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Part Number DS5000FP-16+
Manufacturer Maxim Integrated
Description IC MCU 8BIT NVSRAM 80QFP
Datasheet DS5000FP-16+ Datasheet
Package 80-BQFP
In Stock 396 piece(s)
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Part Number # DS5000FP-16+ (Embedded - Microcontrollers) is manufactured by Maxim Integrated and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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DS5000FP-16+ Specifications

ManufacturerMaxim Integrated
CategoryIntegrated Circuits (ICs) - Embedded - Microcontrollers
Datasheet DS5000FP-16+Datasheet
Core Processor8051
Core Size8-Bit
PeripheralsPower-Fail Reset, WDT
Number of I/O32
Program Memory SizeExternal
Program Memory TypeNVSRAM
RAM Size-
Voltage - Supply (Vcc/Vdd)4.75 V ~ 5.25 V
Data Converters-
Oscillator TypeExternal
Operating Temperature0°C ~ 70°C (TA)
Mounting Type-
Package / Case80-BQFP
Supplier Device Package80-QFP (14x20)

DS5000FP-16+ Datasheet

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1 of 22 REV: 070605 Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be simultaneously available through various sales channels. For information about device errata, click here: FEATURES 8051-Compatible Microprocessor Adapts to Its Task − Accesses between 8kB and 64kB of nonvolatile SRAM − In-system programming via on-chip serial port − Can modify its own program or data memory − Accesses memory on a separate byte-wide bus Crash-Proof Operation − Maintains all nonvolatile resources for over 10 years − Power-fail Reset − Early Warning Power-fail Interrupt − Watchdog Timer − User-supplied lithium battery backs user SRAM for program/data storage Software Security − Executes encrypted programs to prevent observation − Security lock prevents download − Unlocking destroys contents Fully 8051 Compatible − 128 bytes scratchpad RAM − Two timer/counters − On-chip serial port − 32 parallel I/O port pins PIN CONFIGURATION ORDERING INFORMATION PART TEMP RANGE MAX CLOCK SPEED (MHz) PIN- PACKAGE DS5000FP-16 0°C to +70°C 16 80 QFP DS5000FP-16+ 0°C to +70°C 16 80 QFP + Denotes a Pb-free/RoHS-compliant device. DS5000FP Soft Microprocessor Chip This data sheet must be used in conjunction with the Secure Microcontroller User’s Guide, which contains operating information. This data sheet provides ordering information, pinout, and electrical specifications. Download the Secure Microcontroller User’s Guide at 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 P0.4/AD4 N.C. N.C. BA9 P0.3/AD3 BA8 P0.2/AD2 BA13 P0.1/AD1 R/W P0.0/AD0 VCC0 VCC VCC P1.0 BA14 P1.1 BA12 P1.2 BA7 P1.3 N.C. N.C. BA6 P2.6/A14 N.C. N.C. BD3 P2.5/A13 BD2 P2.4/A12 BD1 P2.3/A11 BD0 VLI GND GND P2.2/A10 P2.1/A9 P2.0/A8 XTAL1 XTAL2 P3.7/RD P3.6/WR P3.5/T1 N.C. N.C. P3.4/T0 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 B A 11 P 1. 4 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 P 0. 5/ A D 5 B A 5 C E 2 P 1. 5 P 0. 6/ A D 6 B A 4 B A 10 P 1. 6 P 0. 7/ A D 7 B A 3 C E 1 P 1. 7 E A N .C . N .C . B A 2 B D 7 R S T A LE B A 1 B D 6 P 3. 0/ R X D P S E N B A 0 B D 5 P 3. 1/ T X D P 2. 7/ A 15 P 3. 2/ IN T 0 B D 4 P 3. 3/ IN T 1 DS5000FP TOP VIEW QFP

