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CPC5620ATR

hotCPC5620ATR

CPC5620ATR

For Reference Only

Part Number CPC5620ATR
Manufacturer IXYS Integrated Circuits Division
Description IC LITELINK III HALF RING 32SOIC
Datasheet CPC5620ATRDatasheet
Package 32-SOIC (0.295", 7.50mm Width)
In Stock 10182 piece(s)
Unit Price $ 2.205 *
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CPC5620ATR

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CPC5620ATRSpecifications

ManufacturerIXYS Integrated Circuits Division
CategoryIntegrated Circuits (ICs) - Interface - Telecom
Datasheet CPC5620ATRDatasheet
Package32-SOIC (0.295", 7.50mm Width)
SeriesLITELINK? III
FunctionData Access Arrangement (DAA)
Number of Circuits1
Voltage - Supply3 V ~ 5.5 V
Current - Supply9mA
Power (Watts)1W
Operating Temperature-40°C ~ 85°C
Mounting TypeSurface Mount
Package / Case32-SOIC (0.295", 7.50mm Width)
Supplier Device Package32-SOIC

CPC5620ATRDatasheet

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INTEGRATED CIRCUITS DIVISION DS-CPC5620/CPC5621-R05.1 www.ixysic.com 1 3kVrms Isolation Features • Superior voice solution with low noise, excellent part-to-part gain accuracy • 3 kVrms line isolation • Transmit power of up to +10 dBm into 600  • Data access arrangement (DAA) solution for modems at speeds up to V.92 • 3.3 or 5 V power supply operation • Caller ID signal reception function • Easy interface with modem ICs and voice CODECs • Worldwide dial-up telephone network compatibility • CPC5620 and CPC5621 can be used in circuits that comply with the requirements of TIA/EIA/IS-968 (FCC part 68), UL1950, UL60950, EN/IEC 60950-1 Supplementary Isolation compliant, EN55022B, CISPR22B, EN55024, and TBR-21 • Line-side circuit powered from telephone line • Compared to other silicon DAA solutions, LITELINK: - Uses fewer passive components - Takes up less printed-circuit board space - Uses less telephone line power - Offers simplified operation - Is a single-IC solution Applications • Computer telephony and gateways, such as VoIP • PBXs • Satellite and cable set-top boxes • V.92 (and other standard) modems • Fax machines • Voicemail systems • Embedded modems for POS terminals, automated banking, remote metering, vending machines, security, and surveillance Description LITELINK III is a single-package silicon phone line interface (PLI) DAA used in voice and data communication applications to make connections between low-voltage equipment and high-voltage telephone networks. LITELINK provides a high-voltage isolation barrier, AC and DC phone line terminations, switch hook, 2-wire to 4-wire hybrid, ring detection, and on-hook signal detection. LITELINK can be used in both differential and single-ended signal applications. LITELINK uses on-chip optical components and a few inexpensive external components to form a complete voice or high-speed data phone line interface. LITELINK eliminates the need for large isolation transformers or capacitors used in other interface configurations. It includes the required high-voltage isolation barrier in a surface-mount SOIC package. The CPC5620 (half-wave ringing detect) and CPC5621 (full-wave ringing detect) build upon IXYS Integrated Circuits Division’s LITELINK product line, with improved insertion loss control, improved noise performance, and lower minimum current draw from the phone line. The new mode pin enables worldwide implementation. Ordering Information CPC5620/CPC5621 Block Diagram Part Number Description CPC5620A 32-pin SOIC, half-wave ring detect, 50/Tube CPC5620ATR 32-pin SOIC, half-wave ring detect, 1000/Reel CPC5621A 32-pin SOIC, full-wave ring detect, 50/Tube CPC5621ATR 32-pin SOIC, full-wave ring detect, 1000/Reel Transconductance Stage 2-4 Wire Hybrid AC/DC Termination Hookswitch Isolation Barrier Vref Gain Trim Vref Gain Trim Snoop Amplifier Receive Isolation Amplifier Transmit Isolation Amplifier TIP+ RING- Transmit Diff. Amplifier Receive Diff. Amplifier CID/ RING MUX Tx+ Tx- OH RING MODE CID Rx+ Rx- Current Limit Control AC Impedance Control VI Slope Control CSNOOP CSNOOP RSNOOP RSNOOP CPC5620/CPC5621 LITELINK® III Phone Line Interface IC (DAA)

