MOSFET and diode power modules for on-board charging applications | Heisener Electronics
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MOSFET and diode power modules for on-board charging applications

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Post Date: 2022-11-24, Vishay Dale

    Vishay Intertechnology has released seven new MOSFET and diode power modules for on-board charger applications. They provide all circuit configurations required for AC/DC, DC-DC and DC/AC conversion in airborne charging applications - input/output bridge, full bridge inverter and PFC - within a wide range of rated power. In accordance with the AQG-324 Automobile Guidelines, modules can be combined to provide complete solutions for electric vehicles and hybrid vehicles, as well as agricultural equipment, electric scooters, railways, etc.

     The integrated solution provides various circuit configurations. In the compact EMIPAK 1B package, the high efficiency fast diode mosfet and SiC, FRED Pt and MOAT diode technologies are combined, providing the patented PressFit pin locking technology.The exposed AI2O3 DBC substrate of the device provides improved thermal performance, and their optimized layout helps minimize stray inductance to obtain better EMI performance. The PressFit pin locking technology of the module provides simple PCB installation and reduces the mechanical stress on the substrate, while its baseless structure improves reliability by reducing the number of welding interfaces.

     Based on the matrix method, the EMIPAK package of the device can meet various customized circuit configurations in the same 63mm x 34mm x 12mm compact footprint. This provides a higher power density than discrete solutions, while providing the flexibility to use each module in different power stages of industrial and renewable energy applications, including plasma cutting, UPS, welding, solar inverters, and wind turbines.

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