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AD8045ARDZ-REEL7

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AD8045ARDZ-REEL7

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Part Number AD8045ARDZ-REEL7
Manufacturer Analog Devices Inc.
Description IC OPAMP VFB 1GHZ 8SOIC
Datasheet AD8045ARDZ-REEL7 Datasheet
Package 8-SOIC (0.154", 3.90mm Width) Exposed Pad
In Stock 3,906 piece(s)
Unit Price $ 2.1140 *
Lead Time Can Ship Immediately
Estimated Delivery Time Oct 28 - Nov 2 (Choose Expedited Shipping)
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Part Number # AD8045ARDZ-REEL7 (Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps) is manufactured by Analog Devices Inc. and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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AD8045ARDZ-REEL7 Specifications

ManufacturerAnalog Devices Inc.
CategoryIntegrated Circuits (ICs) - Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
Datasheet AD8045ARDZ-REEL7Datasheet
Package8-SOIC (0.154", 3.90mm Width) Exposed Pad
Series-
Amplifier TypeVoltage Feedback
Number of Circuits1
Output Type-
Slew Rate1350 V/µs
Gain Bandwidth Product-
-3db Bandwidth1GHz
Current - Input Bias2µA
Voltage - Input Offset200µV
Current - Supply16mA
Current - Output / Channel70mA
Voltage - Supply, Single/Dual (±)3.3 V ~ 12 V, ��1.65 V ~ 6 V
Operating Temperature-40°C ~ 125°C
Mounting TypeSurface Mount
Package / Case8-SOIC (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package8-SOIC-EP

AD8045ARDZ-REEL7 Datasheet

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3 nV/√Hz, Ultralow Distortion, High Speed Op Amp Data Sheet AD8045 Rev. C Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2004–2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Ultralow distortion SFDR −101 dBc at 5 MHz −90 dBc at 20 MHz −63 dBc at 70 MHz Third-order intercept 43 dBm at 10 MHz Low noise 3 nV/√Hz 3 pA/√Hz High speed 1 GHz, −3 dB bandwidth (G = +1) 1350 V/µs slew rate 7.5 ns settling time to 0.1% Standard and low distortion pinout Supply current: 15 mA Offset voltage: 1.0 mV max Wide supply voltage range: 3.3 V to 12 V APPLICATIONS Instrumentation IF and baseband amplifiers Active filters ADC drivers DAC buffers CONNECTION DIAGRAMS 04 81 4- 0- 00 1 3–IN 4+IN 1NIC 2FEEDBACK 6 NIC 5 –VS 8 +VS 7 OUTPUT AD8045 TOP VIEW (Not to Scale) NOTES 1. NIC = NO INTERNAL CONNECTION. Figure 1. 8-Lead AD8045 LFCSP (CP-8) 04 81 4- 0- 00 2 FEEDBACK 1 –IN 2 +IN 3 –VS 4 NIC8 +VS7 OUTPUT6 NIC5 AD8045 TOP VIEW (Not to Scale) NOTES 1. NIC = NO INTERNAL CONNECTION. Figure 2. 8-Lead AD8045 SOIC/EP (RD-8) GENERAL DESCRIPTION The AD8045 is a unity-gain stable voltage feedback amplifier with ultralow distortion, low noise, and high slew rate. With a spurious-free dynamic range of −90 dBc at 20 MHz, the AD8045 is an ideal solution in a variety of applications, including ultrasound, automated test equipment (ATE), active filters, and analog-to- digital converter (ADC) drivers. The Analog Devices, Inc., proprietary next generation XFCB process and innovative architecture enable such high performance amplifiers. The AD8045 features a low distortion pinout for the LFCSP, which improves second harmonic distortion and simplifies the layout of the circuit board. The AD8045 has a 1 GHz bandwidth, a 1350 V/µs slew rate, and settles to 0.1% in 7.5 ns. With a wide supply voltage range (3.3 V to 12 V) and a low offset voltage (200 µV), the AD8045 is an ideal candidate for systems that require high dynamic range, precision, and high speed. The AD8045 amplifier is available in a 3 mm × 3 mm LFCSP and the standard 8-lead SOIC. Both packages feature an exposed paddle that provides a low thermal resistance path to the printed circuit board (PCB). This enables more efficient heat transfer and increases reliability. The AD8045 works over the extended industrial temperature range (−40°C to +125°C). 04 81 4- 0- 07 9 FREQUENCY (MHz) 1000.1 1 10 H A R M O N IC D IS TO R TI O N (d B c) –20 –30 –40 –50 –60 –70 –80 –90 –100 –120 –110 HD3 LFCSP HD2 LFCSP G = +1 VS = ±5V VOUT = 2V p-p RL = 1kΩ RS = 100Ω Figure 3. Harmonic Distortion vs. Frequency for Various Packages

