TE Connectivity AMP Connectors Products - Sockets for ICs, Transistors

8080-1G7

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 4POS GOLD

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 4 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Fluoropolymer (FP)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock6,264

4 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Fluoropolymer (FP)

-55°C ~ 125°C

8060-1G5

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock6,648

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8060-1G11

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock8,508

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8060-1G4

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 4POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 4 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock8,820

4 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8060-1G13

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock6,708

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8060-1G3

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock28,776

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8058-1G23

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

Package: -

Stock14,370

3 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

516-AG10D

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: -
Operating Temperature: -55°C ~ 125°C

Package: -

Stock21,396

16 (2 x 8)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

-

Brass

-

-55°C ~ 125°C

510-AG90D-10

TE Connectivity AMP Connectors

CONN SOCKET SIP 10POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: -
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic
Operating Temperature: -

Package: -

Stock6,300

10 (1 x 10)

0.100" (2.54mm)

Gold

-

Beryllium Copper

Through Hole

-

Solder

0.100" (2.54mm)

Gold

-

Beryllium Copper

Thermoplastic

-

840-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock13,056

40 (2 x 20)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

814-AG10D-ES

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock8,100

14 (2 x 7)

0.100" (2.54mm)

Gold

25µin (0.63µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

-

Copper Alloy

Polyester

-55°C ~ 105°C

832-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock20,448

32 (2 x 16)

0.100" (2.54mm)

Gold

Flash

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Copper Alloy

Polyester

-55°C ~ 105°C

828-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock29,370

28 (2 x 14)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

820-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock29,760

20 (2 x 10)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

816-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 16POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock32,988

16 (2 x 8)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

814-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock27,732

14 (2 x 7)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

808-AG11D-ESL-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: Flash
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock23,808

8 (2 x 4)

0.100" (2.54mm)

Gold

Flash

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

Flash

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

4-1571552-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 14POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20µin (0.51µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock28,980

14 (2 x 7)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

20µin (0.51µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

808-AG11D-ES-LF

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 8POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 20µin (0.51µm)
Contact Material - Post: Copper
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

Package: -

Stock21,270

8 (2 x 4)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

20µin (0.51µm)

Copper

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

1-2199299-5

TE Connectivity AMP Connectors

40P,DIP SKT,600 CL,LDR,PB FREE

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60µin (1.52µm)
Contact Material - Post: Nickel
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Package: -

Stock23,010

40 (2 x 20)

0.100" (2.54mm)

Tin

60µin (1.52µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60µin (1.52µm)

Nickel

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

1-2199299-2

TE Connectivity AMP Connectors

28P,DIP SKT,600 CL,LDR,PB FREE

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60µin (1.52µm)
Contact Material - Post: Nickel
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature: -40°C ~ 105°C

Package: -

Stock32,892

28 (2 x 14)

0.100" (2.54mm)

Tin

60µin (1.52µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

60µin (1.52µm)

Nickel

Polybutylene Terephthalate (PBT), Glass Filled

-40°C ~ 105°C

1-2199298-9

TE Connectivity AMP Connectors

28P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock82,590

-

1-2199298-6

TE Connectivity AMP Connectors

20P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock46,494

-

1-2199298-5

TE Connectivity AMP Connectors

18P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock48,552

-

1-2199298-4

TE Connectivity AMP Connectors

16P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock100,842

-

1-2199298-3

TE Connectivity AMP Connectors

14P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock123,318

-

1-2199298-1

TE Connectivity AMP Connectors

6P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock102,798

-

1-2199298-2

TE Connectivity AMP Connectors

8P,DIP SKT,300 CL,LDR,PB FREE

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

Package: -

Stock66,054

-

2-821949-5

TE Connectivity AMP Connectors

CONN SOCKET PQFP 132POS TIN-LEAD

Type: QFP
Number of Positions or Pins (Grid): 132 (4 x 33)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

Package: -

Stock17,916

132 (4 x 33)

0.050" (1.27mm)

Tin-Lead

200µin (5.08µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin-Lead

200µin (5.08µm)

Phosphor Bronze

Liquid Crystal Polymer (LCP)

-

1-1571994-0

TE Connectivity AMP Connectors

CONN SOCKET SIP 10POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 10 (1 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 20µin (0.51µm)
Contact Material - Post: Copper
Housing Material: Thermoplastic, Polyester
Operating Temperature: -

Package: -

Stock28,044

10 (1 x 10)

0.100" (2.54mm)

Gold

20µin (0.51µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

20µin (0.51µm)

Copper

Thermoplastic, Polyester

-