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NXP - Wireless MCU family extended for automotive and industrial markets

Technology Cover
Post Date: 2020-07-26, NXP

NXP Semiconductors has introduced new devices in its KW3x series of MCUs. The new KW39/38/37 MCU adds the remote capability of Bluetooth 5.0 and expanded Bluetooth advertising channels. While providing these enhancements, it also provides a seamless migration of hardware, software and tool compatibility with the previous generation equipment KW34/35/36. The connectivity MCU enables Bluetooth LE devices to communicate over a distance of more than one mile, and increases the number of Bluetooth advertising channels and advertising data within the Bluetooth standard, the main Internet of Things protocol. The new wireless MCU solution enables developers to meet emerging use cases in the automotive and industrial digital fields.

These MCUs are created with automotive and industrial grade hardware and software and reliable serial communication with CAN-FD peripherals. The new device is very suitable for automotive applications such as keyless entry, sensors and wireless on-board diagnostic functions. In addition, they support industrial applications such as building control and surveillance, fire protection and security, home and institutional healthcare, asset management and surveillance, and a range of other industrial use cases.

This series has first-class RF performance, extremely high RX sensitivity, and can provide remote Bluetooth low energy connection. The new device achieves -105dBm RX sensitivity at 125kbit/s data rate of LE encoding. The MCU's innovative data stream buffer can capture radio parameters without stalling the processor or DMA operations, thereby achieving the high-precision measurements required for distance and angle approximation.

The company's MCUXpresso tool suite has a certified Bluetooth low energy software stack, and has application programming interface calls. The new MCU increases the previous generation devices with hardware and software compatibility, thereby speeding up the design cycle.

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