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ATSAMS70N20A-CFN

ATSAMS70N20A-CFN

ATSAMS70N20A-CFN

For Reference Only

Part Number ATSAMS70N20A-CFN
Manufacturer Microchip Technology
Description IC MCU 32BIT 1MB FLASH 100VFBGA
Datasheet ATSAMS70N20A-CFN Datasheet
Package 100-VFBGA
In Stock 374 piece(s)
Unit Price $ 8.2606 *
Lead Time To be Confirmed
Estimated Delivery Time Oct 23 - Oct 28 (Choose Expedited Shipping)
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Part Number # ATSAMS70N20A-CFN (Embedded - Microcontrollers) is manufactured by Microchip Technology and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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ATSAMS70N20A-CFN Specifications

ManufacturerMicrochip Technology
CategoryIntegrated Circuits (ICs) - Embedded - Microcontrollers
Datasheet ATSAMS70N20A-CFNDatasheet
Package100-VFBGA
SeriesSAM S70
Core ProcessorARM? Cortex?-M7
Core Size32-Bit
Speed300MHz
ConnectivityI2C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O75
Program Memory Size1MB (1M x 8)
Program Memory TypeFLASH
EEPROM Size-
RAM Size384K x 8
Voltage - Supply (Vcc/Vdd)1.08 V ~ 3.6 V
Data ConvertersA/D 10x12b, D/A 2x12b
Oscillator TypeInternal
Operating Temperature-40°C ~ 105°C (TA)
Mounting Type-
Package / Case100-VFBGA
Supplier Device Package100-VFBGA (7x7)

ATSAMS70N20A-CFN Datasheet

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Page 2

SAM E70/S70/V70/V71 Family 32-bit ARM Cortex-M7 MCUs with FPU, Audio and Graphics Interfaces, High-Speed USB, Ethernet, and Advanced Analog Features Core • ARM® Cortex®-M7 running at up to 300 MHz • 16 Kbytes of ICache and 16 Kbytes of DCache with Error Code Correction (ECC) • Single- and double-precision HW Floating Point Unit (FPU) • Memory Protection Unit (MPU) with 16 zones • DSP Instructions, Thumb®-2 Instruction Set • Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU) Memories • Up to 2048 Kbytes embedded Flash with unique identifier and user signature for user-defined data • Up to 384 Kbytes embedded Multi-port SRAM • Tightly Coupled Memory (TCM) • 16 Kbytes ROM with embedded Bootloader routines (UART0, USB) and IAP routines • 16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash with on-the-fly scrambling • 16-bit SDRAM Controller (SDRAMC) interfacing up to 256 MB and with on-the-fly scrambling System • Embedded voltage regulator for single-supply operation • Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation • Quartz or ceramic resonator oscillators: 3 to 20 MHz main oscillator with failure detection, 12 MHz or 16 MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock • RTC with Gregorian calendar mode, waveform generation in low-power modes • RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations • 32-bit low-power Real-time Timer (RTT) • High-precision Main RC oscillator with 12 MHz default frequency. • 32.768 kHz crystal oscillator or Slow RC oscillator as source of low-power mode device clock (SLCK) • One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations • Temperature Sensor • One dual-port 24-channel central DMA Controller (XDMAC) © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 1