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AD8045 Data Sheet Rev. C | Page 2 of 24 TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Connection Diagrams ...................................................................... 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications with ±5 V Supply ..................................................... 3 Specifications with +5 V Supply ..................................................... 4 Absolute Maximum Ratings ............................................................ 5 Thermal Resistance ...................................................................... 5 ESD Caution .................................................................................. 5 Pin Configurations and Function Descriptions ........................... 6 Typical Performance Characteristics ............................................. 7 Circuit Configurations ................................................................... 16 Wideband Operation ................................................................. 16 Theory of Operation ...................................................................... 17 Frequency Response .................................................................. 17 DC Errors .................................................................................... 17 Output Noise ............................................................................... 18 Applications Information .............................................................. 19 Low Distortion Pinout ............................................................... 19 High Speed ADC Driver ........................................................... 19 90 MHz Active Low-Pass Filter (LPF) ..................................... 20 Printed Circuit Board Layout ....................................................... 22 Signal Routing ............................................................................. 22 Power Supply Bypassing ............................................................ 22 Grounding ................................................................................... 22 Exposed Paddle........................................................................... 23 Driving Capacitive Loads .......................................................... 23 Outline Dimensions ....................................................................... 24 Ordering Guide .......................................................................... 24 REVISION HISTORY 12/2018—Rev. B to Rev. C Changes to Table 2 ............................................................................ 4 Changes to Ordering Guide .......................................................... 24 5/2016—Rev. A to Rev. B Changed CP-8-2 to CP-8-13 ........................................ Throughout Changes to Figure 1 and Figure 2 ................................................... 1 Changes to Figure 5, Figure 6, and Table 5 ................................... 6 Deleted Table 6; Renumbered Sequentially................................... 6 Updated Outline Dimensions ....................................................... 24 Changes to Ordering Guide .......................................................... 24 9/2004—Rev. 0 to Rev. A Changes to Features Section............................................................ 1 Changes to Specifications Section .................................................. 4 Changes to Figure 58 ...................................................................... 15 Changes to Figure 63 ...................................................................... 17 Changes to Frequency Response Section .................................... 17 Changes to Figure 64 ...................................................................... 17 Changes to DC Errors Section ...................................................... 17 Changes to Figure 65 ...................................................................... 17 Changes to Figure 66 ...................................................................... 18 Changes to Output Noise Section ................................................ 18 Changes to Ordering Guide .......................................................... 24 7/2004—Revision 0: Initial Version

