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XC6VHX250T-2FFG1154I

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XC6VHX250T-2FFG1154I

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Part Number XC6VHX250T-2FFG1154I
Manufacturer Xilinx Inc.
Description IC FPGA 320 I/O 1156FCBGA
Datasheet XC6VHX250T-2FFG1154I Datasheet
Package 1156-BBGA, FCBGA
In Stock 294 piece(s)
Unit Price $ 4660.47 *
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XC6VHX250T-2FFG1154I Specifications

ManufacturerXilinx Inc.
CategoryIntegrated Circuits (ICs) - Embedded - FPGAs (Field Programmable Gate Array)
Datasheet XC6VHX250T-2FFG1154I Datasheet
Package1156-BBGA, FCBGA
SeriesVirtex?-6 HXT
Number of LABs/CLBs19680
Number of Logic Elements/Cells251904
Total RAM Bits18579456
Number of I/O320
Voltage - Supply0.95 V ~ 1.05 V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case1156-BBGA, FCBGA
Supplier Device Package1156-FCBGA (35x35)

XC6VHX250T-2FFG1154I Datasheet

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DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 1 © 2009–2014 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Zynq, Artix, Kintex, Spartan, ISE, Vivado and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. Virtex-6 FPGA Electrical Characteristics Virtex®-6 FPGAs are available in -3, -2, -1, and -1L speed grades, with -3 having the highest performance. Virtex-6 FPGA DC and AC characteristics are specified in commercial, extended, industrial, and military temperature ranges. Unless noted, the Virtex-6Q FPGA DC and AC characteristics are equivalent to the commercial specifications. Except for the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the extended, industrial, or military temperature ranges. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications. Available device and package combinations can be found at: • DS150: Virtex-6 Family Overview • DS155: Defense-Grade Virtex-6Q Family Overview This Virtex-6 FPGA data sheet, part of an overall set of documentation on the Virtex-6 FPGAs, is available on the Xilinx website at: www.xilinx.com/support/index.html/content/xilinx/en/supportNav/silicon_devices/fpga/virtex-6.html. Virtex-6 FPGA DC Characteristics Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 Product Specification Table 1: Absolute Maximum Ratings (1) Symbol Description Range Units VCCINT Internal supply voltage relative to GND –0.5 to 1.1 V For -1L devices: Internal supply voltage relative to GND –0.5 to 1.0 V VCCAUX Auxiliary supply voltage relative to GND –0.5 to 3.0 V VCCO Output drivers supply voltage relative to GND –0.5 to 3.0 V VBATT Key memory battery backup supply –0.5 to 3.0 V VFS External voltage supply for eFUSE programming (2) –0.5 to 3.0 V VREF Input reference voltage –0.5 to 3.0 V VIN (3) 2.5V or below I/O input voltage relative to GND(4) (user and dedicated I/Os) –0.5 to VCCO + 0.5 V VTS Voltage applied to 3-state 2.5V or below output (4) (user and dedicated I/Os) –0.5 to VCCO + 0.5 V TSTG Storage temperature (ambient) –65 to 150 °C TSOL Maximum soldering temperature (5) +220 °C Tj Maximum junction temperature (5) +125 °C Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability. 2. When not programming eFUSE, connect VFS to GND. 3. 2.5V I/O absolute maximum limit applied to DC and AC signals. 4. For I/O operation, refer to UG361:Virtex-6 FPGA SelectIO Resources User Guide. 5. For soldering guidelines and thermal considerations, see UG365:Virtex-6 FPGA Packaging and Pinout Specification.

