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LQW2UAS27NJ00L

hot LQW2UAS27NJ00L

LQW2UAS27NJ00L

For Reference Only

Part Number LQW2UAS27NJ00L
Manufacturer Murata
Description FIXED IND 27NH 1A 130 MOHM SMD
Datasheet LQW2UAS27NJ00L Datasheet
Package 1008 (2520 Metric)
In Stock 3670 piece(s)
Unit Price $ 0.09 *
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Lead Time Can Ship Immediately
Estimated Delivery Time Dec 14 - Dec 19 (Choose Expedited Shipping)
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LQW2UAS27NJ00L

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LQW2UAS27NJ00L Specifications

ManufacturerMurata
CategoryInductors, Coils, Chokes - Fixed Inductors
Datasheet LQW2UAS27NJ00L Datasheet
Package1008 (2520 Metric)
SeriesLQW2
TypeWirewound
Material - CoreAir
Inductance27nH
Tolerance±5%
Current Rating1A
ShieldingUnshielded
DC Resistance (DCR)130 mOhm Max
Q @ Freq55 @ 350MHz
Frequency - Self Resonant1.6GHz
Operating Temperature-55°C ~ 125°C
Frequency - Test50MHz
Mounting TypeSurface Mount
Package / Case1008 (2520 Metric)
Supplier Device Package1008 (2520 Metric)
Size / Dimension0.103" L x 0.096" W (2.62mm x 2.45mm)
Height - Seated (Max)0.080" (2.03mm)

LQW2UAS27NJ00L Datasheet

Page 1

Page 2

Spec No.JELF243A-0085J-01 P.1/12 MURATA MFG.CO.,LTD Reference Only CHIP COIL (CHIP INDUCTORS) LQW2UAS□□□□00L REFERENCE SPECIFICATION 1.Scope This reference specification applies to LQW2UAS_00 Series Chip coil(Chip Inductors). 2.Part Numbering *Bulk packing also available. (A product is put in the plastic bag under the taping conditions.) 3.Rating ・Operating Temperature Range. –55°C ~ +125°C ・Storage Temperature Range. –55°C ~ +125°C Customer Part Number MURATA Part Number Inductance Q (min.) DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) Rated Current (mA) (nH) Tolerance LQW2UAS12NG00L 12 G:±2% J:±5% 50 0.09 3300 1000 LQW2UAS12NJ00L LQW2UAS18NG00L 18 50 0.11 2500 1000 LQW2UAS18NJ00L LQW2UAS22NF00L 22 F:±1% G:±2% J:±5% 55 0.12 2400 1000 LQW2UAS22NG00L LQW2UAS22NJ00L LQW2UAS27NG00L 27 G:±2% J:±5% 55 0.13 1600 1000 LQW2UAS27NJ00L LQW2UAS33NF00L 33 F:±1% G:±2% J:±5% 60 0.14 1600 1000 LQW2UAS33NG00L LQW2UAS33NJ00L LQW2UAS39NF00L 39 60 0.15 1500 1000 LQW2UAS39NG00L LQW2UAS39NJ00L LQW2UAS47NF00L 47 65 0.16 1500 1000 LQW2UAS47NG00L LQW2UAS47NJ00L LQW2UAS56NF00L 56 65 0.18 1300 1000 LQW2UAS56NG00L LQW2UAS56NJ00L LQW2UAS68NF00L 68 65 0.20 1300 1000 LQW2UAS68NG00L LQW2UAS68NJ00L LQW2UAS82NF00L 82 60 0.22 1000 1000 LQW2UAS82NG00L LQW2UAS82NJ00L LQW2UASR10F00L 100 60 0.56 1000 650 LQW2UASR10G00L LQW2UASR10J00L LQW2UASR12F00L 120 60 0.63 950 650 LQW2UASR12G00L LQW2UASR12J00L LQW2UASR15F00L 150 45 0.70 850 580 LQW2UASR15G00L LQW2UASR15J00L (ex) LQ W 2U A S 12N G 0 0 L Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging (L×W) and L:Taping Characteristics *B:Bulk