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Data Sheet AD8045 Rev. C | Page 3 of 24 SPECIFICATIONS WITH ±5 V SUPPLY TA = 25°C, G = +1, RS = 100 Ω, RL = 1 kΩ to ground, unless noted otherwise. The exposed paddle must be left floating or connected to −VS. Table 1. Parameter Test Conditions/Comments Min Typ Max Unit DYNAMIC PERFORMANCE −3 dB Bandwidth G = +1, VOUT = 0.2 V p-p 1000 MHz G = +1, VOUT = 2 V p-p 300 350 G = +2, VOUT = 0.2 V p-p 320 400 MHz Bandwidth for 0.1 dB Flatness G = +2, VOUT = 2 V p-p, RL = 150 Ω 55 MHz Slew Rate G = +1, VOUT = 4 V step 1000 1350 V/µs Settling Time to 0.1% G = +2, VOUT = 2 V step 7.5 ns NOISE/HARMONIC PERFORMANCE Harmonic Distortion (dBc) HD2/HD3 fC = 5 MHz, VOUT = 2 V p-p LFCSP −102/−101 dBc SOIC −106/−101 dBc fC = 20 MHz, VOUT = 2 V p-p LFCSP −98/−90 dBc SOIC −97/−90 dBc fC = 70 MHz, VOUT = 2 V p-p LFCSP −71/−71 dBc SOIC −60/−71 dBc Input Voltage Noise f = 100 kHz 3 nV/√Hz Input Current Noise f = 100 kHz 3 pA/√Hz Differential Gain Error NTSC, G = +2, RL = 150 Ω 0.01 % Differential Phase Error NTSC, G = +2, RL = 150 Ω 0.01 Degrees DC PERFORMANCE Input Offset Voltage 0.2 1.0 mV Input Offset Voltage Drift See Figure 54 8 µV/°C Input Bias Current 2 6.3 µA Input Bias Current Drift 8 nA/°C Input Bias Offset Current 0.2 1.3 µA Open-Loop Gain VOUT = −3 V to +3 V 62 64 dB INPUT CHARACTERISTICS Input Resistance Common-mode/differential 3.6/1.0 MΩ Input Capacitance Common-mode 1.3 pF Input Common-Mode Voltage Range ±3.8 V Common-Mode Rejection VCM = ±1 V −83 −91 dB OUTPUT CHARACTERISTICS Output Overdrive Recovery Time VIN = ±3 V, G = +2 8 ns Output Voltage Swing RL = 1 kΩ −3.8 to +3.8 −3.9 to +3.9 V RL = 100 Ω −3.4 to +3.5 −3.6 to +3.6 V Output Current 70 mA Short-Circuit Current Sinking/sourcing 90/170 mA Capacitive Load Drive 30% overshoot, G = +2 18 pF POWER SUPPLY Operating Range ±1.65 ±5 ±6 V Quiescent Current 16 19 mA Positive Power Supply Rejection +VS = +5 V to +6 V, −VS = −5 V −61 −68 dB Negative Power Supply Rejection +VS = +5 V, −VS = −5 V to −6 V −66 −73 dB

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AD8045 Data Sheet Rev. C | Page 4 of 24 SPECIFICATIONS WITH +5 V SUPPLY TA = 25°C, G = +1, RS = 100 Ω, RL = 1 kΩ to midsupply, unless otherwise noted. Exposed paddle must be floating or connected to −VS. Table 2. Parameter Test Conditions/Comments Min Typ Max Unit DYNAMIC PERFORMANCE –3 dB Bandwidth G = +1, VOUT = 0.2 V p-p 900 MHz G = +1, VOUT = 2 V p-p 160 200 MHz G = +2, VOUT = 0.2 V p-p 320 395 MHz Bandwidth for 0.1 dB Flatness G = +2, VOUT = 2 V p-p, RL = 150 Ω 60 MHz Slew Rate G = +1, VOUT = 2 V step 480 1060 V/µs Settling Time to 0.1% G = +2, VOUT = 2 V step 10 ns NOISE/HARMONIC PERFORMANCE Harmonic Distortion (dBc) HD2/HD3 fC = 5 MHz, VOUT = 2 V p-p LFCSP −89/−83 dBc SOIC −92/−83 dBc fC = 20 MHz, VOUT = 2 V p-p LFCSP −81/−70 dBc SOIC −83/−70 dBc fC = 70 MHz, VOUT = 2 V p-p LFCSP −57/−46 dBc SOIC −57/−46 dBc Input Voltage Noise f = 100 kHz 3 nV/√Hz Input Current Noise f = 100 kHz 3 pA/√Hz Differential Gain Error NTSC, G = +2, RL = 150 Ω 0.01 % Differential Phase Error NTSC, G = +2, RL = 150 Ω 0.01 Degrees DC PERFORMANCE Input Offset Voltage 0.5 1.4 mV Input Offset Voltage Drift See Figure 54 7 µV/°C Input Bias Current 2 6.6 µA Input Bias Current Drift 7 nA/°C Input Bias Offset Current 0.2 1.3 µA Open-Loop Gain VOUT = 2 V to 3 V 61 63 dB INPUT CHARACTERISTICS Input Resistance Common-mode/differential 3/0.9 MΩ Input Capacitance Common-mode 1.3 pF Input Common-Mode Voltage Range 1.2 to 3.8 V Common-Mode Rejection VCM = 2 V to 3 V −78 −94 dB OUTPUT CHARACTERISTICS Output Overdrive Recovery Time VIN = −0.5 V to +3 V, G = +2 10 ns Output Voltage Swing RL = 1 kΩ 1.2 to 3.8 1.1 to 4.0 V RL = 100 Ω 1.3 to 3.7 1.2 to 3.8 V Output Current 55 mA Short-Circuit Current Sinking/sourcing 70/140 mA Capacitive Load Drive 30% overshoot, G = +2 15 pF POWER SUPPLY Operating Range 3.3 5 12 V Quiescent Current 15 18 mA Positive Power Supply Rejection +VS = +5 V to +6 V, −VS = 0 V −65 −67 dB Negative Power Supply Rejection +VS = +5 V, −VS = 0 V to −1 V −70 −73 dB

