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ADM2582EBRWZ

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ADM2582EBRWZ

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Part Number ADM2582EBRWZ
Manufacturer Analog Devices Inc.
Description DGTL ISO RS422/RS485 20SOIC
Datasheet ADM2582EBRWZ Datasheet
Package 20-SOIC (0.295", 7.50mm Width)
In Stock 19,576 piece(s)
Unit Price $ 13.9900 *
Lead Time Can Ship Immediately
Estimated Delivery Time Jan 21 - Jan 26 (Choose Expedited Shipping)
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Part Number # ADM2582EBRWZ (Digital Isolators) is manufactured by Analog Devices Inc. and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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ADM2582EBRWZ Specifications

ManufacturerAnalog Devices Inc.
CategoryIsolators - Digital Isolators
Datasheet ADM2582EBRWZDatasheet
Package20-SOIC (0.295", 7.50mm Width)
SeriesIsoPower?, iCoupler?
TechnologyMagnetic Coupling
TypeRS422, RS485
Isolated PowerYes
Number of Channels3
Inputs - Side 1/Side 22/1
Channel TypeUnidirectional
Voltage - Isolation2500Vrms
Common Mode Transient Immunity (Min)25kV/µs
Data Rate16Mbps
Propagation Delay tpLH / tpHL (Max)-
Pulse Width Distortion (Max)-
Rise / Fall Time (Typ)15ns, 15ns (Max)
Voltage - Supply3.3V, 5V
Operating Temperature-40°C ~ 85°C
Package / Case20-SOIC (0.295", 7.50mm Width)
Supplier Device Package20-SOIC

ADM2582EBRWZ Datasheet

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Signal and Power Isolated RS-485 Transceiver with ±15 kV ESD Protection Data Sheet ADM2582E/ADM2587E Rev. G Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2009–2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com FEATURES Isolated RS-485/RS-422 transceiver, configurable as half or full duplex isoPower integrated isolated dc-to-dc converter ±15 kV ESD protection on RS-485 input/output pins Complies with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E) ADM2582E data rate: 16 Mbps ADM2587E data rate: 500 kbps 5 V or 3.3 V operation Connect up to 256 nodes on one bus Open- and short-circuit, fail-safe receiver inputs High common-mode transient immunity: >25 kV/µs Thermal shutdown protection Safety and regulatory approvals UL recognition: 2500 V rms for 1 minute per UL 1577 VDE Certificates of Conformity DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 VIORM = 560 V peak Operating temperature range: −40°C to +85°C Highly integrated, 20-lead, wide-body SOIC package APPLICATIONS Isolated RS-485/RS-422 interfaces Industrial field networks Multipoint data transmission systems FUNCTIONAL BLOCK DIAGRAM ADM2582E/ADM2587E TxD A B Y Z DE VCC RxD RE ISOLATION BARRIER TRANSCEIVER GND1 GND2 ENCODE ENCODE DECODE DECODE D R DECODE ENCODE OSCILLATOR RECTIFIER REGULATOR VISOOUT DIGITAL ISOLATION iCoupler isoPower DC-TO-DC CONVERTER VISOIN 08 11 1- 00 1 Figure 1. GENERAL DESCRIPTION The ADM2582E/ADM2587E are fully integrated signal and power isolated data transceivers with ±15 kV ESD protection and are suitable for high speed communication on multipoint transmission lines. The ADM2582E/ADM2587E include an integrated isolated dc-to-dc power supply, which eliminates the need for an external dc-to-dc isolation block. They are designed for balanced transmission lines and comply with ANSI/TIA/EIA-485-A-98 and ISO 8482:1987(E). The devices integrate Analog Devices, Inc., iCoupler® technology to combine a 3-channel isolator, a three-state differential line driver, a differential input receiver, and Analog Devices isoPower® dc-to- dc converter into a single package. The devices are powered by a single 5 V or 3.3 V supply, realizing a fully integrated signal and power isolated RS-485 solution. The ADM2582E/ADM2587E driver has an active high enable. An active low receiver enable is also provided, which causes the receiver output to enter a high impedance state when disabled. The devices have current limiting and thermal shutdown features to protect against output short circuits and situations where bus contention may cause excessive power dissipation. The parts are fully specified over the industrial temperature range and are available in a highly integrated, 20-lead, wide-body SOIC package. The ADM2582E/ADM2587E contain isoPower technology that uses high frequency switching elements to transfer power through the transformer. Special care must be taken during printed circuit board (PCB) layout to meet emissions standards. Refer to the AN-0971 Application Note, Control of Radiated Emissions with isoPower Devices, for details on board layout considerations.

