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Part Number FAN2315MPX
Manufacturer ON Semiconductor
Datasheet FAN2315MPX Datasheet
Package 34-PowerTFQFN
In Stock 6,218 piece(s)
Unit Price $ 1.5428 *
Lead Time Can Ship Immediately
Estimated Delivery Time Jan 23 - Jan 28 (Choose Expedited Shipping)
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Part Number # FAN2315MPX (PMIC - Voltage Regulators - DC DC Switching Regulators) is manufactured by ON Semiconductor and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

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FAN2315MPX Specifications

ManufacturerON Semiconductor
CategoryIntegrated Circuits (ICs) - PMIC - Voltage Regulators - DC DC Switching Regulators
Datasheet FAN2315MPXDatasheet
Output ConfigurationPositive
Output TypeAdjustable
Number of Outputs1
Voltage - Input (Min)4.5V
Voltage - Input (Max)15V
Voltage - Output (Min/Fixed)0.6V
Voltage - Output (Max)5.5V
Current - Output15A
Frequency - Switching200kHz ~ 1MHz
Synchronous RectifierYes
Operating Temperature-40°C ~ 125°C (TJ)
Mounting TypeSurface Mount
Package / Case34-PowerTFQFN
Supplier Device Package34-PQFN (5.5x5)

FAN2315MPX Datasheet

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To learn more about ON Semiconductor, please visit our website at Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at Please email any questions regarding the system integration to Is Now Part of ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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September 2015 © 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r FAN2315 15 A Synchronous Buck Regulator Features  VIN Range: 4.5 V to 18 V  High Efficiency: Over 96% Peak  Continuous Output Current: 15 A  PFM Mode for Light-Load Efficiency  Excellent Line and Load Transient Response  Precision Reference: ±1% Over Temperature  Output Voltage Range: 0.6 to 5.5 V  Programmable Frequency: 200 kHz to 1 MHz  Programmable Soft-Start  Low Shutdown Current  Adjustable Sourcing Current Limit  Internal Boot Diode  Thermal Shutdown  Halogen and Lead Free, RoHS Compliant Applications  Servers and Desktop Computers  NVDC Notebooks, Netbooks  Game Consoles  Telecommunications  Storage  Base Stations Description The FAN2315 is a highly efficient synchronous buck regulator. The regulator is capable of operating with an input range from 4.5 V to 18 V and supporting up to 15 A load currents. The FAN2315 utilizes Fairchild’s constant on-time control architecture to provide excellent transient response and to maintain a relatively constant switching frequency. The device utilizes Pulse Frequency Modulation (PFM) mode to maximize light-load efficiency by reducing switching frequency when the inductor is operating in discontinuous conduction mode at light loads. Switching frequency and over-current protection can be programmed to provide a flexible solution for various applications. Output over-voltage, under- voltage, over-current, and thermal shutdown protections help prevent damage to the device during fault conditions. A hysteresis feature restarts the device when normal operating temperature is reached. Ordering Information Part Number Configuration Operating Temperature Range Output Current (A) Package FAN2315MPX PFM with Ultrasonic Mode -40 to 125°C 15 34-Lead, PQFN, 5.5 mm x 5.0 mm .

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 2 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Typical Application Diagram R2 1.5kΩ C4 0.1µF C5 100pF L1 0.56µH R5 1.37kΩ C10 2.2µF C9 0.1µF R11 10Ω R9 54.9kΩ C3 0.1µF CIN 4x10µF R3 10kΩ VIN = 12V VOUT = 1.2V IOUT=0-15A C7 15nF R4 10kΩ PVIN PGND SW PVCCVCC EN ILIM AGND FREQ BOOT SOFT START FB VIN VBIAS = 5V CIN 0.1µF FAN2315MPX Ext EN PGOOD COUT 8x47µF Figure 1. Typical Application Functional Block Diagram Control Logic PVCC PVCC VCC Modulator VCC Thermal Shutdown 2 nd Level Over-Voltage Comparator 1 st Level-Over Voltage Comparator Under-Voltage Comparator FB Comparator Current Limit Comparator PFM Comparator HS Gate Driver LS Gate Driver VREF x1.2 x1.1 x0.9 VCC VCC UVLO PVCC SW PGNDILIM PGOOD FREQ FB SS VCC PVCC VIN BOOT PVIN AGND VCC EN ENABLE 10µA 10µA 0.8V/ 2.0V Figure 2. Block Diagram