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DS5000FP 2 of 22 DESCRIPTION The DS5000FP Soft Microprocessor Chip is an 8051-compatible processor based on NV RAM technology. It is substantially more flexible than a standard 8051, yet provides full compatibility with the 8051 instruction set, timers, serial port, and parallel I/O ports. By using NV RAM instead of ROM, the user can program and then reprogram the microcontroller while in-system. The application software can even change its own operation, which allows frequent software upgrades, adaptive programs, customized systems, etc. In addition, by using NV SRAM, the DS5000FP is ideal for data-logging applications and it connects easily to a Dallas real-time clock for time stamp and date. The DS5000FP provides the benefits of NV RAM without using I/O resources. It uses a nonmultiplexed byte-wide address and data bus for memory access. This bus can perform all memory access and provides decoded chip enables for SRAM. This leaves the 32 I/O port pins free for application use. The DS5000FP uses ordinary SRAM and battery backs the memory contents with a user’s external lithium cell. Data is maintained for over 10 years with a very small lithium cell. A DS5000FP also provides crash-proof operation in portable systems or systems with unreliable power. These features include the ability to save the operating state, Power-fail Reset, Power-fail Interrupt, and Watchdog Timer. A user loads programs into the DS5000FP via its on-chip Serial Bootstrap Loader. This function supervises the loading of code into NV RAM, validates it, and then becomes transparent to the user. Software can be stored in an 8-kbyte or 32-kbyte CMOS SRAM. Using its internal Partitioning, the DS5000FP will divide this common RAM into user programmable code and data segments. This Partition can be selected at program loading time, but can be modified anytime later. It will decode memory access to the SRAM, communicate via its byte-wide bus and write-protect the memory portion designated as ROM. Combining program and data storage in one device saves board space and cost. The DS5000FP can also access a second 32 kbytes of NV RAM but this area is restricted to data memory. The DS2250(T) and DS5000(T) are available for a user who wants a pre-constructed module using the DS5000FP, RAM, lithium cell, and optional real-time clock. Each device is described in separate data sheets, available on our website at More details are contained in the Secure Microcontroller User’s Guide.

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DS5000FP 3 of 22 DS5000FP BLOCK DIAGRAM Figure 1

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DS5000FP 4 of 22 PIN DESCRIPTION PIN NAME FUNCTION 15, 17, 19, 21, 25, 27, 29, 31 P1.0–P1.7 General-Purpose I/O Port 1 34 RST Active-High Reset Input. A logic 1 applied to this pin activates a reset state. This pin is pulled down internally so this pin can be left unconnected if not used. 36 P3.0/ RXD General-Purpose I/O Port Pin 3.0. Also serves as the receive signal for the on board UART. This pin should not be connected directly to a PC COM port. 38 P3.1/ TXD General-Purpose I/O Port Pin 3.1. Also serves as the transmit signal for the on- board UART. This pin should not be connected directly to a PC COM port. 39 P3.2/ INT0 General-Purpose I/O Port Pin 3.2. Also serves as the active-low External Interrupt 0. 40 P3.3/ INT1 General-Purpose I/O Port Pin 3.3. Also serves as the active-low External Interrupt 1. 41 P3.4/T0 General-Purpose I/O Port Pin 3.4. Also serves as the Timer 0 input. 44 P3.5/T1 General-Purpose I/O Port Pin 3.5. Also serves as the Timer 1 input. 45 P3.6/ WR General-Purpose I/O Port Pin. Also serves as the write strobe for expanded bus operation. 46 P3.7/ RD General-Purpose I/O Port Pin. Also serves as the read strobe for expanded bus operation. 47, 48 XTAL2, XTAL1 Crystal Connections. Used to connect an external crystal to the internal oscillator. XTAL1 is the input to an inverting amplifier and XTAL2 is the output. 52, 53 GND Logic Ground 49, 50, 51, 56, 58, 60, 64, 66 P2.0–P2.7 General-Purpose I/O Port 2. Also serves as the MSB of the expanded address bus. 68 PSEN Program Store Enable. This active-low signal is used to enable an external program memory when using the expanded bus. It is normally an output and should be unconnected if not used. PSEN is also used to invoke the Bootstrap Loader. At this time, PSEN will be pulled down externally. This should only be done once the DS5000FP is already in a reset state. The device that pulls down should be open drain since it must not interfere with PSEN under normal operation. 70 ALE Address Latch Enable. Used to de-multiplex the multiplexed Expanded Address/Data bus on Port 0. This pin is normally connected to the clock input on a ’373 type transparent latch. When using a parallel programmer, this pin also assumes the PROG function for programming pulses. 73 EA External Access. This pin forces the DS5000FP to behave like an 8031. No internal memory (or clock) will be available when this pin is at a logic low. Since this pin is pulled down internally, it should be connected to +5V to use NV RAM. In a parallel programmer, this pin also serves as VPP for super voltage pulses.