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Data Sheet AD8045 Rev. C | Page 5 of 24 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Supply Voltage 12.6 V Power Dissipation See Figure 4 Common-Mode Input Voltage −VS − 0.7 V to +VS + 0.7 V Differential Input Voltage ±VS Exposed Paddle Voltage −VS Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +125°C Lead Temperature (Soldering 10 sec) 300°C Junction Temperature 150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is specified for the worst-case conditions; that is, θJA is specified for the device soldered in the circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA θJC Unit SOIC 80 30 °C/W LFCSP 93 35 °C/W Maximum Power Dissipation The maximum safe power dissipation for the AD8045 is limited by the associated rise in junction temperature (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the AD8045. Exceeding a junction temperature of 175°C for an extended period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the AD8045 drive at the output. The quiescent power is the voltage between the supply pins (VS) times the quiescent current (IS). PD = Quiescent Power + (Total Drive Power – Load Power) ( ) L 2 OUT L OUTS SSD R V – R V 2 V IVP       ×+×= RMS output voltages should be considered. If RL is referenced to −VS, as in single-supply operation, the total drive power is VS × IOUT. If the rms signal levels are indeterminate, consider the worst case, when VOUT = VS/4 for RL to midsupply. ( ) ( ) L S SSD R /V IVP 24 +×= In single-supply operation with RL referenced to −VS, worst case is VOUT = VS/2. Airflow increases heat dissipation, effectively reducing θJA. Also, more metal directly in contact with the package leads and exposed paddle from metal traces, through holes, ground, and power planes reduces θJA. Figure 4 shows the maximum safe power dissipation in the package vs. the ambient temperature for the exposed paddle SOIC (80°C/W) and LFCSP (93°C/W) package on a JEDEC standard 4-layer board. θJA values are approximations. 04 81 4- 0- 08 0 AMBIENT TEMPERATURE (°C) 120–40 –20 0 20 40 60 80 100 M A XI M U M P O W ER D IS SI PA TI O N (W at ts ) 0.0 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 LFCSP SOIC Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board ESD CAUTION

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AD8045 Data Sheet Rev. C | Page 6 of 24 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 04 81 4- 0- 00 3 FEEDBACK 1 –IN 2 +IN 3 –VS 4 NIC8 +VS7 OUTPUT6 NIC5 AD8045 TOP VIEW (Not to Scale) NOTES 1. NIC = NO INTERNAL CONNECTION. 2. THE EXPOSED PADDLE MUST BE CONNECTED TO −VS OR LEFT ELECTRICALLY ISOLATED (FLOATING). Figure 5. 8-Lead SOIC Pin Configuration 04 81 4- 0- 00 4 3–IN 4+IN 1NIC 2FEEDBACK 6 NIC 5 –VS 8 +VS 7 OUTPUT NOTES 1. NIC = NO INTERNAL CONNECTION. 2. THE EXPOSED PADDLE MUST BE CONNECTED TO −VS OR LEFT ELECTRICALLY ISOLATED (FLOATING). AD8045 TOP VIEW (Not to Scale) Figure 6 . 8-Lead LFCSP Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description SOIC LFCSP 1 2 FEEDBACK Feedback Pin. 2 3 −IN Inverting Input. 3 4 +IN Noninverting Input. 4 5 −VS Negative Supply. 5, 8 1, 6 NIC No Internal Connection. 6 7 OUTPUT Output. 7 8 +VS Positive Supply. EPAD Exposed Paddle. The exposed paddle must be connected to −VS or left electrically isolated (floating).