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 2 Table 2: Recommended Operating Conditions Symbol Description Min Max Units VCCINT Internal supply voltage relative to GND for all devices except -1L devices. 0.95 1.05 V For -1L commercial temperature range devices: internal supply voltage relative to GND, Tj = 0°C to +85°C 0.87 0.93 V For -1L industrial temperature range devices: internal supply voltage relative to GND, Tj = –40°C to +100°C 0.91 0.97 V VCCAUX Auxiliary supply voltage relative to GND 2.375 2.625 V VCCO (1)(2)(3) Supply voltage relative to GND 1.14 2.625 V VIN 2.5V supply voltage relative to GND GND – 0.20 2.625 V 2.5V and below supply voltage relative to GND GND – 0.20 VCCO + 0.2 V IIN (5) Maximum current through any pin in a powered or unpowered bank when forward biasing the clamp diode. – 10 mA VBATT (6) Battery voltage relative to GND 1.0 2.5 V VFS (7) External voltage supply for eFUSE programming 2.375 2.625 V Tj Junction temperature operating range for commercial (C) temperature devices 0 85 °C Junction temperature operating range for extended (E) temperature devices 0 100 °C Junction temperature operating range for industrial (I) temperature devices –40 100 °C Junction temperature operating range for military (M) temperature devices –55 125 °C Notes: 1. Configuration data is retained even if VCCO drops to 0V. 2. Includes VCCO of 1.2V, 1.5V, 1.8V, and 2.5V. 3. The configuration supply voltage VCC_CONFIG is also known as VCCO_0. 4. All voltages are relative to ground. 5. A total of 100 mA per bank should not be exceeded. 6. VBATT is required only when using bitstream encryption. If battery is not used, connect VBATT to either ground or VCCAUX. 7. During eFUSE programming, VFS must be within the recommended operating range and Tj = +15°C to +85°C. Otherwise, VFS can be connected to GND.

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 3 Table 3: DC Characteristics Over Recommended Operating Conditions (1)(2) Symbol Description Min Typ Max Units VDRINT Data retention VCCINT voltage (below which configuration data might be lost) 0.75 – – V VDRI Data retention VCCAUX voltage (below which configuration data might be lost) 2.0 – – V IREF VREF leakage current per pin – – 10 µA IL Input or output leakage current per pin (sample-tested) – – 10 µA CIN (3) Die input capacitance at the pad – – 8 pF IRPU Pad pull-up (when selected) @ VIN = 0V, VCCO = 2.5V 20 – 80 µA Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.8V 8 – 40 µA Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.5V 5 – 30 µA Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.2V 1 – 20 µA IRPD Pad pull-down (when selected) @ VIN = 2.5V 3 – 80 µA IBATT Battery supply current – – 150 nA n Temperature diode ideality factor – 1.0002 – n r Series resistance – 5 – Ω Notes: 1. Typical values are specified at nominal voltage, 25°C. 2. Maximum value specified for worst case process at 25°C. 3. This measurement represents the die capacitance at the pad, not including the package.

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 4 Important Note Typical values for quiescent supply current are specified at nominal voltage, 85°C junction temperatures (Tj). Xilinx recommends analyzing static power consumption at Tj = 85°C because the majority of designs operate near the high end of the commercial temperature range. Quiescent supply current is specified by speed grade for Virtex-6 devices. Use the Xilinx Power Estimator (XPE) spreadsheet tool (download at http://www.xilinx.com/power) to calculate static power consumption for conditions other than those specified in Table 4. Table 4: Typical Quiescent Supply Current Symbol Description Device Speed and Temperature Grade Units -3 (C) -2 (C, E, & I) -1 (C & I) -1 (I & M)(2) -1L (C) -1L (I)(1) ICCINTQ Quiescent VCCINT supply current XC6VLX75T 927 927 927 N/A 656 741 mA XC6VLX130T 1563 1563 1563 N/A 1102 1245 mA XC6VLX195T 2059 2059 2059 N/A 1441 1628 mA XC6VLX240T 2478 2478 2478 N/A 1733 1957 mA XC6VLX365T 3001 3001 3001 N/A 2092 2363 mA XC6VLX550T(3) N/A 4515 4515 N/A 3147 3555 mA XC6VLX760(3) N/A 5094 5094 N/A 3471 3921 mA XC6VSX315T 3476 3476 3476 N/A 2409 2721 mA XC6VSX475T(3) N/A 5227 5227 N/A 3622 4091 mA XC6VHX250T 2906 2906 2906 N/A N/A N/A mA XC6VHX255T 2746 2746 2746 N/A N/A N/A mA XC6VHX380T(4) 4160 4160 4160 N/A N/A N/A mA XC6VHX565T(5) N/A 5207 5207 N/A N/A N/A mA XQ6VLX130T N/A 1563 N/A 1563 N/A 1245 mA XQ6VLX240T N/A 2478 N/A 2478 N/A 1957 mA XQ6VLX550T(7) N/A N/A N/A 4515 N/A 3555 mA XQ6VSX315T N/A 3476 N/A 3476 N/A 2721 mA XQ6VSX475T(7) N/A N/A N/A 5227 N/A 4091 mA

