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Sockets for ICs, Transistors - Adapters

Records 353
Page  4/12
Image
Part Number
Manufacturer
Description
Package
Stock
Quantity
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
96-100M65
Aries Electronics

SOCKET ADAPTER QFP TO 100PGA

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 100
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,596
PGA
100
0.026" (0.65mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1110267-N
Aries Electronics

SOCKET ADAPTER PLCC TO 68DIP 0.9

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.9" (22.86mm) Row Spacing
  • Number of Pins: 68
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock8,550
DIP, 0.9" (22.86mm) Row Spacing
68
-
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
97-80C251
Aries Electronics

SOCKET ADAPTER DIP TO PLCC

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock5,166
-
-
-
-
-
-
-
-
-
-
96-208M50
Aries Electronics

SOCKET ADAPTER QFP TO 208PGA

  • Convert From (Adapter End): QFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 208
  • Pitch - Mating: 0.020" (0.50mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock3,258
PGA
208
0.020" (0.50mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
97-AQ132D-P
Aries Electronics

SCKT ADPT PQFP-132PGA PANELIZED

  • Convert From (Adapter End): PQFP
  • Convert To (Adapter End): PGA
  • Number of Pins: 132
  • Pitch - Mating: 0.025" (0.64mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: -
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock6,696
PGA
132
0.025" (0.64mm)
Gold
Through Hole
Solder
-
Tin-Lead
-
FR4 Epoxy Glass
48-6645-18
Aries Electronics

SOCKET ADAPTER TQFP TO 48DIP 0.6

  • Convert From (Adapter End): TQFP
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 48
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,830
DIP, 0.6" (15.24mm) Row Spacing
48
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
20-353000-10
Aries Electronics

SOCKET ADAPTER PLCC TO 20DIP 0.3

  • Convert From (Adapter End): PLCC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin-Lead
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock8,694
DIP, 0.3" (7.62mm) Row Spacing
20
0.050" (1.27mm)
Tin-Lead
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
28-354000-20
Aries Electronics

SOCKET ADAPTER DIP TO 28SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 28
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock6,678
SOIC
28
-
Gold
Surface Mount
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
28-650000-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.6

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,956
DIP, 0.6" (15.24mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
16-354W00-20
Aries Electronics

DIP-TO-SOWIC ADAPTER

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 16
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock3,490
SOWIC
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-351000-10
Aries Electronics

SOCKET ADAPTER SSOP TO 24DIP 0.3

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 24
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock3,258
DIP, 0.3" (7.62mm) Row Spacing
24
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
1107254-40
Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.3

  • Convert From (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock3,762
DIP, 0.3" (7.62mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1106396-40
Aries Electronics

SOCKET ADAPTER DIP TO 40DIP 0.6

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.6" (15.24mm) Row Spacing
  • Number of Pins: 40
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock4,374
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Tin
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-301550-10
Aries Electronics

SOCKET ADAPTER SOIC TO 20PLCC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): PLCC
  • Number of Pins: 20
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock4,554
PLCC
20
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
18-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 18SOWIC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock7,326
SOWIC
18
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
32-354000-10
Aries Electronics

SOCKET ADAPTER DIP TO 32SOIC

  • Convert From (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Convert To (Adapter End): SOIC
  • Number of Pins: 32
  • Pitch - Mating: -
  • Contact Finish - Mating: Gold
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • Board Material: -
Package: -
Stock7,524
SOIC
32
-
Gold
Surface Mount
Solder
0.100" (2.54mm)
Gold
Polyamide (PA46), Nylon 4/6, Glass Filled
-
12-666000-00
Aries Electronics

SOCKET ADAPTER SOIC TO 12SOWIC

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): SOWIC
  • Number of Pins: 12
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Surface Mount
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock2,286
SOWIC
12
0.050" (1.27mm)
-
Surface Mount
Solder
0.050" (1.27mm)
Tin-Lead
-
FR4 Epoxy Glass
LCQT-QFP0.65-52
Aries Electronics

SOCKET ADAPTER MULT PKG TO 52QFP

  • Convert From (Adapter End): Multiple Packages
  • Convert To (Adapter End): QFP
  • Number of Pins: 52
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock2,124
QFP
52
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass
28-350002-10-P
Aries Electronics

SOCKET ADAPTER SOIC TO 28DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: FR4 Epoxy Glass
Package: -
Stock3,490
DIP, 0.3" (7.62mm) Row Spacing
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
FR4 Epoxy Glass
18-350000-11-RC-P
Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock8,190
DIP, 0.3" (7.62mm) Row Spacing
18
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
228-4817-19-0602J
3M

RECEPTACLE DIP SOCKET 28POS .4"

  • Convert From (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Convert To (Adapter End): DIP, 0.4" (10.16mm) Row Spacing
  • Number of Pins: 28
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polysulfone (PSU), Glass Filled
  • Board Material: -
Package: -
Stock4,536
DIP, 0.4" (10.16mm) Row Spacing
28
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
18-350000-10
Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock7,056
DIP, 0.3" (7.62mm) Row Spacing
18
-
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
PA-SSD6SM18-40
Logical Systems Inc.

ADAPTER 40TSSOP TO 40DIP

  • Convert From (Adapter End): SSOP
  • Convert To (Adapter End): DIP
  • Number of Pins: 40
  • Pitch - Mating: 0.026" (0.65mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock8,820
DIP
40
0.026" (0.65mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-QSD3SM18-16
Logical Systems Inc.

ADAPTER 16QSOP TO 16DIP

  • Convert From (Adapter End): -
  • Convert To (Adapter End): -
  • Number of Pins: -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Mounting Type: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock7,254
-
-
-
-
-
-
-
-
-
-
18-350000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 18DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 18
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock7,326
DIP, 0.3" (7.62mm) Row Spacing
18
-
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
PA-SOTD3SM18-06
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 6DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 6
  • Pitch - Mating: 0.037" (0.95mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock7,254
DIP
6
0.037" (0.95mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
PA-SOD3SM18-28
Logical Systems Inc.

SOCKET ADAPTER SOIC TO 28DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP
  • Number of Pins: 28
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Housing Material: -
  • Board Material: -
Package: -
Stock6,444
DIP
28
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
-
-
-
16-350000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 16DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 16
  • Pitch - Mating: -
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.050" (1.27mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock34,182
DIP, 0.3" (7.62mm) Row Spacing
16
-
Tin
Through Hole
Solder
0.050" (1.27mm)
Tin-Lead
-
Polyimide (PI)
08-350000-11-RC
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP 0.3

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: Tin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Tin-Lead
  • Housing Material: -
  • Board Material: Polyimide (PI)
Package: -
Stock80,514
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
Tin
Through Hole
Solder
0.100" (2.54mm)
Tin-Lead
-
Polyimide (PI)
LCQT-SOIC8-8
Aries Electronics

SOCKET ADAPTER SOIC TO 8DIP

  • Convert From (Adapter End): SOIC
  • Convert To (Adapter End): DIP, 0.3" (7.62mm) Row Spacing
  • Number of Pins: 8
  • Pitch - Mating: 0.050" (1.27mm)
  • Contact Finish - Mating: -
  • Mounting Type: Through Hole
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Housing Material: Polyester
  • Board Material: FR4 Epoxy Glass
Package: -
Stock20,952
DIP, 0.3" (7.62mm) Row Spacing
8
0.050" (1.27mm)
-
Through Hole
Solder
0.100" (2.54mm)
Gold
Polyester
FR4 Epoxy Glass