Aerospace-grade FPGAs require reliable, high-density non-volatile memory, including its boot configuration. To meet the growing demand for high-reliability memory, Infineon Technologies announced the launch of the industry's first high-density RadTol NOR flash memory product that complies with the QML-V process (QML-V equivalent standard) of MIL-PRF-38535. The QML-V process marks the certification of the highest quality and reliability standards for aviation-grade ICs.
256Mb and 512Mb RadTol NOR flash non-volatile memory provides excellent, low-pin-count single-chip solutions for applications including FPGA configuration, image storage, microcontroller data and boot code storage. When used at a higher clock rate, the data transfer supported by the device matches or exceeds that of traditional parallel asynchronous NOR flash memory, while significantly reducing the number of pins. These devices can withstand up to 30krad (Si) bias and 125krad (Si) bias. At 125C, these devices support 1,000 program/erase cycles and 30 years of data retention, while at 85C, the devices support 10k program/erase cycles and 250 years of data retention.
"Our radiation-tolerant dual QSPI non-volatile memory is fully supported by the latest aerospace-grade FPGAs. They support an excellent, low-pin-count single chip selection solution to configure the processor and FPGA," Infineon Technologies Aviation Helmut Puchner, Vice President of Aerospace and Defense said. "For example, the entire image of the Xilinx Kintex UltraScale XQRKU060 can be loaded in approximately 0.2 seconds in dual four-way mode."
These devices can be programmed in the system via FPGA or a stand-alone programmer, using the same 36-pin ceramic flat package. The company's development kits and software further simplify design implementation.