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 5 ICCOQ Quiescent VCCO supply current XC6VLX75T 1 1 1 N/A 1 1 mA XC6VLX130T 1 1 1 N/A 1 1 mA XC6VLX195T 1 1 1 N/A 1 1 mA XC6VLX240T 2 2 2 N/A 2 2 mA XC6VLX365T 2 2 2 N/A 2 2 mA XC6VLX550T(3) N/A 3 3 N/A 3 3 mA XC6VLX760(3) N/A 3 3 N/A 3 3 mA XC6VSX315T 2 2 2 N/A 2 2 mA XC6VSX475T(3) N/A 2 2 N/A 2 2 mA XC6VHX250T 1 1 1 N/A N/A N/A mA XC6VHX255T 1 1 1 N/A N/A N/A mA XC6VHX380T(4) 2 2 2 N/A N/A N/A mA XC6VHX565T(5) N/A 2 2 N/A N/A N/A mA XQ6VLX130T N/A 1 N/A 1 N/A 1 mA XQ6VLX240T N/A 2 N/A 2 N/A 2 mA XQ6VLX550T(7) N/A N/A N/A 3 N/A 3 mA XQ6VSX315T N/A 2 N/A 2 N/A 2 mA XQ6VSX475T(7) N/A N/A N/A 2 N/A 2 mA Table 4: Typical Quiescent Supply Current (Cont’d) Symbol Description Device Speed and Temperature Grade Units -3 (C) -2 (C, E, & I) -1 (C & I) -1 (I & M)(2) -1L (C) -1L (I)(1)