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Low-Power Features • Low-power Sleep, Wait and Backup modes, with typical power consumption down to 1.1 μA in Backup mode with RTC, RTT and wakeup logic enabled • Ultra-low-power RTC and RTT • 1 Kbyte of backup RAM (BRAM) with dedicated regulator Peripherals • One Ethernet MAC (GMAC) 10/100 Mbps in MII mode and RMII with dedicated DMA. IEEE1588 PTP frames and 802.3az Energy-efficiency support. Ethernet AVB support with IEEE802.1AS Timestamping and IEEE802.1Qav credit-based traffic-shaping hardware support. • USB 2.0 Device/Mini Host High-speed (USBHS) at 480 Mbps, 4-Kbyte FIFO, up to 10 bidirectional endpoints, dedicated DMA • 12-bit ITU-R BT. 601/656 Image Sensor Interface (ISI) • Two master Controller Area Networks (MCAN) with Flexible Data Rate (CAN-FD) with SRAM-based mailboxes, time- and event-triggered transmission • MediaLB® device with 3-wire mode, up to 1024 x Fs speed, supporting MOST25 and MOST50 networks • Three USARTs. USART0/1/2 support LIN mode, ISO7816, IrDA®, RS-485, SPI, Manchester and Modem modes; USART1 supports LON mode. • Five 2-wire UARTs with SleepWalking™ support • Three Two-Wire Interfaces (TWIHS) (I2C-compatible) with SleepWalking support • Quad I/O Serial Peripheral Interface (QSPI) interfacing up to 256 MB Flash and with eXecute-In-Place and on-the-fly scrambling • Two Serial Peripheral Interfaces (SPI) • One Serial Synchronous Controller (SSC) with I2S and TDM support • Two Inter-IC Sound Controllers (I2SC) • One High-speed Multimedia Card Interface (HSMCI) (SDIO/SD Card/e.MMC) • Four Three-Channel 16-bit Timer/Counters (TC) with Capture, Waveform, Compare and PWM modes, constant on time. Quadrature decoder logic and 2-bit Gray Up/Down Counter for stepper motor • Two 4-channel 16-bit PWMs with complementary outputs, Dead Time Generator and eight fault inputs per PWM for motor control, two external triggers to manage power factor correction (PFC), DC-DC and lighting control. • Two Analog Front-End Controllers (AFEC), each supporting up to 12 channels with differential input mode and programmable gain stage, allowing dual sample-and-hold at up to 1.7 Msps. Offset and gain error correction feature. • One 2-channel 12-bit 1 Msps-per-channel Digital-to-Analog Controller (DAC) with Differential and Over Sampling modes • One Analog Comparator Controller (ACC) with flexible input selection, selectable input hysteresis Cryptography • True Random Number Generator (TRNG) • AES: 256-, 192-, 128-bit Key Algorithm, Compliant with FIPS PUB-197 Specifications • Integrity Check Monitor (ICM). Supports Secure Hash Algorithm SHA1, SHA224 and SHA256. I/O • Up to 114 I/O lines with external interrupt capability (edge- or level-sensitivity), debouncing, glitch filtering and On-die Series Resistor Termination • Five Parallel Input/Output Controllers (PIO) SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 2

Page 4

Voltage • Single supply voltage from 3.0V to 3.6V for Qualification AEC - Q100 Grade 2 Devices • Single Supply voltage from 1.7V to 3.6V for Industrial Temperature Devices Packages • LQFP144, 144-lead LQFP, 20x20 mm, pitch 0.5 mm • LFBGA144, 144-ball LFBGA, 10x10 mm, pitch 0.8 mm • UFBGA144, 144-ball UFBGA, 6x6 mm, pitch 0.4 mm • LQFP100, 100-lead LQFP, 14x14 mm, pitch 0.5 mm • TFBGA100, 100-ball TFBGA, 9x9 mm, pitch 0.8 mm • VFBGA100, 100-ball VFBGA, 7x7 mm, pitch 0.65 mm • LQFP64, 64-lead LQFP, 10x10 mm, pitch 0.5 mm • QFN64, 64-pad QFN 9x9 mm, pitch 0.5 mm, with wettable flanks SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 3

Page 5

Table of Contents Features.......................................................................................................................... 1 1. Configuration Summary...........................................................................................15 2. Ordering Information................................................................................................17 3. Block Diagram......................................................................................................... 18 4. Signal Description....................................................................................................19 5. Automotive Quality Grade....................................................................................... 28 6. Package and Pinout................................................................................................ 29 6.1. 144-lead Packages.....................................................................................................................29 6.2. 144-lead Package Pinout........................................................................................................... 30 6.3. 100-lead Packages.....................................................................................................................34 6.4. 100-lead Package Pinout........................................................................................................... 35 6.5. 64-lead Package........................................................................................................................ 39 6.6. 64-lead Package Pinout............................................................................................................. 39 7. Power Considerations............................................................................................. 42 7.1. Power Supplies.......................................................................................................................... 42 7.2. Power Constraints......................................................................................................................42 7.3. Voltage Regulator.......................................................................................................................43 7.4. Backup SRAM Power Switch..................................................................................................... 44 7.5. Active Mode................................................................................................................................44 7.6. Low-power Modes......................................................................................................................44 7.7. Wakeup Sources........................................................................................................................ 46 7.8. Fast Startup................................................................................................................................47 8. Input/Output Lines................................................................................................... 48 8.1. General-Purpose I/O Lines.........................................................................................................48 8.2. System I/O Lines........................................................................................................................48 8.3. NRST Pin................................................................................................................................... 50 8.4. ERASE Pin.................................................................................................................................50 9. Interconnect.............................................................................................................51 10. Product Mapping..................................................................................................... 52 11. Memories.................................................................................................................53 11.1. Embedded Memories................................................................................................................. 53 11.2. External Memories..................................................................................................................... 59 12. Event System.......................................................................................................... 60 SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 4