Page 3

Spec No.JELF243A-0085J-01 P.2/12 MURATA MFG.CO.,LTD Reference Only Customer Part Number MURATA Part Number Inductance Q (min.) DC Resistance (Ω max.) Self Resonant Frequency (MHz min.) Rated Current (mA) (nH) Tolerance LQW2UASR18F00L 180 F:±1% G:±2% J:±5% 45 0.77 750 620 LQW2UASR18G00L LQW2UASR18J00L LQW2UASR22F00L 220 45 0.84 700 500 LQW2UASR22G00L LQW2UASR22J00L LQW2UASR27F00L 270 45 0.91 600 500 LQW2UASR27G00L LQW2UASR27J00L LQW2UASR33F00L 330 45 1.05 570 450 LQW2UASR33G00L LQW2UASR33J00L LQW2UASR39F00L 390 45 1.12 500 470 LQW2UASR39G00L LQW2UASR39J00L LQW2UASR47F00L 470 45 1.19 450 470 LQW2UASR47G00L LQW2UASR47J00L LQW2UASR56F00L 560 45 1.33 415 400 LQW2UASR56G00L LQW2UASR56J00L LQW2UASR62F00L 620 45 1.40 375 300 LQW2UASR62G00L LQW2UASR62J00L LQW2UASR68F00L 680 45 1.47 375 400 LQW2UASR68G00L LQW2UASR68J00L LQW2UASR75F00L 750 45 1.54 360 360 LQW2UASR75G00L LQW2UASR75J00L LQW2UASR82F00L 820 45 1.61 350 400 LQW2UASR82G00L LQW2UASR82J00L LQW2UASR91F00L 910 35 1.68 320 380 LQW2UASR91G00L LQW2UASR91J00L LQW2UAS1R0F00L 1000 35 1.75 290 370 LQW2UAS1R0G00L LQW2UAS1R0J00L LQW2UAS1R2J00L 1200 J:±5% 35 2.0 210 310 LQW2UAS1R5J00L 1500 28 2.3 120 330 LQW2UAS1R8J00L 1800 28 2.6 140 300 LQW2UAS2R2J00L 2200 28 2.8 130 280 LQW2UAS2R7J00L 2700 22 3.2 110 290 LQW2UAS3R3J00L 3300 22 3.4 90 290 LQW2UAS3R9J00L 3900 20 3.6 70 260 LQW2UAS4R7J00L 4700 20 4.0 60 260 4. Testing Conditions 《Unless otherwise specified》 《In case of doubt》 Temperature : Ordinary Temperature / 15°C to 35°C Temperature : 20°C±2°C Humidity : Ordinary Humidity / 25%(RH) to 85%(RH) Humidity : 60%(RH) to 70%(RH) Atmospheric Pressure : 86kPa to 106 kPa

Page 4

Spec No.JELF243A-0085J-01 P.3/12 MURATA MFG.CO.,LTD Reference Only 5. Appearance and Dimensions 6.Electrical Performance No. Item Specification Test Method 6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4287A or equivalent Measuring Frequency: 50MHz/12nH~82nH 25MHz/100nH~1000nH 7.9MHz/1200nH~4700nH 500MHz/12nH~15nH 350MHz/18nH~120nH 100MHz/150nH~820nH 50MHz/910nH~2200nH 25MHz/2700nH~4700nH Measuring Condition: Test signal level / about 0dBm Electrode spaces / 1.5mm Electrical length / 10.0mm Weight / about 1N~3N Measuring Fixture: KEYSIGHT 16197A Position coil under test as shown in below and contact coil with each terminal by adding weight. Measuring Method: See the endnote. 6.2 Q Q shall meet item 3. 6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment:Digital multi meter 6.4 Self Resonant Frequency(SRF) S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT 8753C or equivalent 6.5 Rated Current Self temperature rise shall be limited to 40°C max. The rated current is applied. 1 .8 3 ± 0 .2 0 .2 5 ± 0 .1 5 2.3±0.2 0.6±0.1 (in mm) 2.62±0.3 2.45±0.2 ■Unit Mass (Typical value) 0.039g 1.5mm

