NXP Products

BS108,126

NXP

MOSFET N-CH 200V 300MA SOT54

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 200V
• Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
• Drive Voltage (Max Rds On, Min Rds On): 2.8V
• Vgs(th) (Max) @ Id: 1.8V @ 1mA
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: 120pF @ 25V
• Vgs (Max): ±20V
• FET Feature: -
• Power Dissipation (Max): 1W (Ta)
• Rds On (Max) @ Id, Vgs: 5 Ohm @ 100mA, 2.8V
• Operating Temperature: -55°C ~ 150°C (TJ)
• Mounting Type: Through Hole
• Supplier Device Package: TO-92-3
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

Package: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

MRF6S9060MBR1

NXP

FET RF 68V 880MHZ TO-272-2

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 21.4dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 450mA
• Power - Output: 14W
• Voltage - Rated: 68V
• Package / Case: TO-272-2
• Supplier Device Package: TO-272-2

Package: TO-272-2

MRFG35010ANR5

NXP

FET RF 15V 3.55GHZ NI360HF

• Transistor Type: pHEMT FET
• Frequency: 3.55GHz
• Gain: 10dB
• Voltage - Test: 12V
• Current Rating: -
• Noise Figure: -
• Current - Test: 130mA
• Power - Output: 1W
• Voltage - Rated: 15V
• Package / Case: NI-360HF
• Supplier Device Package: NI-360HF

Package: NI-360HF

MRF6V3090NBR1

NXP

FET RF 110V 860MHZ TO272-4

• Transistor Type: LDMOS
• Frequency: 860MHz
• Gain: 22dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 350mA
• Power - Output: 18W
• Voltage - Rated: 110V
• Package / Case: TO-272BB
• Supplier Device Package: TO-272 WB-4

Package: TO-272BB

AFT05MP075NR1

NXP

FET RF 2CH 40V 520MHZ TO270-4

• Transistor Type: LDMOS (Dual)
• Frequency: 520MHz
• Gain: 18.5dB
• Voltage - Test: 12.5V
• Current Rating: -
• Noise Figure: -
• Current - Test: 400mA
• Power - Output: 70W
• Voltage - Rated: 40V
• Package / Case: TO-270AB
• Supplier Device Package: TO-270 WB-4

Package: TO-270AB

BUK9Y41-80E/GFX

NXP

MOSFET N-CH LFPAK

• Transistor Type: -
• Current - Collector (Ic) (Max): -
• Voltage - Collector Emitter Breakdown (Max): -
• Vce Saturation (Max) @ Ib, Ic: -
• Current - Collector Cutoff (Max): -
• DC Current Gain (hFE) (Min) @ Ic, Vce: -
• Power - Max: -
• Frequency - Transition: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

Package: -

LD6816CX4/21P,315

NXP

IC REG LINEAR 2.1V 150MA 4WLCSP

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 1
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 2.1V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.075V @ 150mA
• Current - Output: 150mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 100µA ~ 250µA
• PSRR: 55dB (1kHz)
• Control Features: Enable
• Protection Features: Over Current, Over Temperature, Transient Voltage
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 4-XFBGA, WLCSP
• Supplier Device Package: 4-WLCSP (0.76x0.76)

Package: 4-XFBGA, WLCSP

MC33287DW

NXP

IC SWITCH DUAL LOW-SIDE 20-SOIC

• Applications: Contact Monitor
• Current - Supply: 55µA
• Voltage - Supply: 7 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

Package: 20-SOIC (0.295", 7.50mm Width)

UBA2074TS/N1,518

NXP

IC DRIVER FULL BRIDGE 28SSOP

• Type: CCFL/EEFL Controller
• Frequency: 43kHz ~ 46.6kHz
• Voltage - Supply: 9 V ~ 30 V
• Current - Supply: 5mA
• Current - Output Source/Sink: -
• Dimming: Yes
• Operating Temperature: -25°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 28-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 28-SSOP

Package: 28-SSOP (0.209", 5.30mm Width)

N74F656AD,602

NXP

IC BUFFER/LDRIVER OCTAL 24SOIC

• Logic Type: Buffer/Driver with Parity
• Supply Voltage: 4.5 V ~ 5.5 V
• Number of Bits: 8
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

Package: 24-SOIC (0.295", 7.50mm Width)

MPC8347EZUAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

Package: 672-LBGA

KMPC860ENZQ80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 80MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

Package: 357-BBGA

MC68EN360ZP25VL

NXP

IC MPU M683XX 25MHZ 357BGA

• Core Processor: CPU32+
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 25MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 357-BGA
• Supplier Device Package: 357-PBGA (25x25)