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC5621 2 www.ixysic.com R05.1 1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1.2 Reactive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 Using LITELINK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2 On-hook Operation: OH=1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2.1 Ringing Signal Reception via the Snoop Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.2.2 Polarity Reversal Detection with CPC5621 in On-hook State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.2.3 On-hook Caller ID Signal Reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.3 Off-Hook Operation: OH=0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.4 Start-up Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.5.1 Setting a Current Limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.6.3 Mode Pin Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 LITELINK Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC56211. Electrical Specifications 1.1 Absolute Maximum Ratings Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Parameter Minimum Maximum Unit VDD -0.3 6 V Logic Inputs -0.3 VDD + 0.3 V Continuous Tip to Ring Current (RZDC = 5.2) - 150 mA Total Package Power Dissipation - 1 W Isolation Voltage - 3000 Vrms Operating temperature -40 +85 °C Storage temperature -40 +125 °CR05.1 www.ixysic.com 3

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC56211.2 Performance Parameter Minimum Typical Maximum Unit Conditions DC Characteristics Operating Voltage VDD 3.0 - 5.50 V Low-voltage side Operating Current IDD - 9 13 mA Low-voltage side Operating Voltage VDDL 2.8 - 3.2 V Line side, derived from tip and ring Operating Current IDDL - 7 8 mA Line side, drawn from tip and ring while off-hook On-hook Characteristics Metallic DC Resistance 10 - - M Tip to ring, 100 VDC applied Longitudinal DC Resistance 10 - - M 150 VDC applied from tip and ring to Earth ground Ringing Signal Detect Level 5 - - Vrms 68 Hz ring signal applied tip to ring Ringing Signal Detect Level 28 - - Vrms 15 Hz ring signal applied tip to ring Snoop Circuit Frequency Response 166 - >4000 Hz -3 dB corner frequency @ 166 Hz, in IXYS Integrated Circuits Division application circuit Snoop Circuit CMRR 1 - 40 - dB 120 Vrms 60 Hz common-mode signal across tip and ring Ringer Equivalence - 0.1B - REN Longitudinal Balance 1 60 - - dB Per FCC part 68 Off-Hook Characteristics AC Impedance - 600 -  Tip to ring, using resistive termination application circuit Longitudinal Balance 40 - - dB Per FCC part 68 Return Loss - 26 - dB Into 600 at 1800 Hz Transmit and Receive Characteristics Frequency Response 30 - 4000 Hz -3 dB corner frequency 30 Hz Transhybrid Loss - 36 - dB Into 600 at 1800 Hz, with C18 in the resistive termination application circuit Transmit and Receive Insertion Loss -0.4 0 0.4 dB 30 Hz to 4 kHz, for resistive termination application circuit with MODE de-asserted and for reactive termination application circuit with MODE asserted. Average In-band Noise - -126 - dBm/Hz 4 kHz flat bandwidth Harmonic Distortion - -80 - dB -3 dBm, 600 Hz, 2nd harmonic Transmit Level - - 2.2 VP-P Single-tone sine wave. Or 0 dBm into 600 Receive Level - - 2.2 VP-P Single-tone sine wave. Or 0 dBm into 600 RX+/RX- Output Drive Current - - 0.5 mA Sink and source TX+/TX- Input Impedance 60 90 120 k Isolation Characteristics Isolation Voltage 3000 - - Vrms Line side to low-voltage side, one minute duration Surge Rise Time 2000 - - V/S No damage via tip and ring MODE, OH, and CID Control Logic Inputs Input Low Voltage - - 0.8 VIL Input High Voltage 2.0 - - VIH High Level Input Current - - -120 A VIN VDD Low Level Input Current - - -120 A VIN = GND RING Output Logic Levels Output High Voltage VDD -0.4 - - V IOUT = -400 A Output Low Voltage - - 0.4 V IOUT = 1 mA Specifications subject to change without notice. All performance characteristics based on the use of IXYS Integrated Circuits Division application circuits. Functional operation of the device at conditions beyond those specified here is not implied. All specifications at 25°C and VDD = 5V unless otherwise noted. 1) This parameter is layout and component tolerance dependent.4 www.ixysic.com R05.1

