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MC34978AES

MC34978AES

MC34978AES

For Reference Only

Part Number MC34978AES
Manufacturer NXP
Description IC INTERFACE SW DETECT 32QFN
Datasheet MC34978AES Datasheet
Package 32-VFQFN Exposed Pad
In Stock 1465 piece(s)
Unit Price $ 4.24 *
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MC34978AES

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MC34978AES Specifications

ManufacturerNXP
CategoryIntegrated Circuits (ICs) - Interface - Specialized
Datasheet MC34978AES Datasheet
Package32-VFQFN Exposed Pad
Series-
ApplicationsMultiple Switch Detection
Voltage - Supply4.5 V ~ 36 V
Package / Case32-VFQFN Exposed Pad
Supplier Device Package32-QFN (5x5)
Mounting TypeSurface Mount

MC34978AES Datasheet

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Document Number: MC33978 Rev. 8.0, 7/2018 NXP Semiconductors Technical Data22 channel multiple switch detection interface with programmable wetting current The 33978 is designed to detect the closing and opening of up to 22 switch contacts. The switch status, either open or closed, is transferred to the microprocessor unit (MCU) through a serial peripheral interface (SPI). This SMARTMOS device also features a 24-to-1 analog multiplexer for reading the input channels as analog inputs. The analog selected input signal is buffered and provided on the AMUX output pin for the MCU to read. Independent programmable wetting currents are available as needed for the application. A battery and temperature monitor are included in the IC and available via the AMUX pin. The 33978 device has two modes of operation, Normal and Low-power mode (LPM). Normal mode allows programming of the device and supplies switch contacts with pull-up or pull-down current as it monitors the change of state on the switches. The LPM provides low quiescent current, which makes the 33978 ideal for automotive and industrial products requiring low sleep-state currents. Features • Fully functional operation 4.5 V ≤ VBATP ≤ 36 V • Full parametric operation 6.0 V ≤ VBATP ≤ 28 V • Operating switch input voltage range from -1.0 V to 36 V • Eight programmable inputs (switches to battery or ground) • 14 switch-to-ground inputs • Selectable wetting current (2, 6, 8, 10, 12, 14, 16, or 20 mA) • Interfaces directly to an MCU using 3.3 V / 5.0 V SPI protocol • Selectable wake-up on change of state • Typical standby current IBATP = 30 μA and IDDQ = 10 μA • Active interrupt (INT_B) on change-of-switch state • Integrated battery and temperature sensing Figure 1. 33978 simplified application diagram Notes 1. The IC is functional from 4.5 V < VBATP < 6.0 V, but with degraded parametric values. The parameters may not meet the minimum and maximum specifications when VBATP drops below 6.0 V. MULTIPLE SWITCH DETECTION INTERFACE 33978 34978 Applications • Automotive • Heating ventilation and air conditioning (HVAC) • Lighting • Central gateway/in-vehicle networking • Gasoline engine management • Industrial • Programmable logic control (PLC) • Process control, temperature control • Input-output control (I/O Control) • Single board computer • Ethernet switch EK SUFFIX (PB-FREE) 98ASA10556D 32-PIN SOICW-EP ES SUFFIX (PB-FREE) 98ASA00656D 32-PIN QFN (WF-TYPE) SP0 SG12 SG13 SG0 SP7 SP1 Battery VBATP VDDQ MISO MOSI SCLK AMUX EP GND WAKE_B Battery Power Supply Power Supply VDDQ MCU MISO MOSI SCLK AN0 INT_B CS_B CSB INTB SG1 33978© NXP B.V. 2018.

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Table of Contents 1 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5.2 Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6 General IC functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.1 Battery voltage ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6.2 Power sequencing conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 7 Functional block description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.1 State diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 7.2 Low-power mode operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7.3 Input functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.4 Oscillator and timer control functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.5 Temperature monitor and control functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.6 WAKE_B control functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.7 INT_B functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.8 AMUX functional block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 7.9 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.10 SPI control register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 8 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 8.1 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 8.2 Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 8.3 Abnormal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 9 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 9.1 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 10 Reference section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 NXP Semiconductors 2 33978