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 6 Power-On Power Supply Requirements Xilinx FPGAs require a certain amount of supply current during power-on to insure proper device initialization. The actual current consumed depends on the power-on sequence and ramp rate of the power supply. The recommended power-on sequence for Virtex-6 devices is VCCINT, VCCAUX, and VCCO to meet the power-up current requirements listed in Table 5. VCCINT can be powered up or down at any time, but power up current specifications can vary from Table 5. The device will have no physical damage or reliability concerns if VCCINT, VCCAUX, and VCCO sequence cannot be followed. If the recommended power-up sequence cannot be followed and the I/Os must remain 3-stated throughout configuration, then VCCAUX must be powered prior to VCCO or VCCAUX and VCCO must be powered by the same supply. Similarly, for power- down, the reverse VCCAUX and VCCO sequence is recommended if the I/Os are to remain 3-stated. ICCAUXQ Quiescent VCCAUX supply current XC6VLX75T 45 45 45 N/A 45 45 mA XC6VLX130T 75 75 75 N/A 75 75 mA XC6VLX195T 113 113 113 N/A 113 113 mA XC6VLX240T 135 135 135 N/A 135 135 mA XC6VLX365T 191 191 191 N/A 191 191 mA XC6VLX550T(3) N/A 286 286 N/A 286 286 mA XC6VLX760(3) N/A 387 387 N/A 387 387 mA XC6VSX315T 186 186 186 N/A 186 186 mA XC6VSX475T(3) N/A 279 279 N/A 279 279 mA XC6VHX250T 152 152 152 N/A N/A N/A mA XC6VHX255T 152 152 152 N/A N/A N/A mA XC6VHX380T(4) 227 227 227 N/A N/A N/A mA XC6VHX565T(5) N/A 315 315 N/A N/A N/A mA XQ6VLX130T(6) N/A 75 N/A 75 N/A 75 mA XQ6VLX240T(6) N/A 135 N/A 135 N/A 135 mA XQ6VLX550T(7) N/A N/A N/A 286 N/A 286 mA XQ6VSX315T(6) N/A 186 N/A 186 N/A 186 mA XQ6VSX475T(7) N/A N/A N/A 279 N/A 279 mA Notes: 1. Typical values are specified at nominal voltage, 85°C junction temperatures (Tj). -1 and -2 industrial (I) grade devices have the same typical values as commercial (C) grade devices at 85°C, but higher values at 100°C. Use the XPE tool to calculate 100°C values. -1L industrial temperature range devices have the values specified in this column. 2. Use the XPE tool to calculate 125°C values for -1M temperature range devices. 3. The -2E extended temperature range (Tj = 0°C to +100°C) is only available in these devices. The -2I temperature range (Tj = –40°C to +100°C) is available for all other devices except the XC6VHX565T. 4. The XC6VHX380T is available with both -2E and -2I temperature ranges. 5. The XC6VHX565T is only available in the following temperature ranges: -1C, -1I, -2C, and -2E. 6. The XQ6VLX130T, XQ6VLX240T, and XQ6VSX315T are available in -2I, -1I, -1M, and -1LI temperature ranges. 7. The XQ6VLX550T and the XQ6VSX475T are only available in -1I and -1LI temperature ranges. 8. Typical values are for blank configured devices with no output current loads, no active input pull-up resistors, all I/O pins are 3-state and floating. 9. If DCI or differential signaling is used, more accurate quiescent current estimates can be obtained by using the XPE or XPower Analyzer (XPA) tools. Table 4: Typical Quiescent Supply Current (Cont’d) Symbol Description Device Speed and Temperature Grade Units -3 (C) -2 (C, E, & I) -1 (C & I) -1 (I & M)(2) -1L (C) -1L (I)(1)

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 7 The GTH transceiver supplies must be powered using a MGTHAVCC, MGTHAVCCRX, MGTHAVCCPLL, and MGTHAVTT sequence. There are no sequencing requirement for these supplies with respect to the other FPGA supply voltages. For more detail see Table 27: GTH Transceiver Power Supply Sequencing. There are no sequencing requirements for the GTX transceivers power supplies. Table 5 shows the minimum current, in addition to ICCQ, that are required by Virtex-6 devices for proper power-on and configuration. If the current minimums shown in Table 4 and Table 5 are met, the device powers on after all three supplies have passed through their power-on reset threshold voltages. The FPGA must be configured after applying VCCINT, VCCAUX, and VCCO for the appropriate configuration banks. Once initialized and configured, use the XPE tools to estimate current drain on these supplies. Table 5: Power-On Current for Virtex-6 Devices Device ICCINTMIN ICCAUXMIN ICCOMIN Units Typ(1) Typ(1) Typ(1) XC6VLX75T See ICCINTQ in Table 4 ICCAUXQ + 10 ICCOQ + 30 mA per bank mA XC6VLX130T See ICCINTQ in Table 4 ICCAUXQ + 10 ICCOQ + 30 mA per bank mA XC6VLX195T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VLX240T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VLX365T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VLX550T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VLX760 See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VSX315T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VSX475T See ICCINTQ in Table 4 ICCAUXQ + 50 ICCOQ + 30 mA per bank mA XC6VHX250T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VHX255T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VHX380T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XC6VHX565T See ICCINTQ in Table 4 ICCAUXQ + 40 ICCOQ + 30 mA per bank mA XQ6VLX130T See ICCINTQ in Table 4 ICCAUXQ + 100 ICCOQ + 30 mA per bank mA XQ6VLX240T See ICCINTQ in Table 4 ICCAUXQ + 100 ICCOQ + 30 mA per bank mA XQ6VLX550T See ICCINTQ in Table 4 ICCAUXQ + 100 ICCOQ + 30 mA per bank mA XQ6VSX315T See ICCINTQ in Table 4 ICCAUXQ + 100 ICCOQ + 40 mA per bank mA XQ6VSX475T See ICCINTQ in Table 4 ICCAUXQ + 100 ICCOQ + 40 mA per bank mA Notes: 1. Typical values are specified at nominal voltage, 25°C. 2. Use the Xilinx Power Estimator (XPE) spreadsheet tool (download at http://www.xilinx.com/power) to calculate maximum power-on currents. Table 6: Power Supply Ramp Time Symbol Description Ramp Time Units VCCINT Internal supply voltage relative to GND 0.20 to 50.0 ms VCCO Output drivers supply voltage relative to GND 0.20 to 50.0 ms VCCAUX Auxiliary supply voltage relative to GND 0.20 to 50.0 ms