Package: 357-BGA

MC8641VJ1333JE

NXP

IC MPU E600 SGL CORE 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

Package: 994-BCBGA, FCCBGA

MCIMX6Q4AVT10AD

NXP

IC MPU I.MX6Q 1.0GHZ 624FCBGA

• Core Processor: ARM? Cortex?-A9
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON? SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100/1000 Mbps (1)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 + PHY (4)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 624-FBGA, FCBGA
• Supplier Device Package: 624-FCBGA (21x21)

Package: 624-FBGA, FCBGA

LH7A404N0F092B3,55

NXP

IC MCU 32BIT ROMLESS 324LFBGA

• Core Processor: ARM9?
• Core Size: 32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
• Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
• Number of I/O: 64
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-LFBGA (17x17)

Package: 324-LFBGA

MC9S12DT256CCPV

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

Package: 112-LQFP

MC68711E20CFNE3

NXP

IC MCU 8BIT 20KB OTP 52PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: SCI, SPI
• Peripherals: POR, WDT
• Number of I/O: 38
• Program Memory Size: 20KB (20K x 8)
• Program Memory Type: OTP
• EEPROM Size: 512 x 8
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 52-LCC (J-Lead)
• Supplier Device Package: 52-PLCC (19.1x19.1)

Package: 52-LCC (J-Lead)

MK10DN512ZVLK10

NXP

IC MCU 32BIT 512KB FLASH 80LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 37x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

Package: 80-LQFP

MK22DN512VDC5

NXP

IC MCU 32BIT 512KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 20x16b, D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-VFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

Package: 121-VFBGA

LPC18S30FET100E

NXP

IC MCU 32BIT ROMLESS 100TFBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
• Number of I/O: 49
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 200K x 8
• Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 4x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-TFBGA
• Supplier Device Package: 100-TFBGA (9x9)

Package: 100-TFBGA

MC9S08AC16CFDE

NXP

IC MCU 8BIT 16KB FLASH 48QFN

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 38
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN-EP (7x7)

Package: 48-VFQFN Exposed Pad

MC9S08FL8CBM

NXP

IC MCU 8BIT 8KB FLASH 32SDIP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: SCI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 30
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-SDIP (0.400", 10.16mm)
• Supplier Device Package: 32-SDIP

Package: 32-SDIP (0.400", 10.16mm)

MPXH6400AC6U

NXP

PRESSURE SENSOR ABS AXIAL 8-SSOP

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 58.02 PSI (20 kPa ~ 400 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.8 V
• Accuracy: ±1.5%
• Voltage - Supply: 4.64 V ~ 5.36 V
• Port Size: Male - 0.13" (3.3mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 232.06 PSI (1600 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SSOP (0.335", 8.50mm Width), Top Port
• Supplier Device Package: 8-SSOP

Package: 8-SSOP (0.335", 8.50mm Width), Top Port

MMA1220EGR2

NXP

ACCELEROMETER 8G ANALOG 16SOIC

• Type: Analog
• Axis: Z
• Acceleration Range: ±8g
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): 250
• Bandwidth: 250Hz
• Output Type: Analog Voltage
• Voltage - Supply: 4.75 V ~ 5.25 V
• Features: -
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 16-SOIC

Package: 16-SOIC (0.295", 7.50mm Width)

SL3S1204FTB0X

NXP

IC UCODE G2XL XSON6

• Type: RFID Transponder
• Frequency: 840MHz ~ 960MHz
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON (1.45x1.00)

Package: 6-XFDFN

NCF2952XTT/T0E080J

NXP

IC REMOTE KEYLESS ENTRY 38TSSOP

• Type: -
• Frequency: -
• Standards: -
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

Package: -

MW7IC2240NR1

NXP

IC PWR AMP RF 4W TO-270-16

• Frequency: 2.11GHz ~ 2.17GHz
• P1dB: 46dBm (40W)
• Gain: 30dB
• Noise Figure: -
• RF Type: W-CDMA
• Voltage - Supply: 32V
• Current - Supply: 420mA
• Test Frequency: 2.14GHz
• Package / Case: TO-270-16 Variant, Flat Leads
• Supplier Device Package: TO-270 WBL-16

Package: TO-270-16 Variant, Flat Leads

SPC5644BK0MLU1R

NXP

NXP 32-BIT MCU POWER ARCH 1.5M

• Core Processor: e200z4d
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CANbus, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 147
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 27x10b, 5x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 176-LQFP
• Supplier Device Package: 176-LQFP (24x24)

Package: 176-LQFP

S912XDP512J0MAG

NXP

16-BIT MCU S12X CORE 512KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b, 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

Package: 144-LQFP