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 3 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Pin Configuration 9 34 17 26 18 27 10 872 3 654 16 15 14 13 12 11 19202122232425 33 28 29 30 31 32 P G N D P G N D P G N D P G N D PVIN PVIN SW SW SW SW SW SW A G N D S W V C C P V C C IL IM FB NC NC NC SS EN FREQ PGOOD P V IN P V IN P V IN P V IN P V IN A G N D B O O T S W V IN AGND (P1) PVIN (P2) SW (P3) 1 PVIN A G N D P V IN P V IN P V IN P V IN PVIN SW SW SW SW SW SW P G N D P G N D P G N D P G N D S W V C C P V C C IL IM FB NC NC NC SS EN FREQ PGOOD A G N D B O O T S W V IN P V IN 19 10 27 2618 17 34 238 7 456 28 29 30 31 32 33 19 20 21 22 23 24 25 11 16 15 14 13 12 Figure 3. Pin Assignments, Bottom View Figure 4. Pin Assignments, Top View Pin Definitions Name Pad / Pin Description PVIN P2, 5-11 Power input for the power stage VIN 1 Input to the modulator for input voltage feed-forward PVCC 25 Power input for the low-side gate driver and boot diode VCC 26 Power supply input for the controller PGND 18-21 Power ground for the low-side power MOSFET and for the low-side gate driver AGND P1, 4, 23 Analog ground for the analog portions of the IC and for substrate SW P3, 2, 12-17, 22 Switching node; junction between high-and low-side MOSFETs BOOT 3 Supply for high-side MOSFET gate driver. A capacitor from BOOT to SW supplies the charge to turn on the N-channel high-side MOSFET. During the freewheeling interval (low-side MOSFET on), the high-side capacitor is recharged by an internal diode connected to PVCC. ILIM 24 Current limit. A resistor between ILIM and SW sets the current limit threshold. FB 27 Output voltage feedback to the modulator EN 29 Enable input to the IC. Pin must be driven logic high to enable, or logic low to disable. SS 31 Soft-start input to the modulator FREQ 32 On-time and frequency programming pin. Connect a resistor between FREQ and AGND to program on-time and switching frequency. PGOOD 30 Power good; open-drain output indicating VOUT is within set limits. NC 28, 33-34 Leave pin open or connect to AGND.

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 4 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Conditions Min. Max. Unit VPVIN Power Input Referenced to PGND -0.3 25.0 V VIN Modulator Input Referenced to AGND -0.3 25.0 V VBOOT Boot Voltage Referenced to PVCC -0.3 26.0 V Referenced to PVCC, <20 ns -0.3 30.0 V VSW SW Voltage to GND Referenced to PGND, AGND -1 25 V Referenced to PGND, AGND < 20 ns -5 25 V VBOOT Boot to SW Voltage Referenced to SW -0.3 6.0 V Boot to PGND Referenced to PGND -0.3 30.0 V VPVCC Gate Drive Supply Input Referenced to PGND, AGND -0.3 6.0 V VVCC Controller Supply Input Referenced to PGND, AGND -0.3 6.0 V VILIM Current Limit Input Referenced to AGND -0.3 6.0 V VFB Output Voltage Feedback Referenced to AGND -0.3 6.0 V VEN Enable Input Referenced to AGND -0.3 6.0 V VSS Soft Start Input Referenced to AGND -0.3 6.0 V VFREQ Frequency Input Referenced to AGND -0.3 6.0 V VPGOOD Power Good Output Referenced to AGND -0.3 6.0 V ESD Electrostatic Discharge Human Body Model, JESD22-A114 (1) 2000 V Charged Device Model, JESD22-C101 (2) 2500 V TJ Junction Temperature +150 °C TSTG Storage Temperature -55 +150 °C Note: 1. Exception for FB pin up to 350V 2. Exception for FB pin up to 500V Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter Conditions Min. Max. Unit VPVIN Power Input Referenced to PGND 4.5 18 V VIN Modulator Input Referenced to AGND 4.5 18 V TJ Junction Temperature -40 +125 °C ILOAD Load Current TA=25ºC, No Airflow 20 A VPVCC Gate Drive Supply Input Referenced to PGND, AGND 4.5 5.5 V

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 5 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Thermal Characteristics The thermal characteristics were evaluated on a 4-layer PCB structure (1 oz/1 oz/1 oz/1 oz) measuring 7 cm x 7 cm). Symbol Parameter Max. Unit JA Thermal Resistance, Junction-to-Ambient 35 °C/W ψJC Thermal Characterization Parameter, Junction-to-Top of Case 2.7 °C/W ψJPCB Thermal Characterization Parameter, Junction-to-PCB 2.3 °C/W