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DS5000FP 5 of 22 PIN DESCRIPTION (continued) PIN NAME FUNCTION 11, 9, 7, 5, 1, 79, 77, 75 P0.0–P0.7 General-Purpose I/O Port 0. This port is open-drain and cannot drive a logic 1. It requires external pullups. Port 0 is also the multiplexed Expanded Address/Data bus. When used in this mode, it does not require pullups. 13, 14 VCC Power Supply, +5V 16, 8, 18, 80, 76, 4, 6, 20, 24, 26, 28, 30, 33, 35, 37 BA14– BA0 Byte-Wide Address Bus Bits 14–0. This 15-bit bus is combined with the nonmultiplexed data bus (BD7–BD0) to access NV SRAM. Decoding is performed on CE1 and CE2 . Read/write access is controlled by R/W. BA14–BA0 connect directly to an 8k or 32k SRAM. If an 8k RAM is used, BA13 and BA14 are unconnected. Note: BA13 and BA14 are inverted from the true logical address. BA14 is lithium backed. 71, 69, 67, 65, 61, 59, 57, 55 BD7–BD0 Byte-Wide Data Bus Bits 7–0. This 8-bit bidirectional bus is combined with the nonmultiplexed address bus (BA14–BA0) to access NV SRAM. Decoding is performed on CE1 and CE2 . Read/write access is controlled by R/W. BD7–BD0 connect directly to an 8k or 32k SRAM, and optionally to a real-time clock. 10 R/W Read/Write (Active Low). This signal provides the write enable to the SRAMs on the byte-wide bus. It is controlled by the memory map and partition. The blocks selected as Program (ROM) is write protected. 74 CE1 Active-Low Chip Enable 1. This is the primary decoded chip enable for memory access on the byte-wide bus. It connects to the chip enable input of one SRAM. CE1 is lithium backed. It will remain in a logic high inactive state when VCC falls below VLI. 78 CE2 Active-Low Chip Enable 2. This chip enable is provided to bank switch to a second block of 32k bytes of nonvolatile data memory. It connects to the chip enable input of one SRAM or one lithium-backed peripheral such a real-time clock. CE2 is lithium backed. It will remain in a logic high inactive state when VCC falls below VLI. 12 VCCO VCC Output. This is switched between VCC and VLI by internal circuits based on the level of VCC. When power is above the lithium input, power will be drawn from VCC. The lithium cell remains isolated from a load. When VCC is below VLI, the VCCO switches to the VLI source. VCCO is connected to the VCC pin of an SRAM. 54 VLI Lithium Voltage Input. Connect to a lithium cell greater than VLImin and no greater than VLImax as shown in the electrical specifications. Nominal value is +3V. 2, 3, 22, 23, 32, 42, 43, 62, 63, 72 N.C. No Connection. Do not connect.

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DS5000FP 6 of 22 INSTRUCTION SET The DS5000FP executes an instruction set that is object code compatible with the industry standard 8051 microcontroller. As a result, software development packages such as assemblers and compilers that have been written for the 8051 are compatible with the DS5000FP. A complete description of the instruction set and operation are provided in the Secure Microcontroller User’s Guide. Also note that the DS5000FP is embodied in the DS5000(T) and DS2250(T) modules. The DS5000(T) combines the DS5000FP with one SRAM of either 8 or 32 kbytes and a lithium cell. An optional Real Time Clock is also available in the DS5000T. This is packaged in a 40-pin DIP module. The DS2250(T) is an identical function in a SIMM form factor. It also offers the option of a second 32k SRAM mapped as data on Chip Enable 2. MEMORY ORGANIZATION Figure 2 illustrates the memory map accessed by the DS5000FP. The entire 64k of program and 64k of data is available. The DS5000FP maps 32k of this space into the SRAM connected to the byte-wide bus. This is the area from 0000h to 7FFFh (32k) and is reached via CE1 . Any area not mapped into the NV RAM is reached via the Expanded bus on Ports 0 & 2. Selecting CE2 provides another 32k of potential data storage. When CE2 is used, no data is available on the ports. The memory map is covered in detail in the Secure Microcontroller User’s Guide. Figure 3 illustrates a typical memory connection for a system using 8k bytes of SRAM. Figure 4 shows a similar system with 32 kbytes. The byte-wide Address bus connects to the SRAM address lines. The bi- directional byte-wide data bus connects the data I/O lines of the SRAM. CE1 provides the chip enable and R/ W is the write enable. An additional RAM could be connected to CE2 , with common connections for R/ W , BA14-0, and BD7-0.