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 8 SelectIO™ DC Input and Output Levels Values for VIL and VIH are recommended input voltages. Values for IOL and IOH are guaranteed over the recommended operating conditions at the VOL and VOH test points. Only selected standards are tested. These are chosen to ensure that all standards meet their specifications. The selected standards are tested at a minimum VCCO with the respective VOL and VOH voltage levels shown. Other standards are sample tested. Table 7: SelectIO DC Input and Output Levels I/O Standard VIL VIH VOL VOH IOL IOH V, Min V, Max V, Min V, Max V, Max V, Min mA mA LVCMOS25, LVDCI25 –0.3 0.7 1.7 VCCO + 0.3 0.4 VCCO – 0.4 Note(3) Note(3) LVCMOS18, LVDCI18 –0.3 35% VCCO 65% VCCO VCCO + 0.3 0.45 VCCO – 0.45 Note(4) Note(4) LVCMOS15, LVDCI15 –0.3 35% VCCO 65% VCCO VCCO + 0.3 25% VCCO 75% VCCO Note(4) Note(4) LVCMOS12 –0.3 35% VCCO 65% VCCO VCCO + 0.3 25% VCCO 75% VCCO Note(5) Note(5) HSTL I_12 –0.3 VREF – 0.1 VREF + 0.1 VCCO + 0.3 25% VCCO 75% VCCO 6.3 –6.3 HSTL I(2) –0.3 VREF – 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO – 0.4 8 –8 HSTL II(2) –0.3 VREF – 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO – 0.4 16 –16 HSTL III(2) –0.3 VREF – 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO – 0.4 24 –8 DIFF HSTL I(2) –0.3 50% VCCO – 0.1 50% VCCO + 0.1 VCCO + 0.3 – – – – DIFF HSTL II(2) –0.3 50% VCCO – 0.1 50% VCCO + 0.1 VCCO + 0.3 – – – – SSTL2 I –0.3 VREF – 0.15 VREF + 0.15 VCCO + 0.3 VTT – 0.61 VTT + 0.61 8.1 –8.1 SSTL2 II –0.3 VREF – 0.15 VREF + 0.15 VCCO + 0.3 VTT – 0.81 VTT + 0.81 16.2 –16.2 DIFF SSTL2 I –0.3 50% VCCO – 0.15 50% VCCO + 0.15 VCCO + 0.3 – – – – DIFF SSTL2 II –0.3 50% VCCO – 0.15 50% VCCO + 0.15 VCCO + 0.3 – – – – SSTL18 I –0.3 VREF – 0.125 VREF + 0.125 VCCO + 0.3 VTT – 0.47 VTT + 0.47 6.7 –6.7 SSTL18 II –0.3 VREF – 0.125 VREF + 0.125 VCCO + 0.3 VTT – 0.60 VTT + 0.60 13.4 –13.4 DIFF SSTL18 I –0.3 50% VCCO – 0.125 50% VCCO + 0.125 VCCO + 0.3 – – – – DIFF SSTL18 II –0.3 50% VCCO – 0.125 50% VCCO + 0.125 VCCO + 0.3 – – – – SSTL15 –0.3 VREF – 0.1 VREF + 0.1 VCCO + 0.3 VTT – 0.175 VTT + 0.175 14.3 –14.3 DIFF SSTL15 –0.3 50% VCCO – 0.1 50% VCCO + 0.1 VCCO + 0.3 – – – – Notes: 1. Tested according to relevant specifications. 2. Applies to both 1.5V and 1.8V HSTL. 3. Using drive strengths of 2, 4, 6, 8, 12, 16, or 24 mA. 4. Using drive strengths of 2, 4, 6, 8, 12, or 16 mA. 5. Supported drive strengths of 2, 4, 6, or 8 mA. 6. For detailed interface specific DC voltage levels, see UG361:Virtex-6 FPGA SelectIO Resources User Guide.