Page 5

Spec No.JELF243A-0085J-01 P.4/12 MURATA MFG.CO.,LTD Reference Only 7.Mechanical Performance No. Item Specification Test Method 7.1 Shear Test Chip coil shall not be damaged after tested as test meth Substrate:Glass-epoxy substrate (in mm) Applied Direction: Force:10N Hold Duration:5s±1s 7.2 Bending Test Chip coil shall not be damaged after tested as test method. Substrate:Glass-epoxy substrate (100mm×40mm×1.0mm) Speed of Applying Force:1mm / s Deflection:3mm Hold Duration:5s 7.3 Vibration Chip coil shall not be damaged after tested as test method Oscillation Frequency: 10Hz~2000Hz~10Hz for 15 min Total amplitude 3 mm or Acceleration amplitude 196m/s2 whichever is smaller. Time : A period of 2 hours in each of 3 mutually perpendicular directions. (Total 6hours) 7.4 Solderability The wetting area of the electrode shall be at least 90% covered with new solder coating. Flux:Ethanol solution of rosin,25(wt)% Includes activator equivalent to 0.06(wt)% chlorine.(immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:240°C±5°C Immersion Time:3s±1s 7.5 Resistance to Soldering Heat Appearance:No damage Inductance Change: within ±5% Flux:Ethanol solution of rosin,25(wt)% Includes activator equivalent to 0.06(wt)% Chlorine.(immersed for 5s to 10s) Solder:Sn-3.0Ag-0.5Cu Pre-Heating:150°C±10°C / 60s to 90s Solder Temperature:270°C±5°C Immersion Time:10s±1s Then measured after exposure in the room condition for 24h±2h. 1.27 3.3 2.54 Chip Coil Pattern Solder resist Substrate Substrate F Chip Coil 45 R230 F Deflection 45 Product Pressure jig (in mm)

Page 6

Spec No.JELF243A-0085J-01 P.5/12 MURATA MFG.CO.,LTD Reference Only 2 .3 ± 0 .1 φ1.5 1.55±0.1 4.0±0.1 2.0±0.05 4.0±0.1 +0.1 -0 1.75±0.1 3 .5 ± 0 .0 5 8 .0 ± 0 .3 1.1±0.1引き出し方向 0.25±0.05 8.Environmental Performance It shall be soldered on the substrate. No. Item Specification Test Method 8.1 Heat Resistance Appearance:No damage Inductance Change: within ±5% Q Change: within ±20% Temperature:125°C±2°C Time:1000h (+48h,0h) Then measured after exposure in the room condition for 24h±2h. 8.2 Cold Resistance Temperature:-55°C±2°C Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24±2 h. 8.3 Humidity Temperature:85°C±2°C Humidity:85%(RH) Time:1000h (+48h,-0h) Then measured after exposure in the room condition for 24h±2h. 8.4 Temperature Cycle 1 cycle: 1 step:-55°C±2°C / 30min±3 min 2 step:Ordinary temp. / 10min to 15 min 3 step:+125°C±2°C / 30min±3 min 4 step:Ordinary temp. / 30min±3 min Total of 10 cycles Then measured after exposure in the room condition for 24h±2h. 9.Specification of Packaging 9.1 Appearance and Dimensions of plastic tape (8mm-wide, 4mm-pitch) ・Dimension of the Cavity is measured at the bottom side. 9.2 Specification of Taping (1) Packing quantity (standard quantity) 2,000 pcs. / reel (2) Packing Method Products shall be packed in the cavity of the plastic tape and sealed by Cover tape. (3) Sprocket hole The sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced point Plastic tape and Cover tape has no spliced point. (5) Missing components number Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous. The Specified quantity per reel is kept. 9.3 Pull Strength Plastic tape 5N min. Cover tape 10N min. Direction of feed (in mm) 1.65±0.1 2. 8± 0. 1 2.7±0.1 2.15±0.1

Page 7

Spec No.JELF243A-0085J-01 P.6/12 MURATA MFG.CO.,LTD Reference Only 165 to 180 degree F Cover tape Plastic tape 9.4 Peeling off force of cover tape Speed of Peeling off 300mm/min Peeling off force 0.1N to 0.6N (minimum value is typical) 9.5 Dimensions of Leader-tape,Trailer and Reel There shall be leader-tape ( cover tape and empty tape) and trailer-tape (empty tape) as follows. (in mm) 9.6 Marking for reel Customer part number, MURATA part number, Inspection number(∗1) , RoHS Marking ( (∗2), Quantity etc ・・・ ∗1) □□ OOOO ××× (1) (2) (3) (1) Factory Code (2) Date First digit : Year / Last digit of year Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D Third, Fourth digit : Day (3) Serial No. ∗2) ROHS – Y (△) (1) (2) (1) RoHS regulation conformity parts. (2) MURATA classification number 9.7 Marking for Outside package (corrugated paper box) Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (∗2) ,Quantity, etc ・・・ 9.8. Specification of Outer Case Outer Case Dimensions (mm) Standard Reel Quantity in Outer Case (Reel) W D H 186 186 93 5 ∗ Above Outer Case size is typical. It depends on a quantity of an order. 10. ! Caution Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (2) Aerospace equipment (7) Traffic signal equipment (3) Undersea equipment (8) Disaster prevention / crime prevention equipment (4) Power plant control equipment (9) Data-processing equipment (5) Medical equipment (10) Applications of similar complexity and /or reliability requirements to the applications listed in the above Empty tape 190 min. Leader Trailer 2.0±0.5 φ13.0±0.2 φ21.0±0.8 φ180 φ60 9.0 13.0±1.4 +1 -0 +0 -3 Direction of feed 210 min. 160 min. Cover tape +1 -0 Label W D Label H

