Contact Us
SalesDept@heisener.com +86-755-83210559 ext. 811

MC33298P

hotMC33298P

MC33298P

For Reference Only

Part Number MC33298P
Manufacturer NXP
Description IC SWITCH SERIAL OCTAL 20-DIP
Datasheet MC33298P Datasheet
Package 20-DIP (0.300", 7.62mm)
In Stock 551 piece(s)
Unit Price Request a Quote
Lead Time Can Ship Immediately
Estimated Delivery Time Jul 15 - Jul 20 (Choose Expedited Shipping)
Request for Quotation

Part Number # MC33298P (PMIC - Power Distribution Switches, Load Drivers) is manufactured by NXP and distributed by Heisener. Being one of the leading electronics distributors, we carry many kinds of electronic components from some of the world’s top class manufacturers. Their quality is guaranteed by its stringent quality control to meet all required standards.

For MC33298P specifications/configurations, quotation, lead time, payment terms of further enquiries please have no hesitation to contact us. To process your RFQ, please add MC33298P with quantity into BOM. Heisener.com does NOT require any registration to request a quote of MC33298P.

MC33298P Specifications

ManufacturerNXP
CategoryIntegrated Circuits (ICs) - PMIC - Power Distribution Switches, Load Drivers
Datasheet MC33298PDatasheet
Package20-DIP (0.300", 7.62mm)
Series-
Switch TypeGeneral Purpose
Number of Outputs8
Ratio - Input:Output1:8
Output ConfigurationLow Side
Output TypeN-Channel
InterfaceSPI
Voltage - Load9 V ~ 26.5 V
Voltage - Supply (Vcc/Vdd)2.5 V ~ 4.5 V
Current - Output (Max)1A
Rds On (Typ)350 mOhm
Input Type-
Features-
Fault ProtectionCurrent Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature-40°C ~ 150°C (TJ)
Package / Case20-DIP (0.300", 7.62mm)
Supplier Device Package20-DIP

MC33298P Datasheet

Page 1

Page 2

Document Number: MC33298 Rev. 6.0, 4/2008 Freescale Semiconductor Technical Data A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N Eight Output Switch with Serial Peripheral Interface I/O The 33298 is a smart eight output low side power switch. It is a versatile device incorporating an 8-bit serial-in shift register to control an 8-bit parallel output latch providing control of eight independent "ON/OFF" output switches. Applications include the control of solenoids, relays, lamps, small DC motors, and other moderate current loads (1.0 – 3.0A). The 33298 interfaces directly with a microcontroller to control various inductive or incandescent loads. Input control is fast. Data rates are guaranteed to 2.0 MHz but the device is capable of rates to 8.5 MHz @ 25°C. Each output uses high efficiency MOSFET power transistors configured with open drains. Each low "ON" resistance output (0.4Ω RDS(ON) @ 25°C) is capable of sinking up to 3.0A of transient current. On a continuous basis, each output can simultaneously (with all outputs "ON") handle 0.5A of current when the device is soldered onto a typical PC board. Higher output currents are dependent on the number of outputs simultaneously "ON". The circuit's innovative monitoring and protection features include very low standby current. Features • Designed to operate over wide supply voltages of 5.5 to 26.5V • Interfaces to microprocessor using 8-bit SPI I/O protocol up to 3.0MHz • 1.0A peak current outputs with maximum RDS(ON) of 1.8Ω at TJ - 150°C • Outputs current limited to accommodate in-rush currents associated with switching incandescent loads • Output voltages clamped to 65V during inductive switching • Maximum sleep current (IPWR) of 25µA • Maximum of 4.0mA IDD during operation • Pb-free packaging designated by suffix code EG Figure 1. 33298 Simplified Application Diagram LOW SIDE SWITCH DW SUFFIX EG SUFFIX (PB-FREE) 98ASB42344B 24 SOICW 33298 ORDERING INFORMATION Device Temperature Range (TA) Package MC33298DW/R2 -40°C to 125°C 24 SOIC MCZ33298EG/R2 MCU 33298 VDD V PWR SFPD CS SCLK SI RESET SO VDD VPWR OP 0 OP 1 OP 2 OP 3 OP 4 OP 5 OP 6 OP 7 GND Freescale Semiconductor, Inc. reserves the right to change the detail specifications, as may be required, to permit improvements in the design of its products. © Freescale Semiconductor, Inc., 2007-2008. All rights reserved.

