Image |
Part Number |
Manufacturer |
Description |
Package |
Stock |
Quantity |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock5,216 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock4,992 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock3,504 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Package: 56-VFQFN Exposed Pad |
Stock2,128 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock3,088 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Package: 56-VFQFN Exposed Pad |
Stock4,064 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Package: 56-VFQFN Exposed Pad |
Stock4,480 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
Package: 56-VFQFN Exposed Pad |
Stock2,416 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
Package: 56-VFQFN Exposed Pad |
Stock4,544 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
Package: 56-VFQFN Exposed Pad |
Stock5,472 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Package: - |
Stock2,928 |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC FOR LOW-POWE
|
Package: 25-UFBGA, WLCSP |
Stock2,704 |
|
- | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 25-UFBGA, WLCSP | 25-WLCSP (2.09x2.09) |
||
NXP |
IC POWER MANAGEMENT
|
Package: 56-VFQFN Exposed Pad |
Stock6,300 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Package: 56-VFQFN Exposed Pad |
Stock7,620 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Package: 56-VFQFN Exposed Pad |
Stock8,328 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Package: - |
Stock6,372 |
|
- | - | - | - | - | - |
||
NXP |
IC POWER MANAGEMENT
|
Package: 56-VFQFN Exposed Pad |
Stock6,348 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Package: 56-VFQFN Exposed Pad |
Stock8,088 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC WIRELESS PWR TX 96KB LQFP48
|
Package: 48-LQFP |
Stock12,612 |
|
1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock5,760 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock2,432 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
Package: 56-VFQFN Exposed Pad |
Stock4,096 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock2,496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
Package: 56-VFQFN Exposed Pad |
Stock6,256 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock7,888 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock7,344 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
Package: 56-VFQFN Exposed Pad |
Stock6,496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
Package: - |
Stock4,784 |
|
- | - | - | - | - | - |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
Package: - |
Stock7,936 |
|
- | - | - | - | - | - |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
Package: - |
Stock5,296 |
|
- | - | - | - | - | - |