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ADM2582E/ADM2587E Data Sheet Rev. G | Page 2 of 22 TABLE OF CONTENTS Features .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 4 ADM2582E Timing Specifications ............................................ 5 ADM2587E Timing Specifications ............................................ 5 ADM2582E/ADM2587E Package Characteristics ................... 5 ADM2582E/ADM2587E Regulatory Information .................. 6 ADM2582E/ADM2587E Insulation and Safety-Related Specifications ................................................................................ 6 ADM2582E/ADM2587E VDE 0884 Insulation Characteristics .............................................................................. 6 Absolute Maximum Ratings ............................................................ 7 ESD Caution .................................................................................. 7 Pin Configuration and Function Descriptions ............................. 8 Typical Performance Characteristics ............................................. 9 Test Circuits ..................................................................................... 13 Switching Characteristics .............................................................. 14 Circuit Description......................................................................... 15 Signal Isolation ........................................................................... 15 Power Isolation ........................................................................... 15 Truth Tables................................................................................. 15 Thermal Shutdown .................................................................... 15 Open- and Short-Circuit, Fail-Safe Receiver Inputs.............. 15 DC Correctness and Magnetic Field Immunity ........................... 15 Applications Information .............................................................. 17 PCB Layout and Electromagnetic Interference (EMI) .......... 17 Insulation Lifetime ..................................................................... 18 Isolated Power Supply Considerations .................................... 19 Typical Applications ................................................................... 20 Outline Dimensions ....................................................................... 22 Ordering Guide .......................................................................... 22 REVISION HISTORY 5/2018—Rev. F to Rev. G Changes to Table 10 .......................................................................... 8 Deleted Electromagnetic Interference (EMI) Considerations Section .............................................................................................. 16 Changes to PCB Layout and Electromagnetic Interference (EMI) Section .................................................................................. 17 Changes to Figure 35 ...................................................................... 18 Changes to PCB Layout Reference ............................................... 19 Changes to Ordering Guide .......................................................... 22 9/2016—Rev. E to Rev. F Changes to Ordering Guide .......................................................... 20 10/2014—Rev. D to Rev. E Changes to Table 12 ........................................................................ 14 9/2014—Rev. C to Rev. D Changes to Figure 9 .......................................................................... 9 6/2011—Rev. B to Rev. C Changes to Features Section and Figure 1 ..................................... 1 Changes to Table 4 ............................................................................. 4 Changes to Table 5 ............................................................................. 5 Deleted Table 6; Renumbered Sequentially ................................... 5 Added Thermal Resistance θJA Parameter, Table 8 ....................... 6 Changes to Table 9 ............................................................................. 6 Changes to Table 10 .......................................................................... 7 Changes to Table 13 ....................................................................... 14 Moved DC Correctness and Magnetic Field Immunity Section .............................................................................................. 14 Changes to PCB Layout Section and Figure 35 .......................... 16 Changes to Figure 39 ...................................................................... 17 Changes to Typical Applications Section and Figure 40 ........... 18

