Latest Technologies | Panasonic - New metallized polypropylene film capacitors feature high safety and humidity resistance | Heisener Electronics
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2018-05-03, Panasonic - New metallized polypropylene film capacitors feature high safety and humidity resistance

Panasonic Industry Europe has a new series of polypropylene film capacitors featuring high humidity resistance (THB test: 85C/85%/240VAC/1000h (C<1μF) and high safety.

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2018-05-03, Cypress - Nonvolatile memory family delivers high-speed, high-reliability performance

Cypress Semiconductor has a new serial nonvolatile memory family that offers superior performance and reliability for mission-critical data capture.

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2018-05-03, Texas Instruments - Low-power, precision instrumentation amplifier offers excellent accuracy

The Texas Instruments INA317 is a low-power, precision instrumentation amplifier offering excellent accuracy. The versatile three-operational amplifier design, small size and low power make the device usable in a wide range of portable applications.

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2018-05-03, Analog Devices - High linearity I/Q demodulator supports 1GHz bandwidth, achieving up to 60dB image rejection

Analog Devices offers the LTC5594, a wideband, high linearity true zero-IF (ZIF) demodulator with 1GHz instantaneous I and Q 1dB bandwidth. The demodulator is typically capable of 37dB image rejection.

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2018-04-02, APEC: 1MHz active clamp flyback chipset and 6-A three-level buck battery buck.

Operating at up to 1 MHz, TI has a new chipset that combines.

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2018-04-02, Cypress adds Arm secure firmware to PSoC6

Plath semiconductor realizes the security system of ARM platform (PSA), trusts firmware-m and refers to Cypress's PSoC 6 microcontroller.

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2018-04-02, APEC: Synchronous Rectifier Saves Secondary Power

Diodes has announced ZXGD3113, a synchronous rectifier controller intended to work with a mosfet to replace the voltage drop associated with a Schottky diode on the secondary side of an isolated power converter such as ac-dc power supplies – potentially removing the need for secondary-side heatsinking.

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2018-04-02, APEC: Microsemi's sample 1.2KV SiC MOSFET.

Microsemi is sampling the first of its next-generation 1.2kV silicon carbide mosfets, the 40m[Ohm] MSC040SMA120B, plus 1.2kV SiC Schottky barrier diodes to go with it.

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2018-04-02, Pico's data recording software is completely redesigned.

UK test equipment maker Pico Technology revealed a ground-up redesign of its data logging software at Embedded World.

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2018-04-02, Harting designs low profile 250A connector for railways

Offering a high-current connector for tight spaces on rail vehicles, Harting has added a low profile high-current connector for up to four 250A contacts to its Han HPR connector series.

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2018-04-02, Knowles provides EMI filters for space and medical treatment

Syfer-branded EMI filters from Knowles Precision Devices are being targeted at medical implantable devices and the space sector.

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2018-04-02, ADI creates internal silicon PCB for system-in-package ADCs

The passives are in the silicon, not in poly, real silicon. They are matched to 0.1%, with temperature drift in the same direction, and have 1% absolute accuracy over temperature: -40 to +125 or -40 to +105°C.

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2018-04-02, BOSCH aims 6 axis inertial chips as VR and AR headphones

Bosch has launched a 6 axis MEMS inertial measurement unit with a 3 axis 16bit accelerometer and 3 axis, 16bit gyroscope in a single package.

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2018-04-02, New version of PVRTune from Imagination

Imagination has brought out a a new version of PVRTune, the PowerVR GPU performance analysis tool.

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2018-04-02, The Maxim uSLIC module provides a switching regulator with a LDO shape

Micro system-level IC (“uSLIC”) modules from Maxim claim to deliver switching regulators with the size and simplicity of a linear regulator (LDO).

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2018-04-02, 500W 12 to 24V converter is suitable for bad environment

Gresham power electronics has introduced 500W DC to DC converter for military and non tactical vehicle communication and security systems.

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2018-04-02, Samsung will rise 10nm Exynos AP at H2

Samsung says it will begin volume production of a 10nm Exynos AP in H2.