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC56211.3 Pin Description Figure 1. Pinout Pin Name Function 1 VDD Low-voltage (CPE) side power supply 2 TXSM Transmit summing junction 3 TX- Negative differential transmit signal to DAA from low-voltage side 4 TX+ Positive differential transmit signal to DAA from low-voltage side 5 TX Transmit differential amplifier output 6 MODE When asserted low, changes gain of TX path (-7 dB) and RX path (+7 dB) to accommodate reactive termination networks 7 GND Low-voltage (CPE) side analog ground 8 OH Assert logic low for off-hook operation 9 RING Ringing Detect Output 10 CID Assert logic low while on hook to allow CID information to be passed to the RX+ and RX- output pins. 11 RX- Negative differential analog signal received from the telephone line. Must be AC coupled with 0.1 F. 12 RX+ Positive differential analog signal received from the telephone line. Must be AC coupled with 0.1 F. 13 SNP+ Positive differential snoop input 14 SNP- Negative differential snoop input 15 RXF Receive photodiode amplifier output 16 RX Receive photodiode summing junction 17 VDDL Power supply for line side, regulated from tip and ring. 18 RXS Receive isolation amp summing junction 19 RPB Receive LED pre-bias current set 20 BR- Bridge rectifier return 21 ZDC Electronic inductor DCR/current limit 22 DCS2 DC feedback output 23 DCS1 V to I slope control 24 NTF Network amplifier feedback 25 GAT External MOSFET gate control 26 NTS Receive signal input 27 BR- Bridge rectifier return 28 TXSL Transmit photodiode summing junction 29 ZNT Receiver impedance set 30 ZTX Transmit transconductance gain set 31 TXF Transmit photodiode amplifier output 32 REFL 1.25 VDC reference 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 V DD TXSM TX- TX+ TX MODE GND OH RING CID RX- RX+ SNP+ SNP- RXF RX REFL TXF ZTX ZNT TXSL BR- NTS GAT NTF DCS1 DCS2 ZDC BR- RPB RXS V DDLR05.1 www.ixysic.com 5

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC56212. Application Circuits LITELINK can be used with telephone networks worldwide. Some public telephone networks, notably in North America and Japan require resistive line termination. Other telephone networks, as in Europe and elsewhere, require a reactive line termination. The application circuits below address both line termination models. The reactive termination application circuit (see Figure 3 on page 8) describes the TBR-21 implementation. This circuit can be adapted easily for other reactive termination needs. 2.1 Resistive Termination Application Circuit Figure 2. Resistive Termination Application Circuit Schematic ¹This design was tested and found to comply with FCC Part 68 with this Sidactor. Other compliance requirements may require a different part. ²Higher-noise power supplies may require substitution of a 220 H inductor, Toko 380HB-2215 or similar. See the Power Quality section of IXYS Integrated Circuits Division application note AN-146, Guidelines for Effective LITELINK Designs for more information. ³Optional for enhanced transhybrid loss. 4Use voltage ratings based on the isolation requirements of your application. + - OH RING TX+ RX+ TX- RX- 3.3 or 5V C13 C14 C2 C4 R1 (RTX) 80.6K R23 2 10 BR- BR- BR- TIP RING U1 LITELINK1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDD TXSM TX- TX+ TX GND RX- RX+ SNP+ SNP- RXF RX MODE OH RING CID REFL TXF ZTX ZNT TXSL BR- NTS GAT NTF DCS1 DCS2 ZDC BR- RPB RXS VDDL DB1 SP1 1 BR- BR- A A A C9 0.1μ C16 10μ FB1 600 Ω 200 mA C1 1μ (RTXF) 60.4K 5% (RHTF)200K R13 (RNTS) 1M 5% C10 0.01μ 500V R15 1.69M R20 2 6.49M (RDCS1A) 6.49 M (CDCS) 0.027μ (RRXF) 130K R3 1.5M C7 (CSNP-) 4 220pF C8 220pF (RSNP-2) 1.8M 1.8M 1.8M 1.8M R4 68.1 BR- NOTE: Unless otherwise noted: Resistor values are in Ohms All resistors are 1%. Capacitor values are in Farads. R14 (RGAT) 47 Q1 CPC5602C (CGAT) (RZDC) 3 8.2 R10 301 R18 3.32K C18 15p 3 R12 499K (RNTF) BR- BR- C15 0.01μ 500V 221K (RNTX) 261K 0.1μ 0.1μ 0.1μ 0.1μ R16 R8 R5 R75 BR- C21 100p R76 R22 R21 C12 R6 R44 R7 R45 (RSNP-1) (RSNP+2) (RSNP+1) (RSNPD) (RDCS1B) (RHTX) (RZNT) (RZTX) (RPB) (RDCS2) (RVDDL) BR- (CSNP+) 4 R2 CID6 www.ixysic.com R05.1