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Data Sheet ADM2582E/ADM2587E Rev. G | Page 3 of 22 3/2011—Rev. A to Rev. B Removed Pending from Safety and Regulatory Approvals ........................................................................ Throughout Changed Minimum External Air Gap (Clearance) Value and Minimum External Tracking (Creepage) Value ............................ 5 Added Text to the ADM2582E/ADM2587E VDE 0884 Insulation Characteristics Section ................................................. 5 9/2010—Rev. 0 to Rev. A Changes to Features Section ............................................................ 1 Changes to Differential Output Voltage, Loaded Parameter, Table 1 ................................................................................................. 3 Changes to Table 5 ............................................................................ 5 Added Table 6; Renumbered Sequentially ..................................... 5 Change to Pin 8 Description, Table 11 ........................................... 7 Changes to Figure 5 and Figure 6 ................................................... 8 Changes to Table 13 and Table 14 ................................................. 14 9/2009—Revision 0: Initial Version

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ADM2582E/ADM2587E Data Sheet Rev. G | Page 4 of 22 SPECIFICATIONS All voltages are relative to their respective ground; 3.0 ≤ VCC ≤ 5.5 V. All minimum/maximum specifications apply over the entire recommended operation range, unless otherwise noted. All typical specifications are at TA = 25°C, VCC = 5 V unless otherwise noted. Table 1. Parameter Symbol Min Typ Max Unit Test Conditions ADM2587E SUPPLY CURRENT ICC Data Rate ≤ 500 kbps 90 mA VCC = 3.3 V, 100 Ω load between Y and Z 72 mA VCC = 5 V, 100 Ω load between Y and Z 125 mA VCC = 3.3 V, 54 Ω load between Y and Z 98 mA VCC = 5 V, 54 Ω load between Y and Z 120 mA 120 Ω load between Y and Z ADM2582E SUPPLY CURRENT ICC Data Rate = 16 Mbps 150 mA 120 Ω load between Y and Z 230 mA 54 Ω load between Y and Z ISOLATED SUPPLY VOLTAGE VISOUT 3.3 DRIVER Differential Outputs Differential Output Voltage, Loaded |VOD2| 2.0 3.6 V RL = 100 Ω (RS-422), see Figure 23 1.5 3.6 V RL = 54 Ω (RS-485), see Figure 23 |VOD3| 1.5 3.6 V −7 V ≤ VTEST1 ≤ 12 V, see Figure 24 Δ|VOD| for Complementary Output States Δ|VOD| 0.2 V RL = 54 Ω or 100 Ω, see Figure 23 Common-Mode Output Voltage VOC 3.0 V RL = 54 Ω or 100 Ω, see Figure 23 Δ|VOC| for Complementary Output States Δ|VOC| 0.2 V RL = 54 Ω or 100 Ω, see Figure 23 Short-Circuit Output Current IOS 200 mA Output Leakage Current (Y, Z) IO 30 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V −30 µA DE = 0 V, RE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V Logic Inputs DE, RE, TxD Input Threshold Low VIL 0.3 × VCC V DE, RE, TxD Input Threshold High VIH 0.7 × VCC V DE, RE, TxD Input Current II −10 0.01 10 µA DE, RE, TxD RECEIVER Differential Inputs Differential Input Threshold Voltage VTH −200 −125 −30 mV −7 V < VCM < +12 V Input Voltage Hysteresis VHYS 15 mV VOC = 0 V Input Current (A, B) II 125 µA DE = 0 V, VCC = 0 V or 3.6 V, VIN = 12 V −100 µA DE = 0 V, VCC = 0 V or 3.6 V, VIN = −7 V Line Input Resistance RIN 96 kΩ −7 V < VCM < +12 V Logic Outputs Output Voltage Low VOL 0.2 0.4 V IO = 1.5 mA, VA − VB = −0.2 V Output Voltage High VOH VCC − 0.3 VCC − 0.2 V IO = −1.5 mA, VA − VB = 0.2 V Short-Circuit Current 100 mA COMMON-MODE TRANSIENT IMMUNITY1 25 kV/µs VCM = 1 kV, transient magnitude = 800 V 1 CM is the maximum common-mode voltage slew rate that can be sustained while maintaining specification-compliant operation. VCM is the common-mode potential difference between the logic and bus sides. The transient magnitude is the range over which the common-mode is slewed. The common-mode voltage slew rates apply to both rising and falling common-mode voltage edges.

