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STPS2H100U

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STPS2H100U

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Part Number STPS2H100U
Manufacturer STMicroelectronics
Description DIODE SCHOTTKY 100V 2A SMB
Datasheet STPS2H100U Datasheet
Package DO-214AA, SMB
In Stock 704,330 piece(s)
Unit Price $ 0.1969 *
Lead Time Can Ship Immediately
Estimated Delivery Time Dec 2 - Dec 7 (Choose Expedited Shipping)
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Part Number # STPS2H100U (Diodes - Rectifiers - Single) is manufactured by STMicroelectronics and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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STPS2H100U Specifications

ManufacturerSTMicroelectronics
CategoryDiscrete Semiconductor Products - Diodes - Rectifiers - Single
Datasheet STPS2H100UDatasheet
PackageDO-214AA, SMB
Series-
Diode TypeSchottky
Voltage - DC Reverse (Vr) (Max)100V
Current - Average Rectified (Io)2A
Voltage - Forward (Vf) (Max) @ If790mV @ 2A
SpeedFast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)-
Current - Reverse Leakage @ Vr1µA @ 100V
Capacitance @ Vr, F-
Mounting TypeSurface Mount
Package / CaseDO-214AA, SMB
Supplier Device PackageSMB
Operating Temperature - Junction175°C (Max)

STPS2H100U Datasheet

Page 1

Page 2

K A SMB Flat SMA SMB K A K A SMA Flat K A Features • Negligible switching losses • High junction temperature capability • Low leakage current • Good trade-off between leakage current and forward voltage drop • Avalanche capability specified • ECOPACK®2 component Description This Schottky rectifier is designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat, SMB and SMB Flat, the STPS2H100 is ideal for use in lighting and telecom power applications. Product status link STPS2H100 Product summary Symbol Value IF(AV) 2 A VRRM 100 V Tj (max.) 175 °C VF (max.) 0.65 V 100 V power Schottky rectifier STPS2H100 Datasheet DS1452 - Rev 9 - May 2018 For further information contact your local STMicroelectronics sales office. www.st.com

Page 3

1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(AV) Average forward current SMA Tl = 130 °C, δ = 0.5 2 A SMB Tl = 135 °C, δ = 0.5 SMA Flat Tl = 145 °C, δ = 0.5 SMB Flat Tl = 150 °C, δ = 0.5 IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 173 W Tstg Storage temperature range -65 to +175 °C Tj Maximum operating junction temperature(1) 175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Max. value Unit Rth(j-l) Junction to lead SMA 30 °C/W SMA Flat 20 SMB 25 SMB Flat 15 Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR(1) Reverse leakage current Tj = 25 °C VR = VRRM - 1.00 µA Tj = 125 °C - 0.40 1.00 mA VF(2) Forward voltage drop Tj = 25 °C IF = 2 A - 0.79 V Tj = 125 °C - 0.60 0.65 Tj = 25 °C IF = 4 A - 0.88 Tj = 125 °C - 0.69 0.74 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.56 x IF(AV) + 0.045 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode STPS2H100 Characteristics DS1452 - Rev 9 page 2/17

Page 4

1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 P (W)F(AV) T =tp/T tp = 1 = 0.1 = 0.05 = 0.5= 0.2 δ δ δδδ δ IF(AV)(A) Figure 2. Average forward current versus ambient temperature (δ = 0.5, SMA / SMB) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175 I (A)F(AV) T =tp/T tp SMB R = 80°C/W S = 1.5cm th(j-a) (CU) 2 T (°C )amb R =Rth(j-a) t h(j-I) SMA R = 100°C/W S = 1.5cm th(j-a) (CU) 2 SMA SMB δ Figure 3. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 50 75 100 125 150 175 SMBflat R =Rth(j-a) th(j-l) R = 40 °C/Wth(j-a) S = 2.5 cmCU 2 I (A)F(AV) T δ=tp/T tp T (°C)amb Figure 4. Average forward current versus ambient temperature (δ = 0.5, SMA Flat) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0 25 5 0 7 5 100 125 150 175 Rth(j-a)=Rth(j-l) SMAflat T δ=tp/T tp T (°C)amb I (A)F(AV) STPS2H100 Characteristics (curves) DS1452 - Rev 9 page 3/17