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12.1. Embedded Characteristics......................................................................................................... 60 12.2. Real-time Event Mapping...........................................................................................................60 13. System Controller....................................................................................................64 13.1. System Controller and Peripherals Mapping..............................................................................64 13.2. Power-on-Reset, Brownout and Supply Monitor........................................................................ 64 13.3. Reset Controller......................................................................................................................... 64 14. Peripherals.............................................................................................................. 66 14.1. Peripheral Identifiers.................................................................................................................. 66 14.2. Peripheral Signal Multiplexing on I/O Lines................................................................................69 15. ARM Cortex-M7 (ARM)........................................................................................... 70 15.1. ARM Cortex-M7 Configuration................................................................................................... 70 16. Debug and Test Features........................................................................................ 71 16.1. Description................................................................................................................................. 71 16.2. Embedded Characteristics......................................................................................................... 71 16.3. Associated Documents...............................................................................................................71 16.4. Debug and Test Block Diagram..................................................................................................72 16.5. Debug and Test Pin Description.................................................................................................72 16.6. Application Examples.................................................................................................................73 16.7. Functional Description................................................................................................................74 17. SAM-BA Boot Program............................................................................................79 17.1. Description................................................................................................................................. 79 17.2. Embedded Characteristics......................................................................................................... 79 17.3. Hardware and Software Constraints.......................................................................................... 79 17.4. Flow Diagram............................................................................................................................. 79 17.5. Device Initialization.....................................................................................................................80 17.6. SAM-BA Monitor.........................................................................................................................80 18. Fast Flash Programming Interface (FFPI)............................................................... 85 18.1. Description................................................................................................................................. 85 18.2. Embedded Characteristics......................................................................................................... 85 18.3. Parallel Fast Flash Programming...............................................................................................85 19. Bus Matrix (MATRIX)...............................................................................................94 19.1. Description................................................................................................................................. 94 19.2. Embedded Characteristics......................................................................................................... 94 19.3. Functional Description................................................................................................................96 19.4. Register Summary....................................................................................................................102 20. USB Transmitter Macrocell Interface (UTMI).........................................................125 20.1. Description............................................................................................................................... 125 20.2. Embedded Characteristics....................................................................................................... 125 20.3. Register Summary....................................................................................................................126 SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 5

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21. Chip Identifier (CHIPID).........................................................................................129 21.1. Description............................................................................................................................... 129 21.2. Embedded Characteristics....................................................................................................... 129 21.3. Register Summary....................................................................................................................131 22. Enhanced Embedded Flash Controller (EEFC).....................................................136 22.1. Description............................................................................................................................... 136 22.2. Embedded Characteristics....................................................................................................... 136 22.3. Product Dependencies.............................................................................................................136 22.4. Functional Description..............................................................................................................137 22.5. Register Summary....................................................................................................................155 23. Supply Controller (SUPC)......................................................................................165 23.1. Description............................................................................................................................... 165 23.2. Embedded Characteristics....................................................................................................... 165 23.3. Block Diagram..........................................................................................................................166 23.4. Functional Description..............................................................................................................167 23.5. Register Summary....................................................................................................................178 24. Watchdog Timer (WDT).........................................................................................191 24.1. Description............................................................................................................................... 191 24.2. Embedded Characteristics....................................................................................................... 191 24.3. Block Diagram..........................................................................................................................191 24.4. Functional Description..............................................................................................................192 24.5. Register Summary....................................................................................................................194 25. Reinforced Safety Watchdog Timer (RSWDT)...................................................... 199 25.1. Description............................................................................................................................... 199 25.2. Embedded Characteristics....................................................................................................... 199 25.3. Block Diagram..........................................................................................................................200 25.4. Functional Description..............................................................................................................200 25.5. Register Summary....................................................................................................................202 26. Reset Controller (RSTC)....................................................................................... 207 26.1. Description............................................................................................................................... 207 26.2. Embedded Characteristics....................................................................................................... 207 26.3. Block Diagram..........................................................................................................................207 26.4. Functional Description..............................................................................................................208 27. Real-time Clock (RTC).......................................................................................... 219 27.1. Description............................................................................................................................... 219 27.2. Embedded Characteristics....................................................................................................... 219 27.3. Block Diagram..........................................................................................................................220 27.4. Product Dependencies.............................................................................................................220 27.5. Functional Description..............................................................................................................220 27.6. Register Summary....................................................................................................................229 28. Real-time Timer (RTT)...........................................................................................254 SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 6

