 ballout, ball side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 9. Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Figure 10. Pin loading conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 11. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Figure 12. Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 13. Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Figure 14. Typical current consumption in Run mode versus frequency (at 3.6 V) - code with data processing running from RAM, peripherals enabled . . . . . . . . . . . . . . . . . 48 Figure 15. Typical current consumption in Run mode versus frequency (at 3.6 V)- code with data processing running from RAM, peripherals disabled . . . . . . . . . . . . . . . . 48 Figure 16. Typical current consumption on VBAT with RTC on vs. temperature at different VBAT values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 17. Typical current consumption in Stop mode with regulator in run mode versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Figure 18. Typical current consumption in Stop mode with regulator in low-power mode versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 19. Typical current consumption in Standby mode versus temperature at different VDD values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Figure 20. High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Figure 21. Low-speed external clock source AC timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Figure 22. Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Figure 23. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Figure 24. Asynchronous non-multiplexed SRAM/PSRAM/NOR read waveforms . . . . . . . . . . . . . . . 66 Figure 25. Asynchronous non-multiplexed SRAM/PSRAM/NOR write waveforms . . . . . . . . . . . . . . . 67 Figure 26. Asynchronous multiplexed PSRAM/NOR read waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 68 Figure 27. Asynchronous multiplexed PSRAM/NOR write waveforms . . . . . . . . . . . . . . . . . . . . . . . . 70 Figure 28. Synchronous multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Figure 29. Synchronous multiplexed PSRAM write timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Figure 30. Synchronous non-multiplexed NOR/PSRAM read timings . . . . . . . . . . . . . . . . . . . . . . . . . 75 Figure 31. Synchronous non-multiplexed PSRAM write timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Figure 32. PC Card/CompactFlash controller waveforms for common memory read access . . . . . . . 77 Figure 33. PC Card/CompactFlash controller waveforms for common memory write access . . . . . . . 78 Figure 34. PC Card/CompactFlash controller waveforms for attribute memory read access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Figure 35. PC Card/CompactFlash controller waveforms for attribute memory write access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Figure 36. PC Card/CompactFlash controller waveforms for I/O space read access . . . . . . . . . . . . . 80 Figure 37. PC Card/CompactFlash controller waveforms for I/O space write access . . . . . . . . . . . . . 81 Figure 38. NAND controller waveforms for read access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Figure 39. NAND controller waveforms for write access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Page 9

List of figures STM32F103xC, STM32F103xD, STM32F103xE 8/143 DS5792 Rev 13 Figure 40. NAND controller waveforms for common memory read access . . . . . . . . . . . . . . . . . . . . . 84 Figure 41. NAND controller waveforms for common memory write access. . . . . . . . . . . . . . . . . . . . . 85 Figure 42. Standard I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Figure 43. Standard I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Figure 44. 5 V tolerant I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Figure 45. 5 V tolerant I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 Figure 46. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Figure 47. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Figure 48. I2C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Figure 49. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Figure 50. SPI timing diagram - slave mode and CPHA = 1(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Figure 51. SPI timing diagram - master mode(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Figure 52. I2S slave timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Figure 53. I2S master timing diagram (Philips protocol)(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Figure 54. SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Figure 55. SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 Figure 56. USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 105 Figure 57. ADC accuracy characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 Figure 58. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109 Figure 59. Power supply and reference decoupling (VREF+ not connected to VDDA). . . . . . . . . . . . . 109 Figure 60. Power supply and reference decoupling (VREF+ connected to VDDA). . . . . . . . . . . . . . . . 110 Figure 61. 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 Figure 62. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 Figure 63. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115 Figure 64. LFBGA144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116 Figure 65. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 Figure 66. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm, 0.8 mm pitch, package recommended footprintoutline . . . . . . . . . . . . . . . . . . . . . . . . . . . 118 Figure 67. LFBGA100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119 Figure 68. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 Figure 69. WLCSP64 - 64-ball, 4.4757 x 4.4049 mm, 0.5 mm pitch wafer level chip scale package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121 Figure 70. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package outline . . . . . . . . . . . . . . 122 Figure 71. LQFP144 - 144-pin,20 x 20 mm low-profile quad flat package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124 Figure 72. LQFP144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Figure 73. LQFP100 – 14 x 14 mm 100 pin low-profile quad flat package outline . . . . . . . . . . . . . . 126 Figure 74. LQFP100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Figure 75. LQFP100 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 Figure 76. LQFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . 129 Figure 77. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat recommended footprint . . . . . . . . . . 130 Figure 78. LQFP64 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 Figure 79. LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

Page 10

DS5792 Rev 13 9/143 STM32F103xC, STM32F103xD, STM32F103xE Introduction 135 1 Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32F103xC, STM32F103xD and STM32F103xE high-density performance line microcontrollers. For more details on the whole STMicroelectronics STM32F103xC/D/E family, please refer to Section 2.2: Full compatibility throughout the family. The high-density STM32F103xC/D/E datasheet should be read in conjunction with the STM32F10xxx reference manual. For information on programming, erasing and protection of the internal Flash memory please refer to the STM32F10xxx Flash programming manual. The reference and Flash programming manuals are both available from the STMicroelectronics website www.st.com. For information on the Arm®(a) Cortex®-M3 core please refer to the Cortex®-M3 Technical Reference Manual, available from the www.arm.com website at the following address: http://infocenter.arm.com. a. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

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I tested some and all look good.

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August 8, 2020

Not much to say. Nice and cheap, and haven't had a failure yet.

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August 7, 2020

Works great with an older drive in a newer computer.have not encountered any problems, Glad somebody is making these for all the older equipment.

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August 2, 2020

These are high quality connectors. They work as you would expect them to. There is not much else you can say about them.

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July 29, 2020

It's an incredible place to buy the hard-to-find parts. Fair price, good quality and nice service! I would definitely do business with them again, thank you!

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July 25, 2020

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