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Virtex-6 FPGA Data Sheet: DC and Switching Characteristics DS152 (v3.6) March 18, 2014 www.xilinx.com Product Specification 9 HT DC Specifications (HT_25) LVDS DC Specifications (LVDS_25) Extended LVDS DC Specifications (LVDSEXT_25) Table 8: HT DC Specifications Symbol DC Parameter Conditions Min Typ Max Units VCCO Supply Voltage 2.38 2.5 2.63 V VOD Differential Output Voltage for XC devices RT = 100 Ω across Q and Q signals 480 600 885 mV Differential Output Voltage for XQ devices 480 600 930 mV Δ VOD Change in VOD Magnitude –15 – 15 mV VOCM Output Common Mode Voltage RT = 100 Ω across Q and Q signals 440 600 760 mV Δ VOCM Change in VOCM Magnitude –15 – 15 mV VID Input Differential Voltage 200 600 1000 mV Δ VID Change in VID Magnitude –15 – 15 mV VICM Input Common Mode Voltage 440 600 780 mV Δ VICM Change in VICM Magnitude –15 – 15 mV Table 9: LVDS DC Specifications Symbol DC Parameter Conditions Min Typ Max Units VCCO Supply Voltage 2.38 2.5 2.63 V VOH Output High Voltage for Q and Q RT = 100 Ω across Q and Q signals – – 1.675 V VOL Output Low Voltage for Q and Q RT = 100 Ω across Q and Q signals 0.825 – – V VODIFF Differential Output Voltage (Q – Q), Q = High (Q – Q), Q = High RT = 100 Ω across Q and Q signals 247 350 600 mV VOCM Output Common-Mode Voltage for XC devices RT = 100 Ω across Q and Q signals 1.075 1.250 1.425 V Output Common-Mode Voltage for XQ devices 1.000 1.250 1.425 V VIDIFF Differential Input Voltage (Q – Q), Q = High (Q – Q), Q = High 100 350 600 mV VICM Input Common-Mode Voltage 0.3 1.2 2.2 V Table 10: Extended LVDS DC Specifications Symbol DC Parameter Conditions Min Typ Max Units VCCO Supply Voltage 2.38 2.5 2.63 V VOH Output High Voltage for Q and Q RT = 100 Ω across Q and Q signals – – 1.785 V VOL Output Low Voltage for Q and Q RT = 100 Ω across Q and Q signals 0.715 – – V VODIFF Differential Output Voltage (Q – Q), Q = High (Q – Q), Q = High for XC devices RT = 100 Ω across Q and Q signals 350 – 840 mV Differential Output Voltage (Q – Q), Q = High (Q – Q), Q = High for XQ devices 350 – 850 mV VOCM Output Common-Mode Voltage for XC devices RT = 100 Ω across Q and Q signals 1.075 1.250 1.425 V Output Common-Mode Voltage for XQ devices 1.000 1.250 1.425 V VIDIFF Differential Input Voltage (Q – Q), Q = High (Q – Q), Q = High Common-mode input voltage = 1.25V 100 – 1000 mV VICM Input Common-Mode Voltage Differential input voltage = ±350 mV 0.3 1.2 2.2 V

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