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Data Sheet ADM2582E/ADM2587E Rev. G | Page 5 of 22 ADM2582E TIMING SPECIFICATIONS TA = −40°C to +85°C. Table 2. Parameter Symbol Min Typ Max Unit Test Conditions DRIVER Maximum Data Rate 16 Mbps Propagation Delay, Low to High tDPLH 63 100 ns RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 Propagation Delay, High to Low tDPHL 64 100 ns RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 Output Skew tSKEW 1 8 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 Rise Time/Fall Time tDR, tDF 15 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 Enable Time tZL, tZH 120 ns RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 Disable Time tLZ, tHZ 150 ns RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 RECEIVER Propagation Delay, Low to High tRPLH 94 110 ns CL = 15 pF, see Figure 27 and Figure 30 Propagation Delay, High to Low tRPHL 95 110 ns CL = 15 pF, see Figure 27 and Figure 30 Output Skew1 tSKEW 1 12 ns CL = 15 pF, see Figure 27 and Figure 30 Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 1 Guaranteed by design. ADM2587E TIMING SPECIFICATIONS TA = −40°C to +85°C. Table 3. Parameter Symbol Min Typ Max Unit Test Conditions DRIVER Maximum Data Rate 500 kbps Propagation Delay, Low to High tDPLH 250 503 700 ns RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 Propagation Delay, High to Low tDPHL 250 510 700 ns RL = 54 Ω, CL1 = C L2 = 100 pF, see Figure 25 and Figure 29 Output Skew tSKEW 7 100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 Rise Time/Fall Time tDR, tDF 200 1100 ns RL = 54 Ω, CL1 = CL2 = 100 pF, see Figure 25 and Figure 29 Enable Time tZL, tZH 2.5 µs RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 Disable Time tLZ, tHZ 200 ns RL = 110 Ω, CL = 50 pF, see Figure 26 and Figure 31 RECEIVER Propagation Delay, Low to High tRPLH 91 200 ns CL = 15 pF, see Figure 27 and Figure 30 Propagation Delay, High to Low tRPHL 95 200 ns CL = 15 pF, see Figure 27 and Figure 30 Output Skew tSKEW 4 30 ns CL = 15 pF, see Figure 27 and Figure 30 Enable Time tZL, tZH 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 Disable Time tLZ, tHZ 15 ns RL = 1 kΩ, CL = 15 pF, see Figure 28 and Figure 32 ADM2582E/ADM2587E PACKAGE CHARACTERISTICS Table 4. Parameter Symbol Min Typ Max Unit Test Conditions Resistance (Input-to-Output)1 RI-O 1012 Ω Capacitance (Input-to-Output)1 CI-O 3 pF f = 1 MHz Input Capacitance2 CI 4 pF 1 Device considered a 2-terminal device: short together Pin 1 to Pin 10 and short together Pin 11 to Pin 20. 2 Input capacitance is from any input data pin to ground.