Page 8

Spec No.JELF243A-0085J-01 P.7/12 MURATA MFG.CO.,LTD Reference Only 11. Notice Products can only be soldered with reflow. This product is designed for solder mounting. Please consult us in advance for applying other mounting method such as conductive adhesive. 11.1 Land pattern designing Recommended land patterns for reflow soldering are as follows: These have been designed for Electric characteristics and solderability. Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process (in mm) ・Do not use gilded pattern. A copper wire may cause open by dissolution of metallization. 11.2 Flux, Solder ・Use rosin-based flux. Includes middle activator equivalent to 0.06(wt)% to 0.1(wt)% Chlorine. Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). Don’t use water-soluble flux. ・Use Sn-3.0Ag-0.5Cu solder. ・Standard thickness of solder paste : 100μm to 150μm. 11.3 Reflow soldering conditions ・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality. ・Standard soldering profile and the limit soldering profile is as follows. The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality. ・Reflow soldering profile Standard Profile Limit Profile Pre-heating 150°C~180°C 、90s±30s Heating above 220°C、30s~60s above 230°C、60s max. Peak temperature 245°C±3°C 260°C,10s Cycle of reflow 2 times 2 times Limit Profile Standard Profile 90s±30s 230℃ 260℃ 245℃±3℃ 220℃ 30s~60s 60s max. 180 150 Temp. (s) (℃) Time. 1.27 3.3 2.54 Chip Coil Pattern Solder resist Substrate

Page 9

Spec No.JELF243A-0085J-01 P.8/12 MURATA MFG.CO.,LTD Reference Only 11.4 Reworking with soldering iron. The following conditions must be strictly followed when using a soldering iron. Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter Φ 3mm max . Soldering time 3(+1,-0)s Times 2 times Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products due to the thermal shock. 11.5 Solder Volume ・ Solder shall be used not to be exceeded the upper limits as shown below. ・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. 1/2T≦t≦T T:thickness of electrode 11.6 Product’s location The following shall be considered when designing and laying out P.C.B.'s. (1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board. [Products direction] Products shall be located in the sideways direction (Length:a<b) to the mechanical stress. (2) Components location on P.C.B. separation. It is effective to implement the following measures, to reduce stress in separating the board. It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. Contents of Measures Stress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part. A > B (3) Keep the mounting position of the component away from the board separation surface. A > C *1 A > D is valid when stress is added vertically to the perforation as with Hand Separation. If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid. 〈Poor example〉 〈Good example〉 b a Recommendable(t) Upper Limit T ⇔⇔ Seam Slit A D B C b a Length:a< b

Page 10

Spec No.JELF243A-0085J-01 P.9/12 MURATA MFG.CO.,LTD Reference Only (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible. 11.7 Cleaning Conditions Products shall be cleaned on the following conditions. (1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA) (2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon at the mounted products and P.C.B. Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max. (3) Cleaner 1. Alcohol type cleaner Isopropyl alcohol (IPA) 2. Aqueous agent PINE ALPHA ST-100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Other cleaning Please contact us. 11.8 Resin coating The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful attention when you select resin in case of coating/molding the products with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board. 11.9 Caution for use ・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be touched to the winding portion to prevent the breaking of wire. ・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core. 11.10 Notice of product handling at mounting In some mounting machines,when picking up components support pin pushes up the components from the bottom of plastic tape. In this case, please remove the support pin. The support pin may damage the components and break wire. 11.11 Handling of a substrate After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending Twisting

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We provide 90 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.

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