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1 Orderable parts This section describes the part numbers available to be purchased along with their differences. Table 1. Orderable part variations Part number Temperature (TA) Package Notes MC33978EK -40 °C to 125 °C SOICW-EP 32 pins (2), (3) MC33978AEK (2) MC33978AES QFN (WF-TYPE) 32 pins MC34978EK -40 °C to 105 °C SOICW-EP 32 pins (2), (3) MC34978AEK (2) MC34978AES QFN (WF-TYPE) 32 pins Notes 2. To order parts in tape and reel, add the R2 suffix to the part number. 3. Refer to errata MC33978ER ER01 for details on current conditions present on the MC33978EK and MC34978EK devices only. 3 NXP Semiconductors 33978

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2 Internal block diagram Figure 2. 33978 internal block diagram Wetting (2.0 mA to 20 mA) Sustain (2.0 mA) Low Power Mode (1.0 mA) VBATP To SPI SG0 VBATP 4.0 V reference To SPI SP0-7 Internal 2.5 V VBATP + - VDDQ Inputs SG0 SG2 SG1 SG13 SP7 SP0 SP1 AMUX VBATP VDDQ GND SCLK MOSI MISO CS_B WAKE_B INT_B Oscillator and Clock control VBATP, VDDQ Internal 2.5 V/5.0 V Power On Reset Bandgap reference Sleep Power Temperature Monitor and Control SPI Interface and Control Internal 2.5 V Internal 2.5 V Internal 2.5 V VDDQ Mux control 24 Interrupt control VDDQ 125 kΩ WAKE_B control VDDQ 125 kΩ Internal 2.5 V VBATP EP Internal 2.5 V 4.0 V reference VBATP To SPI SGx 4.0 V reference VBATP To SPI SG5 4.0 V reference SG5 1/6 Ratio VDDQ 125 kΩ Wetting (2.0 mA to 20 mA) Sustain (2.0 mA) Low Power Mode (1.0 mA) Wetting (2.0 mA to 20 mA) Sustain (2.0 mA) Low Power Mode (1.0 mA) Wetting (2.0 mA to 20 mA) Sustain (2.0 mA) Low Power Mode (1.0 mA) Wetting (2.0 mA to 20 mA) Sustain (2.0 mA) Low Power Mode (2.0 mA) NXP Semiconductors 4 33978

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3 Pin connections 3.1 Pinout Figure 3. 33978 SOICW-EP and QFN (WF-Type) pinouts 3.2 Pin definitions Table 2. 33978 pin definitions Pin number SOIC Pin number QFN Pin name Pin function Formal name Definition 1 29 GND Ground Ground Ground for logic, analog 2 30 MOSI Input/SPI SPI Slave In SPI control data input pin from the MCU 3 31 SCLK Input/SPI Serial Clock SPI control clock input pin 4 32 CS_B Input/SPI Chip Select SPI control chip select input pin 5 – 8 25 – 28 1 - 4 21 - 24 SP0 – 3 SP4 – 7 Input Programmable Switches 0 – 7 Switch to programmable input pins (SB or SG) 9 – 15, 18 – 24 5 - 11 14 - 20 SG0 – 6, SG7 –13 Input Switch-to-Ground Inputs 0 – 13 Switch-to-ground input pins 16 12 VBATP Power Battery Input Battery supply input pin. Pin requires external reverse battery protection 17 13 WAKE_B Input/Output Wake-up Open drain wake-up output. Designed to control a power supply enable pin. Input used to allow a wake-up from an external event. 29 25 INT_B Input/Output Interrupt Open-drain output to MCU. Used to indicate an input switch change of state. Used as an input to allow wake-up from LPM via an external INT_B falling event. 30 26 AMUX Output Analog Multiplex Output Analog multiplex output. 31 27 VDDQ Input Voltage Drain Supply 3.3 V/ 5.0 V supply. Sets SPI communication level for the MISO driver and I/O level buffer MISO1 SP7 SP6 SP5 SP4 SG13 SG12 SG11 SG10 SG9 SG7 WAKE_B SG8 INT_B VDDQ AMUX GND SP0 SP1 SP2 SP3 SG0 SG1 SG2 SG3 SG4 SG6 VBATP SG5 CS_B MOSI SCLK 8 9 10 11 12 13 14 15 16 3 4 5 6 7 2 32 25 24 23 22 21 20 19 18 17 30 29 28 27 26 31 Exposed Pad EK Suffix Only Transparent Top View 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 SP0 SP1 SP2 SP3 SG0 SG1 SG2 SG3 S G 4 S G 5 S G 6 V B A T P W A K E _ B S G 7 S G 8 S G 9 SP7 SP6 SP5 SP4 SG13 SG12 SG11 SG10 C S _ B S C L K M O S I G N D M IS O V D D Q A M U X IN T _ B 5 NXP Semiconductors 33978

