The data center industry faces a significant challenge: meeting the growing energy demands of artificial intelligence (AI) workloads. As AI technology advances, the need for computational power also increases, resulting in a significant surge in energy consumption. Research by Schneider Electric highlights that data centers need to consider power requirements and cooling solutions to achieve peak performance. In search of answers, the data center sector examines different energy sources, and nuclear power is emerging as a possible solution.
Railway electrification systems rely on a steady DC supply to both power their DC motors and the control/energy circuits. These DC-traction systems are more energy efficient than their coal, gas,or diesel-based counterparts while also reducing CO2 emissions.
This article will discuss the advantages and challenges of four battery chemical components (lithium ion, lithium iron phosphate, lithium polymer, and nickel-metal Hydride) in battery applications below 30V, and how battery charging ics for these battery types can improve battery performance, uptime, and service life in applications.
APDS-9702 is a signal conditioning IC that enhances the performance and robustness of optical sensors for proximity or target detection. The device comes in an 8-pin QFN package with dimensions of 0.55mm(H) x 2mm(W) x 2mm(L). It can operate in the voltage range of 2.4V to 3.6V. Has two separate analog and digital output pins. This provides the flexibility to use analog or digital output (or both) depending on the requirements of the application
ACPL-827 is a DC input two-channel fully spaced phototransistor optical coupler consisting of two light-emitting diodes optically coupled to two independent transistors. It is encapsulated in an 8-pin DIP package. Similarly, ACPL-847 is a DC input four-channel full-pitch phototransistor optical coupler containing four light-emitting diodes optically coupled to four independent transistors. It comes in a 16-pin DIP package.
The ACPM-7881 is a high performance W-CDMA power amplifier module in a 4x4x1.1mm package. Using surface mount RF package design, with high cost and size competitiveness
The MSA-2011 and MSA-2086 are high performance silicon bipolar RFIC amplifiers designed to be cascadable in 50 Ω systems. The stability factor of K > 1 contributes to easy cascading in numerous narrow and broadband IF and RF commercial and industrial applications.
The ACPL-W611/ACPL-P611 is an optically coupled gate that combines a GaAsP light emitting diode and an integrated high gain photo detector. The output of the detector IC is an open collector Schottky clamped transistor. The internal shield provides a guaranteed common mode transient immunity specification of 10,000 V/μs for the ACPL-W611
Broadcom ACPL-352J is a 5.0A smart gate driver optical coupler. The high peak output current and wide operating voltage range make it ideal for driving IGBT or SiC/GaN MOSFET directly for motor control and inverter applications
Broadcom's AERD-NxxB-00010 surface-mount infrared emitter LEDs (IR SMT lamps) have a state-of-the-art packaging platform and exceptional lens optics profile. The IR SMT lamp is the right solution for a variety of infrared sensing applications such as light curtains, office automation, traffic detection, and industrial sensing.
Broadcom's automotive high-precision r2 coupler isolation products provide enhanced isolation and reliability, Broadcom's ACPL-C87AT and ACPL-C87BT automotive isolation amplifiers utilize superior optical coupling technology, Sigma-delta (Sigma-Delta erta) analog-to-digital converters, chopper-stabilized amplifiers, and fully differential circuit topologies to provide unmatched isolation-mode noise rejection, low offset, high gain accuracy, and stability.
Broadx Technologies has introduced its new AWG cascade technology. The company's first product to use AWG cascade technology was a multiplexing/demultiplexing chip for four-channel CWDM applications in data center transceivers. Initially, single-pair 1 × 4 AWG cascades and double-pair 2 × 8 dual-density (DD) AWG cascades will be used. Bendy AWG cascades can also be laid out efficiently, providing up to 64 separate AWG cascades on a single chip, ideal for CPO for next-generation multiterabit applications.