Page 3

INTERNAL BLOCK DIAGRAM A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N INTERNAL BLOCK DIAGRAM Figure 2. 33298 Simplified Block Diagram Table 1. Fault Operation SERIAL OUTPUT (SO) PIN REPORTS Over-voltage Over-voltage condition reported Over-temperature Fault reported by Serial Output (SO) pin Over-current SO pin reports short to battery/supply or over-current condition Output ON, Open Load Fault Not reported Output OFF, Open Load Fault SO pin reports output OFF open load condition DEVICE SHUTDOWNS Over-voltage Total device shutdown at VPWR = 28 to 36V. All outputs are latched off while the SPI register is reset (cleared). Outputs can be turned back on with a new SPI command after VPWR has decayed below the over-voltage shutdown voltage including hysteresis. Over-temperature Only the output experiencing an over-temperature condition turns off. Over-current Only the output experiencing an over-current condition shuts down at 3.0A to 6.0A after a 25ms to 100ms delay, with SFPD pin grounded. All outputs will continue to operate in a current limit mode, with no shutdown, if the SFPD pin is at 5.0V. Short-circuit Detect VPWR 21 Gate Control Open Load Detect Over-temperature Detect Over -voltage Voltage Regulator Serial D/O Line Driver OVD VDD RB SFPD SFL CS SCLK SI SO CSI CSBI GE OT SF OF SPI Interface Logic + – Fault Timers + + + 10µA 25µA 10µA Bias To Gates 1 to 7 OUTPUT 0 24 OUTPUT From Detectors 1 to 7 GND 5-8 17-20 RS lLimit 53V 2 11 - 14 23 VDD SFPD RST CS SCLK SI SO 16 15 22 10 3 4 9 10µA 10µA 1 to 7Analog Integrated Circuit Device Data 2 Freescale Semiconductor 33298

Page 4

PIN CONNECTIONS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N PIN CONNECTIONS Figure 3. 33298 Pin Connections Table 2. 33298 Pin Function Description Pin Number Pin Name Formal Name Definition 1 OP7 Output 7 This pin provides connection to drain of output MOSFET number seven. 2 OP6 Output 6 This pin provides connection to drain of output MOSFET number six. 3 SCLK System Clock This pin clocks the internal Shift registers of the 33298. 4 SI Serial Input This pin is for the input of serial instruction data. SI information is read on the falling edge of SCLK. 5 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 6 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 7 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 8 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 9 SO Serial Output This pin is the tri-stateable output from the Shift register. 10 CS Chip Select Whenever this pin is in a logic low state, data can be transferred from the MCU to the 33298 through the SI pin and from the 33298 to the MCU through the SO pin. 11 OP5 Output 5 This pin provides connection to drain of output MOSFET number five. 12 OP4 Output 4 This pin provides connection to drain of output MOSFET number four. 13 OP3 Output 3 This pin provides connection to drain of output MOSFET number three. 14 OP2 Output 2 This pin provides connection to drain of output MOSFET number two. 15 SFPD Short Fault Protect Disable This pin is used to prevent the outputs from latching-OFF because of an over current condition. 16 VDD Logic Supply Logic Supply. 17 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 18 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 19 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 20 GND Ground This pin provides connection to IC Power Ground and functions as part of heat sinking path. 21 VPWR Power Output MOSFET gate drive supply. 22 RST RESET This pin is active low. It is used to clear the SPI Shift register, thereby setting all output switches OFF. 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 OP7 OP8 SCLK SI GND GND GND GND SO CS OP5 OP4 OP0 OP1 RST VPWR GND GND GND GND VDD SFPD OP2 OP3Analog Integrated Circuit Device Data Freescale Semiconductor 3 33298

Page 5

PIN CONNECTIONS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N 23 OP1 Output 1 This pin provides connection to drain of output MOSFET number one. 24 OP0 Output 0 This pin provides connection to drain of output MOSFET number zero. Table 2. 33298 Pin Function Description (continued) Pin Number Pin Name Formal Name DefinitionAnalog Integrated Circuit Device Data 4 Freescale Semiconductor 33298