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32 28 MISO Output/SPI SPI Slave Out Provides digital data from the 33978 to the MCU. EP Ground Exposed Pad It is recommended that the exposed pad is terminated to GND (pin 1) and system ground. Table 2. 33978 pin definitions (continued) Pin number SOIC Pin number QFN Pin name Pin function Formal name Definition NXP Semiconductors 6 33978

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4 General product characteristics 4.1 Maximum ratings Table 3. Maximum ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Description (rating) Min. Max. Unit Notes Electrical ratings VBATP Battery Voltage -0.3 40 V VDDQ Supply Voltage -0.3 7.0 V CS_B, MOSI, MISO, SCLK SPI Inputs/Outputs -0.3 7.0 V SGx, SPx Switch Input Range -14(4) 38 V AMUX AMUX -0.3 7.0 V INT_B INT_B -0.3 7.0 V WAKE_B WAKE_B -0.3 40 V VESD1-2 VESD1-3 VESD3-1 VESD2-1 VESD2-2 ESD Voltage • Human Body Model (HBM) (VBATP versus GND) MC33978 and MC34978 MC33978A and MC34978A • Human Body Model (HBM) (All other pins) • Machine Model (MM) • Charge Device Model (CDM) (Corners pins) • Charge Device Model (CDM) (All other pins) ±2000 ±4000 ±2000 ±200 ±750 ±500 V (5) VESD5-3 VESD5-4 VESD6-1 VESD6-2 Contact Discharge • VBATP(8) • WAKE_B (series resistor 10 kΩ) • SGx and SPx pins with 100 nF capacitor (100 Ω series R) based on external protection performance(7) • SGx and SPx pins with 100 nF capacitor (50 Ω series R) ±8000 ±8000 ±15000 ±8000 V (6) Notes 4. Minimum value of -18 V is guaranteed by design for switch input voltage range (SGx, SPx). 5. ESD testing is performed in accordance AEC Q100, with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM) (CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM). 6. CZAP = 330 pF, RZAP = 2.0 kΩ (Powered and unpowered) / CZAP = 150 pF, RZAP = 330 Ω (Unpowered) 7. ±15000V capability in powered condition, ±8000V in all other conditions. 8. External component requirements at system level: Cbulk = 100uF aluminum electrolytic capacitor Cbypass= 100nF ±37 % ceramic capacitor Reverse blocking diode from Battery to VBATP (0.6 V < VF < 1 V). See Figure 23, Typical application diagram. 7 NXP Semiconductors 33978

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4.2 Thermal characteristics Table 4. Thermal ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Description (rating) Min. Max. Unit Notes Thermal ratings TA TJ Operating Temperature • Ambient • Junction -40 -40 125 150 °C TSTG Storage Temperature -65 150 °C TPPRT Peak Package Reflow Temperature During Reflow – – °C Thermal resistance RΘJA Junction-to-Ambient, Natural Convection, Single-Layer Board • 32 SOIC-EP • 32 QFN 79 94 °C/W (9),(10) RΘJB Junction-to-Board • 32 SOIC-EP • 32 QFN 9.0 12 °C/W (11) RΘJC Junction-to-Case (Bottom) • 32 SOIC-EP • 32 QFN 3.0 2.0 °C/W (12) ΨJT Junction-to-Package (Top), Natural convection • 32 SOIC-EP • 32 QFN 11 2.0 °C/W (13) Package dissipation ratings TSD Thermal Shutdown • 32 SOIC-EP • 32 QFN 155 185 °C TSDH Thermal Shutdown Hysteresis • 32 SOIC-EP • 32 QFN 3.0 15 °C Notes 9. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 10. Per JEDEC JESD51-2 with natural convection for horizontally oriented board. Board meets JESD51-9 specification for 1s or 2s2p board, respectively. 11. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 12. Thermal resistance between the die and the solder pad on the bottom of the package based on simulation without any interface resistance. 13. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51- 2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. NXP Semiconductors 8 33978