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 6 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Electrical Characteristics Unless otherwise noted; VIN=12 V, VOUT=1.2 V, and TA=TJ=-40 to 125°C. (4) Symbol Parameter Condition Min. Typ. Max. Unit Supply Current IVIN,SD Shutdown Current EN=0 V 10 µA IVIN,Q Quiescent Current EN=5 V, Not Switching 1.8 mA IVIN,GateCharge Gate Charge Current EN=5 V, fSW=500 kHz 22 mA Reference, Feedback Comparator VFB FB Voltage Trip Point 590 596 602 mV IFB FB Pin Bias Current -100 0 100 nA Modulator tON On-Time Accuracy RFREQ=56.2 k, VIN=10 V, tON=250 ns, No Load -20 20 % tOFF,MIN Minimum SW Off-Time 320 374 ns DMIN Minimum Duty Cycle FB=1 V 0 % fMINF Minimum Frequency Clamp 18.2 25.4 32.7 kHz Soft-Start ISS Soft-Start Current SS=0.5 V 7 10 13 µA tON,SSMOD SS On-Time Modulation SS<0.6 V 25 100 % VSSCLAMP,NOM Nominal Soft-Start Voltage Clamp VFB=0.6 V 400 mV VSSCLAMP,OVL Soft-Start Voltage Clamp in Overload Condition VFB=0.3 V, OC Condition 40 mV PFM Zero-Crossing Detection Comparator VOFF ZCD Offset Voltage TA=TJ=25°C -6 0 mV Current Limit ILIM Valley Current Limit Accuracy TA=TJ=25°C, IVALLEY=18 A -10 10 % VILIM,OFFSET Comparator Offset -1 1 mV KILIM ILIM Set-Point Scale Factor 80 ILIMTC Temperature Coefficient 4000 ppm/°C Enable VTH+ Rising Threshold 2.0 V VTH- Falling Threshold 0.8 V IENLK Enable Pin Leakage EN=1.2 V 100 nA IENLK Enable Pin Leakage EN=5 V 76 µA UVLO VON VCC Good Threshold Rising 4.4 V VHYS Hysteresis Voltage 160 mV Continued on the following page…

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 7 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Electrical Characteristics (Continued) Unless otherwise noted; VIN=12 V, VOUT=1.2 V, and TA=TJ=-40 to 125°C. (4) Symbol Parameter Condition Min. Typ. Max. Unit Fault Protection VUVP PGOOD UV Trip Point On FB Falling 86 89 92 % VVOP1 PGOOD OV Trip Point On FB Rising 108 111 115 % VOVP2 Second OV Trip Point On FB Rising; LS=On 118 122 125 % RPGOOD PGOOD Pull-Down Resistance IPGOOD=2 mA 125 Ω tPG,SSDELAY PGOOD Soft-Start Delay 0.82 1.42 2.03 ms IPG,LEAK PGOOD Leakage Current 1 µA Thermal Shutdown TOFF Thermal Shutdown Trip Point (3) 155 °C THYS Hysteresis (3) 15 °C Internal Bootstrap Diode VFBOOT Forward Voltage IF=10 mA 0.6 V IR Reverse Leakage VR=5 V 1000 µA Notes: 3. Guaranteed by design; not production tested. 4. Device is 100% production tested at TA=25°C. Limits over that temperature are guaranteed by design.

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© 2011 Fairchild Semiconductor Corporation FAN2315 • Rev. 1.14 8 F A N 2 3 1 5 — 1 5 A S y n c h ro n o u s B u c k R e g u la to r Typical Performance Characteristics Tested using evaluation board circuit shown in Figure 1 with VIN=12 V, VOUT=1.2 V, fSW=500 kHz, TA=25°C, and no airflow; unless otherwise specified. Figure 5. Efficiency vs. Load Current with VIN=12 V and fSW=500 kHz Figure 6. Efficiency vs. Load Current with VIN=12 V and VOUT=1.2 V Figure 7. Efficiency vs. Load Current with VIN=12 V Figure 8. Efficiency vs. Load Current with VOUT=1.2 V and fSW=500 kHz Figure 9. Case Temperature Rise vs. Load Current on 4-Layer PCB, 1 oz Copper, 7 cm x 7 cm Figure 10. Load Regulation 75 80 85 90 95 100 0 5 10 15 20 E ff ic ie n c y ( % ) Load Current (A) 12VIN_5VOUT_500KHZ_1.2UH 12VIN_3.3VOUT_500KHZ_1.2UH 12VIN_1.2VOUT_300KHZ_0.72UH 12VIN_1.2VOUT_500KHZ_0.56UH 12VIN_1.05VOUT_500KHZ_0.4UH 12VIN_1.2VOUT_1MHZ_0.3UH 10 20 30 40 50 60 70 80 90 100 0.001 0.01 0.1 1 10 Ef fi ci e n cy (% ) Load Current (A) Vin=5V, L=0.4uH Vin=8V, L=0.4uH Vin=12V, L=0.56uH 0 10 20 30 40 50 60 70 80 0 5 10 15 20 C as e T e m p e ra tu re R is e (° C ) Load Current (A) 12Vi, 1.2Vo, 1MHz 12Vi, 1.2Vo, 500kHz 12Vi, 1.2Vo, 300kkHz 1.19 1.195 1.2 1.205 1.21 1.215 1.22 0 5 10 15 O u tp u t V o lt ag e (V ) Load Current (A) 30 40 50 60 70 80 90 100 0.01 0.1 1 10 Ef fi ci e n cy (% ) Load Current (A) Vo=5V, L=1.2uH Vo=3.3V, L=1.2uH Vo=1.2V, L=0.56uH Vo=1.05, L=0.4uH 5 20 30 40 50 60 70 80 90 100 0.01 0.1 1 10 Ef fi ci e n cy (% ) Load Current (A) Fsw=300kHz, L=0.72uH Fsw=500kHz, L=0.56uH Fsw=1MHz, L=0.3uH 5 20

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Components all tested within limits of specifications. Components came packaged in an easy to identify resealable bag and will work well for my projects.

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