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DS5000FP 7 of 22 POWER MANAGEMENT The DS5000FP monitors power to provide Power-Fail Reset, early warning Power-Fail Interrupt, and switchover to lithium backup. It uses the lithium cell at VLI as a reference in determining the switch points. These are called VPFW, VCCMIN, and VLI respectively. When VCC drops below VPFW, the DS5000FP will perform an interrupt vector to location 2Bh if the power-fail warning was enabled. Full processor operation continues regardless. When power falls further to VCCMIN, the DS5000FP invokes a reset state. No further code execution will be performed unless power rises back above VCCMIN. CE1 , CE2 , R/ W go to an inactive (logic 1) state. Any address lines that are high (due to encryption) will follow VCC, except for BA14, which is lithium backed. VCC is still the power source at this time. When VCC drops further to below VLI, internal circuitry will switch to the lithium cell for power. The majority of internal circuits will be disabled and the remaining nonvolatile states will be retained. The lithium cell will power any devices connected to VCCO at this time. VCCO will be at the lithium battery voltage less a diode drop. This drop will vary depending on the load. Low-leakage SRAMs should be used for this reason. When a module is used, the lithium cell is selected by Dallas so absolute specifications are provided for the switch thresholds. When using the DS5000FP, the user must select the appropriate battery. The following formulas apply to the switch function: VPFW = 1.45 x VLI VCCMIN = 1.40 x VLI VLI Switch = 1.0 x VLI MEMORY MAP OF THE DS5000FP Figure 2

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DS5000FP 8 of 22 DS5000FP CONNECTION TO 8k X 8 SRAM Figure 3 DS5000FP CONNECTION TO 32k X 8 SRAM Figure 4

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DS5000FP 9 of 22 ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………...………-0.3V to + (VCC + 0.5V) Voltage Range on VCC Relative to Ground…………………….……….……………………..………-0.3V to +7.0V Operating Temperature Range………………………………….….………………………………..…..0°C to +70°C Storage Temperature Range……………………………………...………………………………..…..-40°C to +70°C Soldering Temperature Range……………………………………………..See IPC/JEDEC J-STD-020 Specification This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time can affect reliability. DC CHARACTERISTICS (VCC = 5V 5%, TA = 0C to +70C.) PARAMETER SYMBOL MIN TYP MAX UNITS NOTES Input Low Voltage VIL -0.3 0.8 V 1 Input High Voltage VIH1 2.0 VCC +0.3 V 1 Input High Voltage RST, XTAL1 VIH2 3.5 VCC + 0.3 V 1 Output Low Voltage at IOL = 1.6mA (Ports 1, 2, 3) VOL1 0.15 0.45 V Output Low Voltage at IOL = 3.2mA (Ports 0, ALE, PSEN , BA14–BA0, BD7–BD0, R/W, CE1-2) VOL2 0.15 0.45 V 1 Output High Voltage at IOH = -80A (Ports 1, 2, 3) VOH1 2.4 4.8 V 1 Output High Voltage at IOH = -400A (Ports 0, ALE, PSEN, BA14–BA0, BD7–BD0, R/W, CE1-2) VOH2 2.4 4.8 V 1 Input Low Current VIN = 0.45V (Ports 1, 2, 3) IIL -50 A Transition Current; 1 to 0 VIN = 2.0V (Ports 1, 2, 3) ITL -500 A Input Leakage Current 0.45 < VIN < VCC (Port 0) IL 10 A RST, EA Pulldown Resistor RRE 40 125 k Stop Mode Current ISM 80 A 4 Power-Fail Warning Voltage VPFW 4.15 4.6 4.75 V 1, 6 Minimum Operating Voltage VCCmin 4.05 4.5 4.65 V 1, 6 Operating Voltage VCC VCC(MIN) 5.5 V 1, 6 Lithium Supply Voltage VLI 2.9 3.3 V 1 Programming Supply Voltage (Parallel Program Mode) VPP 12.5 13 V 1 Program Supply Current IPP 15 20 mA

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August 16, 2020

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August 7, 2020

High level customer service, and quick response.


August 6, 2020

happy with the IC and received with perfect packaging, good comunication with seller thanks.


August 5, 2020

Item came in time and looks as described.


July 27, 2020

I have never been experienced anything wrong with my order, the logistic has always get out the same day, and the items are always well packaged.


July 26, 2020

The order has arrived ahead of time, we appreciate it very much!! Thanks


July 23, 2020

Exactly as listed and arrived very fast, excellent price and service!


July 22, 2020

I can count on your provision for BOM of my design in near future


July 22, 2020

Items as described, quick dispatch, took a while with shipment.

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