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28.1. Description............................................................................................................................... 254 28.2. Embedded Characteristics....................................................................................................... 254 28.3. Block Diagram..........................................................................................................................254 28.4. Functional Description..............................................................................................................254 28.5. Register Summary....................................................................................................................257 29. General Purpose Backup Registers (GPBR).........................................................263 29.1. Description............................................................................................................................... 263 29.2. Embedded Characteristics....................................................................................................... 263 29.3. Register Summary....................................................................................................................264 30. Clock Generator.................................................................................................... 266 30.1. Description............................................................................................................................... 266 30.2. Embedded Characteristics....................................................................................................... 266 30.3. Block Diagram..........................................................................................................................267 30.4. Slow Clock................................................................................................................................267 30.5. Main Clock................................................................................................................................268 30.6. PLLA Clock...............................................................................................................................272 30.7. UTMI PLL Clock....................................................................................................................... 274 31. Power Management Controller (PMC).................................................................. 275 31.1. Description............................................................................................................................... 275 31.2. Embedded Characteristics....................................................................................................... 275 31.3. Block Diagram..........................................................................................................................276 31.4. Master Clock Controller............................................................................................................276 31.5. Processor Clock Controller.......................................................................................................276 31.6. SysTick External Clock.............................................................................................................277 31.7. USB Full-speed Clock Controller..............................................................................................277 31.8. Core and Bus Independent Clocks for Peripherals.................................................................. 277 31.9. Peripheral and Generic Clock Controller..................................................................................278 31.10. Asynchronous Partial Wakeup................................................................................................. 278 31.11. Free-running Processor Clock..................................................................................................280 31.12. Programmable Clock Output Controller................................................................................... 281 31.13. Fast Startup..............................................................................................................................281 31.14. Startup from Embedded Flash................................................................................................. 282 31.15. Main Crystal Oscillator Failure Detection.................................................................................283 31.16. 32.768 kHz Crystal Oscillator Frequency Monitor....................................................................284 31.17. Recommended Programming Sequence.................................................................................284 31.18. Clock Switching Details............................................................................................................287 31.19. Register Write Protection......................................................................................................... 289 31.20. Register Summary................................................................................................................... 290 32. Parallel Input/Output Controller (PIO)....................................................................339 32.1. Description............................................................................................................................... 339 32.2. Embedded Characteristics....................................................................................................... 339 32.3. Block Diagram..........................................................................................................................340 32.4. Product Dependencies.............................................................................................................341 32.5. Functional Description..............................................................................................................341 SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 7

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32.6. Register Summary....................................................................................................................355 33. External Bus Interface (EBI)..................................................................................417 33.1. Description............................................................................................................................... 417 33.2. Embedded Characteristics....................................................................................................... 417 33.3. EBI Block Diagram................................................................................................................... 418 33.4. I/O Lines Description................................................................................................................418 33.5. Application Example.................................................................................................................420 34. SDRAM Controller (SDRAMC).............................................................................. 424 34.1. Description............................................................................................................................... 424 34.2. Embedded Characteristics....................................................................................................... 424 34.3. Signal Description.................................................................................................................... 425 34.4. Software Interface/SDRAM Organization, Address Mapping...................................................425 34.5. Product Dependencies.............................................................................................................426 34.6. Functional Description..............................................................................................................428 34.7. Register Summary....................................................................................................................435 35. Static Memory Controller (SMC)............................................................................454 35.1. Description............................................................................................................................... 454 35.2. Embedded Characteristics....................................................................................................... 454 35.3. I/O Lines Description................................................................................................................454 35.4. Multiplexed Signals.................................................................................................................. 455 35.5. Product Dependencies.............................................................................................................455 35.6. External Memory Mapping....................................................................................................... 456 35.7. Connection to External Devices............................................................................................... 456 35.8. Application Example.................................................................................................................460 35.9. Standard Read and Write Protocols.........................................................................................462 35.10. Scrambling/Unscrambling Function......................................................................................... 470 35.11. Automatic Wait States.............................................................................................................. 471 35.12. Data Float Wait States............................................................................................................. 474 35.13. External Wait............................................................................................................................478 35.14. Slow Clock Mode..................................................................................................................... 482 35.15. Asynchronous Page Mode.......................................................................................................484 35.16. Register Summary................................................................................................................... 487 36. DMA Controller (XDMAC)......................................................................................501 36.1. Description............................................................................................................................... 501 36.2. Embedded Characteristics....................................................................................................... 501 36.3. Block Diagram..........................................................................................................................502 36.4. DMA Controller Peripheral Connections.................................................................................. 502 36.5. Functional Description..............................................................................................................504 36.6. Linked List Descriptor Operation..............................................................................................508 36.7. XDMAC Maintenance Software Operations.............................................................................510 36.8. XDMAC Software Requirements.............................................................................................. 511 36.9. Register Summary....................................................................................................................512 37. Image Sensor Interface (ISI)................................................................................. 583 SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 8

