MOSFETs in PowerDI8080 Package from Diodes Incorporated Improve Power Density in Modern Automotive Applications | Heisener Electronics
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MOSFETs in PowerDI8080 Package from Diodes Incorporated Improve Power Density in Modern Automotive Applications

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Post Date: 2022-08-08, Diodes Incorporated

      Diodes Incorporated announces the PowerDI 8080-5, an innovative high current, thermally efficient power package that meets the needs of electric vehicle (EV) product applications. The first product in the PowerDI 8080-5 package is the DMTH4M70 SPGWQ, an automotive-spec 40V MOSFET with a typical RDS(ON) of only 0.54mΩ and a gate charge of 117nC with a 10V gate drive. This industry-leading performance enables designers of automotive high-power BL DC motor drivers, DC-DC converters and charging systems to dramatically increase system efficiency while ensuring that power consumption is kept to an absolute minimum.

     The PowerDI 8080-5 package has a PCB area of 64mm2, which is 40% smaller than the TO263 (D2PAK) package format. It also has a 1.7mm outer profile, which is 63% smaller than the TO263. Copper clip soldering between die and terminals helps achieve a low junction-to-case thermal resistance of 0.36°C/W. As a result, the PowerDI®8080-5 can handle currents up to 460A and provide eight times higher power density than the TO263 package.

     The DMTH4M70SPGWQ is AEC-Q101 qualified, PPAP compliant, and manufactured in an IATF 16949 certified facility. Its gull-wing leads facilitate automatic optical inspection (AOI) and improve reliability of temperature cycling.

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