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC56212.1.1 Resistive Termination Application Circuit Part List Quantity Reference Designator Description Supplier(s) 1 C1 1 F, 16 V, ±10% AVX, Murata, Novacap, Panasonic, SMEC, Tecate, etc. 5 C2, C4, C9, C13, C14 0.1 F, 16 V, ±10% 2 C7, C8 1 220 pF, ±5% 2 C10, C15 0.01 F, 500 V, ±10% 1 C12 0.027 F, 16 V, ±10% 1 C16 10 F, 16 V, ±10% 1 C18 (optional) 15 pF, 16 V, ±10% 1 C21 100 pF, 16 V, 10% 1 R1 80.6 k, 1/16 W, ±1% Panasonic, Electro Films, FMI, Vishay, etc. 1 R2 130 k, 1/16 W, ±1% 1 R3 1.5 M, 1/16 W, ±1% 1 R4 68.1 , 1/16 W, ±1% 1 R5 60.4 k, 1/16 W, ±1% 4 R6, R7, R44, R45 2 1.8 M, 1/10 W, ±1% 1 R8 221 k, 1/16 W, ±1% 1 R10 301 , 1/16 W, ±1% 1 R12 499 k, 1/16 W, ±1% 1 R13 1 M, 1/16 W, ±1% 1 R14 47 , 1/16 W, ±5% 1 R15 1.69 M, 1/16 W, ±1% 1 R16 8.2 , 1/8 W, ±1% 1 R18 3.32 k 1/16 W, ±1% 1 R20 2 , 1/16 W, ±5% 1 R21, R22 6.49 M, 1/16 W, ±1% 1 R23 10  1/16 W, ±5%, or 220 H inductor 1 R75 261 k, 1/16 W, ±1% 1 R76 200 k, 1/16 W, ±1% 1 FB1 600 , 200 mA ferrite bead Murata BLM11A601S or similar 1 DB1 S1ZB60 bridge rectifier Shindengen, Diodes, Inc. 1 SP1 350 V Littelfuse (P3100SCL) 1 Q1 CPC5602 FET IXYS Integrated Circuits Division 1 U1 CPC5620/CPC5621 LITELINK 1Use voltage ratings based on the isolation requirements of your application. Typical applications will require 2kV to safely hold off the isolation voltage. 2Use components that allow enough space to account for the possibility of high-voltage arcing.R05.1 www.ixysic.com 7