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Data Sheet AD8045 Rev. C | Page 7 of 24 TYPICAL PERFORMANCE CHARACTERISTICS 04 81 4- 0- 04 9 FREQUENCY (MHz) 10001 10 100 N O R M A LI ZE D C LO SE D -L O O P G A IN (d B ) 1 0 –1 –2 –3 –4 –5 –6 –7 G = +2 G = –1G = +10 VS = ±5V RL = 1kΩ Figure 7. Small Signal Frequency Response for Various Gains 04 81 4- 0- 05 0 FREQUENCY (MHz) 100010 100 C LO SE D -L O O P G A IN (d B ) 4 3 2 1 0 –1 –3 –2 –4 –5 –6 G = +1 VS = ±5V RS = 100Ω RL = 500Ω RL = 100Ω RL = 1kΩ Figure 8. Small Signal Frequency Response for Various Loads 04 81 4- 0- 05 1 FREQUENCY (MHz) 100010 100 C LO SE D -L O O P G A IN (d B ) 5 4 3 2 0 1 –2 –1 –3 –4 –5 VS = ±5V VS = ±2.5V G = +1 RL = 1kΩ RS = 100Ω Figure 9. Small Signal Frequency Response for Various Supplies 04 81 4- 0- 04 8 FREQUENCY (MHz) 100010 100 C LO SE D -L O O P G A IN (d B ) 12 10 11 8 9 6 7 4 5 2 3 0 1 18pF 5pF 10pF G = +2 VS = ±5V RL = 1kΩ RF = 499Ω 0pF Figure 10. Small Signal Frequency Response for Various Capacitive Loads 04 81 4- 0- 05 2 FREQUENCY (MHz) 100010 100 C LO SE D -L O O P G A IN (d B ) 4 2 0 –1 –3 3 1 –2 –4 –5 –6 –40°C +25°C +125°C G = +1 VS = ±5V RL = 1kΩ Figure 11. Small Signal Frequency Response for Various Temperatures 04 81 4- 0- 03 9 FREQUENCY (MHz) 1 10 100 C LO SE D -L O O P G A IN (d B ) 6.3 6.2 6.1 6.0 5.9 5.8 5.7 VOUT = 2V p-p VOUT = 200mV p-p G = +2 VS = ±5V RF = 499Ω RL = 150Ω Figure 12. 0.1 dB Flatness vs. Frequency for Various Output Voltages

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AD8045 Data Sheet Rev. C | Page 8 of 24 04 81 4- 0- 04 3 FREQUENCY (MHz) 100010 100 C LO SE D -L O O P G A IN (d B ) 2 0 1 –2 –1 –4 –3 –6 –5 –8 –7 –10 –9 G = +1 RL = 1kΩ RS = 100Ω VOUT = 2V p-p VS = ±2.5V VS = ±5V Figure 13. Large Signal Frequency Response for Various Supplies 04 81 4- 0- 04 2 FREQUENCY (MHz) 100010 100 C LO SE D -L O O P G A IN (d B ) 2 0 1 –2 –1 –4 –3 –6 –5 –8 –9 –7 –10 G = +1 VS = ±5V RS = 100Ω VOUT = 2V p-p RL = 1kΩ RL = 100Ω Figure 14. Large Signal Frequency Response for Various Loads 04 81 4- 0- 04 1 FREQUENCY (MHz) 10001 10 100 N O R M A LI ZE D C LO SE D -L O O P G A IN (d B ) 2 1 0 –1 –2 –3 –4 –5 –6 –7 –8 VS = ±5V RF = 499Ω RL = 1kΩ VOUT = 2V p-p G = +10 G = –1 G = +2 Figure 15. Large Signal Frequency Response for Various Gains 04 81 4- 0- 06 4 FREQUENCY (MHz) 10000.01 0.1 1 10 100 O PE N -L O O P PH A SE (D eg re es ) –360 0 –90 –135 –180 –45 –225 –270 –315 O PE N -L O O P G A IN (d B ) 70 50 60 40 20 30 10 0 –10 VS = ±5V RL = 1kΩ Figure 16. Open-Loop Gain and Phase vs. Frequency 04 81 4- 0- 03 0 FREQUENCY (MHz) 1000.1 1 10 H A R M O N IC D IS TO R TI O N (d B c) –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 HD3 SOIC AND LFCSP HD2 LFCSP HD2 SOIC G = +1 VS = ±5V VOUT = 2V p-p RL = 1kΩ RS = 100Ω Figure 17. Harmonic Distortion vs. Frequency for Various Packages 04 81 4- 0- 02 8 FREQUENCY (MHz) 0.1 1 10 100 H A R M O N IC D IS TO R TI O N (d B c) –30 –40 –50 –60 –70 –80 –90 –100 –110 –120 G = +1 VS = ±5V VOUT = 4V p-p RL = 1kΩ HD3 LFCSP AND SOIC HD2 LFCSP HD2 SOIC Figure 18. Harmonic Distortion vs. Frequency for Various Packages

