The company developed the packages – part of its MicroPak package range – to offer the smallest footprint for logic functions while assuring pad pitch remains 0.4mm or over. The company’s low-power AUP, AXP, LV and LVC technology families which covers over 100 logic solutions are offered in X2SON eight, six, five and four-pin packages.
The new four-pin X2SON4 package option lessens the footprint of the same function by 44% when compared to five-pin X2SON5, and by up to 64% when compared to XSON packages.
Michael Lyons, senior product manager at Nexperia, commented: “X2SON4 enables the release of smaller buffers and inverters, which were previously only available in five-pin or six-pin leadless packages. All our X2SON solutions enable miniaturisation without the use of expensive and fragile step-down masks.”