Page 6

ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit Power Supply Voltage Normal Operation (Steady-state) Transient Conditions(1) VPWR(SS) VPWR(PK) - 1.5 to 26.5 - 13 to 60 V Logic Supply Voltage(2) VDD - 0.3 to 7.0 V Input pin Voltage(3) VIN - 0.3 to 7.0 V Output Clamp Voltage(4) 2.0mA ≤ IOUT ≤ 0.5A VOUT(OFF) 50 to 75 V Output Self-Limit Current IOUT(LIM) 3.0 to 6.0 A Continuous Per Output Current(5) IOUT(CONT) 1.0 A ESD Voltage(6) Human Body Model(7) Machine Model(7) VESD1 VESD2 2000 200 V Output Clamp Energy(8) Repetitive: TJ = 25°C TJ = 124°C Non-Repetitive: TJ = 25°C TJ = 124°C ECLAMP 100 30 2.0 0.5 mJ mJ J J Recommended Frequency of SPI Operation(9) fSPI 2.0 MHz Storage Temperature TSTG - 55 to 150 °C Peak Package Reflow Temperature During Reflow(10),(11) TPPRT Note 11. °C Notes 1. Transient capability with external 100Ω resistor in series with VP pin and supply. 2. Exceeding these limits may cause a malfunction or permanent damage to the device. 3. Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device. 4. With output OFF. 5. Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature will require maximum output current computation using package RθJA. 6. ESD data available upon request. 7. ESD1 testing is performed in accordance with the Human Body Model (CZap = 200pF, RZap = 1500Ω), ESD2 testing is performed in accordance with the Machine Model (CZap = 200pF, RZap = 0Ω). 8. Maximum output clamp energy capability at 150°C junction temperature using a single non-repetitive pulse method. 9. Guaranteed and production tested for 2.0MHz SPI operation, but demonstrated to operate to 8.5MHz at 25°C. 10. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 11. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.Analog Integrated Circuit Device Data Freescale Semiconductor 5 33298

Page 7

ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N Table 4. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Rating Symbol Value Unit Operating Case Temperature TC - 40 to 125 °C Operating Junction Temperature(12) TJ - 40 to 150 °C Power Dissipation (TA = 25°C)(13) PD 3.0 W Thermal Resistance (Junction-to-Ambient) Case 738 Package All Outputs ON(15) Single Output ON(15) Case 751E Package All Outputs ON(14) Single Output ON(15) RθJA 31 37 34 40 °C/W Notes 12. See Figure 22 for Thermal model. 13. Soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering; exceeding these limits may cause malfunction or permanent damage to the device. Contact Freescale Semiconductor Sales Office for device immersion soldering time/temperature limits. 14. Thermal resistance from Junction-to-Ambient with all outputs ON and dissipating equal power. 15. Thermal resistance from Junction -to-Ambient with a single output ON.Analog Integrated Circuit Device Data 6 Freescale Semiconductor 33298