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ADM2582E/ADM2587E Data Sheet Rev. G | Page 6 of 22 ADM2582E/ADM2587E REGULATORY INFORMATION Table 5. ADM2582E/ADM2587E Approvals Organization Approval Type Notes UL Recognized under the Component Recognition Program of Underwriters Laboratories, Inc. In accordance with UL 1577, each ADM2582E/ADM2587E is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 second. VDE Certified according to DIN EN 60747-5-2 (VDE 0884 Part 2): 2003-01 In accordance with DIN EN 60747-5-2, each ADM2582E/ADM2587E is proof tested by applying an insulation test voltage ≥ 1050 VPEAK for 1 second. ADM2582E/ADM2587E INSULATION AND SAFETY-RELATED SPECIFICATIONS Table 6. Parameter Symbol Value Unit Conditions Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration Minimum External Air Gap (Clearance) L(I01) 7.7 mm Measured from input terminals to output terminals, shortest distance through air Minimum External Tracking (Creepage) L(I02) 7.6 mm Measured from input terminals to output terminals, shortest distance along body Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303-1 Isolation Group IIIa Material Group (DIN VDE 0110: 1989-01, Table 1) ADM2582E/ADM2587E VDE 0884 INSULATION CHARACTERISTICS This isolator is suitable for basic electrical isolation only within the safety limit data. Maintenance of the safety data must be ensured by means of protective circuits. An asterisk (*) on packages denotes VDE 0884 Part 2 approval. Table 7. Description Conditions Symbol Characteristic Unit CLASSIFICATIONS Installation Classification per DIN VDE 0110 for Rated Mains Voltage ≤150 V rms I to IV ≤300 V rms I to III ≤400 V rms I to II Climatic Classification 40/85/21 Pollution Degree DIN VDE 0110, see Table 1 2 VOLTAGE Maximum Working Insulation Voltage VIORM 560 V peak Input-to-Output Test Voltage VPR Method b1 VIORM × 1.875 = VPR, 100% production tested, tm = 1 sec, partial discharge < 5 pC 1050 V peak Method a After Environmental Tests, Subgroup 1 VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC 896 V peak After Input and/or Safety Test, Subgroup 2/Subgroup 3 VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 672 V peak Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 4000 V peak SAFETY-LIMITING VALUES Maximum value allowed in the event of a failure Case Temperature TS 150 °C Input Current IS, INPUT 265 mA Output Current IS, OUTPUT 335 mA Insulation Resistance at TS VIO = 500 V RS >109 Ω

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Data Sheet ADM2582E/ADM2587E Rev. G | Page 7 of 22 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. All voltages are relative to their respective ground. Table 8. Parameter Rating VCC −0.5 V to +7 V Digital Input Voltage (DE, RE, TxD) −0.5 V to VDD + 0.5 V Digital Output Voltage (RxD) −0.5 V to VDD + 0.5 V Driver Output/Receiver Input Voltage −9 V to +14 V Operating Temperature Range −40°C to +85°C Storage Temperature Range −55°C to +150°C ESD (Human Body Model) on A, B, Y, and Z pins ±15 kV ESD (Human Body Model) on Other Pins ±2 kV Thermal Resistance θJA 50°C/W Lead Temperature Soldering (10 sec) 260°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Table 9. Maximum Continuous Working Voltage1 Parameter Max Unit Reference Standard AC Voltage Bipolar Waveform 424 V peak 50-year minimum lifetime Unipolar Waveform Basic Insulation 560 V peak Maximum approved working voltage per VDE 0884 Part 2 DC Voltage Basic Insulation 560 V peak Maximum approved working voltage per VDE 0884 Part 2 1 Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details. ESD CAUTION

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ADM2582E/ADM2587E Data Sheet Rev. G | Page 8 of 22 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND1 1 VCC 2 GND1 3 RxD 4 GND220 VISOIN19 A18 B17 RE 5 GND216 DE 6 Z15 TxD 7 GND214 VCC 8 Y13 GND1 9 VISOOUT12 GND1 10 GND211 NOTES 1. PIN 12 AND PIN 19 MUST BE CONNECTED EXTERNALLY. ADM2582E ADM2587E TOP VIEW (Not to Scale) 08 11 1- 00 2 Figure 2. Pin Configuration Table 10. Pin Function Description Pin No. Mnemonic Description 1 GND1 Ground, Logic Side. 2 VCC Logic Side Power Supply. It is recommended that a 0.1 µF and a 0.01 µF decoupling capacitor be fitted between Pin 2 and Pin 1. See Figure 35 for layout recommendations. 3 GND1 Ground, Logic Side. 4 RxD Receiver Output Data. This output is high when (A − B) ≥ −30 mV and low when (A − B) ≤ –200 mV. The output is tristated when the receiver is disabled, that is, when RE is driven high. 5 RE Receiver Enable Input. This is an active-low input. Driving this input low enables the receiver; driving it high disables the receiver. 6 DE Driver Enable Input. Driving this input high enables the driver; driving it low disables the driver. 7 TxD Driver Input. Data to be transmitted by the driver is applied to this input. 8 VCC Logic Side Power Supply. It is recommended that a 0.1 µF and a 10 µF decoupling capacitor be fitted between Pin 8 and Pin 9. See Figure 35 for layout recommendations. 9 GND1 Ground, Logic Side. 10 GND1 Ground, Logic Side. 11, 14 GND2 Ground for Isolated DC-to-DC Converter. It is recommended to connect Pin 11 and Pin 14 together through one ferrite bead to PCB ground. See Figure 35 for layout recommendations. 12 VISOOUT Isolated Power Supply Output. This pin must be connected externally to VISOIN. It is recommended that a reservoir capacitor of 10 µF and a decoupling capacitor of 0.1 µF be fitted between Pin 12 and Pin 11. 13 Y Driver Noninverting Output 15 Z Driver Inverting Output 16 GND2 Ground, Bus Side. Do not connect this pin to Pin 14 and Pin 11. See Figure 35 for layout recommendations. 17 B Receiver Inverting Input. 18 A Receiver Noninverting Input. 19 VISOIN Isolated Power Supply Input. This pin must be connected externally to VISOOUT. It is recommended that a 0.1 µF and a 0.01 µF decoupling capacitor be fitted between Pin 19 and Pin 20. Connect this pin through a ferrite bead and short trace length to VISOOUT for operation. See Figure 35 for layout recommendations. 20 GND2 Ground, Bus Side.