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4.3 Operating conditions This section describes the operating conditions of the device. Conditions apply to the following data, unless otherwise noted. 4.4 Electrical characteristics 4.4.1 Static electrical characteristics Table 5. Operating conditions All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Ratings Min. Max. Unit Notes VBATP Battery Voltage 4.5 36 V VDDQ Supply Voltage 3.0 5.25 V CS_B, MOSI, MISO, SCLK SPI Inputs / Outputs 3.0 5.25 V SGx, SPx Switch Input Range -1.0 36 V AMUX, INT_B AMUX, INT_B 0.0 5.25 V WAKE_B WAKE_B 0.0 36 V Table 6. Static electrical characteristics TA = - 40 °C to +125 °C, VDDQ = 3.1 V to 5.25 V, VBATP = 6.0 V to 28.0 V, unless otherwise noted. Symbol Characteristic Min. Typ. Max. Units Notes Power input VBATP(POR) VBATP Supply Voltage POR • VBATP Supply Power on Reset voltage. 2.7 3.3 3.8 V VBATPUV VBATP Undervoltage Rising Threshold — 4.3 4.5 V VBATPUVHYS VBATP Undervoltage Hysteresis 250 — 500 mV VBATPOV VBATP Overvoltage Rising Threshold 32 — 37 V VBATPOVHYS VBATP Overvoltage Hysteresis 1.5 — 3.0 V IBAT(ON) VBATP Supply Current • All switches open, Normal mode, Tri-state disabled (all channels) — 7.0 12 mA IBATP,IQ,LPM,P IBATP,IQ,LPM,F VBATP Low-power Mode Supply Current (polling disabled) • Parametric VBATP, 6.0 V < VBATP < 28 V • Functional Low VBATP, 4.5 V < VBATP < 6.0 V — — — — 40 40 µA IPOLLING,IQ VBATP Polling Current • Polling 64 ms, 11 inputs of wake enabled — — 20 µA (14) IVDDQ,NORMAL Normal mode (IVDDQ) • SCLK, MOSI, WakeB = 0 V, CS_B, INT_B =VDDQ, no SPI communication, AMUX selected no input — — 500 uA IVDDQ,LPM Logic Low-power mode Supply Current • SCLK, MOSI = 0 V, CS_B, INT_B, WAKE_B = VDDQ, no SPI communication — — 10 µA VGNDOFFSET Ground Offset • Ground offset of Global pins to IC ground -1.0 — 1.0 V VDDQUV VDDQ Undervoltage Falling Threshold 2.2 — 2.8 V VDDQUVHYS VDDQ Undervoltage Hysteresis 150 — 350 mV 9 NXP Semiconductors 33978

MC34978AES Reviews

Average User Rating
5 / 5 (116)
★ ★ ★ ★ ★
5 ★
104
4 ★
12
3 ★
0
2 ★
0
1 ★
0

Chris*****r Pena

February 6, 2020

I like this way to add a project, choose existing project to add components. I use this method frequently to keep track of my projects. Thanks Heisener!

Ray C*****ensen

December 29, 2020

To be honest, you're beating your competitor on delivery - sometimes I request 2nd day and you still get it here overnight. Thanks!

Sari*****arin

November 21, 2019

These are high quality connectors. They work as you would expect them to. There is not much else you can say about them.

Alan*****rabhu

November 16, 2019

Very supportive of my small orders, but very glad easy to work with. Hard to see how it could be any more efficient!

Av***** Pai

October 21, 2019

Great dealing with you Guys. Thanks for a very prompt delivery.

Lei*****urry

October 11, 2019

Worked wonderfully. Went through the instructions to the tea to make sure it was done correctly.

Zari*****Wagner

October 2, 2019

Received the parts, and all parts are in tight packaging without any problems, professional seller.

Brigg*****nston

September 13, 2019

These very economical items will repair my expensive contactors with just a quick connection.

Adel*****ardner

September 13, 2019

You're my good supplier. I appreciate Heisener Electronics on many levels.

Nora*****uglas

August 21, 2019

This product works great what more can I say.

MC34978AES Guarantees

Service Guarantee

Service Guarantees

We guarantee 100% customer satisfaction.

Our experienced sales team and tech support team back our services to satisfy all our customers.

Quality Guarantee

Quality Guarantees

We provide 90 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.

MC34978AES Packaging

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