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INTEGRATED CIRCUITS DIVISION CPC5620/CPC5621Figure 3. Reactive Termination Application Circuit Schematic ¹This design was tested and found to comply with FCC Part 68 with this Sidactor. Other compliance requirements may require a different part. ²Higher-noise power supplies may require substitution of a 220 H inductor, Toko 380HB-2215 or similar. See the Power Quality section of IXYS Integrated Circuits Division application note AN-146, Guidelines for Effective LITELINK Designs for more information. 3RZDC sets the loop-current limit, see “Setting a Current Limit” on page 13. Also see IXYS Integrated Circuits Division’s application note AN-146 for heat sinking recommendations for the CPC5602C FET. 4Use voltage ratings based on the isolation requirements of your application. + - OH RING TX+ RX+ TX- RX- 3.3 or 5V C13 C14 C2 C4 R1 (RTX) 80.6K R23 2 10 BR- BR- BR- TIP RING U1 LITELINK1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VDD TXSM TX- TX+ TX GND RX- RX+ SNP+ SNP- RXF RX MODE OH RING REFL TXF ZTX ZNT TXSL BR- NTS GAT NTF DCS1 DCS2 ZDC BR- RPB RXS VDDL DB1 SP1 1 BR- BR- A A A C9 0.1μ C16 10μ FB1 600 Ω 200 mA C1 1μ (RTXF) 60.4K 5% (RHTF)200K R13 (RNTS) 1M 5% C10 0.01μ 500V R15 1.69M R20 2 6.49M (RDCS1A) 6.49M (CDCS) 0.027μ (RRXF) 130K R3 1.5M C7 (CSNP-) 4 220p C8 220p (RSNP-2) 1.8M 1.8M 1.8M 1.8M R4 68.1 BR- NOTE: Unless otherwise noted: Resistor values are in Ohms All resistors are 1%. Capacitor values are in Farads. R14 (RGAT) 47 Q1 CPC5602C (CGAT) (RZDC) 3 8.2 R10 59 R18 10K R11 169 C20 (CZNT) 0.68μ R12 221K (RNTF) BR- BR- C15 0.01μ 500V 200K (RNTX) 110K 0.1μ 0.1μ 0.1μ 0.1μ R16 R8 R5 R75 BR- C21 100p R76 R22 R21 C12 R6 R44 R7 R45 (RSNP-1) (RSNP+2) (RSNP+1) (RSNPD) (RDCS1B) (RHTX) (RZNT1) (RZTX) (RPB) (RZNT2) (RDCS2) (RVDDL) BR- (CSNP+) 4 R2 CID CID8 www.ixysic.com R05.1

Page 10

INTEGRATED CIRCUITS DIVISION CPC5620/CPC56212.1.2 Reactive Termination Application Circuit Part List Quantity Reference Designator Description Supplier 1 C1 1 F, 16 V, ±10% AVX, Murata, Novacap, Panasonic, SMEC, Tecate, etc. 5 C2, C4, C9, C13, C14 0.1 F, 16 V, ±10% 2 C7, C8 1 220 pF, ±5% 2 C10, C15 0.01 F, 500 V, ±10% 1 C12 0.027 F, 16 V, ±10% 1 C16 10 F, 16 V, ±10% 1 C20 0.68 F, 16 V, ±10% 1 C21 100 pF, 16 V, 10% 1 R1 80.6 k, 1/16 W, ±1% Panasonic, Electro Films, FMI, Vishay, etc. 1 R2 130 k, 1/16 W, ±1% 1 R3 1.5 M, 1/16 W, ±1% 1 R4 68.1 , 1/16 W, ±1% 1 R5 60.4 k 1/16 W, ±1% 4 R6, R7, R44, R45 2 1.8 M, 1/10 W, ±1% 1 R8 200 k, 1/16 W, ±1% 1 R10 59 , 1/16 W, ±1% 1 R11 169 , 1/16 W, ±1% 1 R12 221 k, 1/16 W, ±1% 1 R13 1 M, 1/16 W, ±1% 1 R14 47 , 1/16 W, ±5% 1 R15 1.69 M, 1/16 W, ±1% 1 R16 8.2 , 1/8 W, ±1% 1 R18 10 k, 1/16 W, ±1% 1 R20 2 , 1/16 W, ±5% 1 R21, R22 6.49 M, 1/16 W, ±1% 1 R23 10 , 1/16 W, ±5%, or 220 H inductor 1 R75 110 k, 1/16 W, ±1% 1 R76 200 k, 1/16 W, ±1% 1 FB1 600  200 mA ferrite bead Murata BLM11A601S or similar 1 DB1 S1ZB60 bridge rectifier Shindengen, Diodes, Inc. 1 SP1 350 V Littelfuse (P3100SCL) 1 Q1 CPC5602 FET IXYS Integrated Circuits Division 1 U1 CPC5620/CPC5621 LITELINK 1Use voltage ratings based on the isolation requirements of your application. Typical applications will require 2kV to safely hold off the isolation voltage. 2Use components that allow enough space to account for the possibility of high-voltage arcing.R05.1 www.ixysic.com 9

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January 26, 2020

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September 6, 2019

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August 30, 2019

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