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Nexperia - Small logic package can be used without a step-down mask

Technology Cover
Post Date: 2018-10-03, Nexperia USA Inc.


The company developed the packages – part of its MicroPak package range – to offer the smallest footprint for logic functions while assuring pad pitch remains 0.4mm or over. The company’s low-power AUP, AXP, LV and LVC technology families which covers over 100 logic solutions are offered in X2SON eight, six, five and four-pin packages.

The new four-pin X2SON4 package option lessens the footprint of the same function by 44% when compared to five-pin X2SON5, and by up to 64% when compared to XSON packages.

Michael Lyons, senior product manager at Nexperia, commented: “X2SON4 enables the release of smaller buffers and inverters, which were previously only available in five-pin or six-pin leadless packages. All our X2SON solutions enable miniaturisation without the use of expensive and fragile step-down masks.”

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