ADI creates internal silicon PCB for system-in-package ADCs | Heisener Electronics
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ADI creates internal silicon PCB for system-in-package ADCs

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Post Date: 2018-04-02
This is a new thing in system-in-package, and iPassive has been used to add a matching input driver and a reference buffer to the company's 4000 series of high-precision successive approximation ADCs (see figure), forming the ADAQ400x to date-forthcoming release Series, it will sample at a rate of 1-2Msample / s with a resolution of 16 or 18bit. Adding an input buffer to the package greatly simplifies the process of driving the variable input impedance of the converter. According to Tzscheetzsch, it has a fast rise time, "stabilizing to 0.1% in a few nanoseconds, and you can turn off the power to the amplifier during ADC conversions." The power of the ADC is 7mW / Msample / s, and the power of the buffer is ~ 1mA. Due to the use of iPassive substrates, if the number is sufficient (Tzscheetzsch said, greater than 50-100,000, ADI will provide customized versions). This is a dual-power product. Last year the company released a similar ADAQ798x series, which only accepts single-ended inputs and does not use iPassive.