Page 5

Figure 5. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) P (tp) P (10 µs) ARM ARM 0.001 0.01 0.1 1 1 10 100 1000 t (µs)p Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Z /Rth(j-a) th(j-a) t (s)p Single pulse SMA Figure 7. Relative variation of thermal impedance junction to lead versus pulse duration (SMA Flat) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Single pulse SM flatA Z /Rth(j-l) th(j-l) 0.9 1.0 t (s)p Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Z /Rth(j-a) th(j-a) t (s)p Single pulse SMB Figure 9. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 SMBflat Z /Rth(j-l) th(j-l) t (s)p Single pulse Figure 10. Reverse leakage current versus reverse voltage applied (typical values) 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 0 20 40 60 80 100 Tj = 150 °C Tj = 125 °C Tj = 25 °C Tj = 100 °C Tj = 75 °C Tj = 50 °C V (V)R I (µA)R STPS2H100 Characteristics (curves) DS1452 - Rev 9 page 4/17

Page 6

Figure 11. Junction capacitance versus reverse voltage applied (typical values) 10 100 1 10 100 C(pF) V (V)R F= 1MHz V = 30mV T = 25°C OSC RMS j Figure 12. Forward voltage drop versus forward current (low level) I (A)F 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Tj=25°C (Maximum values) Tj=125°C (Maximum values) Tj=125°C (Typical values) V (V)F Figure 13. Forward voltage drop versus forward current (high level) I (A)F 1 10 100 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 Tj=25°C (Maximum values) Tj=125°C (Maximum values) Tj=125°C (Typical values) V (V)F Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W)th(j-a) SMA S(Cu)(cm²) Epoxy printed circuit board FR4,copper thickness: 35 µm Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W)th(j-a) SMAflat S(Cu)(cm²) Epoxy printed circuit board FR4,copper thickness: 35 µm Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W)th(j-a) SMB S(Cu)(cm²) Epoxy p rinted ci rcui t board FR4, coppe r t hickness: 35 µm STPS2H100 Characteristics (curves) DS1452 - Rev 9 page 5/17

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Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat) 0 50 100 150 200 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SCu(cm²) Rth(j-a) (°C/W) SMB-FlatEpoxy printed circuit board FR4, eCu= 35 µm STPS2H100 Characteristics (curves) DS1452 - Rev 9 page 6/17

Page 8

2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 SMA Flat package information • Epoxy meets UL94, V0 • Lead-free package Figure 18. SMA Flat package outline D A L 2x L L2 2x L1 2x E E1 b c 2x Table 4. SMA Flat package mechanical data Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.075 0.097 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.95 0.089 0.116 E 4.80 5.60 0.189 0.220 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 0.50 0.020 L2 0.50 0.020 STPS2H100 Package information DS1452 - Rev 9 page 7/17

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Figure 19. SMA Flat recommended footprint in mm (inches) 1.20 (0.047) 1.20 (0.047) 3.12 (0.123) 5.52 (0.217) 1.52 (0.060) millimeter s (inches) STPS2H100 SMAflat package information DS1452 - Rev 9 page 8/17

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2.2 SMA package information • Epoxy meets UL94, V0 • Lead-free package Figure 20. SMA package outline E C L E1 D A1 A2 b Table 5. SMA package mechanical data Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.097 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 STPS2H100 SMA package information DS1452 - Rev 9 page 9/17

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November 22, 2020

All items individually packed in anti static bags and properly labeled.

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November 14, 2020

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November 9, 2020

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November 9, 2020

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November 6, 2020

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October 31, 2020

I am a novice technician. I really rely on reviews to help guide me, as I do not have anyone to assist me with electronics. I purchased these items and report I am happy with the purchase. I took a chance and it was one of the better choices I made.

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October 27, 2020

Worked very well! I would highly recommend buying.

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