Page 10

37.1. Description............................................................................................................................... 583 37.2. Embedded Characteristics....................................................................................................... 584 37.3. Block Diagram..........................................................................................................................585 37.4. Product Dependencies.............................................................................................................585 37.5. Functional Description..............................................................................................................585 37.6. Register Summary....................................................................................................................595 38. GMAC - Ethernet MAC..........................................................................................633 38.1. Description............................................................................................................................... 633 38.2. Embedded Characteristics....................................................................................................... 633 38.3. Block Diagram..........................................................................................................................634 38.4. Signal Interface........................................................................................................................ 634 38.5. Product Dependencies.............................................................................................................635 38.6. Functional Description..............................................................................................................635 38.7. Programming Interface.............................................................................................................666 38.8. Register Summary....................................................................................................................671 39. USB High-Speed Interface (USBHS).................................................................... 824 39.1. Description............................................................................................................................... 824 39.2. Embedded Characteristics....................................................................................................... 824 39.3. Block Diagram..........................................................................................................................825 39.4. Product Dependencies.............................................................................................................826 39.5. Functional Description..............................................................................................................827 39.6. Register Summary....................................................................................................................852 40. High-Speed Multimedia Card Interface (HSMCI)................................................ 1035 40.1. Description............................................................................................................................. 1035 40.2. Embedded Characteristics..................................................................................................... 1035 40.3. Block Diagram........................................................................................................................1036 40.4. Application Block Diagram..................................................................................................... 1036 40.5. Pin Name List.........................................................................................................................1037 40.6. Product Dependencies...........................................................................................................1037 40.7. Bus Topology..........................................................................................................................1037 40.8. High-Speed Multimedia Card Operations...............................................................................1039 40.9. SD/SDIO Card Operation.......................................................................................................1048 40.10. CE-ATA Operation..................................................................................................................1049 40.11. HSMCI Boot Operation Mode.................................................................................................1050 40.12. HSMCI Transfer Done Timings.............................................................................................. 1051 40.13. Register Write Protection....................................................................................................... 1052 40.14. Register Summary................................................................................................................. 1053 41. Serial Peripheral Interface (SPI)..........................................................................1088 41.1. Description............................................................................................................................. 1088 41.2. Embedded Characteristics..................................................................................................... 1088 41.3. Block Diagram........................................................................................................................1089 41.4. Application Block Diagram..................................................................................................... 1089 41.5. Signal Description.................................................................................................................. 1090 41.6. Product Dependencies...........................................................................................................1090 SAM E70/S70/V70/V71 Family © 2017 Microchip Technology Inc. Datasheet DS60001527A-page 9

ATSAMS70N20A-CFN Reviews

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Cor*****May

August 15, 2020

All resistors exactly -0.01%. Pretty good.

Land*****ohal

August 12, 2020

So far so good. I need to see how they hold up.

Ensl*****oods

August 5, 2020

Reasonable prices, fast shipping, and the best customer service I've ever experienced! Absolutely will share it to my friends.

Brea*****Vang

July 24, 2020

Heisener.com is a good company. Pleasant transaction, communicative , thank you

Amay*****tokes

July 19, 2020

These function just as well. You do need to spend some time modifying the harness, but no big deal.

Kais*****alters

July 16, 2020

Awesome selection! Great service for whatever electronic parts you want! Prices are competitive as well. Thank you!

Roy*****Kota

July 15, 2020

Order arrived to Estonia in 3 days. Item as described. Well packed.

Kim***** Bedi

July 12, 2020

can supply almost all of my necessary parts in short lead time.

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