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Data Sheet ADM2582E/ADM2587E Rev. G | Page 9 of 22 TYPICAL PERFORMANCE CHARACTERISTICS 20 0 40 60 80 100 120 140 160 180 –40 –15 10 35 60 85 SU PP LY C U R R EN T, I C C (m A ) TEMPERATURE (°C) NO LOAD RL = 120Ω RL = 54Ω 08 11 1- 10 3 Figure 3. ADM2582E Supply Current (ICC) vs. Temperature (Data Rate = 16 Mbps, DE = 3.3 V, VCC = 3.3 V) 20 0 40 60 80 100 120 140 –40 –15 10 35 60 85 SU PP LY C U R R EN T, I C C (m A ) TEMPERATURE (°C) RL = 120Ω RL = 54Ω 08 11 1- 10 4 NO LOAD Figure 4. ADM2582E Supply Current (ICC) vs. Temperature (Data Rate = 16 Mbps, DE = 5 V, VCC = 5 V) 20 0 40 60 80 100 120 –40 –15 10 35 60 85 SU PP LY C U R R EN T, I C C (m A ) TEMPERATURE (°C) RL = 120Ω RL = 54Ω 08 11 1- 10 6 NO LOAD Figure 5. ADM2587E Supply Current (ICC) vs. Temperature (Data Rate = 500 kbps, DE = 5 V, VCC = 5 V) 20 0 40 60 80 100 120 140 –40 –15 10 35 60 85 SU PP LY C U R R EN T, I C C (m A ) TEMPERATURE (°C) RL = 120Ω RL = 54Ω 08 11 1- 10 5 NO LOAD Figure 6. ADM2587E Supply Current (ICC) vs. Temperature (Data Rate = 500 kbps, DE = 3.3 V, VCC = 3.3 V) 50 52 54 56 58 60 62 64 66 68 70 72 D R IV ER P R O PA G A TI O N D EL A Y (n s) TEMPERATURE (°C) tDPHL tDPLH –40 –15 10 35 60 85 08 11 1- 10 7 Figure 7. ADM2582E Differential Driver Propagation Delay vs. Temperature 400 420 440 460 480 500 520 540 560 580 600 D R IV ER P R O PA G A TI O N D EL A Y (n s) TEMPERATURE (°C) tDPHL tDPLH –40 –15 10 35 60 85 08 11 1- 10 8 Figure 8. ADM2587E Differential Driver Propagation Delay vs. Temperature

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Amali*****rison

December 19, 2020

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Zain*****very

December 18, 2020

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December 7, 2020

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November 26, 2020

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November 23, 2020

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November 17, 2020

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November 16, 2020

I took time to note down but perfect after several months of use

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It arrived earlier than the deadline. All is OK. Thank you

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