Page 8

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N 33298 STATIC ELECTRICAL CHARACTERISTICS Table 5. Static Electrical Characteristics Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 9.0V ≤ VPWR ≤ 16V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate value with VBAT = 13V, TA = 25°C. Characteristic Symbol Min Typ Max Unit POWER INPUT Supply Voltage Range Quasi-Functional(16) Fully Operational VPWR(QF) VPWR(FO) 5.5 9.0 — — 9.0 26.5 V Supply Current (All Outputs ON, IOUT = 0.5A) (17) VPWR(ON) — 1.0 2.0 V Sleep State Supply Current (VDD = 0.5V) IPWR(SS) — 1.0 50 µA Sleep State Output Leakage Current (per Output, VDD = 0.5V) IOUT(SS) — — 50 µA Over-voltage Shutdown VOV 28 — 36 V Over-voltage Shutdown Hysteresis VOV(HYS) 0.2 — 1.5 V Logic Supply Voltage VDD 4.5 — 5.5 V Logic Supply Current (with any combination of Outputs ON) IDD — — 4.0 mA Logic Supply Under-voltage Lockout Threshold(18) VDD(UVLO) 2.0 — 4.5 V POWER OUTPUT Drain-to-Source ON Resistance (IOUT = 0.5A, TJ = 25°C) VPWR = 5.5V VPWR = 9.0V VPWR = 13V RDS(ON) — — — — 0.4 0.35 1.0 0.5 0.45 Ω Drain-to-Source ON Resistance (IOUT = 0.5A, TJ = 150°C) VPWR = 5.5V VPWR = 9.0V VPWR = 13V RDS(ON) — — — — 7.5 0.65 1.8 0.9 0.8 Ω Output Self-limiting Current Outputs Programmed ON, VOUT = 0.6VDD IOUT(LIM) 3.0 4.0 6.0 A Output Fault Detect Threshold(19) Output Programmed OFF VOUTTH(F) 0.6 0.7 0.8 VDD Output OFF Open Load Detect Current(20) Output Programmed OFF, VOUT = 0.6VDD IOCO 30 50 100 µA Output Clamp Voltage 2.0mA < IOUT < 200mA VOK 50 60 75 V Output Leakage Current (VDD < 2.0V) (21) IOUT(LKG) -50 0 50 µA Notes 16. SPI inputs and outputs operational; Fault status reporting may not be fully operational within this voltage range. 17. Value reflects normal operation (no faults) with all outputs ON. Each ON output contributes approximately 20µA to IPWR. Each output experiencing a soft short condition contributes approximately 0.5mA to IPWR. A soft short is defined as any load current causing the output source current to self-limit. A hard output short is a very low-impedance short to supply. 18. For VDD less than the Under-voltage Lockout Threshold voltage, all data registers are reset and all outputs are disabled. 19. Output Fault Detect Threshold with outputs programmed OFF. Output fault detect thresholds are the same for output opens and shorts. 20. Output OFF Open Load Detect Current is the current required to flow through the load for the purpose of detecting the existence of an open load condition when the specific output is commanded to be OFF. 21. Output leakage current measured with the output OFF and at 16V. Analog Integrated Circuit Device Data Freescale Semiconductor 7

Page 9

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N Table 6. Static Electrical Characteristics (continued) Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 9.0V ≤ VPWR ≤ 16V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate value with VPWR = 13V, TA = 25°C. Characteristic Symbol Min Typ Max Unit Over-temperature Shutdown (Outputs OFF)(22) TLIM 155 170 185 °C Over-temperature Shutdown Hysteresis(22) TLIM(HYS) — 10 20 °C DIGITAL INTERFACE Input Logic High Voltage(23) VIH 0.7 — 1.0 VDD Input Logic Low Voltage(24) VIL 0 — 0.2 VDD Input Logic Voltage Hysteresis(25) VI(HYS) 50 100 500 mV Input Logic Current(26) IIN -10 0 10 µA RST Pull-up Current (RST = 0.7VDD) IRST 10 22 50 µA SFPD Pull-down Current (SFPD = 0.2VDD) ISFPD 10 22 50 μA SO High State Output Voltage (IOH = 1.0mA) VSOH VDD -1.0V VDD -0.6V — V SO Low State Output Voltage (IOL = -1.6mA) VSOL — 0.2 0.4 V SO Tri-state Leakage Current (CS = 0.7VDD, 0V < VSO < VDD) ISOT -10 0 10 µA Input Capacitance (0V < VDD < 5.5V) (27) CIN — — 12 pF SO Tri-state Capacitance (0V < VDD < 5.5V) (28) CSOT — — 20 pF Notes 22. This parameter is guaranteed by design, but it is not production tested. 23. Upper and lower logic threshold voltage levels apply to SI, CS, SCLK, RST, and SFPD inputs. 24. Lower logic threshold voltage range applies to SI, CS, SCLK, Reset, and SFPD input signals. 25. Only the SFPD and Reset inputs have hysteresis. This parameter is guaranteed by design, but it is not production tested. 26. Input current of SCLK, SI and CS logic control inputs. 27. Input capacitance of SI, CS, SCLK, RST, and SFPD for 0 V < VDD < 5.5 V. This parameter is guaranteed by design, but it is not production tested. 28. Tri-state capacitance of SO for 0V < VDD < 5.5V. This parameter is guaranteed by design, but it is not production tested. Analog Integrated Circuit Device Data 8 Freescale Semiconductor 33298

