Murata launches 72W ultra-thin 4-split step-down DC-DC charge pump module supporting 48V input voltage | Heisener Electronics
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Murata launches 72W ultra-thin 4-split step-down DC-DC charge pump module supporting 48V input voltage

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Post Date: 2022-08-26, Murata

      Murata has developed a 4-split step-down DC-DC "charge pump module (MYC0409)" that has the industry's highest power density (5.4kW/inch3) and supports 48V input voltage

      Whereas the previous industry standard - an isolated Brick converter that steps down from 48V to an intermediate bus (typically 12V), the MYC0409 delivers a maximum of 72W at approximately 97% peak efficiency through Murata's unique virtually lossless switched capacitor architecture of power. In addition, by using the interleaving method, very low input and output ripple performance is also achieved.

     Taking advantage of the above properties, system designers can distribute this product near the load to reduce copper losses on the printed circuit board and build a centralized 48V bus system by connecting this product in parallel for a more suitable motherboard design. Also, the MYC0409 is 2.0mm high and has a compact package shape, suitable for low-profile applications and mounting on the back of a motherboard.the MYC0409 also provides a breakthrough high-power, high-efficiency solution for step-down conversion from 48V input voltages in HPC(3), accelerator cards, network routers and optical transmission equipment where high power density is required.

     "In recent years, the rapid growth of the 5G and IoT markets is raising the power density limit of data center and network equipment. Therefore, in order to reduce the power density of busbars and printed circuit boards Copper loss, the next-generation system has begun to migrate from the current 12V bus system to the 48V bus system. Last year, Murata first launched a unique discrete IC solution that supports 48V input power - FlexiCP™ series (PE25204). MYC0409 can meet further The demand for miniaturization is the first product of the charge pump module series, a module solution that integrates charge pump ICs and passive components with our unique resin encapsulation technology."

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