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Data Sheet AD8045 Rev. C | Page 9 of 24 04 81 4- 0- 03 2 FREQUENCY (MHz) 0.1 1 10 100 H A R M O N IC D IS TO R TI O N (d B c) –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 G = +1 VS = ±5V VOUT = 2V p-p RL = 100Ω RS = 100Ω HD2 SOIC HD2 LFCSP HD3 SOIC AND LFCSP Figure 19. Harmonic Distortion vs. Frequency for Various Packages 04 81 4- 0- 03 6 FREQUENCY (MHz) 0.1 1 10 100 H A R M O N IC D IS TO R TI O N (d B c) –20 –30 –40 –50 –60 –70 –80 –90 –100 –110 G = –1 VS = ±5V VOUT = 2V p-p RL = 1kΩ SOIC AND LFCSP HD2 HD3 Figure 20. Harmonic Distortion vs. Frequency for Various Packages 04 81 4- 0- 03 7 FREQUENCY (MHz) 0.1 1 10 100 H A R M O N IC D IS TO R TI O N (d B c) –30 –50 –40 –60 –80 –70 –100 –90 –110 G = –1 VS = ±5V RL = 150Ω VOUT = 2V p-p HD3 SOIC AND LFCSP HD2 SOIC HD2 LFCSP Figure 21. Harmonic Distortion vs. Frequency for Various Packages 04 81 4- 0- 03 3 FREQUENCY (MHz) 0.1 1 10 100 H A R M O N IC D IS TO R TI O N (d B c) –30 –40 –50 –60 –70 –80 –90 –100 –110 HD2 SOIC HD2 LFCSP HD3 SOIC AND LFCSP G = +2 VS = ±5V VOUT = 2V p-p RL = 150Ω RF = 499Ω Figure 22. Harmonic Distortion vs. Frequency for Various Packages 04 81 4- 0- 03 4 FREQUENCY (MHz) 1000.1 1 10 H A R M O N IC D IS TO R TI O N (d B c) –40 –50 –60 –70 –80 –90 –100 –110 HD2 LFCSP HD2 SOIC HD3 SOIC AND LFCSP G = +10 VS = ±5V VOUT = 2V p-p RL = 1kΩ Figure 23. Harmonic Distortion vs. Frequency for Various Packages 04 81 4- 0- 02 5 OUTPUT AMPLITUDE (V p-p) 80 1 2 3 4 5 76 H A R M O N IC D IS TO R TI O N (d B c) –50 –70 –60 –80 –90 –100 –110 –120 G = +1 VS = ±5V RL = 1kΩ RS = 100Ω f = 10MHz HD3 SOIC AND LFCSP HD2 SOIC HD2 LFCSP Figure 24. Harmonic Distortion vs. Output Voltage for Various Packages

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I wanted something that would handle voltage spikes. Worked perfectly. I plan to use four more.

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