Page 10

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS A R C H IV E IN F O R M A T IO N A R C H IV E IN F O R M A T IO N 33298 DYNAMIC ELECTRICAL CHARACTERISTICS . Table 7. Dynamic Electrical Characteristics Characteristics noted under conditions 4.5V ≤ VDD ≤ 5.5V, 9.0V ≤ VPWR ≤ 16V, -40°C ≤ TA ≤ 125°C, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions, unless otherwise noted. Characteristic Symbol Min Typ Max Unit POWER OUTPUT TIMING Output Rise Time (VPWR = 13V, RL = 26Ω) (29) tR 0.4 1.5 20 µs Output Fall Time (VPWR = 13V, RL = 26Ω) (29) tF 0.4 2.5 20 µs Output Turn ON Delay Time (VPWR = 13V, RL = 26Ω) (30) tDLY(ON) 1.0 5.0 15 µs Output Turn-OFF Delay Time (VPWR = 13V, RL = 26Ω) (31) tDLY(OFF) 1.0 5.0 15 µs Output Short Fault Disable Report Delay(32) SFPD = 0.2 x VDD tDLY(SF) 25 50 100 µs Output OFF Fault Report Delay(33) SFPD = 0.2 x VDD tDLY(OFF) 25 50 100 µs DIGITAL INTERFACE TIMING SCLK Clock Period(34) tPSCLK 500 — — ns SCLK Clock High Time tWSCLKH 175 — — ns SCLK Clock Low Time tWSCLKL 175 — — ns Required Low State Duration for Reset (VIL < 0.2VDD) (35) tW(RST) 250 50 — ns Falling Edge of CS to Rising Edge of SCLK (Required Setup Time) tLEAD 250 50 — ns Falling Edge of SCLK to Rising Edge of CS (Required for Setup Time) tLAG 250 50 — ns SI to Falling Edge of SCLK (Required for Setup Time) tSISU 125 25 — ns Falling Edge of SCLK to SI (Required for Hold Time) tSI(HOLD) 125 25 — ns SO Rise Time (CL = 200pF) tRSO — 25 75 ns SO Fall Time (CL = 200pF) tFSO — 25 75 ns SI, CS, SCLK, Incoming Signal Rise Time(36) tRSI — — 200 ns SI, CS, SCLK, Incoming Signal Fall Time(36) tFSI — — 200 ns Time from Falling Edge of CS to SO Low-impedance(37) tSO(EN) — — 200 ns Time from Rising Edge of CS to SO High-impedance(38) tSO(DIS) — — 200 ns Time from Rising Edge of SCLK to SO Data Valid(39) 0.2VDD < SO > 0.8VDD, CL = 200pF tVALID — 50 125 ns Notes 29. Output Rise and Fall time respectively measured across a 26Ω resistive load at 10 to 90 percent, and 90 to 10 percent voltage points. 30. Output Turn ON Delay time measured from 50 percent rising edge of CS to 90 percent of Output OFF voltage (VPWR) with RL = 26Ω resistive load. 31. Output Turn OFF Delay time measured from 50 percent rising edge of CS to 10 percent of Output OFF voltage (VPWR) with RL = 26Ω resistive load. 32. Output Short Fault Delay time measured from rising edge of CS to IOUT -= 2.0A point with output ON, VOUT = 5.0V, and SFPD = 0.2 VDD. See Figures 8 and 10. 33. Output OFF Fault Report Delay measured from 50 percent rising edge of CS to rising edge of output. See Figure 9. 34. Clock period include 75ns rise plus 75ns fall transition in addition to clock high and low time. 35. RST Low duration measured with outputs enabled and going to OFF or disabled condition. 36. Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing. 37. Time required for output status data to be available for use at the SO pin. 38. Time required for output status data to be terminated at the SO pin. 39. Time required to obtain valid data out from SO following the rise of SCLK. See Figure 5.Analog Integrated Circuit Device Data Freescale Semiconductor 9

MC33298P Reviews

Average User Rating
5 / 5 (143)
★ ★ ★ ★ ★
5 ★
129
4 ★
14
3 ★
0
2 ★
0
1 ★
0

Write a Review

Not Rated
Thanks for Your Review!

Ail***** Diaz

June 26, 2020

All items individually packed in anti static bags and properly labeled.

Ales*****Pandey

June 25, 2020

Perfect, functional, arrived a weeks earlier, excellent Seller. Recommended

Lill***** Barry

June 15, 2020

I took time to note down but perfect after several months of use

Lon***** Peri

June 15, 2020

I recommend this and would definitely buy it again.

Aria*****vsar

June 10, 2020

Heisener has everything! Each product is easy to search and navigate. No minimum quantities. Fast shipping!

Ros*****Heath

June 7, 2020

A well designed product that fit my custom PCB's perfectly. Easy to use. Sturdy construction. Highly recommend to all PCB builders.

Jazl*****olomon

June 5, 2020

can supply almost all of my necessary parts in short lead time.

Lilia*****lbert

May 26, 2020

Good! quick and convenient delivery. product tracking with good advice.

Aver*****ines

May 25, 2020

It arrived earlier than the deadline. All is OK. Thank you

Ian*****tty

May 24, 2020

It's an incredible place to buy the hard-to-find parts. Fair price, good quality and nice service! I would definitely do business with them again, thank you!

MC33298P Guarantees

Service Guarantee

Service Guarantees

We guarantee 100% customer satisfaction.

Our experienced sales team and tech support team back our services to satisfy all our customers.

Quality Guarantee

Quality Guarantees

We provide 90 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.

MC33298P Packaging

Verify Products
Customized Labels
Professional Packaging
Sealing
Packing
Insepction

MC33298P Related Products

SIT8208AI-31-33E-16.368000X SIT8208AI-31-33E-16.368000X SiTIME, -40 TO 85C, 5032, 20PPM, 3.3V, 1, -, - View
06031A2R0C4T2A 06031A2R0C4T2A AVX Corporation, CAP CER 2PF 100V NP0 0603, 0603 (1608 Metric), - View
1N4750AHR0G 1N4750AHR0G Taiwan Semiconductor Corporation, DIODE, ZENER, 27V, 1000MW, 5%, A, DO-204AL, DO-41, Axial, - View
AD5338RBRUZ AD5338RBRUZ Analog Devices Inc., IC DAC 10BIT I2C/SRL 16TSSOP, 16-TSSOP (0.173", 4.40mm Width), - View
JANTX1N6106US JANTX1N6106US Microsemi Corporation, TVS DIODE 7.6VWM BSQMELF, SQ-MELF, B, - View
WW5JT18K0 WW5JT18K0 Stackpole Electronics Inc., RES 18K OHM 5W 5% AXIAL, Axial, - View
KTR18EZPF2743 KTR18EZPF2743 Rohm Semiconductor, RES SMD 274K OHM 1% 1/4W 1206, 1206 (3216 Metric), - View
74651175R 74651175R Wurth Electronics Inc., SHANK, THR, -, - View
BSW-103-04-S-S-S BSW-103-04-S-S-S Samtec Inc., BOTTOM MOUNT STRIPS, -, - View
TM5RF-66 TM5RF-66 Hirose Electric Co Ltd, CONN MOD JACK 6P6C R/A UNSHLD, -, - View
5748271-1 5748271-1 TE Connectivity AMP Connectors, CONN SCREW LOCKS FMALE KIT 4-40, -, - View
MS3471W18-32PY MS3471W18-32PY Amphenol Aerospace Operations, CONN RCPT 32POS STRAIGHT PINS, -, - View
Payment Methods
Delivery Services

Quick Inquiry

MC33298P

Certified Quality

Heisener's commitment to quality has shaped our processes for sourcing, testing, shipping, and every step in between. This foundation underlies each component we sell.

ISO9001:2015, ICAS, IAF, UKAS

View the Certificates

Do you have any question about MC33298P?

+86-755-83210559 ext. 811 SalesDept@heisener.com heisener007 2354944915 Send Message

MC33298P Tags

  • MC33298P
  • MC33298P PDF
  • MC33298P datasheet
  • MC33298P specification
  • MC33298P image
  • NXP
  • NXP MC33298P
  • buy MC33298P
  • MC33298P price
  • MC33298P distributor
  • MC33298P supplier
  • MC33298P wholesales

MC33298P is Available in